CN201000887Y - Rectifier diode bare crystal structure on radiating fin - Google Patents

Abstract

The utility model relates to a naked crystal structure of rectifier diode on fin, this structure is installed on power supply's fin, electronic component has been installed according to the preface on the circuit board, the fin, and cover in the circuit board outside and be equipped with the casing, and the fin constitutes for electrically conductive material, this fin surface electric connection has naked crystal and forms one of them utmost point electric property of positive negative pole, and the naked crystal top is equipped with the electrically conductive medium of crooked extension and forms another utmost point electric property, so naked crystal can be through fin and electrically conductive medium and circuit board electric connection, because of the direct and fin contact of naked crystal, so naked crystal has good radiating effect.

Description

Bare crystal structure of rectifier diode on heat sink

technical field

The utility model relates to a bare crystal structure of a rectifier diode on a heat sink, which replaces the rectifier diode with an insulating layer on the heat sink, and is used to solve the heat dissipation problem of the rectifier diode installed on the power supply, and the bare crystal structure is installed on the heat sink. The rectifier diode of the crystal, the bare crystal of the rectifier diode is directly connected to the heat sink, and has a good heat dissipation effect.

Background technique

As the mechanical age enters the electronic age, electronic products are becoming more and more common, and electronic components are also changing with each passing day, and are developing in the direction of small size and high efficiency. Due to the advantages of small size, low power consumption, high stability, long life, easy mass production and quick response, the diode quickly replaced the vacuum tube after its appearance, and diodes have also developed types with different functions in response to market demand, but the diode There are also various defects in use and need to be improved. For example, the rectifier diode commonly used in power supplies has the effect of high-frequency rectification, and it pays attention to the ability to withstand voltage, current and heat dissipation. As the temperature rises, its heat dissipation capacity is not enough to cope with the increase in temperature, so that the temperature often exceeds the tolerance range of the diode and causes a short circuit.

Many manufacturers have proposed improvements to this problem, as shown in Figure 6 and Figure 7, a plurality of electronic components A1, heat sink B, rectifier diode B1 and fan C are sequentially installed on the motherboard A, and on the motherboard A The outer side of A is covered with a housing D. The rectifier diode B1 is electrically connected to the transistor and the pin B11, and is coated with epoxy resin on the outside to form a sealing body B12, and the sealing body B12 is made of metal material. The bracket B13 is equipped with a lock hole B131 in the center of the bracket B13 for the screw B3 to penetrate, and the screw B3 is used to penetrate the rectifier diode B1 and the insulator B2 to fix it on the heat sink B. The insulator B2 is used to prevent the bracket B13 from The heat sink B is electrically connected, the pin B11 of the rectifier diode B1 is electrically connected to the motherboard A, and when the rectifier diode B1 starts to rectify, the heat energy of the rectifier diode B1 is dissipated through the heat sink B, so that the rectifier diode B1 does not It will cause a short circuit due to overheating; although this improved design can improve the problem of overheating and short circuit of the rectifier diode B1, the above rectifier diode still has some defects, such as:

1. Because the transistor of the rectifier diode B1 is covered with the encapsulant B12, the heat energy of the transistor needs to pass through the encapsulant B12 when dissipating heat, and because the rectifier diode B1 is fixed on the heat sink B through the insulator B2, the heat energy still needs to pass through the insulator B2 If the bracket B13 is not fully bonded to the insulator B2, there will be a gap in the unbonded part and a heat accumulation effect will be formed, which will affect the heat dissipation effect and prevent the heat from being dissipated smoothly. Although the improved heat dissipation effect is It has been improved, but still has the disadvantages of the above-mentioned designs.

Therefore, how to solve the problems and defects of traditional rectifier diodes is the direction that relevant manufacturers engaged in this industry want to study and improve.

Contents of the invention

The main purpose of this utility model is to provide a rectifier diode bare crystal structure on the heat sink, the outside of the rectifier diode is not coated with an insulating layer, to replace the rectifier diode covered with an insulator on the heat sink, which is called a bare crystal here .

The secondary purpose of this utility model is to provide a rectifier diode bare crystal structure on the heat sink. The circuit board of the power supply is equipped with a heat sink, and the heat sink can be made of conductive material or non-conductive material, and the rectifier diode bare The crystal can be electrically connected with the circuit on the circuit board.

For achieving above-mentioned purpose and effect, an embodiment that the utility model adopts is as follows:

A rectifier diode bare crystal structure on a heat sink, electronic components and a heat sink are installed on a circuit board, and a housing is provided on the outer side of the circuit board, and the features are:

The heat sink is made of a conductive medium material, and a bare rectifier diode crystal is electrically connected to the surface of the heat sink. The bare rectifier diode crystal is not covered with an insulating layer. The positive and negative poles of the crystal, one of the electrodes is electrically connected to the circuit board, and the conductive medium connected with the other electrode of the bare crystal of the rectifier diode is electrically connected to the circuit board.

Wherein, the conductive medium of the heat sink is made of metal material, metal-plated material, conductive graphite or other materials with conductive effect, and one or more electrical contacts or pins are arranged under the heat sink to connect with the electrical connection of the circuit board. connect.

Wherein, the surface of the heat sink is welded, riveted or otherwise electrically connected with one or more bare crystals of rectifier diodes, and the bare crystals of rectifier diodes are fixed with epoxy resin, heat insulating glue or other structures with the same structure. on the heat sink.

In order to achieve the above purpose and effect, another embodiment adopted by the utility model is as follows:

A rectifier diode bare crystal structure on a heat sink, electronic components and a heat sink are installed on a circuit board, and a housing is provided on the outer side of the circuit board, and the features are:

The heat sink is made of a non-conductive material, and the surface of the heat sink is provided with a first circuit and a second circuit electrically connected to the circuit board, and the first circuit is electrically connected to the bare crystal of the rectifier diode to form positive and negative poles One of the electrodes, while the rectifier diode bare crystal is connected to the conductive medium of the other electrode and connected to the second circuit.

Among them, the heat sink is made of non-conductive ceramics or other materials with non-conductive effect, and its surface is welded, riveted or other structures with the same effect. The diode bare crystal is fixed on the heat sink with epoxy resin, thermal insulation glue or other structures with equivalent functions.

Wherein, the first circuit and the second circuit are arranged and extended to the bottom of the heat sink, and are connected with a plurality of electrical contacts or pins to be electrically connected to the circuit board.

Through the above technical features, the utility model has the following beneficial effects:

(1) The bare crystal structure is directly electrically connected to the heat sink, so the heat energy can be directly transmitted to the heat sink without passing through the encapsulant and insulator, and the bare crystal can be closely attached to the heat sink without gaps. Causes the problem of heat accumulation, and has a good heat dissipation effect.

(2) After the heat sink of the current prior art is installed on the main board, the rectifier diode is installed on the heat sink again. Because the main board is equipped with electronic components, it causes difficulties and labor-consuming assembly procedures. The improved The bare crystal of the rectifier diode is connected to the heat sink, and then the heat sink is installed on the circuit board, so there is no assembly problem and the manufacturing process can be reduced.

Description of drawings

Fig. 1 is the three-dimensional exterior view of the utility model.

Fig. 2 is the side view exterior view of preferred embodiment of the utility model.

Fig. 3 is the three-dimensional exploded view of preferred embodiment of the present utility model.

Figure 4 is a side view of another preferred embodiment of the utility model.

Fig. 5 is the three-dimensional exploded view of another preferred embodiment of the present utility model.

Figure 6 is a perspective view of the prior art.

Fig. 7 is the three-dimensional exploded view of prior art.

Explanation of symbols in the figure

1 circuit board

11 Electronic Components 12 Contacts

2 heat sink

21 bare crystal rectifier diode 23 electrical contact

211 Conductive medium 24 The first circuit

22 pins 25 second circuit

3 fans

4 shell

A motherboard

A1 electronic components

B heat sink

B1 rectifier diode B131 keyhole

B11 Pin B2 Insulator

B12 sealing body B3 screw

B13 Bracket

C fan

D body

specific implementation structure

Please refer to Fig. 1, which is a three-dimensional appearance diagram of the present utility model. It can be clearly seen from the figure that the bare crystal structure of the rectifier diode includes a circuit board 1, electronic components 11, heat sink 2, bare crystal rectifier diode 21, Fan 3 and casing 4, wherein:

The circuit board 1 is provided with a plurality of electronic components 11, and the surface of the heat sink 2 is electrically connected with one or more rectifier diode bare crystals 21, and the heat sink 2 is installed at a preset position on the circuit board 1 , and a fan 3 is provided on one side of the circuit board 1 , and a housing 4 is provided on the outer side of the circuit board 1 .

Please refer to shown in Fig. 2 again, it is the side view exterior view of the preferred embodiment of the present utility model, can clearly see that circuit board 1 is provided with heat sink 2 as shown in the figure, and this heat sink 2 can be metal material, Metallized material, conductive graphite or other conductive materials, and the surface of the heat sink 2 can be welded, riveted or other structure with the same effect to electrically connect the rectifier diode bare crystal 21, so that the heat sink 2 2 Form one of the positive and negative poles, and the upper part of the rectifier diode bare crystal 21 can be electrically connected with a conductive medium 211 by welding, ultrasonic riveting or other structures with the same effect, and the conductive medium 211 is electrically connected to the other pole and Bending and extending, the rectifier diode bare crystal 21 is fixed on the heat sink 2 with epoxy resin, heat insulating glue or other structures with the same effect, and one or more pins 22 are provided under the heat sink 2, and the conductive medium The pins 211 and pins 22 can be electrically connected to multiple contacts 12 of the circuit board 1 through through holes or other equivalent structures, so that the rectifier diode bare crystal 21 can operate through the electrical connection of the circuit board 1 .

Please continue to refer to Fig. 3, which is a three-dimensional exploded view of a preferred embodiment of the present invention, one or more than one electrical contact 23 may also be provided below the heat sink 2, and the conductive medium 211 and the electrical contact 23 may be surface Adhesive welding, piercing or other equivalent structures are electrically connected to the plurality of contacts 12 of the circuit board 1 , and also make the rectifier diode bare crystal 21 operate through the electrical connection of the circuit board 1 .

Furthermore, please refer to shown in Figure 4, which is a side view appearance view of another preferred embodiment of the present utility model, it can be clearly seen that the circuit board 1 is provided with a heat sink 2 as shown in the figure, and the heat sink 2 It is made of non-conductive ceramics or other materials with non-conductive effect, and the surface of heat sink 2 is provided with multiple circuits with printing, etching or other structures with the same effect. The multiple circuits can be the first circuit 24, the second circuit circuit 25, and the bottom of the rectifier diode bare crystal 21 is electrically connected to the first circuit 24, and the first circuit 24 is electrically connected to form one of the positive and negative poles, and the top of the rectifier diode bare crystal 21 is welded, riveted or otherwise The structural connection with the same effect is provided with a conductive medium 211, and the other side of the conductive medium 211 is electrically connected to the second circuit 25 with another polarity. The rectifier diode bare crystal 21 is made of epoxy resin and heat insulating glue. Or other structures with the same effect are fixed on the heat sink 2, and the first circuit 24 and the second circuit 25 are arranged and extended to the bottom of the heat sink 2, and a plurality of pins 22 and the first circuit 24 are arranged below the heat sink 2 1. The second circuit 25 is connected, and the pins 22 can be electrically connected to the plurality of contacts 12 of the circuit board 1 through penetration or other structures with equivalent functions, so that the bare crystal 21 can operate through the electrical connection of the circuit board 1 .

Please continue to refer to Fig. 5 , which is a three-dimensional exploded view of another preferred embodiment of the present invention. A plurality of electrical contacts 23 are provided below the heat sink 2 to connect with the first circuit 24 and the second circuit 25. The electrical contacts 23 can be electrically connected to the plurality of contacts 12 of the circuit board 1 by surface mount soldering or other structures with equivalent functions, and also make the bare crystal 21 operate through the electrical connection of the circuit board 1 .

To sum up, the rectifier diode bare crystal 21 is directly electrically connected to the heat sink 2, and is electrically connected to the circuit board 1 through components such as circuits, pins, and contacts, so that the rectifier diode bare crystal 21 can be fully operated. It has the function of rectification and has a good heat dissipation effect. The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. The bare crystal structure of the rectifier diode on the heat sink of the utility model can be Reach the purpose of reducing manufacturing process, saving cost, increasing space and good heat dissipation, so all structures and devices that can achieve the aforementioned effects should be covered by the utility model, and such simple modifications and equivalent structural changes should be included in the same reason Within the patent scope of the present utility model, Chen Ming is jointly granted.

Therefore, this utility model is mainly aimed at the bare crystal structure of rectifier diodes, and a heat sink is provided on the circuit board, and the bare crystal is directly electrically connected to the heat sink, and the main protection focus is to improve the heat dissipation effect. The above description is only for this practical application. It is just a new preferred embodiment, and it does not limit the patent scope of the utility model. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the utility model should be included in the utility model in the same way. Within the scope of the patent, he agreed with Chen Ming.

In summary, the bare crystal structure of the rectifier diode on the heat sink of the present invention can indeed achieve its efficacy and purpose when used, so the present utility model is a design with excellent practicability, which meets the requirements of patent application and is proposed according to law. Apply.

Claims (6)

1. A rectifier diode bare crystal structure on a heat sink, an electronic component and a heat sink are installed on a circuit board, and the circuit board outer cover is provided with a housing, which is characterized in that: The heat sink is made of a conductive medium material, and a bare rectifier diode crystal is electrically connected to the surface of the heat sink. The bare rectifier diode crystal is not covered with an insulating layer. The positive and negative poles of the crystal, one of the electrodes is electrically connected to the circuit board, and the conductive medium connected with the other electrode of the rectifier diode bare crystal is electrically connected to the circuit board. 2. The rectifier diode bare crystal structure on the heat sink as claimed in claim 1, wherein the conductive medium of the heat sink is made of metal material, metal-plated material, conductive graphite or material with conductive effect, and the heat dissipation One or more electrical contacts or pins are provided under the chip to be electrically connected with the circuit board. 3. The rectifier diode bare crystal structure on the heat sink as claimed in claim 1, wherein the surface of the heat sink is electrically connected with one or more rectifier diode bare crystals by welding, riveting or a structure with equivalent effects , and the bare crystal of the rectifier diode is fixed on the heat sink with epoxy resin, thermal insulation glue or a structure with the same effect. 4. A rectifier diode bare crystal structure on the heat sink, electronic components and heat sinks are installed on the circuit board, and the outer cover of the circuit board is provided with a housing, which is characterized in that: The heat sink is made of a non-conductive material, and the surface of the heat sink is provided with a first circuit and a second circuit electrically connected to the circuit board, and the first circuit is electrically connected to the bare crystal of the rectifier diode to form positive and negative poles One of the electrodes, while the rectifier diode bare crystal is connected to the conductive medium of the other electrode and connected to the second circuit. 5. The rectifier diode bare crystal structure on the heat sink as claimed in claim 4, wherein the heat sink is made of non-conductive ceramics or a material with non-conductive effect, and its surface is welded, riveted or has the same The functional structure is connected with one or more bare crystals of the rectifier diodes, and the bare crystals of the rectifier diodes are fixed on the heat sink with epoxy resin, heat insulating glue or structures with equivalent functions. 6. The bare crystal structure of a rectifier diode on a heat sink as claimed in claim 4, wherein the first circuit and the second circuit are arranged to extend below the heat sink, and are connected with a plurality of electrical contacts or pins and the circuit The board is electrically connected.

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