CN201003736Y - Semi-conductor LED road lamp heat dissipation structure - Google Patents
Semi-conductor LED road lamp heat dissipation structure Download PDFInfo
- Publication number
- CN201003736Y CN201003736Y CNU2006200279805U CN200620027980U CN201003736Y CN 201003736 Y CN201003736 Y CN 201003736Y CN U2006200279805 U CNU2006200279805 U CN U2006200279805U CN 200620027980 U CN200620027980 U CN 200620027980U CN 201003736 Y CN201003736 Y CN 201003736Y
- Authority
- CN
- China
- Prior art keywords
- heat conductive
- heat
- light source
- conductive rod
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 title description 2
- 239000003292 glue Substances 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005498 polishing Methods 0.000 description 2
- 241000237983 Trochidae Species 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a heat radiating structure for semiconductor LED street lamp; wherein, a LED light source is fixed on an aluminum-made heat conductive bar, and the heat conductive bar is fixed on a heat conductive base. The LED light source is connected with the heat conductive bar by bolt, and the heat conductive bar is sequentially connected with the heat conductive base by bolt as well, with contact surfaces are painted by heat conductive glue so to reduce thermal resistance. The heat conductive base contacts the semiconductor street lamp directly, in order to transmit thermal energy generated by the LED light source to the street lamp and acquire brilliant heat radiating effect. The utility model can assure normal work internal power type LED light source of the street lamp under proper range of temperature.
Description
Technical field
The utility model relates to a kind of semiconductor LED street lamp, belongs to semiconductor lighting equipment field.
Background technology
Semiconductor lighting replaces traditional light source, the working junction temperature of semiconductor light sources performance and life-span and the semiconductor light sources relation of being inversely proportional to the high-power LED light source light source.Therefore, semiconductor light sources needs supporting good heat dissipation design to reduce the led light source operating temperature and then reduce its junction temperature.And out of doors under the harsh environmental conditions, road lamp needs good seal, reaches the water proof and dust proof effect.This closed environment is unfavorable for the heat radiation of semiconductor light sources, thereby has influence on the performance of semiconductor energy-conserving road lamp.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of radiator structure of semiconductor LED street lamp, and this structure conducts to lamp body with the heat that power type LED light source produces, and the assurance semiconductor light sources is worked in suitable temperature range.
The technical solution of the utility model is as follows:
A kind of semiconductor LED road lamp cooling structure, be used to comprise the semiconductor LED street lamp of a lamp body and at least one led light source, on lamp body, be fixed with heat conducting base, the upper surface of heat conducting base is provided with at least one groove that has through hole, be provided with heat conductive rod on the described groove, described heat conductive rod bottom surface be provided with described groove on the screwed hole that matches of through hole, described heat conductive rod is fixed on by screw on the groove of heat conducting base, is fixed with led light source on the top of described heat conductive rod.
In the above-mentioned semiconductor LED road lamp cooling structure, the top of heat conductive rod is preferably the inclined-plane, should scribble heat-conducting glue between the contact-making surface on led light source and heat conductive rod top.The surface of heat conductive rod bottom surface and described heat conducting base groove all should scribble the burnishing surface of heat-conducting glue.The lower surface of heat conducting base is preferably curved, and radian is consistent with lamp body inner surface radian.Scribble heat-conducting glue between the inner surface of heat conducting base and described lamp body.Heat conducting base can be the cast aluminium material.
Led light source of the present utility model and heat conductive rod, heat conductive rod and heat conducting base are screwed, and scribble heat-conducting glue between its contact-making surface, reduce the thermal resistance of contact-making surface.Heat conducting base directly contacts with the semiconductor road lamp lamp body, and the heat that led light source is produced is directly conducted to light fixture, reaches better heat radiating effect.This structure assurance semiconductor road lamp internal power type led light source light source is worked in suitable temperature range.
Description of drawings
Fig. 1 semiconductor LED street lamp of the present utility model heat conductive rod structure chart (a) is front view, (b) is vertical view;
Fig. 2 semiconductor LED street lamp of the present utility model heat conduction substrate structure figure (a) is a vertical view, (b) is front view;
The radiator structure figure of Fig. 3 semiconductor LED street lamp of the present utility model.
Mark among the figure:
1 heat conducting base, 2 heat conductive rods, 3 LED, 4 light fixture top shells
The specific embodiment
With example utility model is described further in conjunction with the accompanying drawings:
1, semiconductor LED street lamp heat conductive rod 2 (as Fig. 1) adopts fine aluminium material pole, also can be made by other heat-conductings.Height 100mm, radius 20mm.The top is the inclined-plane, and distributing according to street lamp light requires to make different angles, and the surface makes radius 5mm screwed hole, is used to install led light source 3.The bottom makes radius 8mm screwed hole, as heat conducting base 1 screw fixed hole.Polishing is all done in heat conductive rod 2 tops and bottom.
2, semiconductor LED street lamp heat conducting base 1 (as Fig. 2) adopts the cast aluminium material, also can be made by other heat-conductings.Size of main body is 160mm * 160mm, and heat conducting base 1 upper surface is smooth, is manufactured with the round groove of 4 radius 20mm, the groove surfaces polishing, and the center makes the 8mm through hole.Heat conducting base 1 lower surface is an arc, and its radian is consistent with the road lamp body radian.There is fixed-wing heat conducting base 1 both sides, thickness 10mm, and the center makes radius 8mm through hole.
3, referring to Fig. 3, led light source 3 is installed on the heat conductive rod 2, and is closely fixing by screw, scribbles heat-conducting glue between led light source 3 and the heat conductive rod 2.Heat conductive rod 2 closely is connected in heat conducting base 1 groove by screw, and heat conducting base 1 groove surfaces and heat conductive rod 2 bottom surfaces scribble heat-conducting glue.Heat conducting base 1 closely is connected on the road lamp body by screw, scribbles heat-conducting glue between the two.
Claims (6)
1. semiconductor LED road lamp cooling structure, be used to comprise the semiconductor LED street lamp of a lamp body and at least one led light source, it is characterized in that, on lamp body, be fixed with heat conducting base, the upper surface of heat conducting base is provided with at least one groove that has through hole, be provided with heat conductive rod on the described groove, described heat conductive rod bottom surface be provided with described groove on the screwed hole that matches of through hole, described heat conductive rod is fixed on by screw on the groove of heat conducting base, is fixed with led light source on the top of described heat conductive rod.
2. semiconductor LED road lamp cooling structure according to claim 1 is characterized in that the top of described heat conductive rod is the inclined-plane, between the contact-making surface on led light source and heat conductive rod top for scribbling heat-conducting glue.
3. semiconductor LED road lamp cooling structure according to claim 1 is characterized in that the surface of described heat conductive rod bottom surface and described heat conducting base groove is the burnishing surface that scribbles heat-conducting glue.
4. semiconductor LED road lamp cooling structure according to claim 1 is characterized in that the lower surface of described heat conducting base is curved, and radian is consistent with lamp body inner surface radian.
5. according to claim 1 or 4 described semiconductor LED road lamp cooling structures, it is characterized in that, between the inner surface of described heat conducting base and described lamp body, scribble heat-conducting glue.
6. semiconductor LED road lamp cooling structure according to claim 1 is characterized in that described heat conducting base is the cast aluminium material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200279805U CN201003736Y (en) | 2006-11-02 | 2006-11-02 | Semi-conductor LED road lamp heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200279805U CN201003736Y (en) | 2006-11-02 | 2006-11-02 | Semi-conductor LED road lamp heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201003736Y true CN201003736Y (en) | 2008-01-09 |
Family
ID=39039273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006200279805U Expired - Fee Related CN201003736Y (en) | 2006-11-02 | 2006-11-02 | Semi-conductor LED road lamp heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201003736Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010108305A1 (en) | 2009-03-26 | 2010-09-30 | Yung Pun Cheng | Led lighting lamp |
| CN102095113A (en) * | 2011-03-09 | 2011-06-15 | 翁小翠 | Power type LED (Light Emitting Diode) lamp with high heat conducting property |
| WO2011072457A1 (en) * | 2009-12-18 | 2011-06-23 | 东协金属科技（深圳）有限公司 | Led distribution device, led lamp and led apparatus |
-
2006
- 2006-11-02 CN CNU2006200279805U patent/CN201003736Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010108305A1 (en) | 2009-03-26 | 2010-09-30 | Yung Pun Cheng | Led lighting lamp |
| EP2411727A4 (en) * | 2009-03-26 | 2016-06-08 | Yung Pun Cheng | Led lighting lamp |
| WO2011072457A1 (en) * | 2009-12-18 | 2011-06-23 | 东协金属科技（深圳）有限公司 | Led distribution device, led lamp and led apparatus |
| CN102095113A (en) * | 2011-03-09 | 2011-06-15 | 翁小翠 | Power type LED (Light Emitting Diode) lamp with high heat conducting property |
| CN102095113B (en) * | 2011-03-09 | 2012-06-20 | 翁小翠 | Power type LED (Light Emitting Diode) lamp with high heat conducting property |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Suoen Illuminating (Tianjin) Co., Ltd. Assignor: Yuan Jingyu Contract fulfillment period: 2009.2.26 to 2013.2.25 Contract record no.: 2009120000146 Denomination of utility model: Semi-conductor LED road lamp heat dissipation structure Granted publication date: 20080109 License type: Exclusive license Record date: 20090731 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.2.26 TO 2013.2.25; CHANGE OF CONTRACT Name of requester: THORN LIGHTING ( TIANJIN ) CO., LTD. Effective date: 20090731 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080109 Termination date: 20111102 |