CN1971893A - Cooling module and its heat pipe - Google Patents

Abstract

A heat dissipation module comprises a heat pipe and at least one heat dissipation fin. The heat pipe comprises a heat pipe body, a base, a first capillary structure, a second capillary structure and a working fluid filled in the heat pipe. The heat pipe body has a top and a side wall surrounding the top, and the base is combined with the heat pipe body to form a closed space and is arranged opposite to the top. The base has a non-flat base inner surface facing the top. The first capillary structure is arranged on the inner surface of the side wall part and the inner surface of the top part of the heat pipe body, the second capillary structure is arranged on the inner surface of the base, and the second capillary structure is connected with the first capillary structure.

Description

Cooling module and its heat pipe

【Technical field】

The invention relates to a heat dissipation module, in particular to a heat dissipation module with high-efficiency heat pipes.

【Background technique】

With the advancement of technology, the number of transistors per unit area of electronic components is increasing, resulting in an increase in heat generation during operation. On the other hand, the operating frequency of electronic components is getting higher and higher, and the heat (switch loss) caused by the on/off (on/off) conversion during transistor operation is also the reason for the increase in the heat generation of electronic components. If the heat is not handled properly, the computing speed of the chip will be reduced, and in severe cases, the life of the chip may even be affected. In order to enhance the heat dissipation effect of electronic components, most of the current practices are to use a heat sink to dissipate the heat at the heat source, and dissipate the heat to the environment through natural or forced convection through the fins of the heat sink.

Since the heat pipe can transmit a large amount of heat over a considerable distance with a small cross-sectional area and temperature difference, and can operate without an external power supply, there is no need for power supply and space utilization considerations. Under the current situation, all kinds of heat pipes have become one of the heat transfer elements widely used in electronic heat dissipation products. Please refer to FIG. 1 , which is a schematic cross-sectional view of a conventional columnar heat pipe. The conventional columnar heat pipe 10 is a closed hollow cavity formed by combining a heat pipe body 12 with one end closed and the other open, and an upper cover 14 .

The heat pipe body 12 is an integral tank body, and is composed of a side wall 122 and a bottom 124 . Capillary structures 16a, 16b are respectively provided on the inner wall of the heat pipe body 12 (ie, the inner surface of the side wall portion 122 and the inner surface of the bottom 124 ), and the heat pipe 10 is filled with working fluid W. When the columnar heat pipe 10 is actually in use, the bottom 124 is in direct contact with a heat source (not shown) located below the heat pipe 10 to direct the heat generated by the heat source away from the heat source. The bottom 124 of the columnar heat pipe 10 is the evaporation end, while the side wall 122 and the upper cover 14 are the condensation end. The working fluid at the evaporating end evaporates into a gaseous state due to heat absorption, and flows naturally to the condensing end under the influence of the pressure difference, and then turns into a liquid working fluid after releasing latent heat at the condensing end. The condensed working fluid flows back to the evaporation end through the capillary force of the capillary structures 16a, 16b. In this way, repeated circulation achieves the effect of heat dissipation.

However, for the columnar heat pipe 10 using the powder sintering method to make the capillary structures 16a, 16b, limited by the sintering mold and process factors, the capillary structure 16b on the bottom 124 and the capillary structure 16a on the side wall 122 are the same It is formed by powder filling and sintering, but there is usually no additional capillary structure on the inner surface of the upper cover 14, so that the working fluid condensed on the upper cover 14 cannot return, causing the upper cover 14 to become an invalid condensation end, affecting the heat pipe 10 Changes in the quality of the internal working fluid further affect the heat transfer efficiency and overall thermal resistance of the heat pipe 10 .

If the inner surface of the upper cover 14 is also provided with a capillary structure, it is necessary to adopt a process of simultaneously filling powder and sintering at the evaporation end and the condensation end, which will make it difficult to control the shape of the capillary structure and powder particles, so it cannot be used. This process is accomplished. Therefore, if the inner surface of the upper cover 14 is to be provided with a capillary structure, copper mesh or the like needs to be inserted to form a mesh capillary structure. However, since the capillary structure 16a positioned at the upper cover 14 and the capillary structure 16a positioned on the side wall 122 are not produced simultaneously, and belong to different types of capillary structures (one is a powder sintered capillary structure, the other is a mesh capillary structure ), so the connection between the contact parts of the two capillary structures is very poor, so that the working fluid cannot flow smoothly from the upper cover 14 to the side wall 122 by capillary force, thus causing the overall thermal conductivity of the heat pipe 10 to deteriorate.

Based on the above, how to manufacture a columnar heat pipe with low cost and simple manufacturing process, which can solve the above-mentioned problems, is really an important issue.

【Content of invention】

Therefore, in order to solve the above problems, the present invention proposes a heat dissipation module and its heat pipe. In addition to the advantages of low cost and simple manufacturing process, the present invention can not only solve the capillary problem at the side wall and upper cover of the conventional columnar heat pipe. The problem of structural connectivity can effectively increase the heat exchange area of the columnar heat pipe to improve the overall heat dissipation performance.

According to the object of the present invention, a heat pipe is proposed, which includes a heat pipe body, a base, a first capillary structure, a second capillary structure and a working fluid filled in the heat pipe. The heat pipe body has a top and a side wall surrounding the top, and the base is combined with the heat pipe body to form a closed space, and the base is set opposite to the top. The base has a non-flat base inner surface, and the inner surface of the base is towards the top. The first capillary structure is arranged on the inner surface of the side wall and the top of the heat pipe body, and the second capillary structure is arranged on the inner surface of the base, and the second capillary structure is connected with the first capillary structure.

As in the heat pipe mentioned above, the side wall and the top are integrally formed to form the heat pipe body, or the side wall and the top are two separate elements that are connected to form the heat pipe body. Wherein the inner surface of the base is formed with at least one protrusion, the cross-sectional shape of the protrusion on the inner surface of the base is hemispherical, arc-shaped, triangular, rectangular, square or trapezoidal, and the protrusion forms a checkerboard shape on the inner surface of the base. pattern, a row-column pattern, a symmetrical pattern, or an asymmetrical pattern.

The second capillary structure is laid on the inner surface of the base so that the second capillary structure faces the top to form a plane. The second capillary structure has a first thickness and a second thickness in a direction perpendicular to the base, and the first thickness is greater than the second thickness. Alternatively, the second capillary structure is arranged along the contour of the inner surface of the base, and the second capillary structure has equal or unequal thicknesses. Furthermore, the inner surface of the top of the heat pipe body is flat or uneven. In addition, the inner surface of the side wall of the heat pipe body is flat or non-flat, and at least one protrusion is formed on the inner surface of the side wall, and the section of the protrusion on the side wall forms a zigzag ring pattern or a continuous pattern. Semicircle pattern.

The side wall of the heat pipe body is a hollow column, and the material of the heat pipe body and the base is a high thermal conductivity material, such as copper, silver, aluminum or their alloys.

The materials of the first capillary structure and the second capillary structure include one selected from the group consisting of plastics, metals, alloys, and porous non-metallic materials, and the setting method is selected from sintering, adhesion, filling, and deposition. one or a combination of groups. The working fluid system is one of inorganic compounds, pure water, alcohols, ketones, liquid metals, refrigerants, organic compounds or mixtures thereof.

According to another object of the present invention, a heat dissipation module is provided, including a heat pipe and at least one heat dissipation fin. The heat pipe includes a heat pipe body, a base, a first capillary structure, a second capillary structure and a working fluid filled in the heat pipe. The heat pipe body has a top and a side wall surrounding the top, and the base is combined with the heat pipe body to form a closed space, and the base is set opposite to the side wall. The base has a non-flat base inner surface, and the inner surface of the base is towards the top. The first capillary structure is arranged on the inner surface of the side wall and the top of the heat pipe body, and the second capillary structure is arranged on the inner surface of the base, and the second capillary structure is connected with the first capillary structure.

The cooling fins are produced by aluminum extrusion, stamping or other processing methods, and the cooling fins are distributed horizontally, vertically, obliquely, radially or in other ways. The cooling fins are arranged outside the heat pipe and connected with the heat pipe, and the connection method is selected from one of the group consisting of welding, fitting, clamping and adhesion. For example, the heat dissipation fins and the heat pipes are fitted and/or fastened in a heat fitting manner. In addition, there is a soldering paste, a thermal grease, or a material that can serve as a thermal interface between the heat dissipation fins and the heat pipe.

Like the heat dissipation module mentioned above, the heat pipe can pass through a base or directly contact with a heat source, so as to conduct the heat dissipated by the heat source directly to the heat dissipation fins. The base is a solid metal block, and the heat source is a heating electronic component, such as a central processing unit, transistor, server, high-end graphics card, hard disk, power supply, driving control system, multimedia electronic mechanism, wireless communication Base stations or high-end game consoles, etc. Furthermore, the above-mentioned heat dissipation module is combined with a fan to facilitate the heat dissipated by the heat dissipation module to be dissipated more quickly.

In order to make the above and other purposes, features, and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, together with the accompanying drawings, as follows:

【Description of drawings】

FIG. 1 is a schematic cross-sectional view of a conventional columnar heat pipe.

FIG. 2 is a schematic diagram of a columnar heat pipe according to a preferred embodiment of the present invention.

3A and 3B are schematic diagrams of two bases of the columnar heat pipe in FIG. 2 .

3C and 3D are two schematic diagrams of the base in FIG. 2 and the capillary structure thereon.

FIG. 4 is a schematic diagram of another columnar heat pipe according to a preferred embodiment of the present invention.

5A to 5C are schematic diagrams illustrating the assembly of the columnar heat pipe in FIG. 4 .

FIG. 6A is a schematic diagram of another inner wall of the columnar heat pipe in FIG. 4 .

Fig. 6B is a top view of the inner wall of the columnar heat pipe in Fig. 6A.

7A and 7B are two schematic diagrams of applying the columnar heat pipe of the preferred embodiment of the present invention to the heat dissipation module.

【Detailed ways】

Embodiments of the heat dissipation module and the heat pipe thereof according to the present invention will be described below with reference to related drawings.

Please refer to FIG. 2 , which is a schematic diagram of a columnar heat pipe according to a preferred embodiment of the present invention. The columnar heat pipe 20 of the present invention includes a heat pipe body 22 , a base 28 , a first capillary structure 26 a , a second capillary structure 26 b and a working fluid W filled inside the heat pipe 20 . The heat pipe body 22 has a top 224 and a side wall 222 surrounding the top 224 , and the base 28 is combined with the heat pipe body 22 to form a closed space, and the base 28 is opposite to the top 224 .

The base 28 has an uneven base inner surface 281 , and the base inner surface 281 faces the top 224 . The inner surface 281 of the base is formed with at least one protrusion 282 , and the cross-sectional shape of the protrusion 282 on the inner surface 281 of the base is rectangular or other shapes such as hemispherical, arc, triangle, square or trapezoid. Here, it should be noted that the shape and number of the protrusions 282 formed on the inner surface 281 of the base are not limited, and may be multiple protrusions (as shown in FIG. 3A ), or only a single protrusion (such as 3B ), and a plurality of protrusions 282 form a checkerboard pattern, a row-column pattern, a symmetrical pattern or an asymmetrical pattern on the inner surface 281 of the base.

The first capillary structure 26a is disposed on the inner surface of the side wall portion 222 and the inner surface of the top 224 of the heat pipe body 22, while the second capillary structure 26b is disposed on the inner surface 281 of the base 28, and the second capillary structure 26b and the inner surface of the top 224 The first capillary structures 26a are connected. Please refer to FIG. 3C , which is a schematic diagram of the base in FIG. 2 and one of the capillary structures thereon. The second capillary structure 26b is disposed along the contour of the inner surface 281 of the base, and the second capillary structure 26b has equal or unequal thicknesses. It should be noted that in FIG. 3C , a plurality of protrusions 282 are formed on the inner surface 281 of the base 28 as an example, which is clearly shown in FIG. 2 , so FIG. 2 only shows a single protrusion 282 .

Alternatively, please refer to FIG. 3D , which is another schematic view of the base in FIG. 2 and the capillary structure thereon. The second capillary structure 26b is laid on the inner surface 281 of the base so that the second capillary structure 26b faces the top 224 to form a plane. The second capillary structure 26 b has a first thickness H1 and a second thickness H2 in a direction perpendicular to the base 28 , and the first thickness H1 is greater than the second thickness H2 . The first thickness H1 is the thickness of the second capillary structure 26b above the inner surface 281 of the base without the bump 282, and the second thickness H2 is the second capillary structure above the inner surface 281 of the base with the bump 282. 26b thickness. It should be noted that in FIG. 3D , a plurality of protrusions 282 are formed on the inner surface 281 of the base 28 as an example, which is clearly shown in FIG. 2 , so FIG. 2 only shows a single protrusion 282 .

When the heat pipe 20 is actually in use, the base 28 is in direct contact with a heat source (not shown) located below the heat pipe 20 , so as to direct the heat generated by the heat source away from the heat source. Alternatively, the heat pipe 20 may be in contact with the heat source through an external base (not shown) located below the heat pipe 20 and above the heat source. When the heat pipe 20 is arranged on the heat source, the working fluid in the capillary structure 26b near the end of the heat source (that is, the evaporation end) absorbs the heat generated by the heat source and becomes a gaseous working fluid, and naturally flows to the condensation end under the influence of the pressure difference. , and then release latent heat in the capillary structure 26a at the end far away from the heat source (i.e., the condensation end), and then turn into a liquid working fluid, and then flow back to the evaporation end through the capillary force provided by the capillary structure 26b, so that the heat is circulated endlessly Keep it away from the heat source to achieve the effect of heat dissipation.

Since the heat pipe body 20 and the base 28 are two independent components, the inner surface 281 of the base 285 can be easily processed into an uneven surface, so that the contact area between the base 28 and the capillary structure 26b increases, which helps to improve the heat dissipation of the heat pipe 20 performance. Moreover, the capillary structure 26b disposed on the inner surface 281 of the base is set separately from the capillary structure 26a on the heat pipe body 20, so that the capillary structure 26b of a single or different thickness can be easily disposed on the uneven base 28 to increase the capillary structure. The surface area of the structure is used to improve the evaporation efficiency of the working fluid, thereby improving the heat dissipation performance of the heat pipe 10 at the evaporation end.

The material of the heat pipe body 22 and the base 28 is a high thermal conductivity material, such as copper, silver, aluminum or alloys thereof. The material of the first capillary structure 26a and the second capillary structure 26b includes one selected from the group consisting of plastics, metals, alloys, and porous non-metallic materials, and the setting method is selected from sintering, adhesion, filling, and deposition. One or a combination of groupings. The working fluid W is one of inorganic compounds, pure water, alcohols, ketones, liquid metals, refrigerants, organic compounds or mixtures thereof.

The side wall 222 and the top 224 are integrally formed to form the heat pipe body 22, or the side wall of the heat pipe body is a hollow column, and the side wall and the top are two separate elements, which are connected to form the heat pipe body. Please refer to FIG. 4 and FIGS. 5A to 5C at the same time. FIG. 4 is a schematic diagram of another columnar heat pipe according to a preferred embodiment of the present invention, and FIGS. 5A to 5C are schematic diagrams of assembly of the columnar heat pipe in FIG. 4 . Another columnar heat pipe 40 in a preferred embodiment of the present invention includes a heat pipe body 42, a base 48, a first capillary structure 46a, a second capillary structure 46b, and a working fluid W filled inside the heat pipe 40. .

The heat pipe body 42 has a top 424 and a side wall 422 surrounding the top 424. The difference from the heat pipe 20 in FIG. The heat pipe body 42 is formed after being connected by matching, welding, bonding and other methods. Afterwards, the first capillary structure 46 a is disposed on the inner surfaces of the side wall portion 422 and the top 424 , and on the other hand, the second capillary structure 46 b is also disposed on the base 48 . After the capillary structure is formed, the base 48 is combined with the heat pipe body 42 to form a closed space inside the heat pipe 40 , and the base 48 is set opposite to the top 424 . Other implementation methods have the same technical features as those in FIG. 2 , and will not be repeated here.

In addition, in addition to the non-flat inner surface of the base 28, 48, the top inner surface or the inner surface of the side wall of the heat pipe body can also be designed as a non-flat surface, so as to increase the surface area of the capillary structure, that is, the inner surface of the top The surface or the inner surface of the side wall portion may have unevenness in addition to being flat. Please refer to FIG. 6A , which is a schematic diagram of another inner wall of the columnar heat pipe in FIG. 4 . 6A is an example where the base 68 and the side wall 622 are non-flat surfaces. Similar to the bases 28 and 48 in FIGS. 2 and 4 , at least A bump 682a, 682b, and the cross-section of the bump 682b on the side wall portion 622 forms a zigzag ring pattern (as shown in FIG. 6B ), a continuous semicircular pattern or other patterns with equivalent structures, as shown in FIG. 6B is a top view of the inner wall of the columnar heat pipe in FIG. 6A . Here, it should be particularly noted that the shape and number of the protrusions 682a, 682b formed on the inner surface of the base 68 and the inner surface of the side wall portion 522 are not limited, and may consist of only a single protrusion, or multiple protrusions. bumps, and the bumps 682a form a checkerboard pattern, a row-column pattern, a symmetrical pattern or an asymmetrical pattern on the inner surface of the bump 68.

Similar to the arrangement of the first capillary structure 26a and the second capillary structure 26b in FIG. The second capillary structure 66b is disposed on the inner surface of the base 68, and the second capillary structure 66b is connected to the first capillary structure 66a. The second capillary structure 66b is disposed along the contour of the inner surface of the base 68 , and the second capillary structure 66b has equal or unequal thicknesses. Alternatively, the second capillary structure 66b is laid on the inner surface of the base 68 such that the second capillary structure 66b faces the top 624 to form a plane. The second capillary structure 66b has a first thickness (not shown) and a second thickness (not shown) in a direction perpendicular to the base 68 , and the first thickness is greater than the second thickness. The first thickness is the thickness of the second capillary structure 66b located on the inner surface of the base 68 without the protrusion 682a, and the second thickness is the second capillary structure located on the inner surface of the base 68 and above the protrusion 682a. 66b thickness. As for the first capillary structure 66 a on the side wall portion 622 , it may have the same technical features as the second capillary structure 66 b , so details will not be repeated here.

Please refer to FIG. 7A and FIG. 7B at the same time, which are two schematic diagrams of applying the cylindrical heat pipe of the preferred embodiment of the present invention to the heat dissipation module. The cooling modules 50A, 50B can be applied to a heat source (not shown), and the heat pipe 20 is in direct contact with the heat source or through an external base (not shown) located below the heat pipe and above the heat source. . A heat source is an electronic component that generates heat, such as a central processing unit, transistor, server, high-end graphics card, hard disk, power supply, driving control system, multimedia electronic mechanism, wireless communication base station, or high-end game console, etc. . In addition, the cooling modules 50A, 50B can be combined with a fan to promote the heat dissipated by the cooling modules 50A, 50B more quickly.

In FIG. 7A , the heat dissipation module 50A includes a heat pipe 20 and at least one heat dissipation fin 52 a. The heat pipe 20 may have the same technical features as the heat pipe 20 in FIG. 2 , which will not be repeated here. The heat dissipation fins 52 a are made by aluminum extrusion, stamping or other processing methods, and the heat dissipation fins 52 a are disposed outside the heat pipe 20 and connected to the heat pipe 20 . The connection method of the heat dissipation fin 52a and the heat pipe 20 is selected from the group consisting of welding, fitting, fastening and adhesion. For example, the heat dissipation fins and the heat pipes are fitted and/or fastened in a heat fitting manner. In addition, a soldering paste, a heat conduction grease, or a material that can serve as a heat conduction interface is further coated between the heat dissipation fins 52 a and the heat pipe 20 .

A plurality of heat dissipation fins 52a are radially distributed outside the heat pipe 20 and connected to the heat pipe 20, and the heat pipe 20 is sheathed between the plurality of heat dissipation fins 52a. Alternatively, as shown in FIG. 7B , a plurality of heat dissipation fins 52 b are disposed on the outside of the heat pipe 20 in a horizontally spaced manner, and the plurality of heat dissipation fins 52 b are parallel to each other. However, the distribution of the heat dissipation fins 52a and 52b is just an example, and the present invention is not limited thereto. The arrangement of the heat dissipation fins 52a and 52b may also be vertically spaced, obliquely spaced or other distributions.

Based on the above, the heat dissipation module and its heat pipe of the present invention not only have the advantages of low cost and simple manufacturing process, but also the side wall and the top of the heat pipe body of the present invention are integrally formed or tightly fitted. The capillary structure is provided on the inner surface of the side wall and the top at the same time. Therefore, because the capillary structure of the side wall and the top is continuous, the working fluid condensed on the capillary structure of the top can flow smoothly to the capillary structure of the side wall without There will be obstacles, which can solve the problem of capillary structure connectivity between the side wall of the columnar heat pipe and the upper cover, and can effectively increase the heat exchange area of the columnar heat pipe to improve the overall heat dissipation performance.

Furthermore, since the heat pipe body and the base are two independent components, the inner surface of the base can be easily processed into an uneven surface, so that the contact area between the base and the capillary structure increases, which helps to improve the heat dissipation performance of the heat pipe. In addition, the capillary structure on the inner surface of the base is set separately from the capillary structure on the heat pipe body, so it is easy to set a single or different thickness of capillary structure on the uneven base, so as to increase the surface area of the capillary structure to improve the working fluid. The evaporation efficiency is improved, thereby improving the heat dissipation performance of the heat pipe at the evaporation end.

The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

Claims (18)

1, a kind of heat pipe comprises:

One heat pipe body has the side wall portion that a top and is located on this top;

One base be to combine the back to form an enclosure space with this heat pipe body, and this base is and this top is oppositely arranged, and wherein this base has the base inner surface of a non-flat forms, and this base inner surface system is towards this top;

One first capillary structure is arranged on this side wall portion inner surface and this top inner surface of this heat pipe body;

One second capillary structure is arranged on this base inner surface, and this second capillary structure links to each other with this first capillary structure; And

One working fluid, filling is in this heat pipe.

2, heat pipe according to claim 1 is characterized in that, this side wall portion and this top are one-body molded to form this heat pipe body.

3, heat pipe according to claim 1 is characterized in that, this side wall portion is two elements that separate with this top, after connecting and form this heat pipe body.

4, heat pipe according to claim 1 is characterized in that, this base inner surface system is formed with at least one projection.

5, heat pipe according to claim 4 is characterized in that, whenever the cross sectional shape of those projections on this base inner surface is hemisphere, arc, triangle, rectangle, square or trapezoidal.

6, heat pipe according to claim 4 is characterized in that, those projections are to constitute a checkerboard pattern, a ranks pattern, a symmetrical expression pattern or an asymmetric pattern on this base inner surface.

7, heat pipe according to claim 1, it is characterized in that, this second capillary structure system is layed in this base inner surface, in order to do making this second capillary structure form a plane towards this top system, and this second capillary structure has one first thickness and one second thickness on perpendicular to this base direction, and this first thickness system is greater than this second thickness.

8, heat pipe according to claim 1 is characterized in that, this second capillary structure is to be provided with along the profile of this base inner surface, and this second capillary structure cording has equal thickness or non-equal thickness.

9, heat pipe according to claim 1 is characterized in that, the inner surface at the top of this heat pipe body is a flat condition, or rough shape is arranged and be formed with at least one projection in this top inner surface system.

10, heat pipe according to claim 9 is characterized in that, those projections are to constitute a checkerboard pattern, a ranks pattern, a symmetrical expression pattern or an asymmetric pattern on this top inner surface.

11, heat pipe according to claim 9, it is characterized in that, this first capillary structure system is layed in this top inner surface, in order to do making this first capillary structure form a plane towards this base system, and this first capillary structure is in perpendicular to this top-direction, cording has one the 3rd thickness and one the 4th thickness, and the 3rd thickness system is greater than the 4th thickness.

12, heat pipe according to claim 9 is characterized in that, this first capillary structure is to be provided with along the profile of this top inner surface, and this first capillary structure cording has equal thickness or non-equal thickness.

13, heat pipe according to claim 1 is characterized in that, the side wall portion inner surface of this heat pipe body is the non-flat forms shape, and is formed with at least one projection in this top inner surface system.

14, heat pipe according to claim 13 is characterized in that, those projections constitute a sawtooth annular patterns or a continuous semicircle shape pattern in the cross section of this side wall portion system.

15, heat pipe according to claim 13 is characterized in that, this first capillary structure system is layed in this side wall portion inner surface, in order to do making this first capillary structure form a plane towards this enclosure space system.

16, heat pipe according to claim 1 is characterized in that, this base is circular, square or other geometries.

17, a kind of radiating module comprises:

One heat pipe comprises:

One heat pipe body;

One base is to combine the back to form an enclosure space with this heat pipe body, and wherein this base has the base inner surface of a non-flat forms;

One first capillary structure is arranged on one of this heat pipe body inner surface;

One second capillary structure is arranged on this base inner surface, and this second capillary structure links to each other with this first capillary structure; And

One working fluid, filling is in this heat pipe; And

At least one radiating fin is arranged at this heat pipe and is connected outward and with this heat pipe.

18, radiating module according to claim 17, it is characterized in that, this heat pipe body has the side wall portion that a top and is located on this top, this base system is oppositely arranged with this top, and this base inner surface system is towards this top, and this first capillary structure system is arranged on this side wall portion inner surface and this top inner surface of this heat pipe body.

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