CN107289800A - Temperature equalizing plate structure and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a temperature equalizing plate structure and a manufacturing method thereof, comprising: a main body, a capillary structure, and a working fluid, wherein the main body has a condensation zone, an evaporation zone, and a chamber, wherein the condensation zone and the evaporation zone are arranged on both sides of the chamber, and the evaporation portion has a first side surface and a second side surface, wherein the first side surface has a convex portion; the capillary structure is arranged on the inner surface of the aforementioned chamber; the working fluid is filled in the aforementioned chamber, and the convex portion is formed by mechanical processing to play a role in supporting the structure and increasing the structural strength, thereby greatly reducing the manufacturer's cost.

Description

Vapor structure and manufacturing method thereof

technical field

The invention belongs to a uniform temperature plate structure and a manufacturing method thereof, in particular to a uniform temperature plate structure and a manufacturing method thereof that can greatly reduce manufacturing costs.

Background technique

As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to improving the performance of electronic equipment and systems. Despite the ever-shrinking dimensions of the semiconductors forming electronic components, there is a continuing demand for increased performance. As semiconductors shrink in size, the resulting heat flux increases. The heat flux increase creates challenges in cooling the product beyond just the overall heat increase, because the heat flux increase causes overheating at different times and at different length dimensions, which can lead to electronic failure or damage. Therefore, in order to solve the problem of the narrow heat dissipation space in the prior art, a VC (Vapor chamber) HeatSink is placed above the chip as a heat sink. In order to increase the capillary limit, copper column coating sintering, sintering column, Capillary structures such as foam columns are used as support for the return channel, but because the thickness of the upper and lower walls of the micro-chamber is relatively thin (applied below 1.5mm), the conventional structure using the above-mentioned capillary structure as a support is not suitable for application on the micro-chamber , will cause the micro-chamber to be supported only where there are copper pillars, sintered pillars or foaming pillars, and the rest of the places where there are no places will form collapse limits or depressions, resulting in the overall flatness of the micro-chamber structure Since the strength and strength cannot be maintained, thinning cannot be achieved. When the working fluid in the above vapor chamber evaporates from the heating area of the evaporation area, the working fluid changes from a liquid state to a vapor state, and the vapor state working fluid condenses into a liquid state after reaching the condensation area of the vapor chamber, and then flows back to the The evaporation area continues to circulate, and the condensation area of the vapor chamber is usually a smooth surface, or it has a sintered capillary structure. The relationship makes it possible to return to the evaporation area, but the structure of the conventional condensation area is a smooth surface, so that the condensed liquid water droplets need to be stored to a certain volume before dripping by gravity, resulting in insufficient reflux efficiency, and Because the return rate of the liquid working fluid is too slow, there is no working fluid in the evaporation area, resulting in a dry state, which greatly reduces the heat transfer efficiency; if it is to enhance the return efficiency of the working fluid, adding a capillary structure is a conventionally indispensable structure , but the setting of this capillary structure (such as sintered body or grid) makes the vapor chamber unable to achieve the effect of thinning.

The thinning hot plate is mainly to open grooves on the plate body by etching to form a capillary structure or to form a support structure on the plate body, but the disadvantages of etching are poor precision and time-consuming processing, making the thinning hot plate Or the manufacturing cost of the vapor chamber cannot be reduced.

Contents of the invention

In order to solve the above-mentioned shortcomings of the prior art, the present invention provides a vapor chamber structure that can reduce manufacturing costs.

Another object of the present invention is to provide a method for manufacturing a chamber that can greatly reduce the manufacturing cost of the chamber.

To achieve the above object, the present invention provides a vapor chamber structure, comprising: a body with a condensation area, an evaporation area and a chamber, the condensation area and the evaporation area are located on both sides of the chamber; The protrusion is selected to be configured by any protrusion in the evaporation area or the condensation area; a capillary structure is arranged on the surface of the aforementioned chamber; a working fluid is filled in the aforementioned chamber.

The convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the evaporation area to the opposite direction of the evaporation area, and the periphery of the main body adjacent to the convex bodies is correspondingly concave.

The convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the condensation area to the direction opposite to the condensation area, and the periphery of the main body adjacent to the convex bodies is correspondingly concave.

The body has a first plate body and a second plate body. The first and second plate bodies correspond to the covers and jointly define the aforementioned chamber. The condensation area is set on one side of the first plate body, and the evaporation area is set on one side of the second board.

The body is a flat tube.

The convex body has a free end, and the free end is connected with the condensation zone, that is, the convex body and the condensation zone have the aforementioned capillary structure.

The convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the evaporation area to the direction opposite to the evaporation area, and the other side of the main body opposite to the convex bodies is correspondingly concave.

The convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the condensation area to the direction opposite to the condensation area, and the other side of the main body opposite to the convex bodies is correspondingly concave.

In order to achieve the above object, the present invention provides a method for manufacturing a uniform temperature plate structure, which includes the following steps: providing a first plate body and a second plate body; selecting any of the first and second plate bodies by mechanical processing Firstly, at least one convex body is formed; the first and second plate bodies are covered correspondingly, the surroundings are sealed, and the operation of vacuumizing and filling the working fluid is carried out.

A method for manufacturing a vapor chamber structure, comprising the following steps: providing a first plate body and a second plate body; forming at least one convex body on any one of the first and second plate bodies by mechanical processing; The first and second boards are covered correspondingly, the surroundings are sealed, and the operation of vacuumizing and filling the working fluid is carried out.

The machining process is any one of stamping process, embossing process, forging process, rolling process, engraving process or casting process.

After the step of forming at least one convex body on any one of the first and second plates by mechanical processing, there is a further step of forming capillary structures on the corresponding sides of the first and second plates.

The invention provides a method for manufacturing a vapor chamber structure, which includes the following steps: providing a flat tube body; forming at least one convex body on the inner side of the tube body by mechanical processing; sealing both ends of the tube body and extracting Vacuum and filling operations with working fluid.

After the step of forming at least one convex body on the inner side of the aforementioned tube body by mechanical processing, there is a further step of forming a capillary structure inside the tube body.

The mechanical processing is any one of stamping processing, embossing processing, forging processing, rolling processing, engraving processing or casting processing.

Through the present invention, the manufacturing cost of the uniform temperature plate can be greatly reduced, and the manufacturing precision can be further improved.

Description of drawings

Fig. 1 is a three-dimensional exploded view of the first embodiment of the vapor chamber structure of the present invention;

Fig. 2 is a three-dimensional combined view of the first embodiment of the vapor chamber structure of the present invention;

Fig. 3 is a cross-sectional view of the first embodiment of the vapor chamber structure of the present invention;

Fig. 4 is a cross-sectional view of the second embodiment of the vapor chamber structure of the present invention;

Fig. 5 is a cross-sectional view of the third embodiment of the vapor chamber structure of the present invention;

Fig. 6 is a cross-sectional view of the fourth embodiment of the vapor chamber structure of the present invention;

Fig. 7 is a flow chart of the steps of the first embodiment of the manufacturing method of the chamber structure of the present invention;

Fig. 8 is a flow chart of the steps of the second embodiment of the manufacturing method of the vapor chamber structure of the present invention;

Fig. 9 is a flow chart of the steps of the third embodiment of the manufacturing method of the vapor chamber structure of the present invention;

Fig. 10 is a flow chart of the steps of the fourth embodiment of the manufacturing method of the chamber structure of the present invention.

Description of main symbols:

Ontology 11

The first plate body 11a

second plate body 11b

Convex part 111

Convex 1111

Free end 1111a

capillary structure 2

working fluid 3

Condensation zone 112

Evaporation zone 113

chamber 114 .

detailed description

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1, 2, and 3, which are three-dimensional decomposition, assembly and cross-sectional views of the first embodiment of the chamber structure of the present invention. As shown in the figure, the chamber structure includes: a body 11, a convex portion 111, a capillary structure 2, a working fluid 3;

The main body 11 has a condensation area 112, an evaporation area 113 and a chamber 114, and the main body 11 further has a first plate body 11a and a second plate body 11b. The first and second plate bodies 11a, 11b corresponds to the cover and jointly defines the aforementioned chamber 114. The condensation zone 112 is located on the side of the first plate 11a, and the evaporation zone 113 is located on the side of the second plate 11b, that is, the condensation zone 112 and the The evaporation regions 113 are respectively disposed on two sides of the chamber 114 and correspond to each other.

The convex portion 111 is selected to be configured by any one or both of the evaporation region 113 or the condensation region 112 (evaporation region 113, condensation region 112). The convex portion 111 of this embodiment has a plurality of A convex body 1111, said convex body 1111 is formed by extending from the evaporation area 113 to the opposite direction of the evaporation area 113, and the convex body 1111 has a free end 1111a, the free end 1111a is connected to the aforementioned condensation area 112, the The periphery of the main body 11 adjacent to the convex body 1111 is correspondingly concave. The convex body 1111 in this embodiment is formed by embossing method, so the other side of the convex body 1111 is flat.

The capillary structure 2 is disposed on the surface of the chamber 114 , that is, the capillary structure 2 is provided between the protrusion 1111 and the condensation area 112 , and the working fluid 3 is filled in the chamber 114 .

Please refer to Fig. 4, which is a cross-sectional view of the second embodiment of the chamber structure of the present invention. As shown in the figure, this embodiment has the same structural technical features as the aforementioned first embodiment, so it will not be repeated here, but this The difference between the example and the aforementioned first embodiment is that the opposite side of the plurality of convex bodies 1111 of the evaporation region 113 is concave.

Please refer to Fig. 5, which is a cross-sectional view of the third embodiment of the chamber structure of the present invention. As shown in the figure, this embodiment has the same structural technical features as the aforementioned first embodiment, so it will not be repeated here, but this The difference between the example and the aforementioned first embodiment is that the convex portion 111 has a plurality of convex bodies 1111, and the convex bodies 1111 are formed by extending from the condensation area 112 to the direction opposite to the condensation area 112. The main body 11 The surrounding areas adjacent to the protrusions 1111 are correspondingly concave.

Please refer to Figure 6, which is a cross-sectional view of the fourth embodiment of the chamber structure of the present invention. As shown in the figure, this embodiment has the same structural technical features as the first, second, and third embodiments described above, so it will not be repeated here To repeat, the difference between this example and the aforementioned first, second, and third embodiments is that the main body 11 is a flat tube.

Please refer to FIG. 7, which is a flow chart of the steps of the first embodiment of the method for manufacturing the chamber structure of the present invention, and refer to the aforementioned FIGS. 1 to 6 together. As shown in the figure, the method for manufacturing the chamber structure includes the following steps :

S1: providing a first plate body and a second plate body;

A first plate body 11a and a second plate body 11b are provided. The first and second plate bodies 11a and 11b are made of materials with better thermal conductivity, such as copper or aluminum.

S2: choose to form at least one convex body on any one of the aforementioned first and second plates by means of mechanical processing;

By choosing to form at least one convex body 1111 on any one of the aforementioned first and second plate bodies 11a, 11b by means of mechanical processing, the mechanical processing can be selected as any one of stamping processing, embossing processing or forging processing, so The stamping process can also be selected to form the convex body in any one of embossing method, compression molding method or embossing method.

S3: Cover the first and second boards correspondingly, seal their surroundings and carry out the operation of vacuumizing and filling the working fluid.

After the protruding body 1111 is formed by machining, the first and second plate bodies 11a and 11b are covered correspondingly, and the first and second plate bodies 11a and 11b are sealed by welding or diffusion bonding, and vacuum pumping and Fill in the working fluid 3 and other operations. Please refer to FIG. 8 , which is a flow chart of the steps of the second embodiment of the method for manufacturing a chamber structure of the present invention, and refer to FIGS. 1 to 6 together. As shown in the figure, the method for manufacturing a chamber structure includes the following steps:

S1: providing a first plate body and a second plate body;

S2: choose to form at least one convex body on any one of the aforementioned first and second plates by means of mechanical processing;

S3: Cover the first and second boards correspondingly, seal their surroundings and carry out the operation of vacuumizing and filling the working fluid.

Part of the steps in this embodiment are the same as those in the aforementioned first embodiment, so they will not be repeated here, but the difference between this embodiment and the aforementioned first embodiment is that the step S2 is selected in the aforementioned first embodiment by mechanical processing. After the step of forming at least one convex body in any one of the first and second plate bodies, there is a step S4:.

The capillary structure 2 can be sintered powder structure or placed in a mesh body or grooves are provided on the first and second plate bodies 11a and 11b.

Please refer to FIG. 9, which is a flow chart of the steps of the third embodiment of the manufacturing method of the chamber structure of the present invention, and refer to FIGS. 1 to 6 together. As shown in the figure, the manufacturing method of the chamber structure includes the following steps:

A1: Provide a flat tube body;

A flat tubular body with at least one open end is provided.

A2: At least one convex body is formed on the inner side of the aforementioned pipe body by mechanical processing;

By choosing to form at least one convex body 1111 on the inner side of the aforementioned pipe body by means of mechanical processing, the mechanical processing can be selected as any one of stamping processing, embossing processing or forging processing, and the stamping processing can also be selected in the form of The convex body 1111 is formed by embossing method, molding method or embossing method.

A3: The two ends of the pipe body are closed and vacuumized and filled with working fluid.

The open end of the flattened pipe body after the convex body is formed by machining is sealed by welding or diffusion bonding, and operations such as vacuuming and filling with working fluid are performed.

Please refer to Fig. 10, which is a flow chart of the steps of the fourth embodiment of the method for manufacturing a chamber structure according to the present invention, and refer to Figs. 1 to 6 together. As shown in the figure, the method for manufacturing a chamber structure includes the following steps:

A1: Provide a flat tube body;

A2: At least one convex body is formed on the inner side of the aforementioned pipe body by mechanical processing;

A3: The two ends of the pipe body are closed and vacuumized and filled with working fluid.

Part of the steps of this embodiment are the same as those of the aforementioned third embodiment, so they will not be repeated here, but the difference between this embodiment and the aforementioned first embodiment is step A2: by mechanical processing inside the aforementioned tube body After the step of forming at least one convex body on one side, there is a step A4: forming a capillary structure 2 inside the tube body. The capillary structure 2 can be sintered powder structure or placed in a grid or grooved. A capillary structure 2 is additionally arranged inside the tube body.

The mechanical processing described in the above embodiments can be any one of stamping processing, embossing processing, forging processing, rolling processing, engraving processing or casting processing.

The vapor chamber structure and manufacturing method of the present invention can further provide a chamber structure and manufacturing method that can save manufacturing man-hours and improve manufacturing accuracy.

Claims (7)

1. A vapor chamber structure with a convex portion, comprising: A body, having a condensing area, an evaporating area and a chamber, the condensing area and the evaporating area are arranged on both sides of the chamber; a protrusion, optionally configured by a protrusion in either said evaporation zone or said condensation zone; a working fluid, filled in the chamber; a capillary structure disposed on the surface of the chamber; Wherein, the body has a first board and a second board; the first and second boards correspond to the cover and jointly define the chamber; the first board has a first outer surface and a first The inner surface, where the condensation area is arranged; the second plate has a second outer surface and a second inner surface, where the evaporation area is arranged; the convex part is formed by the first plate of the first plate The inner surface or the second inner surface of the second plate protrudes; the capillary structure is arranged on the first and second inner surfaces of the first and second plates in the chamber; on the The capillary structure of the first inner surface of the first plate extends to the surface of the convex part protruding from the first inner surface of the first plate, and the capillary structure of the convex part directly contacts the second plate. The capillary structure on the second inner side of the second plate; or the capillary structure on the second inner side of the second plate extends to the surface of the convex part raised from the second inner side of the second plate, on the second plate The capillary structure of the protrusion directly contacts the capillary structure of the first inner surface of the first plate. 2. The uniform temperature plate structure according to claim 1, wherein the convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the evaporation area to the direction opposite to the evaporation area, and the body The surrounding areas adjacent to the convex body are correspondingly concave. 3. The vapor chamber structure according to claim 1, wherein the convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the condensation area to the direction opposite to the condensation area, and the body The surrounding areas adjacent to the convex body are correspondingly concave. 4. The vapor chamber structure according to claim 1, wherein the body is a flat tube. 5. The vapor chamber structure according to claim 2, wherein the convex body has a free end, the free end is connected to the condensation zone, and the convex body and the condensation zone have the capillary structure . 6. The uniform temperature plate structure according to claim 1, wherein the convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the evaporation area to the direction opposite to the evaporation area, and the body On the contrary, the other side of the convex body is correspondingly concave. 7. The uniform temperature plate structure according to claim 1, wherein the convex part has a plurality of convex bodies, and the convex bodies are formed by extending from the condensation area to the direction opposite to the condensation area, and the body On the contrary, the other side of the convex body is correspondingly concave.