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CN201069841Y - Electric connector assembly - Google Patents

Electric connector assembly Download PDF

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Publication number
CN201069841Y
CN201069841Y CNU2007200392003U CN200720039200U CN201069841Y CN 201069841 Y CN201069841 Y CN 201069841Y CN U2007200392003 U CNU2007200392003 U CN U2007200392003U CN 200720039200 U CN200720039200 U CN 200720039200U CN 201069841 Y CN201069841 Y CN 201069841Y
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China
Prior art keywords
electrical connector
buckle
group
connector assembly
buckles
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CNU2007200392003U
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Chinese (zh)
Inventor
马浩云
司明伦
达瑞尔·威尔兹
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Abstract

The utility model discloses an electric connector component, which comprises an electric connector able to electrically connect with a printed circuit board and a buckle piece combination pressing a wafer module group toward the electric connector. The buckle piece combination comprises a first group buckle piece for pressing an element module, and a second group buckle piece able to press toward the substrate of the wafer module group. The wafer module group after being assembled to the electric connector can guarantee certain flatness of the wafer module group during the process of pressing downwards the wafer module group through the buckle piece to ensure the good electrical connection between the electric connector and the wafer module group.

Description

电连接器组件 Electrical Connector Assembly

【技术领域】【Technical field】

本实用新型关于一种电连接器组件,尤指一种电性连接晶片模组(CPU)至印刷电路板的电连接器组件。The utility model relates to an electrical connector assembly, in particular to an electrical connector assembly electrically connecting a chip module (CPU) to a printed circuit board.

【背景技术】【Background technique】

CPU连接器已广泛地应用在个人计算机上。使用在桌上型计算机的,则泛见美国专利第5,722,848号揭露出一种用在桌上型计算机的连接器。这种CPU连接器亦称做零插入力(Zero Insertion Force)连接器。它包括了一个基体,其上设置有多数个端子槽,每一端子槽内都容置有一根端子。在基体上,另滑动地设置有一盖体,盖体上设置有多数个穿孔,分别与每一端子槽对齐。在基体的一个侧边位置处,尚设置有一个驱动组件,以驱动盖体在基体上移动。驱动组件是一个凸轮结构,同时连接有一操作杆。当操作杆位于垂直位置时,CPU的插脚可以不受任何力的情况下穿过盖体上的孔洞,再进入到端子槽内。之后,操作杆旋转下移,此时凸轮结构亦随之转动,并同时驱动盖体在基体上移动。而组装在盖体上的CPU这时也随盖体一起移动,进而与端子槽内的端子完成了电连接。以上介绍的是桌上型计算机用的连接器。CPU connectors have been widely used in personal computers. For desktop computers, US Pat. No. 5,722,848 discloses a connector for desktop computers. This CPU connector is also known as a Zero Insertion Force (Zero Insertion Force) connector. It includes a base body on which a plurality of terminal grooves are arranged, and a terminal is accommodated in each terminal groove. On the base body, a cover body is slidably arranged, and a plurality of perforations are arranged on the cover body, which are respectively aligned with each terminal slot. At one side of the base body, a driving assembly is provided to drive the cover to move on the base body. The driving assembly is a cam structure, and is connected with an operating rod at the same time. When the operating lever is in the vertical position, the pins of the CPU can pass through the holes on the cover without any force, and then enter the terminal slot. Afterwards, the operating rod rotates and moves down, and at this time, the cam structure also rotates accordingly, and simultaneously drives the cover body to move on the base body. At this time, the CPU assembled on the cover also moves together with the cover, and then completes the electrical connection with the terminals in the terminal groove. The above are the connectors for desktop computers.

笔记型计算机所使用的CPU连接器,其基本架构亦与前述的专利大致相同,只是受限于笔记型计算机的空间,前述的操作杆则改成了水平式的驱动片。而其工作与操作原理亦与桌上型计算机相同,故不再多述。The basic structure of the CPU connector used in the notebook computer is similar to that of the aforementioned patent, but limited by the space of the notebook computer, the aforementioned joystick is changed to a horizontal drive plate. And its work and operating principle are also the same as those of the desktop computer, so it will not be described further.

美国专利第7,001,197号则揭露了另一种电连接器。这种连接器一般被通称为LGA(Land Grid Array)连接器。主要是由于CPU的效能愈来愈高,其输出的Input/Output,也随之增加。因此无法再使用原来的插脚式,而必须改成接触片(Pad)式。如此,可以增加更多的空间来容置接触片。而相对于CPU的改变,连接器上的端子结构,也随着改变。其中端子的接触端是凸起于连接器的上表面,以直接与CPU的接触片接触。US Patent No. 7,001,197 discloses another electrical connector. This type of connector is generally referred to as an LGA (Land Grid Array) connector. The main reason is that the CPU's performance is getting higher and higher, and its output Input/Output also increases accordingly. Therefore, the original pin type can no longer be used, but must be changed into a contact piece (Pad) type. In this way, more space can be added to accommodate the contact piece. Compared with the change of the CPU, the terminal structure on the connector also changes accordingly. Wherein the contact end of the terminal protrudes from the upper surface of the connector so as to directly contact with the contact piece of the CPU.

前述第’197专利涉及到的电连接器没有盖体,也没有驱动盖体的驱动装置,而改用了一种被简称为上下铁片的结构。其中电连接器是组装在下铁片的中央,而上铁片则是可转动地枢接在下铁片的一侧,而在下铁片的另一侧,则枢接有一压杆。当CPU置于连接器上后,上铁片便盖了下来,最后再使用压杆把上铁片压扣在下铁片上,以确保CPU与连接器接触面的LGA端子电接触。The electrical connector involved in the aforementioned '197 patent has neither a cover body nor a driving device for driving the cover body, but instead uses a structure referred to as an upper and lower iron sheet for short. Wherein the electrical connector is assembled in the center of the lower iron piece, while the upper iron piece is rotatably pivoted to one side of the lower iron piece, and a pressing rod is pivotally connected to the other side of the lower iron piece. When the CPU is placed on the connector, the upper iron sheet is covered, and finally the upper iron sheet is pressed and buckled on the lower iron sheet with a pressure rod to ensure electrical contact between the CPU and the LGA terminal on the contact surface of the connector.

这种LGA态样的连接器,使用在桌上型计算机时,由于空间足够,没有任何问题,但使用在笔记型计算机上时,就没法使用摇杆式的压杆结构了。This kind of LGA-shaped connector, when used on a desktop computer, has enough space, there is no problem, but when used on a notebook computer, the rocker-type pressure bar structure cannot be used.

此外,还有另一个问题要考虑的,就是CPU的基本架构。CPU是由一个基板(Substrate)及形成在其上的晶元模块(Die)所构成。晶元模块是凸出在基板上。因此,当把CPU压向连接器时,必须要把下压力均匀地分布在晶元模块以及周围的基板上。因为单独地下压晶元模块或基板,则都有可能会因为受力不平均而造成CPU变形翘曲,最后影响到电气连接特性。In addition, there is another issue to consider, which is the basic architecture of the CPU. The CPU is composed of a substrate (Substrate) and a wafer module (Die) formed on it. The die module is protruded on the substrate. Therefore, when pressing the CPU against the connector, it is necessary to distribute the downforce evenly on the die module and the surrounding substrate. Because the wafer module or the substrate is pressed separately, the CPU may be deformed and warped due to uneven force, which will eventually affect the electrical connection characteristics.

鉴于此,实有必要提供一种改进的电连接器,以克服上述电连接器的缺陷。In view of this, it is necessary to provide an improved electrical connector to overcome the above-mentioned defects of the electrical connector.

【实用新型内容】【Content of utility model】

本实用新型的目的是提供一种设有下压扣片装置的电连接器组件,该下压扣片装置能确保下压晶片模组时晶片模组不发生变形翘曲。The purpose of this utility model is to provide an electrical connector assembly provided with a push-down device, which can ensure that the chip module does not deform and warp when the chip module is pressed down.

为实现前述的目的,本实用新型采用如下技术方案:一种电连接器组件,其包括可电性连接至印刷电路板的电连接器以及将晶片模组压向电连接器的扣片组合,该扣片组合包括扣片本体、用于压迫晶元模块的第一组扣片以及压向晶片模组基板的第二组扣片。第一组扣片是由扣片本体朝第一方向延伸,该第一组扣片包括位于第一平面的第一压扣面;第二组扣片,也由扣片本体延伸而成,其包括位于第二平面的第二压扣面,且与第一压扣面形成一个段差。In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: an electrical connector assembly, which includes an electrical connector electrically connected to a printed circuit board and a clasp assembly that presses the chip module to the electrical connector, The clip combination includes a clip body, a first group of clips for pressing the wafer module, and a second group of clips pressed against the chip module substrate. The first group of buckles is extended from the buckle body toward the first direction, and the first group of buckles includes a first buckle surface located on the first plane; the second group of buckles is also extended from the buckle body, which It includes a second buckle surface on the second plane and forms a level difference with the first buckle surface.

相对于现有技术,本实用新型电连接器组件具有以下优点:扣片组合设有第一组扣片和第二组扣片,且二者的压扣面形成一个段差,这样第一组扣片可对晶元模块施加下压的力量,同时,第二组扣片则可针对晶片模组的基板施加下压力,从而保证下压晶片模组时受力均匀,不易因发生变形翘曲而影响电气连接特性。Compared with the prior art, the electrical connector assembly of the present utility model has the following advantages: the first set of buckles and the second set of buckles are provided in the buckle combination, and the buckle surfaces of the two form a step difference, so that the first set of buckles The chip can exert a downward force on the wafer module, and at the same time, the second set of buckles can apply a downward force to the substrate of the chip module, so as to ensure that the force is uniform when the chip module is pressed down, and it is not easy to be damaged due to deformation and warping. Affects electrical connection characteristics.

【附图说明】【Description of drawings】

图1是本实用新型第一优选实施例电连接器组件的立体分解图;Fig. 1 is a three-dimensional exploded view of the electrical connector assembly of the first preferred embodiment of the present invention;

图2是图1所示电连接器组件的立体组合图;Fig. 2 is a three-dimensional assembled view of the electrical connector assembly shown in Fig. 1;

图3是本实用新型第二优选实施例电连接器组件的立体分解图;Fig. 3 is a three-dimensional exploded view of the electrical connector assembly of the second preferred embodiment of the present invention;

图4是图3所示电连接器组件的立体组合图;Fig. 4 is a three-dimensional assembled view of the electrical connector assembly shown in Fig. 3;

图5是本实用新型第三优选实施例电连接器组件的扣片组合的立体分解图;Fig. 5 is a three-dimensional exploded view of the buckle combination of the electrical connector assembly of the third preferred embodiment of the present invention;

图6是图5所示扣片组合的立体组合图。Fig. 6 is a three-dimensional assembled view of the buckle assembly shown in Fig. 5 .

【具体实施方式】【Detailed ways】

请参阅图1至图2所示,其揭示了本实用新型第一优选实施例的电连接器组件100,其包括电性连接至印刷电路板10的电连接器20、安装于电连接器20导电区域的晶片模组30、散热装置40以及将晶片模组30压向电连接器20的扣片组合50。Please refer to FIG. 1 to FIG. 2 , which disclose an electrical connector assembly 100 according to a first preferred embodiment of the present invention, which includes an electrical connector 20 electrically connected to a printed circuit board 10 , mounted on the electrical connector 20 The chip module 30 in the conductive area, the heat sink 40 , and the buckle assembly 50 that presses the chip module 30 to the electrical connector 20 .

电连接器20用以电性连接晶片模组30至印刷电路板10,其包括绝缘本体201,绝缘本体201大致呈纵长形,其包括收容有若干导电端子(未图示)的导电区域202以及围绕导电区域202的侧墙203。The electrical connector 20 is used to electrically connect the chip module 30 to the printed circuit board 10, and includes an insulating body 201, the insulating body 201 is generally elongated, and includes a conductive area 202 for accommodating a plurality of conductive terminals (not shown). and sidewalls 203 surrounding the conductive region 202 .

晶片模组30大致呈方形结构,其由一个基板301及形成在其上的晶元模块302所构成。The chip module 30 has a roughly square structure, which is composed of a substrate 301 and a chip module 302 formed thereon.

散热装置40压接至晶片模组30,用于散除晶片模组30在工作时产生的热量,其包括大致方形的散热片401以及组装于散热片的凹槽402中的散热管403。The heat sink 40 is crimped to the chip module 30 for dissipating heat generated by the chip module 30 during operation, and includes a substantially square heat sink 401 and a heat pipe 403 assembled in the groove 402 of the heat sink.

扣片组合50包括扣片本体501、用于压迫晶元模块的第一组扣片502以及压向晶片模组基板30 1的第二组扣片503。扣片本体501为一框形结构,其包括内缘5011与外缘5012,其中第一组扣片502是由框形结构的内缘5011朝下延伸形成的,第二组扣片503是由外缘5012朝下延伸。第一组扣片502包括若干互相间隔的扣片,且扣片是先朝水平方向延伸,再向下延伸并形成位于第一平面的第一压扣面,第二组扣片503也包括若干互相间隔的扣片,其在第二平面上形成第二压扣面。即,第一压扣面是第一组扣片自由端所处的同一平面,第二压扣面是第二组扣片自由端所处的同一平面,上述第一、二扣合面之间形成一个段差。此外,该框形结构的扣片本体501的四角处还设有用于将所述扣片组合50固定的装配孔504。The clip assembly 50 includes a clip body 501, a first group of clips 502 for pressing the wafer module, and a second group of clips 503 pressed against the chip module substrate 301. The buckle body 501 is a frame-shaped structure, which includes an inner edge 5011 and an outer edge 5012, wherein the first set of buckle pieces 502 is formed by extending downward from the inner edge 5011 of the frame-shaped structure, and the second set of buckle pieces 503 is formed by The outer edge 5012 extends downwardly. The first set of buckles 502 includes a number of buckles spaced apart from each other, and the buckles first extend horizontally, and then extend downwards to form a first buckle surface on the first plane. The second set of buckles 503 also includes several buckles. The buckle pieces spaced apart from each other form a second buckle surface on the second plane. That is, the first buckle surface is the same plane where the free ends of the first group of buckle pieces are located, and the second buckle surface is the same plane where the free ends of the second group of buckle pieces are located. form a gap. In addition, the four corners of the buckle body 501 of the frame structure are provided with assembly holes 504 for fixing the buckle assembly 50 .

组装时,首先将电连接器20定位于印刷电路板10上,然后将晶片模组30放入电连接器20的导电区域202内,又将散热装置40压接至晶片模组30上,再将扣片组合50组装至散热装置40上,最后,连接件(未图示)从电路板10的下方依次穿过电路板10、扣片本体501的配合孔504,从而将电路板10、电连接器20、散热装置40以及扣片组合50组装成一体。这样扣片组合50设有的第一组扣片502向下施加的压力便通过散热片401传导至晶片模组30的晶元模块302上,第二组扣片503向下施加的压力直接作用于晶片模组30的基板301上,从而保证组装好后的晶片模组30不发生翘曲。During assembly, the electrical connector 20 is first positioned on the printed circuit board 10, then the chip module 30 is placed in the conductive area 202 of the electrical connector 20, and the heat sink 40 is crimped on the chip module 30, and then Assemble the buckle assembly 50 to the heat sink 40, and finally, the connectors (not shown) pass through the matching holes 504 of the circuit board 10 and the buckle body 501 sequentially from the bottom of the circuit board 10, so that the circuit board 10, the electrical The connector 20 , the heat sink 40 and the buckle assembly 50 are assembled into one body. In this way, the downward pressure exerted by the first set of buckle plates 502 provided on the buckle plate combination 50 is transmitted to the wafer module 302 of the chip module 30 through the heat sink 401, and the downward pressure exerted by the second set of buckle plates 503 acts directly. on the substrate 301 of the chip module 30 to ensure that the assembled chip module 30 does not warp.

请继续参阅图3至图4所示,其揭示本实用新型第二优选实施例的电连接器组件800,其也包括电性连接至印刷电路板(未图示)的电连接器80、安装于电连接器80导电区域801的晶片模组802、散热装置以及将晶片模组802压向电连接器80的扣片组合804。Please continue to refer to FIGS. 3 to 4, which disclose an electrical connector assembly 800 according to a second preferred embodiment of the present invention, which also includes an electrical connector 80 electrically connected to a printed circuit board (not shown), an installation The chip module 802 in the conductive area 801 of the electrical connector 80 , the heat sink, and the buckle assembly 804 that presses the chip module 802 to the electrical connector 80 .

详细的说,第二优选实施例与第一优选实施例的不同之处在于:其一,本实施例中散热装置的散热片8031上未设置收容散热管8032的凹槽,组装后,二者直接压接在一起;其二,扣片组合804也包括扣片本体805、用于压迫晶元模块(未标号)的第一组扣片8041以及压向晶片模组基板(未标号)的第二组扣片8042,但第一、二组扣片8041、8042非一体成型形成的,而是通过连接件(未图示)组合在一起的。In detail, the differences between the second preferred embodiment and the first preferred embodiment are: First, the heat sink 8031 of the heat dissipation device in this embodiment is not provided with a groove for accommodating the heat dissipation pipe 8032. After assembly, the two directly crimped together; secondly, the buckle assembly 804 also includes the buckle body 805, the first set of buckle 8041 for pressing the wafer module (not numbered) and the first group of buckle pieces 8041 pressed against the wafer module substrate (unnumbered). The two sets of buckle pieces 8042, but the first and second sets of buckle pieces 8041, 8042 are not integrally formed, but are combined together through connectors (not shown).

本实用新型还提供了第三优选实施例的电连接器组件,本实施例提供另外一种扣片组合装置,请参阅图5至图6所示,该种扣片组合900包括的扣片本体902、第一、二组扣片903、906与第二优选实施例中的扣片组合804一样都不是一体成型的,扣片本体902也是框形结构,第一组扣片903的末端是通过第一横向杆904、第二横向杆905连接的。通过第一、二横向杆904、905将扣片本体902的框形结构划分为两个区域。The utility model also provides the electrical connector assembly of the third preferred embodiment. This embodiment provides another buckle combination device. Please refer to FIG. 5 to FIG. 6, the buckle body included in this buckle combination 900 902, the first and second sets of buckles 903, 906 are not integrally formed like the buckle combination 804 in the second preferred embodiment, the buckle body 902 is also a frame structure, and the end of the first set of buckles 903 is through The first transverse bar 904 and the second transverse bar 905 are connected. The frame structure of the buckle body 902 is divided into two regions by the first and second transverse bars 904 , 905 .

以上三种优选实施例的电连接器组件,都是利用其设置的扣片组合能将下压时施加在晶片模组上的力均匀地分布在晶元模块以及周围的基板上,从而保证了晶片模组组装以及工作时不发生翘曲,以便更好地电性连接至印刷电路板。The electrical connector assemblies of the above three preferred embodiments all use the buckle combination provided to distribute the force applied on the wafer module evenly on the wafer module and the surrounding substrate when pressing down, thereby ensuring The chip module does not warp during assembly and operation, so as to better electrically connect to the printed circuit board.

Claims (10)

1.一种电连接器组件,其包括可电性连接至印刷电路板的电连接器以及将晶片模组压向电连接器的扣片组合,其特征在于:该扣片组合包括扣片本体、用于压迫晶元模块的第一组扣片以及压向晶片模组基板的第二组扣片。1. An electrical connector assembly, which includes an electrical connector that can be electrically connected to a printed circuit board and a buckle combination that presses the chip module to the electrical connector, characterized in that: the buckle combination includes a buckle body , the first group of clips for pressing the wafer module and the second group of clips pressed against the chip module substrate. 2.如权利要求1所述的电连接器组件,其特征在于:所述第一组扣片是由扣片本体朝第一方向延伸,该第一组扣片包括位于第一平面的第一压扣面;所述第二组扣片,也由扣片本体延伸而成,其包括位于第二平面的第二压扣面,且与第一压扣面形成一个段差。2. The electrical connector assembly according to claim 1, wherein the first group of clips extends from the clip body toward the first direction, and the first group of clips includes a first set of clips located on a first plane. The buckle surface: the second group of buckle pieces is also extended from the buckle piece body, which includes a second buckle surface located on a second plane, and forms a level difference with the first buckle surface. 3.如权利要求1所述的电连接器组件,其特征在于:第一组扣片的末端是通过一横向杆连接起来的。3. The electrical connector assembly as claimed in claim 1, wherein the ends of the first set of tabs are connected by a transverse bar. 4.如权利要求3所述的电连接器组件,其特征在于:所述横向杆与扣片本体位于同一平面上。4. The electrical connector assembly according to claim 3, wherein the transverse bar and the clip body are located on the same plane. 5.如权利要求1所述的电连接器组件,其特征在于:所述第一、第二组扣片与扣片本体一体成型。5 . The electrical connector assembly according to claim 1 , wherein the first and second sets of clips are integrally formed with the clip body. 6 . 6.如权利要求2所述的电连接器组件,其特征在于:第一组扣片是先朝水平方向延伸,再向下延伸形成第一压扣面。6 . The electrical connector assembly as claimed in claim 2 , wherein the first group of buckle pieces extend horizontally first, and then extend downward to form the first buckle surface. 7 . 7.如权利要求1所述的电连接器组件,其特征在于:第一组扣片包括若干个扣片,且扣片与扣片之间相隔一定的距离。7. The electrical connector assembly as claimed in claim 1, wherein the first group of buckles comprises several buckles, and there is a certain distance between the buckles. 8.如权利要求1所述的电连器组件,其特征在于:第二组扣片包括若干个扣片,且扣片与扣片之间相隔一定的距离。8 . The electrical connector assembly according to claim 1 , wherein the second group of buckles comprises several buckles, and there is a certain distance between the buckles. 9.如权利要求1所述的电连接器组件,其特征在于:扣片本体为一框形结构,其包括内缘与外缘,其中第一组扣片是由框形结构的内缘朝下延伸形成的,第二组扣片系由外缘朝下延伸。9. The electrical connector assembly according to claim 1, wherein the buckle body is a frame-shaped structure, which includes an inner edge and an outer edge, wherein the first group of buckles is formed from the inner edge of the frame-shaped structure toward the Formed by extending downward, the second set of buckles extends downward from the outer edge. 10.如权利要求9所述的电连接器组件,其特征在于:该框形结构至少包括一固定部份,设置在对角位置。10. The electrical connector assembly as claimed in claim 9, wherein the frame structure includes at least one fixing portion disposed at a diagonal position.
CNU2007200392003U 2007-05-28 2007-05-28 Electric connector assembly Expired - Lifetime CN201069841Y (en)

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