CN204168701U - Graphite heat conducting foam liner - Google Patents
Graphite heat conducting foam liner Download PDFInfo
- Publication number
- CN204168701U CN204168701U CN201420675462.9U CN201420675462U CN204168701U CN 204168701 U CN204168701 U CN 204168701U CN 201420675462 U CN201420675462 U CN 201420675462U CN 204168701 U CN204168701 U CN 204168701U
- Authority
- CN
- China
- Prior art keywords
- graphite
- heat
- paster
- heat conduction
- foam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 75
- 239000010439 graphite Substances 0.000 title claims abstract description 75
- 239000006260 foam Substances 0.000 title claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000007306 turnover Effects 0.000 claims abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of graphite heat conducting foam liner, comprise cubical heat conduction foam, heat conduction foam surrounding outer wall is coated with one deck graphite paster, heat conduction foam and graphite paster are fit together by bonding material layer, described graphite paster is unitary piece of material, both sides are coated on heat conduction foam after turnover, the edge of graphite paster both sides contacts with each other, the outer surface being positioned at the graphite paster of heat conduction foam front and two sides is all arranged with many radiating grooves in parallel, and one end of described radiating groove extends transverse to the edge of graphite paster.The graphite chip surface of graphite heat conducting foam liner is provided with radiating groove, adds the surface area of graphite paster and extraneous contact, improves radiating efficiency.Graphite paster is full wafer, adds the efficiency of graphite paster heat transfer on adjacently situated surfaces.Radiating groove one end extends to edge, has opening, defines passage of heat, further increases radiating efficiency.And the other end of radiating groove does not extend to edge, make graphite paster form a heat bridge at the other end, heat is delivered to fast on the ridge formed between each radiating groove and radiating groove, increase the efficiency of heat transfer and heat radiation.
Description
Technical field
The utility model relates to a kind of heat abstractor, specifically, is a kind of graphite heat conducting foam liner.
Background technology
Along with developing rapidly of microelectronics integrated technology and high density PCB packaging technology, packaging density improves rapidly, and electronic component, logical circuit volume thousands of times of ground reduce, and electronic instrument and equipment are day by day towards light, thin, short, little future development.Under high-frequency work frequency, semiconductor operating thermal environment is to the movement rapidly of high temperature direction, now, the heat run-up that electronic devices and components produce, increase, at environment for use temperature, electronic devices and components still can normally be worked with high reliability, and timely heat-sinking capability becomes the critical limiting factor affecting its useful life.For ensureing components and parts operational reliability, the material of the excellent combination property such as high reliability, high thermal conductivity need be used, rapidly, in time the heat that heater element gathers is passed to heat dissipation equipment, ensure that electronic equipment normally runs.
Traditional heat-dissipating material is generally copper or aluminium, at present no matter chip package or product systems heat radiation, is all with the heat radiation of this bi-material nothing more than or coordinates silica gel, fan and flow liquid to form cooling system.Greatly, radiating effect is also undesirable for copper and aluminum processing and manufacturing difficulty.
Graphite material heat dispersion is fine, uses graphite radiating just better can play the effect of heat radiation, if need thicker heat radiation graphite price too high, processing and manufacturing difficulty is large, not easily makes; And graphite itself does not have elasticity, the intensity between material is weak, can be torn easily.
Propose a kind of device utilizing graphite radiating at first patent " graphite heat conducting foam " (publication number: CN103533806A), although final result the problems referred to above, still come with some shortcomings, the area of dissipation of graphite is less, and heat-sinking capability is still limited.
Utility model content
The utility model is little for current graphite heat conducting foam area of dissipation, and the problems such as heat-sinking capability is limited, devise a kind of new graphite heat conducting foam liner.
Graphite heat conducting foam liner of the present utility model, comprise cubical heat conduction foam, heat conduction foam surrounding outer wall is coated with one deck graphite paster, heat conduction foam and graphite paster are fit together by bonding material layer, described graphite paster is unitary piece of material, both sides are coated on heat conduction foam after turnover, the edge of graphite paster both sides contacts with each other, the outer surface being positioned at the graphite paster of heat conduction foam front and two sides is all arranged with many radiating grooves in parallel, and one end of described radiating groove extends transverse to the edge of graphite paster.
Preferably, the cross section of described radiating groove is inverted trapezoidal.
Preferably, the junction of described graphite paster both sides of the edge is positioned at the back side of heat conduction foam, is positioned on the graphite paster on the heat conduction foam back side and is bonded with two-sided tape.
Preferably, the direction that on adjacently situated surfaces, radiating groove extends is contrary.
Preferably, the thickness of described graphite paster is 0.03mm ~ 0.13mm.
Preferably, the density of described heat conduction foam is 25Kg/m
3~ 60Kg/m
3.
The beneficial effects of the utility model are: the graphite chip surface of graphite heat conducting foam liner is provided with radiating groove, adds the surface area of graphite paster and extraneous contact, improves radiating efficiency.Graphite paster is full wafer, adds the efficiency of graphite paster heat transfer on adjacently situated surfaces.Radiating groove one end extends to edge, has opening, defines passage of heat, further increases radiating efficiency.And the other end of radiating groove does not extend to edge, make graphite paster form a heat bridge at the other end, heat is delivered to fast on the ridge formed between each radiating groove and radiating groove, increase the efficiency of heat transfer and heat radiation.
The cross section of radiating groove can be inverted trapezoidal, while increase graphite chip surface is long-pending, makes graphite chip surface outside as far as possible, optimizes heat dissipation channel, improve radiating efficiency.
The junction of graphite patch edges is positioned at the back side, ensure that the radiating efficiency of other three graphite pasters, and this position is attached on electronic devices and components by two-sided tape again, too increases the aesthetics after installation.
On adjacently situated surfaces, radiating groove can extend in the opposite direction, makes the S-shaped trend of heat-conductive bridges that graphite paster is formed, extends heat bang path, extends the distribution of heat in graphite paster outermost surfaces, improves radiating efficiency.
Accompanying drawing explanation
Accompanying drawing 1 is the structure chart of this graphite heat conducting foam liner.
Embodiment
Graphite heat conducting foam liner of the present utility model, as shown in Figure 1, comprises cubical heat conduction foam 1, and heat conduction foam 1 surrounding outer wall is coated with one deck graphite paster 2, and heat conduction foam 1 and graphite paster 2 are fit together by bonding material layer 3.The thickness of graphite paster 2 is 0.03mm ~ 0.13mm, and the density of heat conduction foam 1 is 25Kg/m
3~ 60Kg/m
3.
Graphite paster 2 is unitary piece of material, and both sides are after turnover, and be coated on heat conduction foam 1, the edge of graphite paster 2 both sides contacts with each other.The junction 5 of graphite paster 2 both sides of the edge is positioned at the back side of heat conduction foam 1, is positioned on the graphite paster 2 on heat conduction foam 1 back side and is bonded with two-sided tape 6, and graphite heat conducting foam liner is bonded in the electronic devices and components of needs heat radiation on the surface by two-sided tape 6.
The outer surface being positioned at the graphite paster 2 of heat conduction foam 1 front and two sides is all arranged with many radiating grooves 4 in parallel, and the cross section of radiating groove 4 can be rectangle, also can be trapezoidal.One end of radiating groove 4 extends transverse to the edge of graphite paster 2, forms an opening; The other end does not extend to the edge of graphite paster 2, makes graphite paster 2 form a heat-conductive bridges on edge.
The direction that on adjacently situated surfaces, radiating groove 4 extends can be identical, also can be contrary.When bearing of trend is identical, heat-conductive bridges is all positioned at same one end, adds heat transfer rate; When bearing of trend is contrary, adjacent heat-conductive bridges is positioned at different end, forms the heat bang path of S shape.
Claims (6)
1. a graphite heat conducting foam liner, comprise cubical heat conduction foam (1), heat conduction foam (1) surrounding outer wall is coated with one deck graphite paster (2), heat conduction foam (1) and graphite paster (2) are fit together by bonding material layer (3), it is characterized in that, described graphite paster (2) is unitary piece of material, both sides are coated on heat conduction foam (1) after turnover, the edge of graphite paster (2) both sides contacts with each other, the outer surface being positioned at the graphite paster (2) of heat conduction foam (1) front and two sides is all arranged with many radiating grooves (4) in parallel, one end of described radiating groove (4) extends transverse to the edge of graphite paster (2).
2. graphite heat conducting foam liner according to claim 1, is characterized in that, the cross section of described radiating groove (4) is inverted trapezoidal.
3. graphite heat conducting foam liner according to claim 1, it is characterized in that, the junction (5) of described graphite paster (2) both sides of the edge is positioned at the back side of heat conduction foam (1), is positioned on the graphite paster (2) on heat conduction foam (1) back side and is bonded with two-sided tape (6).
4. graphite heat conducting foam liner according to claim 1, is characterized in that, the direction that on adjacently situated surfaces, radiating groove (4) extends is contrary.
5. graphite heat conducting foam liner according to claim 1, is characterized in that, the thickness of described graphite paster (2) is 0.03mm ~ 0.13mm.
6. graphite heat conducting foam liner according to claim 1, is characterized in that, the density of described heat conduction foam (1) is 25Kg/m
3~ 60Kg/m
3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420675462.9U CN204168701U (en) | 2014-11-13 | 2014-11-13 | Graphite heat conducting foam liner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420675462.9U CN204168701U (en) | 2014-11-13 | 2014-11-13 | Graphite heat conducting foam liner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204168701U true CN204168701U (en) | 2015-02-18 |
Family
ID=52542342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420675462.9U Expired - Fee Related CN204168701U (en) | 2014-11-13 | 2014-11-13 | Graphite heat conducting foam liner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204168701U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953193A (en) * | 2016-06-21 | 2016-09-21 | 太仓鸿鑫精密压铸有限公司 | LED light heat sink |
| CN108475830A (en) * | 2016-08-26 | 2018-08-31 | 株式会社Lg化学 | Heat dissipation material, method of manufacturing heat dissipation material, and battery module including heat dissipation material |
| CN111988958A (en) * | 2020-08-04 | 2020-11-24 | 陆皓 | Hot graphite sponge |
| US10901259B2 (en) | 2018-01-02 | 2021-01-26 | Boe Technology Group Co., Ltd. | Shading tape, backlight unit and display device |
| CN113384006A (en) * | 2021-06-01 | 2021-09-14 | 深圳麦克韦尔科技有限公司 | Battery pack and electronic atomization device |
-
2014
- 2014-11-13 CN CN201420675462.9U patent/CN204168701U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105953193A (en) * | 2016-06-21 | 2016-09-21 | 太仓鸿鑫精密压铸有限公司 | LED light heat sink |
| CN108475830A (en) * | 2016-08-26 | 2018-08-31 | 株式会社Lg化学 | Heat dissipation material, method of manufacturing heat dissipation material, and battery module including heat dissipation material |
| CN108475830B (en) * | 2016-08-26 | 2022-04-26 | 株式会社Lg新能源 | Heat dissipation material, method of manufacturing the same, and battery module including the same |
| US10901259B2 (en) | 2018-01-02 | 2021-01-26 | Boe Technology Group Co., Ltd. | Shading tape, backlight unit and display device |
| CN111988958A (en) * | 2020-08-04 | 2020-11-24 | 陆皓 | Hot graphite sponge |
| CN113384006A (en) * | 2021-06-01 | 2021-09-14 | 深圳麦克韦尔科技有限公司 | Battery pack and electronic atomization device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204168701U (en) | Graphite heat conducting foam liner | |
| CN205920959U (en) | A radiator and an air conditioner for reducing the temperature of an air conditioner controller chip | |
| CN205161023U (en) | Liquid metal base heat conduction membrane composite construction | |
| US7295441B1 (en) | Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe | |
| CN107871723A (en) | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment | |
| CN2831718Y (en) | Radiation boards | |
| CN201830604U (en) | Flexible heat dissipation device | |
| CN203251557U (en) | Heat dissipation device for electronic device | |
| CN103874391B (en) | Radiator and method of manufacturing the same | |
| CN204442828U (en) | A kind of PCB of high efficiency and heat radiation | |
| CN102623540B (en) | Heat radiation structure | |
| CN211406665U (en) | Server mainboard heat abstractor | |
| CN204578881U (en) | Heat radiation type flexible circuit board | |
| CN107396618A (en) | A kind of fin of good insulating | |
| CN104392971B (en) | A kind of watchband-shaped contactor formula heat conducting device | |
| CN109920904B (en) | Heat radiation structure of high-power GaN-based LED and processing technology | |
| WO2012135988A1 (en) | Led radiator | |
| CN206237732U (en) | A kind of heat abstractor and the Intelligent hardware with it | |
| CN205176774U (en) | Take fin of graphite alkene bed course | |
| CN212164023U (en) | An FMC interface board radiator | |
| CN204005868U (en) | LED radiator | |
| CN210670777U (en) | A Servo Driver Circuit Structure Using Embedded Power Chip | |
| CN202134575U (en) | LED cooling substrate | |
| CN204946906U (en) | A kind of middle low power frequency converter IGBT (PCC) power | |
| CN207651473U (en) | A kind of alternative radiator nanometer heat radiating fin structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 266200 No. three, No. 50 Tianshan Road, Jimo, Shandong, Qingdao Patentee after: Qingdao Zhuo Ying Polytron Technologies Inc Address before: 266200 No. three, No. 50 Tianshan Road, Jimo, Shandong, Qingdao Patentee before: QingDao Joinset Science & Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 Termination date: 20191113 |