CN1905220A - LED packaging structure - Google Patents

Abstract

A light-emitting diode packaging structure includes a carrier and a light-emitting diode chip. The surface of the carrier has an insulating layer and a conductive layer. The surface of the carrier is recessed downwards to form a concave cup, and the bottom of the concave cup rises upwards to form a convex seat. The height of the top surface of the convex seat is preferably equal. Or higher than the level of the surface of the conductive layer; the light emitting diode chip is arranged on the top surface of the convex seat, which has better luminous effect and heat dissipation effect. An encapsulation resin seals and protects the LED chip. A condensing mask is fixed on the carrier corresponding to the encapsulation resin.

Description

Light-emitting diode packaging structure

technical field

The invention relates to a package structure, especially a light-emitting diode package structure, which can improve the light-emitting and heat dissipation effects of the light-emitting diode.

Background technique

Because light emitting diodes (Light Emitting Diode, LED) have a long service life and low power consumption, especially in the current situation of rising energy costs, light emitting diodes are more valued and utilized by the industry to replace Other light-emitting components that consume a lot of power in the past.

Please refer to FIG. 1 , which is a schematic cross-sectional view of a conventional LED packaging structure. The existing LED packaging structure 1 includes: a carrier 11 , a LED chip 12 and a packaging resin 13 . There is an insulating layer 111 on the surface of the carrier 11, and a conductive layer 112 composed of conductive lines is arranged on the surface of the insulating layer. The surface of the carrier is recessed downward to form a concave cup portion 113; the light-emitting diode chip 12 is arranged at the bottom of the concave cup portion 113 114 , there are two wires 121 connected between the two electrodes of the LED chip 12 and the conductive layer 112 ; the encapsulating resin 13 seals the LED chip 12 and the wires 121 . The light-emitting diode chip 12 is electrically connected to the conductive layer 112 through its wire 121 , and emits light from the top surface and surrounding sides of the light-emitting diode chip 12 .

However, in the above-mentioned existing LED packaging structure 1, since its LED chip 12 is arranged at the bottom 114 of the concave cup portion 113, the light emitted by the LED chip 12, except the light generated on its top surface, is not received by the concave cup portion. 113 obstructs and will directly emit outward; in addition, most of the light generated by the side of the light-emitting diode chip 12 will be emitted outward after being reflected by the inner wall 115 of the concave cup portion 113. However, due to the incident angle of the light at each part Therefore, when the light travels, it will interfere with other light rays with different incident angles and reflection angles, resulting in loss, that is, the luminous flux is poor. In other words, due to the impact of reflection interference and loss, the luminous flux generated by the light emitting diode chip 12 in the existing LED packaging structure 1 can only emit 90% of the light in the best case, and part of the light is in the reflection process. The mutual interference in the light source is lost, thus reducing the brightness of the light emitted by the light emitting diode chip 12 to the outside.

Furthermore, when the light-emitting diode chip is converted from electrical energy to light energy during use, it will generate heat and high temperature. When it rises by 1°C, the brightness of the light-emitting diode chip will decrease by 0.9%. The effect of diode brightness is extremely important.

In the conventional LED packaging structure 1 described above, the LED chip 12 is disposed on the bottom 114 of the concave cup portion 113 to be in contact with each other. Therefore, the bottom 114 and the inner wall 115 of the concave cup portion 113 can be used as a surface area for the LED chip 12 to dissipate heat. However, the heat dissipation surface area is still limited, so the heat dissipation effect is still not obvious, and the luminous brightness of the LED chip 12 is relatively reduced.

Contents of the invention

The main purpose of the present invention is to provide a light emitting diode packaging structure, which can reduce the reflection loss and provide better luminous flux, thereby improving the luminous effect.

Another object of the present invention is to provide a light-emitting diode packaging structure, which can provide better heat dissipation, thereby improving the luminous effect and prolonging the service life.

To achieve the above object, the present invention provides a light emitting diode packaging structure, which includes a carrier and a light emitting diode chip. The surface of the carrier has an insulating layer, and a conductive layer is arranged on the surface of the insulating layer. The surface of the carrier is recessed downward to form a concave cup, and the bottom of the concave cup rises upward to form a convex seat. The height of the top surface of the convex seat is higher than that of the concave cup. Preferably, the height is equal to or higher than the level of the surface of the conductive layer; and the LED chip is arranged on the top surface of the protrusion. According to this, the light generated on the top surface of the light emitting diode chip and its surroundings has better luminous flux because it is not hindered by the concave cup and is not lost by reflection, thus enhancing the luminous effect; moreover, the surface area of the convex seat increases the number of light emitting diode The heat dissipation surface area of the chip provides better heat dissipation, thereby improving the luminous effect of the light emitting diode and relatively increasing the service life.

To achieve the above purpose, the present invention provides another embodiment of a LED packaging structure, which includes: a carrier, a LED chip, and a packaging resin. There is an insulating layer on the surface of the carrier, and a conductive layer is arranged on the surface of the insulating layer. The surface of the carrier is recessed downward to form a concave cup, and the bottom of the concave cup rises upward to form a convex seat. The height of the top surface of the convex seat is better. The latter is equal to or higher than the level of the surface of the conductive layer; the light-emitting diode chip is arranged on the top surface of the convex seat; the packaging resin is sealed to protect the light-emitting diode chip. According to this, the light generated on the top surface of the light emitting diode chip and its surroundings has better luminous flux because it is not hindered by the concave cup and is not lost by reflection, thus enhancing the luminous effect; moreover, the surface area of the convex seat increases the number of light emitting diode The heat dissipation surface area of the chip provides better heat dissipation, thereby improving the luminous effect of the light emitting diode and relatively increasing the service life.

In order to achieve the above purpose, the present invention provides a light emitting diode packaging structure according to another embodiment, which includes: a carrier, a light emitting diode chip, a packaging resin and a condensing cover. There is an insulating layer on the surface of the carrier, and a conductive layer is arranged on the surface of the insulating layer. The surface of the carrier is recessed downward to form a concave cup, and the bottom of the concave cup rises upward to form a convex seat. The height of the top surface of the convex seat is better. The latter is equal to or higher than the level of the surface of the conductive layer; the light-emitting diode chip is arranged on the top surface of the convex seat; the packaging resin is sealed to protect the light-emitting diode chip; the light-collecting cover is fixed on the carrier corresponding to the packaging resin, and used to enhance the light-gathering effect. According to this, the light generated on the top surface of the light emitting diode chip and around it has better luminous flux because it is not hindered by the concave cup and is not lost by reflection, thus enhancing the luminous effect; moreover, the surface area of the convex seat increases the number of light emitting diodes The heat dissipation surface area of the chip provides better heat dissipation, thereby improving the luminous effect of the light emitting diode and relatively increasing the service life.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional LED packaging structure.

FIG. 2 is a schematic cross-sectional view of the LED packaging structure according to the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a light emitting diode package structure according to a second embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a light emitting diode package structure according to a third embodiment of the present invention.

Explanation of reference signs:

1 Existing light-emitting diode packaging structure

11 carriers

111 insulating layer

112 conductive layer

113 concave cup

114 bottom

115 inner edge

12 LED chips

121 wire

13 Encapsulation resin

2 Packaging structure of light emitting diode of the present invention

21 carriers

211 insulating layer

212 conductive layer

213 concave cup

214 bottom

215 inner edge

216 convex seat

217 Top

218 around the side wall

219 perforations

22 LED chips

221 wire

23 Encapsulation resin

24 condenser cover body

241 pin

242 inner wall surface

243 outer wall

Detailed ways

In order to enable your examining committee members to further understand the structure, features and effects of the present invention, the detailed description of the accompanying drawings and preferred specific embodiments is as follows.

Please refer to FIG. 2 , which is a schematic cross-sectional view of the LED packaging structure according to the first embodiment of the present invention. As shown in the figure, the LED packaging structure 2 of the present invention includes a carrier 21 and a LED chip 22 .

The carrier 21 is a substrate with high heat dissipation, such as substrates or alloys such as gold, silver, copper, tungsten, molybdenum, tin, zinc, indium, and aluminum. The surface of the carrier 21 is provided with an insulating layer 211 , and a conductive layer 212 composed of conductive circuits is disposed on the surface of the insulating layer; the surface of the carrier 21 is depressed downward to form a concave cup portion 213 . These structures are the same as existing ones. However, in the present invention, the bottom 214 of the concave cup portion 213 protrudes upward to form a convex seat 216 . The height of the top surface 217 of the protrusion is preferably equal to or higher than the level of the surface of the conductive layer 212 .

The LED chip 22 is disposed on the top surface 217 of the protrusion 216 , and two wires 221 are provided to connect between the two electrodes of the LED chip 22 and the conductive layer 212 of the carrier 21 . That is, the LED chip 22 is connected to the conductive layer 212 through the wire 221 , and when the circuit of the conductive layer 212 is electrified, the LED chip 22 emits light from its top surface and surrounding sides.

And the light-emitting diode package structure 2 of the present invention, because its light-emitting diode chip 22 is arranged on the top surface 217 of convex seat 216, improves the focal point of light source, and the height of top surface 217 is higher than concave cup part 213, therefore, by light-emitting diode chip 22 The light generated on the top surface and the surrounding sides is not hindered by the inner wall 215 of the concave cup part 213, and is not affected by the reflection interference of the inner wall 215 of the concave cup part 213, so that the loss of the light emitted by the light emitting diode chip 22 is reduced to The lowest, and increase the luminous flux, thus enhancing the luminous brightness and effect.

Furthermore, since the light-emitting diode chip 22 is arranged on the top surface 217 of the convex seat 216 of the present invention and contacts each other, the surrounding side walls 218 of the convex seat 216 continuous with the top surface 217, the bottom 214 of the concave cup portion 213 and the concave cup The inner wall 215 of the portion 213 forms the heat dissipation surface area of the LED chip 22 together, and the heat dissipation surface area is obviously larger than the existing one, thereby improving its heat dissipation, thereby improving the luminous effect of the LED chip 22, and relatively increasing the use of the LED chip 22 life.

FIG. 3 is a schematic cross-sectional view of a light emitting diode package structure according to a second embodiment of the present invention. As shown in the figure, the second embodiment of the present invention has the same structure as the above-mentioned first embodiment, and further includes an encapsulation resin 23 for sealing and protecting the LED chip 22 and its wires 221 . The light emitting diode package structure of the second embodiment of the present invention has the same luminous effect and heat dissipation effect as the above first embodiment.

FIG. 4 is a schematic cross-sectional view of a light emitting diode package structure according to a third embodiment of the present invention. As shown in the figure, the third embodiment of the present invention has the same structure as the above-mentioned second embodiment, and is further provided with a condensing cover 24 , which is fixed on the carrier 21 corresponding to the encapsulating resin 23 . The condensing cover 24 can be fixed on the carrier 21 in a bonding or fitting manner.

In terms of bonding, the bottom surface of the condensing cover 24 is bonded to the surface of the carrier 21 by, for example, glue or adhesive. In terms of fitting, for example, the bottom of the condensing cover body 24 is provided with a plurality of insertion pins 241, and a plurality of through holes 219 are pierced at the corresponding position of the carrier 21, and the insertion pins 241 penetrate and protrude from top to bottom. On the lower surface of the through hole 219 , the tip end is heated, melted and hardened to be fixed with the lower surface of the carrier 21 .

The top of the condensing cover body 24 has an inner wall surface 242 and an outer wall surface 243, and the inner wall surface and the outer wall surface can be composed of a curved surface, a parabolic surface or a spherical surface, so as to have a light-condensing effect. Moreover, the light emitting diode packaging structure of the third embodiment of the present invention has the same luminous effect and heat dissipation effect as those of the above-mentioned first and second embodiments.

Although the present invention has been described in detail with the above-mentioned preferred embodiments, the above description is only used to illustrate the present invention, so that those skilled in the art can understand the present invention more easily, and is not used to limit the scope of the present invention. Therefore, all equivalent changes and modifications based on the shape, structure, features and spirit described in the claims of the present invention shall be included in the protection scope of the claims of the present invention.

Claims (10)

1. A light-emitting diode packaging structure, characterized in that the light-emitting diode packaging structure comprises: A carrier, the surface of which has an insulating layer, and a conductive layer is arranged on the surface of the insulating layer, the surface of the carrier is recessed downwards to form a concave cup part, and the bottom of the concave cup part rises upwards to form a convex seat; and A light-emitting diode chip is arranged on the top surface of the protrusion, and two wires are provided to connect between the two electrodes of the light-emitting diode chip and the conductive layer. 2. The LED packaging structure according to claim 1, wherein the carrier is a substrate with high heat dissipation. 3. The light-emitting diode packaging structure according to claim 2, wherein the carrier is at least A sort of. 4. The light emitting diode package structure according to claim 1, wherein the top surface of the protrusion is equal to or higher than the level of the surface of the conductive layer. 5 . The LED package structure according to claim 1 , wherein the package structure further comprises an encapsulation resin, and the encapsulation resin seals the LED chip and the wires. 6 . The light emitting diode packaging structure according to claim 5 , wherein the packaging structure further comprises a condensing cover, and the condensing cover is fixed on the carrier corresponding to the encapsulating resin. 7 . 7. The light emitting diode packaging structure according to claim 6, wherein the light collecting cover is bonded to the carrier. 8 . The light emitting diode package structure according to claim 7 , wherein the light-concentrating cover is bonded to the surface of the carrier by glueing or adhering the bottom surface thereof. 9. The light-emitting diode package structure according to claim 6, wherein the light-collecting cover is embedded in the carrier. 10. The light-emitting diode packaging structure according to claim 9, wherein the bottom of the condensing cover is provided with a plurality of pins, and a plurality of perforations are pierced at the corresponding positions of the carrier, and the pins It penetrates from top to bottom and protrudes from the surface below the perforation, and the tip end is heated, melted and hardened to be fixed with the bottom surface of the carrier.

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