CN1521863A - Packaging device of light emitting diode - Google Patents

Abstract

A packaging device of light emitting diode includes an insulating bearing seat formed with a groove or a through hole. The depth of the recess or through hole is sufficient to fully accommodate a light emitting diode. The recess or through hole has two steps for providing two intermediate mesas. The two planar metal layers are separately formed on the two middle mesas and are respectively connected to the two metal pads outside the grooves or the through holes. Two wires are respectively connected with two electrodes of the light emitting diode and the two plane metal layers. A resin is filled in the groove or the through hole to seal the light emitting diode and the two wires.

Description

Packaging device for light emitting diodes

technical field

The invention relates to a packaging device of a light emitting diode. The invention particularly relates to a packaging device capable of enhancing the luminous efficiency of a light-emitting diode, which has the advantages of simplifying the packaging process of the light-emitting diode, thereby improving productivity and reducing production costs.

Background technique

In commercial and industrial applications, light-emitting diodes provide more efficient and lower-cost light sources than incandescent and fluorescent lamps. In recent years, various packaging devices and methods have been developed for light emitting diodes, such as surface mount packaging devices and flip chip packaging devices.

FIG. 1 shows a cross-sectional view of an example of a prior art LED packaging device. Referring to FIG. 1 , a light emitting diode 10 is flip-chip mounted on a package base 20 . The LED 10 has a substrate 11 , a first conductive type semiconductor layer 12 formed on the substrate 11 , and a second conductive type semiconductor layer 13 formed on the first conductive type semiconductor layer 12 . In addition, a first electrode 14 is formed on a predetermined area of the first conductive type semiconductor layer 12 , and a second electrode 15 is formed on a predetermined area of the second conductive type semiconductor layer 13 . The manufacturing method and operation method of the light-emitting diode 10 are well known, so the details will not be repeated here.

In the prior art packaging device shown in FIG. 1 , two metal solder balls 16 and 17 are respectively formed on the first electrode 14 and the second electrode 15 of the LED 10 . Then in a flip-chip manner, the two metal solder balls 16 and 17 are respectively aligned and bonded to the first pad 21 and the second pad 22 formed on the package base 20 . Finally, a transparent resin 18 is used to seal the LED 10, thereby completing the packaging of the LED in the prior art. When power is supplied to the LED 10 through the first pad 21 and the second pad 22 , the light generated by the LED 10 will be emitted to the outside through the substrate 11 and the transparent resin 18 , as indicated by the arrow in FIG. 1 .

The prior art packaging device shown in Fig. 1 has the following disadvantages. Firstly, the metal solder balls 16 and 17 may contact each other to cause a short circuit between the first electrode 14 and the second electrode 15 . Furthermore, when the light-emitting diode 10 is mounted on the package base 20 in a flip-chip manner, it is necessary to ensure that the metal solder balls 16 and 17 are precisely aligned with the first pad 21 and the second pad 22 respectively, resulting in more difficult manufacturing and increased Cost of production.

In addition, it is desired to provide a packaging device with better luminous efficiency of light-emitting diodes than the prior art packaging device shown in FIG. sex.

Contents of the invention

In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a packaging device for light emitting diodes, which is used to simplify the packaging process of light emitting diodes, thereby improving productivity and reducing production costs.

Another object of the present invention is to provide a packaging device for LEDs, which has better luminous efficiency of LEDs, thereby reducing the heat generated during operation, thereby increasing the service life and reliability of LEDs.

In order to accomplish the purpose of the present invention, the present invention provides a packaging device for packaging a light-emitting diode with a substrate and two electrodes, characterized in that: the packaging device includes:

A transparent insulating carrier, forming a groove, the groove has a bottom surface, wherein the bottom surface is used to support the substrate, and the depth of the groove is sufficient to completely accommodate the light emitting diode;

At least one planar metal layer is formed on the surface of the transparent insulating carrier on the area outside the groove,

at least one wiring for connecting one of the at least one planar metal layer and one of the two electrodes; and

A resin fills the groove and covers a part of the at least one planar metal layer, so as to seal the LED and the at least one wiring.

The present invention also provides a packaging device for packaging a light emitting diode with a substrate and two electrodes, characterized in that the packaging device includes:

A transparent insulating bearing seat, forming a groove, the groove has a bottom surface and at least one stepped portion connected to the bottom surface, the at least one stepped portion has a lower side wall surface, connected to the bottom surface, a middle table, and an upper a sidewall surface, wherein the bottom surface is used to support the substrate, and the depth of the groove is sufficient to completely accommodate the light emitting diode;

at least one planar metal layer formed on the middle mesa and the upper side wall of the at least one stepped portion,

At least one metal pad is formed on the surface of the transparent insulating bearing seat outside the groove, and connected to the at least one planar metal layer.

at least one wiring for connecting a portion of the at least one planar metal layer located on the intermediate mesa and one of the two electrodes; and

A resin fills up the groove so as to seal the light emitting diode and the at least one wiring.

The present invention further provides a packaging device for packaging a light emitting diode with a substrate and two electrodes, characterized in that the packaging device includes:

An insulating bearing seat is formed with a through hole, the through hole has a lower opening and an upper opening, wherein the substrate faces the lower opening, and the depth of the through hole is sufficient to completely accommodate the light emitting diode;

At least one planar metal layer is formed on the surface of the insulating carrier on the area outside the through hole,

at least one wiring for connecting one of the at least one planar metal layer and one of the two electrodes; and

A resin fills the through hole and covers a part of the at least one planar metal layer, so as to seal the light emitting diode and the at least one wiring.

The present invention further provides a packaging device for packaging a light emitting diode having a substrate and two electrodes, characterized in that the packaging device includes:

An insulating bearing seat is formed with a through hole, the through hole has a lower opening, an upper opening, and at least one stepped portion connected between the lower opening and the upper opening, the at least one stepped portion has a lower side wall, connected to the The lower opening, a middle table, and an upper side wall are connected to the upper opening, wherein the substrate faces the lower opening, and the depth of the through hole is sufficient to completely accommodate the light emitting diode;

at least one planar metal layer formed on the middle mesa and the upper side wall of the at least one stepped portion,

At least one metal pad is formed on the area of the surface of the insulating bearing seat outside the through hole, and connected to the at least one planar metal layer.

at least one wiring for connecting a portion of the at least one planar metal layer located on the intermediate mesa and one of the two electrodes; and

A resin fills up the through hole so as to seal the light emitting diode and the at least one wiring.

In other words, according to one aspect of the present invention, there is provided a packaging device for light emitting diodes, which includes a transparent insulating carrier formed with a groove. The bottom surface of the groove is used to support the substrate of the LED. The depth of the groove is sufficient to completely accommodate the light emitting diode. At least one planar metal layer is formed on the surface of the transparent insulating bearing seat outside the groove. At least one wire connects one of the at least one planar metal layer and one of the two electrodes of the light emitting diode. A resin fills the groove and covers a part of at least one planar metal layer, so as to seal the LED and at least one wiring.

According to another aspect of the present invention, the groove may have at least one stepped portion for providing at least one intermediate mesa. At least one planar metal layer is formed on at least one intermediate mesa and connected to at least one metal pad outside the groove. At least one wire connects one of the at least one planar metal layer and one of the two electrodes of the light emitting diode. A resin fills the groove so as to seal the LED and at least one wiring.

According to yet another aspect of the present invention, a packaging device for a light emitting diode is provided, including an insulating carrier formed with a through hole. The substrate of the light emitting diode faces the lower opening of the through hole. The depth of the through hole is enough to completely accommodate the light emitting diode. At least one planar metal layer is formed on the surface of the transparent insulating bearing seat outside the through hole. At least one wire connects one of the at least one planar metal layer and one of the two electrodes of the light emitting diode. A resin fills the through hole and covers a part of at least one planar metal layer, so as to seal the LED and at least one wiring.

According to yet another aspect of the present invention, the through hole may have at least one stepped portion for providing at least one intermediate mesa. At least one planar metal layer is formed on at least one intermediate mesa and connected to at least one metal pad outside the through hole. At least one wiring is connected to at least one planar metal layer and one of the two electrodes of the LED. A resin fills the through hole so as to seal the LED and at least one wiring.

As mentioned above, the packaging device provided by the present invention simplifies the packaging process of light-emitting diodes, thereby improving productivity and reducing production costs. Heat, thereby increasing the service life and reliability of LEDs.

Description of drawings

1 shows a cross-sectional view of an example of a prior art light emitting diode packaging device;

Fig. 2 (a) shows the top view of the transparent insulating carrier according to the first embodiment of the present invention;

Fig. 2 (b) shows the cross-sectional view along the line A-A' in Fig. 2 (a) of the packaging device of the light-emitting diode according to the first embodiment of the present invention;

FIG. 3(a) shows a top view of a transparent insulating carrier 40 according to a second embodiment of the present invention;

Fig. 3 (b) shows the sectional view along the line B-B' in Fig. 3 (a) of the packaging device of the light-emitting diode according to the second embodiment of the present invention;

4 shows a cross-sectional view of a light emitting diode packaging device according to a third embodiment of the present invention;

5 shows a cross-sectional view of a light emitting diode packaging device according to a fourth embodiment of the present invention;

6 shows a cross-sectional view of a light emitting diode packaging device according to a fifth embodiment of the present invention; and

FIG. 7 shows a cross-sectional view of an LED packaging device according to a sixth embodiment of the present invention.

Detailed ways

The foregoing and other objects, features, and advantages of the present invention will be more apparent from the following description and accompanying drawings.

Preferred embodiments according to the present invention will be described in detail below with reference to the drawings.

FIG. 2(a) shows a top view of a transparent insulating carrier 30 according to a first embodiment of the present invention, and FIG. 2(b) shows a packaging device of a light-emitting diode according to a first embodiment of the present invention along the line in FIG. 2(a). The profile of the line A-A'.

Referring to FIG. 2( a ), the transparent insulating carrier 30 according to the first embodiment of the present invention is formed with a groove 31 in an approximately central area. The groove 31 has a bottom surface 32 and two sidewall surfaces 33a and 33b. For example, the transparent insulating carrier 30 is formed of glass. On the surface of the transparent insulating carrier 30 , in the area outside the groove 31 , there are two planar metal layers 34 a and 34 b separated from each other. In addition, two metal pads 35 a and 35 b are respectively formed on the planar metal layers 34 a and 34 b and located on the peripheral area of the transparent insulating carrier 30 .

2 (b), the LED 10 is placed in the groove 31 so that the substrate 11 of the LED 10 is supported by the bottom surface 32 of the groove 31. For example, the substrate 11 of the LED 10 can be fixed on the bottom surface 32 by a transparent adhesive, so as to facilitate subsequent processes. It should be noted that in the present invention, the light emitting diode 10 is not limited to the specific material type or structure shown in the icon, but can be any material type or structure. For example, the material type of the light-emitting diode 10 may be AlGaInP, AlGaInN, InGaN, AlGaAs, or SiC. The configuration of the light emitting diode 10 can be a configuration in which two electrodes are on the same side and a transparent substrate is provided. Furthermore, the light emitting diode 10 can be designed to be front-emitting or back-emitting. In addition, the LED 10 may further include a reflective layer and a transparent conductive layer.

The groove 31 according to the present invention has sufficient depth so that the light emitting diode 10 can be fully accommodated in the groove 31 and will not be exposed from the opening of the groove 31 . For example, the depth of the groove 31 is less than 10mm. The wiring 36a is used to connect the first electrode 14 and the planar metal layer 34a, and the wiring 36b is used to connect the second electrode 15 and the planar metal layer 34b. The resin 37 fills the groove 31 and covers the parts of the wires 36 a and 36 b exposed from the groove 31 , so that the LED 10 and the wires 36 a and 36 b are sealed in the resin 37 . For example, the resin 37 may be formed of epoxy resin. Materials with high thermal conductivity can be added to the resin 37 to enhance the heat dissipation performance of the packaged device. Moreover, a material with high reflectivity can be added to the resin 37 , so that the part of the light generated by the light emitting diode 10 toward the resin 37 is reflected to improve the luminous efficiency. In addition, in order to further improve the luminous efficiency, a reflective layer (not shown) can be coated on the resin 37 to reflect the light generated by the LED 10 toward the bottom surface 32 .

When power is supplied to the LED 10 through the protruding metal pads 35a and 35b, the light generated by the LED 10 will be emitted to the outside through the substrate 11 and the transparent insulating carrier 30, as indicated by the arrow in FIG. 2(b) . Compared with the prior art packaging device shown in FIG. 1 , the light emitting diode packaging device according to the present invention can be completed through a simple packaging process without using precise alignment technology, thereby improving productivity and reducing production costs.

Fig. 3(a) shows a top view of a transparent insulating carrier 40 according to a second embodiment of the present invention, and Fig. 3(b) shows a packaging device of a light emitting diode according to a second embodiment of the present invention along Fig. 3(a) Profile of line BB'. Only the differences of the second embodiment from the first embodiment will be described below.

Referring to FIGS. 3( a ) and 3 ( b ), the second embodiment of the present invention is different from the first embodiment of the present invention in that two stepped portions are formed in the groove 41 according to the second embodiment of the present invention. Specifically, the lower wall 43a, the middle table 44a, and the upper wall 45a form a stepped portion, while the lower wall 43b, the middle table 44b, and the upper wall 45b form another stepped portion. Moreover, the planar metal layer 46a is formed on the middle mesa 44a and the upper sidewall 45a, and the planar metal layer 46b is formed on the middle mesa 44b and the upper sidewall 45b. Two separate metal pads 47 a and 47 b are formed on the surface of the transparent insulating carrier 30 in areas other than the groove 31 . The metal pad 47a is connected to the planar metal layer 46a, and the metal pad 47b is connected to the planar metal layer 46b.

The LED 10 is put into the groove 41 such that the substrate 11 of the LED 10 is supported by the bottom surface 42 of the groove 41 . The wiring 48a is used to connect the first electrode 14 and the portion of the planar metal layer 46a on the intermediate mesa 44a, and the wiring 48b is used to connect the second electrode 15 to the portion of the planar metal layer 46b located on the intermediate mesa 44b. With the design of the groove 41 having two stepped portions, the wires 48 a and 48 b can be fully accommodated in the groove 41 . Finally, the resin 49 fills the groove 41 and covers the wires 48 a and 48 b, so that the LED 10 and the wires 48 a and 48 b are sealed in the resin 49 . For example, the resin 49 may be formed of epoxy resin. Materials with high thermal conductivity can be added to the resin 49 to enhance the heat dissipation performance of the packaged device. Moreover, a material with high reflectivity can be added to the resin 49 , so that the part of the light generated by the LED 10 toward the resin 49 is reflected to improve the luminous efficiency. In addition, in order to further improve the luminous efficiency, a reflective layer (not shown) can be coated on the resin 49 to reflect the light generated by the LED 10 toward the bottom surface 42 .

From the comparison of FIG. 2( b ) and FIG. 3( b ), it can be known that the size of the light emitting diode packaging device of the second embodiment is smaller than that of the first embodiment because the wires 48 a and 48 b can be completely located in the groove 41 .

FIG. 4 shows a cross-sectional view of a light emitting diode packaging device according to a third embodiment of the present invention. Only the differences of the third embodiment from the first embodiment will be described below.

Referring to FIG. 4 , the third embodiment of the present invention is different from the first embodiment of the present invention in that the insulating carrier 50 according to the third embodiment of the present invention does not need to be transparent and a through hole 51 is formed in an approximately central region . The through hole 51 passes through the insulating carrier 50 to form a lower opening 52a and an upper opening 52b. It should be noted that in the present invention, the aperture size of the lower opening 52a may be greater than, equal to, or smaller than that of the upper opening 52b, and is not limited to the example shown in FIG. 4 .

In the case of sealing the lower opening 52a, the transparent resin 53a is injected into the through hole 51 from the upper opening 52b so that the through hole 51 is only partially filled. Then, put the light emitting diode 10 into the through hole 51 through the upper opening 52b, so that the substrate 11 of the light emitting diode 10 is supported by the transparent resin 53a. After the transparent resin 53 a is baked and hardened, the LED 10 is fixed on the transparent resin 53 a in the through hole 51 . Finally, the wire connection process is performed and the transparent resin 53b is used to fill the through hole 51 and cover the parts of the wires 36a and 36b where the through hole 51 is exposed, so that the light emitting diode 10 and the wires 36a and 36b are sealed in the transparent resin 53a and 53b .

When power is supplied to the LED 10 through the protruding metal pads 35a and 35b, the light generated by the LED 10 will be emitted to the outside through the substrate 11 and the transparent resin 53a, as indicated by the arrow in FIG. 4 . Since the light does not need to be emitted to the outside through the insulating carrier 50, the insulating carrier 50 according to the third embodiment of the present invention is not limited to being formed of a transparent material such as glass, but can also be made of ceramics, AlN, SiC, plastic, resin, Or a printed circuit board, and a combination of the aforementioned materials. In addition, the insulating bearing seat 50 can also be formed by combining a plurality of components, for example, by covering a metal core body with an insulating material outer film.

FIG. 5 shows a cross-sectional view of a light emitting diode packaging device according to a fourth embodiment of the present invention. Only the differences of the fourth embodiment from the second embodiment will be described below.

Referring to FIG. 5 , the fourth embodiment of the present invention is different from the second embodiment of the present invention in that the insulating carrier 60 according to the fourth embodiment of the present invention does not need to be transparent and a through hole 61 is formed in an approximately central region . The through hole 61 passes through the insulating carrier 60 to form a lower opening 62a and an upper opening 62b. It should be noted that in the present invention, the aperture size of the lower opening 62a may be greater than, equal to, or smaller than that of the upper opening 62b, and is not limited to the example shown in FIG. 5 .

Like the groove 41 of the second embodiment, two stepped portions are also formed in the through hole 61 . Through the manufacturing method similar to the third embodiment, the substrate 11 of the light emitting diode 10 is supported by the transparent resin 63a, and then the transparent resin 63b fills the through hole 61 and covers the wiring 48a and 48b, so that the light emitting diode 10 and the wiring 48a and 48b is sealed in transparent resin 63a and 63b. The insulating carrier 60 is not limited to be formed of transparent materials such as glass, but can also be formed of ceramics, AlN, SiC, plastics, resins, printed circuit boards, and combinations thereof. In addition, the insulating bearing seat 60 can also be formed by combining a plurality of components, for example, by covering a metal core body with an insulating material outer film.

From the comparison of FIG. 4 and FIG. 5 , it can be known that the size of the light emitting diode packaging device of the fourth embodiment is smaller than that of the third embodiment because the wires 48 a and 48 b can be completely located in the through hole 61 .

FIG. 6 shows a cross-sectional view of a packaging device for light emitting diodes according to a fifth embodiment of the present invention. Only the differences of the fifth embodiment from the third embodiment will be described below.

In the fifth embodiment, the resin for sealing the LED 10 and the wirings 36a and 36b is composed of the lower resin portion 73a and the upper resin portion 73b. The lower resin portion 73a is formed of a transparent material and serves as a light emitting channel. Preferably, the lower resin portion 73a is formed by selecting a material with a high refractive index matching degree with the substrate 11, which can reduce the total reflection of light at the interface between the substrate 11 and the lower resin portion 73a. The upper resin portion 73b may be formed of a reflective material or a resin doped with a high reflective material for reflecting light toward the lower resin portion 73a. In addition, in order to further improve the luminous efficiency, a reflective layer (not shown) can be coated on the resin 73b to reflect the light generated by the LED 10 toward the lower opening 52a. Furthermore, a diopter lens 74 can be disposed at the lower opening 52 a of the through hole 51 to control the light emitted from the LED packaging device.

FIG. 7 shows a cross-sectional view of an LED packaging device according to a sixth embodiment of the present invention. Only the differences of the sixth embodiment from the fourth embodiment will be described below.

In the sixth embodiment, the resin used to seal the LED 10 and the wirings 48a and 48b is composed of the lower resin portion 83a and the upper resin portion 83b. The lower resin portion 83a is formed of a transparent material and serves as a light emitting channel. Preferably, the lower resin portion 83a is formed by selecting a material with a high refractive index matching degree with the substrate 11, which can reduce the total reflection of light at the interface between the substrate 11 and the lower resin portion 83a. The upper resin portion 83b may be formed of a reflective material or a resin doped with a high reflective material for reflecting light toward the lower resin portion 83a. In addition, the lower resin portion 83 a may be doped with a fluorescent material such as phosphor or a fluorescent layer 84 is coated on the lower opening 62 a of the through hole 61 . Based on the porosity and coating thickness of the phosphor, the wavelength of light emitted from the LED packaging device is changed to provide light with a desired color.

Although the present invention has been described with reference to the preferred embodiments, it should be understood that the present invention is not limited to the disclosed embodiments. On the contrary, the invention is intended to cover various modifications and similar arrangements apparent to those skilled in the art. Accordingly, the scope of the claims should be accorded the broadest interpretation to embrace all such modifications and similar arrangements. For example, the planar shapes of the insulating bearing seat, the groove, and the upper opening and the lower opening of the through hole according to the present invention are not limited to a rectangle but can be any shape such as a circle, an ellipse, or a polygon.

Claims (50)

1. packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, and it is characterized in that: this packaging system comprises:

One transparent insulation load bearing seat is formed with a groove, and this groove has a bottom surface, and wherein this bottom surface is in order to supporting this substrate, and the degree of depth of this groove is enough in order to hold this light-emitting diode fully;

At least one planar metal layer is formed on the zone that is positioned in the surface of this transparent insulation load bearing seat beyond this groove,

At least one distribution is in order to connect in one deck in this at least one planar metal layer and this two electrode; And

One resin fills up this groove and covers the part of this at least one planar metal layer, so as to sealing this light-emitting diode and this at least one distribution.

2. packaging system as claimed in claim 1 is characterized in that: also comprise:

At least one metal gasket, be formed at this at least one planar metal layer not by on the part that this resin covered.

3. packaging system as claimed in claim 1 is characterized in that: this transparent insulation load bearing seat is formed by glass.

4. packaging system as claimed in claim 1 is characterized in that: this degree of depth of this groove is less than 10mm.

5. packaging system as claimed in claim 1 is characterized in that: this groove shaped is formed in the zone of about central authorities of this transparent insulation load bearing seat.

6. packaging system as claimed in claim 1 is characterized in that: this underrun one transparent binder fixes this substrate.

7. packaging system as claimed in claim 1 is characterized in that: this resin is formed by epoxy resin.

8. packaging system as claimed in claim 1 is characterized in that: be added with the material with high-termal conductivity in this resin, in order to strengthen the heat dispersion of this packaging system.

9. packaging system as claimed in claim 1 is characterized in that: be added with the material with highly reflective in this resin, in order to reflect the light that this light-emitting diode produces.

10. packaging system as claimed in claim 1 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.

11. packaging system as claimed in claim 1 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.

12. a packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:

One transparent insulation load bearing seat, be formed with a groove, this groove has a bottom surface and at least one end difference that is connected in this bottom surface, this at least one end difference has side wall surface, be connected in this bottom surface, table top in the middle of, with a upside wall, wherein this bottom surface is in order to supporting this substrate, and the degree of depth of this groove is enough in order to hold this light-emitting diode fully;

At least one planar metal layer is formed on this centre table top and this upside wall of this at least one end difference,

At least one metal gasket is formed on the zone that is positioned in the surface of this transparent insulation load bearing seat beyond this groove, and is connected in this at least one planar metal layer.

At least one distribution is in order to connect the part that is arranged in this centre table top in this at least one planar metal layer and this two electrode one; And

One resin fills up this groove, so as to sealing this light-emitting diode and this at least one distribution.

13. packaging system as claimed in claim 12 is characterized in that: this transparent insulation load bearing seat is formed by glass.

14. packaging system as claimed in claim 12 is characterized in that: this degree of depth of this groove is less than 10mm.

15. packaging system as claimed in claim 12 is characterized in that: this groove shaped is formed in the zone of about central authorities of this transparent insulation load bearing seat.

16. packaging system as claimed in claim 12 is characterized in that: this underrun one transparent adhesive fixes this substrate.

17. packaging system as claimed in claim 12 is characterized in that: this resin is formed by epoxy resin.

18. packaging system as claimed in claim 12 is characterized in that: be added with material in this resin, in order to strengthen the heat dispersion of this packaging system with high-termal conductivity.

19. packaging system as claimed in claim 12 is characterized in that: be added with material in this resin, in order to reflect the light that this light-emitting diode produces with highly reflective.

20. packaging system as claimed in claim 12 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.

21. packaging system as claimed in claim 12 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.

22. a packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:

One insulation load bearing seat is formed with a through hole, and this through hole has a under shed and a upper shed, and wherein this substrate is towards this under shed, and the degree of depth of this through hole is enough in order to hold this light-emitting diode fully;

At least one planar metal layer is formed on the zone that is positioned in the surface of this insulation load bearing seat beyond this through hole,

At least one distribution is in order to connect in one deck in this at least one planar metal layer and this two electrode; And

One resin fills up this through hole and covers the part of this at least one planar metal layer, so as to sealing this light-emitting diode and this at least one distribution.

23. packaging system as claimed in claim 22 is characterized in that: also comprise:

At least one metal gasket, be formed at this at least one metal level not by on the part that this resin covered.

24. packaging system as claimed in claim 22 is characterized in that: this insulation load bearing seat is made of glass, pottery, AlN, SiC, plastics, resin or printed circuit board (PCB) and their combination.

25. packaging system as claimed in claim 22 is characterized in that: this insulation load bearing seat forms by using an insulating material adventitia to coat a metallic core body.

26. packaging system as claimed in claim 22 is characterized in that: this degree of depth of this through hole is less than 10mm.

27. packaging system as claimed in claim 22 is characterized in that: this through hole is formed in the zone of about central authorities of this insulation load bearing seat.

28. packaging system as claimed in claim 22 is characterized in that: this resin is formed by epoxy resin.

29. packaging system as claimed in claim 22 is characterized in that: be added with material in this resin, in order to strengthen the heat dispersion of this packaging system with high-termal conductivity.

30. packaging system as claimed in claim 22, it is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is formed by having for the high material of the refractive index match degree of this substrate, the total reflection that takes place in order to the place, interface that reduces this substrate and this interlaminar resin.

31. packaging system as claimed in claim 22 is characterized in that: the part that is positioned in this resin between this upper shed and this light-emitting diode is added with the material with highly reflective, in order to reflect the light that this light-emitting diode produces.

32. packaging system as claimed in claim 22 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.

33. packaging system as claimed in claim 22 is characterized in that: also comprise dioptric lens, be arranged at this lower opening of this through hole.

34. packaging system as claimed in claim 22 is characterized in that: also comprise a fluorescent layer, coat this lower opening of this through hole, in order to the light with desired color to be provided.

35. packaging system as claimed in claim 22 is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is doped with a fluorescent material, in order to the light with desired color to be provided.

36. packaging system as claimed in claim 22 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.

37. a packaging system has a light-emitting diode of a substrate and two electrodes in order to encapsulation, it is characterized in that: this packaging system comprises:

One insulation load bearing seat, be formed with a through hole, this through hole has a under shed, a upper shed, and is connected at least one end difference between this under shed and upper shed, this at least one end difference has side wall surface, be connected in this under shed, table top in the middle of, with a upside wall, be connected in this upper shed, wherein this substrate is towards this under shed, and the degree of depth of this through hole is enough in order to hold this light-emitting diode fully;

At least one planar metal layer is formed on this centre table top and this upside wall of this at least one end difference,

At least one metal gasket is formed on the zone that is positioned in the surface of this insulation load bearing seat beyond this through hole, and is connected in this at least one planar metal layer.

At least one distribution is in order to connect the part that is arranged in this centre table top in this at least one planar metal layer and this two electrode one; And

One resin fills up this through hole, so as to sealing this light-emitting diode and this at least one distribution.

38. packaging system as claimed in claim 37 is characterized in that: this insulation load bearing seat is made of glass, pottery, AlN, SiC, plastics, resin or printed circuit board (PCB) and their combination.

39. packaging system as claimed in claim 37 is characterized in that: this insulation load bearing seat forms by using an insulating material adventitia to coat a metallic core body.

40. packaging system as claimed in claim 37 is characterized in that: this degree of depth of this through hole is less than 10mm.

41. packaging system as claimed in claim 37 is characterized in that: this through hole is formed in the zone of about central authorities of this insulation load bearing seat.

42. packaging system as claimed in claim 37 is characterized in that: this resin is formed by epoxy resin.

43. packaging system as claimed in claim 37 is characterized in that: be added with material in this resin, in order to strengthen the heat dispersion of this packaging system with high-termal conductivity.

44. packaging system as claimed in claim 37, it is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is formed by having for the high material of the refractive index match degree of this substrate, the total reflection that takes place in order to the place, interface that reduces this substrate and this interlaminar resin.

45. packaging system as claimed in claim 37 is characterized in that: the part that is positioned in this resin between this upper shed and this light-emitting diode is added with the material with highly reflective, in order to reflect the light that this light-emitting diode produces.

46. packaging system as claimed in claim 37 is characterized in that: also comprise a reflector, coat on this resin, in order to reflect the light that this light-emitting diode produces.

47. packaging system as claimed in claim 37 is characterized in that: also comprise dioptric lens, be arranged at this lower opening of this through hole.

48. packaging system as claimed in claim 37 is characterized in that: also comprise a fluorescent layer, coat this lower opening of this through hole, in order to the light with desired color to be provided.

49. packaging system as claimed in claim 37 is characterized in that: the part that is positioned in this resin between this light-emitting diode and this under shed is doped with a fluorescent material, in order to the light with desired color to be provided.

50. packaging system as claimed in claim 37 is characterized in that: the material type of this light-emitting diode is AlGaInP type, aluminum indium gallium nitride type, InGaN type, aluminum gallium arsenide type or carborundum type.

Images