CN201004240Y - Memory card packaging structure - Google Patents

Abstract

A memory card package structure includes a printed circuit board and at least one chip package, wherein the upper surface of the printed circuit board is provided with a plurality of bonding pads, the lower surface of the printed circuit board is provided with an exposed golden finger, each chip package includes at least one chip and a substrate, at least one layer of wiring is arranged in the substrate, the wiring is provided with a plurality of conductive terminals exposed on the lower surface of the substrate, and the conductive terminals are adhered to the bonding pads and electrically conducted. The utility model discloses can set up multilayer wiring in the base plate in order to increase the degree of freedom and the elasticity of encapsulation design to can adopt the function and the storage capacity of stacked multichip encapsulation in order to increase the memory card.

Description

Memory card package structure

technical field

The utility model relates to a memory card packaging structure, in particular to a memory card packaging structure using a chip package body and using a substrate as a chip seat.

Background technique

Memory card is a very light and portable data storage device. With the advancement of technology, memory card has been widely used in various electronic devices, such as personal computer (Personal Computer, PC), mobile phone (cell phone), digital camera (Digital Camera, DC), digital video camera (Digital Video, DV) and personal digital assistant (Personal Digital Assistant, PDA)... etc., according to the different needs of various applications, there are many different types of memory cards Size, appearance and specifications, such as: digital security card (Secure Digital card, SDcard), mini digital security card (mini SD card), micro SD card (micro SD card, μSD card), multimedia card (Multi Media Card, MMC) and flash memory card (CompactFlash card, CF card)...etc.

Generally speaking, a memory card includes at least one chip (chip), such as a flash memory (flash memory) chip, and the chip can be directly bonded on a printed circuit board (Printed Circuit Board, PCB) to be electrically connected with it; The chip package, such as a DRAM (Dynamic Random Access Memory, DRAM), is adhered and electrically connected to the printed circuit board.

A known chip package for a memory card, such as a ThinSmall Out-Line Package (TSOP), uses a lead frame to carry the chip and is electrically connected to the printed circuit board, as shown in Figure 1 It is a schematic cross-sectional view of a known thin and small-sized package body 1, and FIG. 2 is a schematic top view thereof. A chip 12 is arranged on a chip carrier (chip carrier) 142 of a lead frame 14. The lead frame 14 has a plurality of external leads. (outer lead) 144, and the chip 12 is electrically connected to the lead frame 14 by a plurality of bonding wires (bonding wire) 16, and a packaging colloid (molding compound) 18 covers the chip 12 and the chip socket 142, and exposes the outer pin 144.

FIG. 3 is a schematic top view of a known printed circuit board 2, the upper surface of the printed circuit board 2 is provided with a plurality of solder pads (solder pad) 22.

FIG. 4 is a schematic top view of a known memory card package structure 3. A plurality of external pins 144 of the thin small-size package 1 are adhered to and electrically connected to a plurality of welding pads 22 of the printed circuit board 2, and the resistance (resistor ), capacitors or inductors and other passive components 32 are disposed on the printed circuit board 2 and electrically connected with it.

As mentioned above, because the thin small size package uses the lead frame as the chip holder, and the thickness of the thin small size package has its specification limit, it is not suitable for the stacked-type multi-chip package structure (Stacked-type Multi Chip Package, Stacked-type Multi Chip Package, St .MCP), and due to limited space, passive components are not easy to be placed in a thin and small-sized package. Therefore, the conventional chip package using a lead frame limits the function and capacity of the memory card and cannot be further improved.

Utility model content

In order to solve the above problems, one of the purposes of this utility model is to provide a memory card packaging structure of a chip package with a substrate as a chip seat, which can be applied to digital security cards, mini digital security cards, miniature Digital security card and multimedia card or flash memory card...etc.

One of the purposes of the present invention is to provide a memory card packaging structure, which adopts a flip chip chip packaging body.

One of the purposes of the present invention is to provide a memory card packaging structure, which adopts a stacked multi-chip packaging chip package.

Therefore, the chip package body of the memory card of the present utility model adopts the substrate as the chip holder and has many advantages: 1. Multi-layer wiring (trace) can be arranged in the substrate to increase the freedom and flexibility of the packaging design, and a stacked multi-layer trace can be used. Chip packaging to increase the function and storage capacity of the memory card; 2. Passive components can be placed in the chip package to save the packaging space of the printed circuit board, so more than two chip packages can be set on the printed circuit board to further increase the memory The function and storage capacity of the card.

In order to achieve the above object, the memory card package structure of an embodiment of the present invention includes: a printed circuit board, which has a first upper surface and a first lower surface, the first lower surface is provided with an exposed golden finger, And the first upper surface is provided with a plurality of welding pads; and at least one chip package, each chip package includes at least one chip and a substrate, the substrate has a second upper surface and a second lower surface, the chip package is set On the second upper surface, at least one layer of wiring is arranged inside the substrate, and the wiring has a plurality of conductive terminals exposed on the second lower surface, and the conductive terminals are adhered to the pads and are electrically connected.

The following will be described in detail through specific embodiments in conjunction with the accompanying drawings, so that it is easier to understand the purpose, technical content, characteristics and effects of the present utility model.

Description of drawings

FIG. 1 and FIG. 2 are respectively a schematic cross-sectional view and a schematic top view of a thin and small-sized package in the prior art;

FIG. 3 is a schematic top view of a prior art printed circuit board;

4 is a schematic top view of a memory card packaging structure in the prior art;

5 and 6 are respectively a schematic cross-sectional view and a schematic bottom view of a chip package according to an embodiment of the present invention;

7 is a schematic top view of a printed circuit board according to an embodiment of the present invention;

FIG. 8 is a schematic top view of a memory card packaging structure according to an embodiment of the present invention;

9 and 10 are schematic cross-sectional views of the packaging structure of the memory card according to the embodiment of the present invention;

11 and 12 are schematic cross-sectional views of a chip package according to an embodiment of the present invention;

13 is a schematic top view of a memory card packaging structure according to an embodiment of the present invention;

14 is a schematic cross-sectional view of a chip package according to an embodiment of the present invention;

FIG. 15 is a schematic top view of a memory card package structure according to an embodiment of the present invention.

Explanation of symbols in the figure

1 Thin small size package

12 chips

14 lead frame

142 chip socket

144 external pins

16 welding wire

18 Encapsulation colloid

2 printed circuit board

22 solder pads

3 Memory card packaging structure

32 passive components

4. 4' chip package

42 chips

44 Substrate (including upper and lower surfaces, referred to as the second upper and lower surfaces in this case)

442 Wiring

4422 Conductive terminals

46 welding wire

48 Encapsulation colloid

49 passive components

5. 5' printed circuit board (including the upper and lower surfaces, referred to as the first upper and lower surfaces in this case

lower surface)

52 solder pads

54 Goldfinger

6, 7, 7' memory card package structure

72 Upper cover

74 Encapsulation colloid

8, 8' chip package

81, 82, chip

83

84, 85 Substrate

842、 Wiring

852

86 solder balls

87 welding wire

9. 9' memory card packaging structure

92 passive components

Detailed ways

The detailed description is as follows, and the preferred embodiment is only for illustration but not for limiting the utility model.

5 and 6 are respectively a schematic cross-sectional view and a schematic bottom view of a chip package 4 according to an embodiment of the present invention, at least one chip package 4, the chip package 4 includes at least one chip 42 and a substrate 44, the substrate 44 It has a second upper surface and a second lower surface, and a chip 42 is arranged on the second upper surface of a substrate 44, that is, the chip package 4 is arranged on the second upper surface of the substrate; the substrate 44 has a layer of wiring 442 inside , the wiring 442 has a plurality of conductive terminals 4422 exposing the second lower surface of the substrate 44, a plurality of bonding wires 46 electrically connect the chip 42 and the substrate 44, and an encapsulant 48 covers the bonding wires 46 and the second upper surface of the substrate 44 and the chip 42, and expose the second lower surface of the substrate 44. In one embodiment, the encapsulant 48 is made of epoxy resin.

FIG. 7 is a schematic top view of a printed circuit board 5 according to an embodiment of the present invention. The first upper surface of the printed circuit board 5 is provided with a plurality of welding pads 52 .

FIG. 8 is a schematic top view of a memory card packaging structure 6 according to an embodiment of the present invention. A printed circuit board 5 has a first upper surface and a first lower surface. The first lower surface is provided with an exposed gold plate. The finger 54 (as shown in FIG. 9 ), the chip package 4 is disposed on the first upper surface of the printed circuit board 5 , and the conductive terminal 4422 (not shown in the figure) is adhered to the pad 52 and is electrically connected.

Therefore, one of the features of the memory card packaging structure of the present invention is that it includes a chip package, and it uses the substrate as the chip socket. Therefore, the memory card packaging structure of the present utility model can be applied to memory cards of different sizes, shapes and specifications, such as digital security cards, mini digital security cards, miniature digital security cards, multimedia cards or flash memory cards...etc. , but not limited to this.

Continuing the above description, after completing the bonding of the chip package, use a cover or an encapsulant to cover the chip package and the upper surface of the substrate to protect the memory card and prevent damage to the memory card caused by external force or dust pollution; please refer to Figure 9 , FIG. 9 is a schematic cross-sectional view of a memory card packaging structure 7 according to an embodiment of the present invention. An upper cover 72 is used to cover the first upper surface of the chip package 4 and the printed circuit board 5, and expose the printed circuit board 5. The first lower surface of the first lower surface; a golden finger (golden finger) 54 is exposed on the first lower surface of the printed circuit board 5, when the memory card is inserted into the slot of an electronic device (not shown), the golden finger 54 is used as an electronic device An electrical connection terminal for power transmission and data exchange with the memory card. Please refer to FIG. 10, which is a schematic cross-sectional view of a memory card packaging structure 7' according to another embodiment of the present invention. FIG. 10 is different from the memory card packaging structure 7 in FIG. 9. The memory card packaging structure 7' in FIG. The first upper surface of the chip package body 4 and the printed circuit board 5 is covered with a packaging compound 74 .

Those who have ordinary knowledge of this technology should understand that the present invention can be applied to various chips and chip packages, such as flash memory chips and dynamic random access memory; The package can be applied to various packaging structures, such as flip-chip chip packaging. Please refer to FIG. 11 , which is a schematic cross-sectional view of a chip package 8 according to an embodiment of the present invention. The active surface of the chip 82 faces the second upper surface of the substrate 84 , and the chip 82 is electrically connected to the wiring 842 of the substrate 84 by a plurality of flipballs 86 .

Because the utility model uses the substrate as the chip socket, there is enough space inside the chip package for stacked multi-chip packaging. Please refer to FIG. 12, which is a schematic cross-sectional view of a chip package 8' according to another embodiment of the utility model. The chip package 8' is a stacked multi-chip package, which includes a chip 81 and a chip 83 stacked on a substrate 85. In this embodiment, the chip 81 and the chip 83 are electrically connected to the substrate 85 by bonding wires 87 In another embodiment, other methods such as solder balls can also be used. Therefore, according to the spirit of the present invention, all memory card packaging structures that use chip packages and use the substrate as a chip socket are covered by the scope of the present invention. , and will not be repeated here.

In addition, another advantage of using the substrate as a chip holder is that multiple layers of wiring can be provided inside the substrate to increase the freedom and flexibility of packaging design. For example, there are two layers of wiring 852 inside the substrate 85 (please refer to FIG. 12 again).

Generally speaking, memory cards must have passive components such as resistors, capacitors, or inductors to achieve functions such as filtering noise. Please refer to FIG. 4 is disposed on the first upper surface of the printed circuit board 5 , and passive components 92 such as resistors, capacitors or inductors are also disposed on the first upper surface of the printed circuit board 5 and are electrically connected to the printed circuit board 5 .

Moreover, because the utility model uses the substrate as the chip socket inside the chip package has a larger space, passive components such as resistors, capacitors or inductors can be packaged inside the chip package to save the packaging space of the printed circuit board, Please refer to FIG. 14 , which is a schematic cross-sectional view of a chip package 4' according to an embodiment of the present invention. The chip package 4' includes at least one passive element 49 disposed on the second upper surface of the substrate 44 and connected to the substrate 44. electrical connection.

As mentioned above, because the passive components of the present invention can be packaged inside the chip package, the space saved on the printed circuit board can be used to repackage more than one chip package in the same memory card, please refer to FIG. A schematic top view of a memory card package structure 9' according to a new embodiment, two chip packages 4' are arranged on a printed circuit board 5' to increase the function and storage capacity of the memory card.

In summary, the chip package of the memory card of the present invention adopts the substrate as the chip socket and has many advantages: 1. Multi-layer wiring can be arranged in the substrate to increase the freedom and flexibility of the package design, and a stacked multi-layer can be used. Chip packaging to increase the function and storage capacity of the memory card; 2. Passive components can be placed inside the chip package to save the packaging space of the memory card, so more than two chip packages can be set on the printed circuit board to further increase the memory The function and storage capacity of the card.

The above-described embodiments are only to illustrate the technical ideas and characteristics of the present utility model, and its purpose is to enable those skilled in this art to understand the content of the present utility model and implement it accordingly, and should not limit the patent of the present utility model with this scope, that is, all equivalent changes or modifications made according to the spirit disclosed in the utility model should still be covered within the patent scope of the utility model.

Claims (17)

1. A memory card packaging structure, characterized in that it comprises: A printed circuit board, which has a first upper surface and a first lower surface, the first lower surface is provided with an exposed gold finger, and the first upper surface is provided with a plurality of welding pads; and At least one chip package, the chip package includes at least one chip and a substrate, the substrate has a second upper surface and a second lower surface, the chip package is arranged on the second upper surface, and the inner part of the substrate is There is at least one layer of wiring, and the wiring has a plurality of conductive terminals exposed on the second lower surface, and the conductive terminals are adhered to the pads and are electrically connected. 2. The memory card packaging structure according to claim 1, characterized in that it comprises an upper cover, which covers the first upper surface of the printed circuit board and the chip package, and exposes the printed circuit board. the first lower surface. 3. The packaging structure of the memory card according to claim 1, characterized in that it comprises a packaging compound, which covers the first upper surface of the printed circuit board and the chip package, and exposes the printed circuit board. the first lower surface. 4. The memory card packaging structure as claimed in claim 1, wherein the packaging colloid is made of epoxy resin. 5 . The memory card packaging structure as claimed in claim 1 , comprising at least one passive element disposed on the first upper surface of the printed circuit board and electrically connected to the printed circuit board. 6. The package structure of the memory card according to claim 5, wherein the passive element is a resistor, a capacitor or an inductor. 7. The memory card packaging structure of claim 1, wherein the chip package includes a plurality of bonding wires electrically connecting the chip and the substrate. 8. The memory card packaging structure according to claim 1, wherein the chip package comprises at least one packaging compound, which covers the second upper surface of the substrate of the chip package and the chip, and exposes out of the second lower surface of the substrate of the chip package. 9. The memory card packaging structure as claimed in claim 8, wherein the packaging colloid is made of epoxy resin. 10 . The memory card packaging structure according to claim 1 , wherein the chip package is a stacked chip package comprising a plurality of chips stacked on the substrate, and the chips are electrically connected to the substrate. 11 . 11. The memory card packaging structure of claim 10, comprising a plurality of bonding wires electrically connecting the chips and the substrate. 12. The memory card packaging structure according to claim 1, wherein the chip package is a flip-chip chip package, the active surface of the chip faces the second upper surface, and the chip is connected with a plurality of solder balls. The substrate is electrically connected. 13 . The memory card packaging structure of claim 1 , wherein the chip package comprises at least one passive element disposed on the second upper surface of the substrate and electrically connected to the substrate. 14 . 14. The package structure of the memory card according to claim 13, wherein the passive element is a resistor, a capacitor or an inductor. 15. The memory card packaging structure of claim 1, wherein the memory card is a digital security card, a mini digital security card, a micro digital security card, a multimedia card or a flash memory card. 16. The memory card packaging structure of claim 1, wherein the chip package is a dynamic random access memory. 17. The memory card packaging structure as claimed in claim 1, wherein the chip is a flash memory chip.

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