CN1993011A - Electronic carrier plate and packaging structure thereof - Google Patents

Abstract

The invention discloses an electronic carrier plate and a packaging structure thereof, the electronic carrier plate comprises a main body, a plurality of welding pads which are arranged on the surface of the main body in pairs, and a protective layer which is used for covering the surface of the main body, an opening is formed between the protection layer and at least two paired bonding pads to expose at least three side surfaces of each bonding pad, and the protection layer is formed with at least one independent residual portion in the opening corresponding to the bonding pads arranged in pairs, the electronic element can be connected to the independent residual portion of the protection layer, and a conductive material is electrically connected to the pair of pads to form a blind via space between the electronic device and the main body, and the insulating resin can be fully distributed under the electronic device and in the opening when covering the electronic device, so as to coat at least three side surfaces of the bonding pad, avoid the generation of air holes under the electronic elements, and prevent the problem of improper electrical bridging of the conductive material between the paired bonding pads or the adjacent electronic elements.

Description

Electronic carrier board and its structure

technical field

The present invention relates to an electronic carrier board and a structural structure, in particular to an electronic carrier board and a structural structure applied in Surface Mounted Technology (SMT).

Background technique

With the advancement of integrated circuit production technology, the design and production of electronic components continue to develop towards the trend of miniaturization, and because they have larger-scale and highly integrated electronic circuits, the product functions are also more complete.

In this case, the traditional use of plug-in assembly technology (Through Hole Technology; THT) for placement of electronic components, because the size cannot be further reduced, thus occupying printed circuit board (Printed Circuit Board; PCB), circuit board (circuit board) ) or substrate (substrate) and other electronic carrier boards have a lot of space, plus the plug-in assembly technology needs to drill holes on the electronic carrier board corresponding to each pin position of each electronic component, so the pins of such electronic components are practical Occupies space on both sides of the electronic carrier board, and the solder joints at the connection between the electronic component and the electronic carrier board are also relatively large. In today's electronic component assembly procedures, a large number of surface mount technology (Surface Mounted Technology; SMT) is used to effectively improve the electronic components. The assembly density of components on an electronic carrier.

Electronic components using surface mount technology, because their electrical connection terminals (pins) are soldered on the electronic carrier board on the same side as the electronic component, therefore, it is not necessary to drill a large number of holes in the electronic carrier board like plug-in assembly technology. Holes, that is, use surface mount technology to assemble electronic components on both sides of the electronic carrier board at the same time, which greatly improves the space utilization of the electronic carrier board. Compared with the electronic components of the assembly technology, the electronic components using the surface mount technology are arranged in a larger number on the electronic carrier board, and the cost of the electronic components of the surface mount technology is also cheaper, so this technology has become the current electronic carrier. The mainstream of board-assembled electronic components.

Furthermore, based on electrical and performance requirements, placing passive components such as capacitors, resistors, or inductors on electronic substrates has become indispensable for maintaining the electrical quality of electronic products. missing steps. In line with the development of electronic products in the direction of light, thin, small and low energy consumption, the plug-in components used in traditional electronic carrier boards must drill holes before soldering the circuit board, and then solder after the component pins pass through. The pins cannot be too close together, and the back of the electronic substrate is densely covered with solder joints, making it difficult to use effectively. In recent years, it has been gradually replaced by surface mount components.

Please refer to Figure 1A, which is a schematic plan view of surface mount passive components on the substrate, and refer to Figure 1B and Figure 1C at the same time, which is formed corresponding to the section line 1B-1B and section line 1C-1C in Figure 1A Sectional schematic. It mainly forms a pair of spaced apart soldering pads 12 on a preset position of the substrate 11, and the two soldering pads 12 respectively have openings 130 that expose and cover the solder repelling layer (Solder Mask) 13 on the substrate 11; After coating an appropriate amount of solder paste (Solder Paste) 15 on the solder pad 12, the two ends of a passive component 14 can be bonded to the solder paste 15 respectively, and then reflow soldering (Reflow Soldering) treatment is performed. 14 can be properly electrically connected to the welding pad 12 by means of the solder paste 15.

When applied to semiconductor packages, due to the coating amount of solder paste 15 and the melting of solder paste 15 during reflow processing, it is difficult to precisely control the height of passive components 14. In addition, the surface of solder repellent layer 13 is not smooth, and sometimes dents occur As a result, a gap (Clearance) 17 is often formed between the soldered passive component 14 and the solder repellent layer 13. This gap 17 has a height of only 10 to 30 μm at most, and is used to form the resin material that covers the passive component 14 encapsulant. The size of the particle (Filler) is about 50 μm, and the filling particle is larger than this gap height. Therefore, when the molding operation is filled with resin, the gap 17 at the bottom of the passive element 14 cannot be filled by the resin, forming a void, which will cause a popcom effect in the subsequent high-temperature working environment, and make the entire structure The structure is damaged; or the molten solder paste 15 drills through the gap 17 (ie, capillary phenomenon) to form a bridge, causing a short circuit of the passive component 14 (as shown in FIG. 1B ), thereby affecting the yield of the finished product.

At the same time, due to the influence of the configuration of adjacent passive components 14, the molten solder paste 15 that is electrically connected to the solder pad 12 from different passive components 14 may also flow through the gap between the surface of the solder pad 12 and the solder repellent layer 13, and then flow along the substrate. The gap between 11 and the solder repellent layer 13 diffuses and contacts with each other, so that solder extrusion occurs, which leads to a short circuit problem in the adjacent passive element 14, as shown by the label SE in FIG. 1C.

Furthermore, referring to Fig. 2, when using the passive element 24 connected in parallel or in series, such as the 0805 type passive element, it is composed of a plurality of paired capacitance or resistance elements, relatively used to connect the 0805 type passive element The welding pads of the components are also arranged in pairs, and the openings 230 of the solder repellent layer for exposing the welding pads are also arranged in a corresponding manner. In this way, due to the influence of the configuration depth of the passive components connected in parallel or in series, the insulating resin is more It is difficult to fill the gap between the passive component and the substrate, and also increases the probability of solder extrusion.

Please also refer to FIG. 3 , the technology proposed by US Patent No. 6,521,997 is to add a groove (Groove) 330 between the openings of the solder repellent layer 33 formed between the opposing solder pads 32 , and to expand the gap for the resin to pass through by opening the groove 330 .

Also refer to Fig. 4A, the U.S. Patent No. 2005/0253231 patent is respectively on the two welding pads 42 that are arranged in pairs, forms two solder repellent layer openings 430 that expose the side walls of the welding pads 42, and on the two Barrier strips 431 are provided between the openings 430 to form two flow channels 4300 filled with insulating resin.

Please refer to FIG. 4B. In US Patent No. 2005/0253231, when the insulating resin 47 (as shown by the arrow) flows into the two openings 430 formed by the barrier strip 431 and the exposed solder pad 42 When the flow channel is 4300, the space is extremely small, which can easily cause turbulent flow at the corner of the flow channel, and even lead to the generation of air holes V, which will increase the probability of gas explosion in the subsequent thermal process environment.

Furthermore, in the technologies disclosed in the above-mentioned U.S. Patent No. 6,521,997 and No. 2005/0253231, in the face of the influence of the configuration of adjacent passive components, they cannot provide an effective solution to the problem that the solder paste between adjacent passive components may pass through the surface of the substrate and solder rejection. Inter-diffusion, contact, etc. in the gaps between layers cause solder extrusion (solder extrusion), and even lead to short-circuit problems in adjacent passive components.

To sum up, how to provide an electronic carrier board and its structure to avoid air holes, electrical bridging, and solder bumps caused by gaps between the electronic components and the electronic carrier board when electronic components are placed on it. The extension problem is actually a problem that the industry needs to solve urgently.

Contents of the invention

In order to overcome the above-mentioned problems in the prior art, the main purpose of the present invention is to provide an electronic carrier board and a structural structure, which can effectively fill the insulating material between the electronic components and the electronic carrier board, and avoid air explosion caused by air holes. and electrical bridging issues.

Another object of the present invention is to provide an electronic carrier board and a construction structure, which can prevent electrical conduction between adjacent electronic components and cause short circuit.

Another object of the present invention is to provide an electronic carrier board and a construction structure, which can effectively make the insulating resin coat the conductive material used to connect the electronic components on the electronic carrier board, and prevent the conductive material from escaping and spreading.

Another object of the present invention is to provide an electronic carrier board and its assembly structure. When the insulating resin coats the electronic components connected to the electronic carrier board, it provides a smooth flow path through the bottom of the electronic components and avoids the generation of gas. Hole.

To achieve the above disclosure and other objectives, the present invention provides an electronic carrier board, which includes: a main body; a plurality of welding pads arranged in pairs on the surface of the main body; and a protective layer for covering the surface of the main body An opening is formed in the protective layer corresponding to at least two welding pads arranged in pairs, exposing at least three side surfaces of each of the welding pads, and the protective layer is formed in the opening corresponding to the welding pads arranged in pairs. There is at least one independent residual part, and the electronic component can be connected to the independent residual part of the protective layer, and electrically connected to the pair of pads, so that the electronic component and the surface of the main body form a flow channel space without dead ends. When covering the electronic component, the insulating resin can be fully distributed on the lower side of the electronic component and in the opening, and then cover at least three sides of the welding pad.

The present invention also provides a construction structure of an electronic carrier board, the construction structure includes: an electronic carrier board, the electric carrier board has a body, a plurality of welding pads arranged in pairs on the surface of the body, and a cover for covering The protective layer on the surface of the body, the protective layer corresponds to an opening formed between at least two welding pads arranged in pairs, exposing at least three side surfaces of each of the welding pads, and the protective layer corresponds to the paired arrangement in the opening At least one independent residual part is formed between the soldering pads; an electronic component is placed on the independent residual part of the protective layer and electrically connected to the pair of soldering pads, so that there is no dead space between the electronic component and the surface of the main body the flow channel space; and an insulating resin covering the electronic component, and can be fully distributed in the lower side of the electronic component and the opening, so as to cover at least three sides of the welding pad. Wherein the electronic carrier is a substrate, a circuit board or a printed circuit board, etc., the protective layer is a solder repelling layer, and the electronic component is a passive component.

The electronic carrier board and its construction structure of the present invention make the protective layer covering the surface of the electronic carrier board form a single opening between at least two solder pads arranged in pairs, and expose at least three sides of each solder pad, and at the same time Make the protective layer form at least one independent residual part that is not connected to the opening and not in contact with the rest of the protective layer between the welding pads that should be arranged in pairs in the opening, so that the welding pad is connected and electrically connected by a conductive material. When the electronic component is permanently connected and the electronic component is covered with insulating resin, the insulating resin can flow smoothly through the opening below the electronic component, so that the insulating resin material can be effectively filled in the gap and opening between the electronic component and the electronic carrier board, avoiding Gas explosion and electrical bridging problems caused by air holes.

At the same time, since the opening of the protective layer exposes at least three surfaces of each of the welding pads, when the insulating resin material is effectively filled in the gap and opening between the electronic component and the electronic carrier board, the insulating resin covers the welding pads At least three surfaces, avoiding that in the prior art when passive components are placed on the substrate by means of solder paste, the molten solder paste may flow through the gap between the surface of the pad and the solder repellent layer, and then along the gap between the substrate and the solder repellent layer. The gaps between the gaps diffuse and contact with each other, resulting in solder extrusion (solder extrusion) phenomenon, and even lead to problems such as short circuit of adjacent passive components.

Furthermore, in the present invention, at least one independent residual portion that is not in contact with the rest of the protective layer is formed between the paired welding pads in the opening of the protective layer, so that the soldering pads are connected and electrically connected to the electronic pads through conductive materials. Components, and when the electronic component is covered with insulating resin, it can provide a smooth flow channel without dead ends for the insulating resin, avoiding the turbulent flow at the corner caused by the improper configuration of the flow channel under the electronic component in the prior art, and even causing air holes Generation and gas explosion and other issues.

Description of drawings

FIG. 1A is a schematic plan view of a surface-mounted passive component mounted on an existing substrate;

FIG. 1B and FIG. 1C are schematic cross-sectional views corresponding to the section line 1B-1B and the section line 1C-1C in FIG. 1A;

Fig. 2 is a schematic plan view of conventional parallel or series passive components connected to a substrate;

Fig. 3 is a schematic diagram of assembly of passive components disclosed in US Patent No. 6,521,997;

4A and 4B are schematic diagrams of distribution of the substrate and insulating resin disclosed in US Patent No. 2005/0253231;

5A and FIG. 5B are schematic plan views of the electronic carrier board of the present invention and Embodiment 1 of constructing electronic components on the electronic carrier board;

Fig. 6 is a schematic diagram of insulating resin flowing through the bottom of the electronic component in the present invention;

7 is a schematic plan view of Embodiment 2 of the electronic carrier board of the present invention;

8 is a schematic plan view of Embodiment 3 of the electronic carrier of the present invention;

9 is a schematic plan view of Embodiment 4 of the electronic carrier board of the present invention; and

FIG. 10 is a schematic plan view of Embodiment 5 of the electronic carrier board of the present invention.

Detailed ways

Example 1

Please refer to FIG. 5A and FIG. 5B , which are schematic plan views of the electronic carrier board of the present invention and Embodiment 1 of constructing electronic components on the electronic carrier board. It should be noted that the drawings are simplified schematic diagrams, The basic structure of the invention is illustrated by way of illustration only. Therefore, only elements related to the present invention are shown in the drawings, and the number, shape, and size ratio of the shown elements are not drawn in actual implementation, and the layout of the elements may be more complicated.

As shown in the figure, the electronic carrier 51 of the present invention includes: a main body 511; a plurality of welding pads 52 arranged in pairs on the surface of the main body; and a protective layer 53 for covering the surface of the main body 511, the protective layer 53 An opening 54 is formed corresponding to at least two welding pads 52 arranged in pairs, exposing at least three side surfaces of each welding pad 52 , and the protective layer 53 corresponds to the welding pads 52 arranged in pairs in the opening 54 At least one independent residual portion 530 is formed therebetween.

The electronic carrier 51 may be a packaging substrate, a circuit board, or a printed circuit board used for chip packaging. In this embodiment, the packaging substrate is mainly used as an example for illustration. The body 511 of the electronic carrier 51 can be an insulating layer or an insulating layer with a circuit layer stacked in the middle, and a plurality of conductive circuits (not shown) and welding pads 52 are arranged on its surface, and some of the welding pads are two Two pairs set. The insulating layer is made of materials such as glass fiber, epoxy resin (Epoxy), polyimide film, FR4 resin and BT (Bismaleimide Triazine) resin, and the circuit layer is, for example, a copper layer.

The body 511 of the electronic carrier 51 is covered with a protective layer 53, the protective layer 53 is, for example, a solder mask, and the material of the solder mask is a highly fluid polymer (Polymer), such as Epoxy resin (Epoxy Resin), etc. An opening 54 is formed between the protective layer 53 corresponding to at least two welding pads 52 arranged in pairs, exposing at least three side surfaces of each of the welding pads 52, and the protective layer 53 corresponds to the paired welding pads 52 in the opening 54. Between the pads 52, there is formed at least one independent residual portion 530 not connected to the opening 54 and not in contact with other parts of the protection layer.

The present invention also provides a construction structure of an electronic carrier, which includes: an electronic carrier 51, wherein the electronic carrier 51 has a body 511, and a plurality of welding pads 52 arranged in pairs on the surface of the body 511 , and a protective layer 53 for covering the surface of the main body, an opening 54 is formed between the protective layer 53 corresponding to at least two welding pads 52 arranged in pairs, exposing at least three side surfaces of each welding pad 52, and the The protective layer 53 has at least one independent residual portion 530 formed between the paired welding pads 52 in the opening 54; an electronic component 55 is placed on the independent residual portion 530 of the protective layer and electrically connected to the paired Welding pad, make this electronic component 55 and the surface of this main body 511 form a channel space without dead space; An insulating resin 57, cover this electronic component 55, and fully distribute in this electronic component 55 lower side and this opening 530 , further covering at least three side surfaces of the pad 52 .

The electronic component 55 can be connected to the independent residual part 530 of the protective layer, and the independent residual part 530 of the protective layer provides a good supporting effect for the electronic component 55, and through a conductive material (not shown) such as solder paste, The two ends of the electronic component 55 are correspondingly electrically connected to the soldering pad 52 that exposes the protective layer, and then the reflow operation is performed, so that the electronic component 55 is soldered to the soldering pad 52 by solder paste to form an electrical connection relationship . Wherein the electronic component 55 is a passive component.

Please refer to FIG. 6, which shows a schematic diagram of insulating resin flowing through the bottom of the electronic component. Because the protective layer 53 of the present invention forms a single opening 54 between the paired welding pads 52, and exposes each of the welding pads 52. At least three sides, and the protective layer 53 is formed in the opening 54 between the paired welding pads 52, at least one independent residual portion 530 not connected to the opening 54 and not in contact with the rest of the protective layer 53 is formed, And then provide this insulating resin 57 a flow channel space (as shown by the arrow) without dead ends, make this insulating resin 57 flow through smoothly and be fully distributed in the opening below this electronic component 55, and then make insulating resin 57 effectively It is filled in the gap between the electronic component 55 and the electronic carrier 51 and the opening 54 to avoid the generation of voids (Voids) and the occurrence of gas explosions in the subsequent thermal environment, and to form an electrical insulation barrier between the paired pads to prevent paired Improper electrical bridging between pads.

At the same time, since the opening 54 of the protective layer exposes at least three surfaces of the solder pad 52, the insulating resin 57 can cover at least three surfaces of the solder pad 52, so as to prevent passive components from being connected by solder paste in the prior art. When placed on the substrate, the molten solder paste may flow through the gap between the surface of the pad and the solder repellent layer, and then diffuse and contact each other along the gap between the substrate and the solder repellent layer, resulting in solder extrusion. It even leads to problems such as short circuit of adjacent passive components.

Example 2

Please refer to FIG. 7 , which is a schematic plan view of Embodiment 2 of the electronic carrier board of the present invention.

The electronic carrier board and its assembly structure of Embodiment 2 of the present invention are substantially the same as those of Embodiment 1 above, the main difference being that the protective layer 53 on the electronic carrier board is formed in the opening 54 between corresponding paired welding pads 52. A plurality of independent residual portions 530, two independent residual portions 530 are shown in FIG. It can provide good support for the subsequent electronic components, and at the same time provide a flow channel space for the insulating resin without dead ends, so that the insulating resin can flow smoothly and be fully distributed in the openings under the electronic components.

Example 3

Please refer to FIG. 8 , which is a schematic plan view of Embodiment 3 of the electronic carrier board of the present invention.

The electronic carrier board and its assembly structure in Embodiment 3 of the present invention are substantially the same as those in Embodiment 1 above, the main difference being that the protective layer 53 on the electronic carrier board is formed in the opening 54 between corresponding pairs of welding pads 52. A plurality of independent residual portions 530, two independent residual portions 530 are shown in FIG. Part of the protective layer 530 is not connected, so as to provide good support for the subsequent electronic components, and provide a flow channel space for the insulating resin without dead ends, so that the insulating resin can flow smoothly and fully distribute in the opening below the electronic components.

Example 4

Please refer to FIG. 9 , which is a schematic plan view of Embodiment 4 of the electronic carrier board of the present invention.

The electronic carrier board and its assembly structure of Embodiment 4 of the present invention are substantially the same as those of Embodiment 1 above, the main difference is that the electronic carrier board is provided with a plurality of side-by-side paired welding pads 52, while covering the electronic carrier board In the protective layer 53 on the top, a single opening 54 is formed corresponding to these welding pads 52, and the three side surfaces of each welding pad 52 are exposed at the same time. In subsequent operations, passive components connected in parallel or in series, such as 0805 type The passive components are correspondingly connected and electrically connected to each of the welding pads 52 .

In this embodiment, the protective layer 53 is formed with a single opening 54 that exposes at least three side surfaces of all the welding pads corresponding to the plurality of pairs of welding pads 52, so as to avoid the passive components connected in parallel or in series in the prior art. The arrangement of the depth effect makes it difficult for the insulating resin to fill the gap under the passive components, so that the insulating resin covers each of the solder pads, thereby reducing the probability of solder extrusion (solder extrusion).

In addition, in the opening 54 of the protective layer 53 on the electronic carrier, corresponding to the paired pads 52, a plurality of independent residual parts 530 such as rectangles are formed to effectively support larger passive components. .

Example 5

Please refer to FIG. 10 , which is a schematic plan view of Embodiment 5 of the electronic carrier board of the present invention.

The electronic carrier board and its assembly structure of Embodiment 5 of the present invention are substantially the same as those of Embodiment 1 above, the main difference being that the protective layer 53 on the electronic carrier board corresponds to an opening formed between at least two solder pads 52 arranged in pairs. 54, and the opening 54 simultaneously exposes the four side surfaces of the welding pads 52, that is, completely exposes the welding pads.

In this way, the insulating resin can completely cover the solder pad in the subsequent operation, avoiding the possibility of molten solder paste flowing through the surface of the solder pad and solder rejection when the passive component is connected to the substrate by solder paste in the prior art The gap between the layers, and then spread and contact each other along the gap between the substrate and the solder-rejection layer, causing solder extrusion (solder extrusion) phenomenon, and even causing problems such as short circuit of adjacent passive components.

Therefore, the electronic carrier board and its construction structure of the present invention make the protective layer covering the surface of the electronic carrier board form a single opening between at least two solder pads arranged in pairs, and expose at least three sides of each solder pad At the same time, at least one independent residual part that is not connected to the opening and not in contact with the rest of the protective layer is formed between the corresponding paired welding pads in the opening, so that the conductive material is placed on the welding pad And electrically connect the electronic component, and when the electronic component is covered with insulating resin, the insulating resin can flow smoothly through the opening below the electronic component, so that the insulating resin material can be effectively filled in the gap and opening between the electronic component and the electronic carrier , to avoid air explosion and electrical bridging problems caused by air holes.

At the same time, since the opening of the protective layer exposes at least three surfaces of each of the welding pads, when the insulating resin material is effectively filled in the gap and opening between the electronic component and the electronic carrier board, the insulating resin covers the welding pads At least three surfaces, avoiding that in the prior art when passive components are placed on the substrate by means of solder paste, the molten solder paste may flow through the gap between the surface of the pad and the solder repellent layer, and then along the gap between the substrate and the solder repellent layer. The gaps between the gaps diffuse and contact with each other, resulting in solder extrusion (solder extrusion) phenomenon, and even lead to problems such as short circuit of adjacent passive components.

Furthermore, in the present invention, at least one independent residual portion that is not in contact with the rest of the protective layer is formed between the paired welding pads in the opening of the protective layer, so that the soldering pads are connected and electrically connected to the electronic pads through conductive materials. Components, and when the electronic component is covered with insulating resin, it can provide a smooth flow channel without dead ends for the insulating resin, avoiding the turbulent flow at the corner caused by the improper configuration of the flow channel under the electronic component in the prior art, and even causing air holes Generation and gas explosion and other issues.

Claims (20)

1. an electronic carrier board is characterized in that, this electronic carrier board comprises:

One main body;

Many the weld pads that are located at this body surfaces in pairs; And

One in order to cover the protective layer of this body surfaces; this protective layer is corresponding to being formed with an opening between at least two weld pads that are provided with in pairs; expose outside respectively these weld pad at least three side surfaces; and this protective layer in this opening between the weld pad that should be provided with in pairs; be formed with at least one independent residual fraction; electronic component can connect to be put at this protective layer independence residual fraction; and be electrically connected to this paired weld pad; make this electronic component and this body surfaces form the flow channel space at a no dead angle; when coating this electronic component; insulating resin can be fully distributed in this electronic component downside and this opening, and then coats this weld pad at least three side surfaces.

2. electronic carrier board as claimed in claim 1 is characterized in that, this electronic carrier board is base plate for packaging, circuit board or the printed circuit board (PCB) that Chip Packaging is used.

3. electronic carrier board as claimed in claim 1 is characterized in that, the main body of this electronic carrier board is the insulating barrier that insulating barrier or intermediate depot have line layer.

4. electronic carrier board as claimed in claim 1 is characterized in that, this protective layer is to refuse layer, and this material of refusing layer is selected the high molecular polymer with high fluidity for use.

5. electronic carrier board as claimed in claim 1 is characterized in that, this protective layer independence residual fraction is not connected with opening, and does not contact with all the other protective layers.

6. electronic carrier board as claimed in claim 1 is characterized in that, this protective layer independence residual fraction contacts with weld pad.

7. electronic carrier board as claimed in claim 1; it is characterized in that this electronic carrier board is provided with many paired weld pads side by side, simultaneously in the protective layer on being covered in this electronic carrier board; be formed with single opening corresponding to these weld pad places, be used to electrically connect the passive device of serial or parallel connection.

8. electronic carrier board as claimed in claim 1 is characterized in that, can be coated with tin cream on this weld pad, and electronic component borrows this tin cream to be electrically connected to this weld pad.

9. electronic carrier board as claimed in claim 1 is characterized in that, this opening exposes outside respectively these weld pad four side surfaces, complete this weld pad that manifests.

10. electronic carrier board as claimed in claim 1 is characterized in that this electronic component is a passive device.

11. the assembling structure of an electronic carrier board is characterized in that, this assembling structure comprises:

One electronic carrier board, this electricity support plate has a body, many weld pads and that are located at this body surface in pairs in order to cover the protective layer of this body surface, this protective layer is corresponding to being formed with an opening between at least two weld pads that are provided with in pairs, expose outside respectively these weld pad at least three side surfaces, and this protective layer in this opening to being formed with at least one independent residual fraction between the weld pad that should be provided with in pairs;

One electronic component connects and puts at this protective layer independence residual fraction and must be electrically connected to this paired weld pad, makes formation one no dead angle flow channel space between this electronic component and this body surfaces; And

One insulating resin coats this electronic component, and can be distributed in this electronic component downside and this opening, and then coats this weld pad at least three side surfaces.

12. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, this electronic carrier board is base plate for packaging, circuit board or the printed circuit board (PCB) that Chip Packaging is used.

13. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, the main body of this electronic carrier board is the insulating barrier that insulating barrier or intermediate depot have line layer.

14. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, this protective layer is for refusing layer, and this material of refusing layer is selected the high molecular polymer with high fluidity for use.

15. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, this protective layer independence residual fraction is not connected with opening, and does not contact with all the other protective layers.

16. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, this protective layer independence residual fraction contacts with weld pad.

17. the assembling structure of electronic carrier board as claimed in claim 11; it is characterized in that; this electronic carrier board is provided with many paired weld pads side by side; simultaneously in the protective layer on being covered in this electronic carrier board; be formed with single opening corresponding to these weld pad places, electrically connect the passive device of serial or parallel connection.

18. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, is coated with tin cream on this weld pad, electronic component borrows this tin cream to be electrically connected to this weld pad.

19. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, this opening exposes outside respectively these weld pad four side surfaces, complete this weld pad that manifests.

20. the assembling structure of electronic carrier board as claimed in claim 11 is characterized in that, this electronic component is a passive device.

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