CN1736851A - Method for Batch Processing of Metal Micro Components - Google Patents

Abstract

Disclosed is a method for batch preparation of metallic microelement, belonging to the technique field of Micro Electro-Me-chanical Systems. Firstly preparing die according to the form of re-prepared microelement, stamping the macromolecular polymer substrate with the die to batch prepare macromolecular polymer die, surface conductive treatment to the macromolecular polymer, micro-electroforming the macromolecular polymer die, rubbing the extra metal on the surface, and removing the macromolecular polymer substrate, then the needed metallic microelement is prepared. In the invention, it decreases the complexity of batch preparation of metallic microelement, accelerates the technique flow, and solves the problem of preparing metallic microelement in low cost and with batch production. The preparation method is characterized in that the technique is simple, the flexibility and uniformity is perfect, the cost is low, and it is suit for mass production.

Description

Method for Batch Processing of Metal Micro Components

technical field

The invention relates to a processing method in the field of micro-electromechanical technology, in particular to a batch processing method for metal micro-components.

Background technique

The wide application of micro-electromechanical systems (MEMS: Micro Electro Mechanical Systems) devices has led to the vigorous development of various micro-processing technologies. At present, there are two main types of micromachining technologies used in the manufacture of microelectromechanical systems in the world: one is surface silicon micromachining technology and bulk silicon micromachining technology developed based on microelectronics technology. Some silicon micromachines have been successfully developed by using this technology, such as micro accelerometers, micro pressure sensors, micro motors, and micro pumps, but this technology can only micro process silicon materials, which greatly limits its application range. The second process is to use LIGA technology (German Li thografie, Galvanoformung , Abformung , representing three main processes: X-ray deep lithography process, micro-electroforming process and micro-replication technology), the advantage of this technology is that it can Manufacture three-dimensional metal or plastic micromechanical devices, the obtained devices have a large high aspect ratio and fine structure, with steep side walls and flat surfaces. It is a perfect combination of X-ray deep lithography, micro-electroforming and micro-replication processes. However, it requires expensive synchrotron radiation X-ray light sources and X-ray masks, and the processing cycle is long, so its application is also limited. In recent years, a variety of alternative processes have been developed , among which SU-8 adhesive technology based on UV-LIGA has developed rapidly. Instead of the synchrotron radiation X light source in LIGA technology for exposure, and then through micro-electroforming, micro-replication and other processes, devices of various materials can be produced in batches.

Found through the retrieval of prior art document, the people such as H.Lorenz writes on " Sensors and Actuators A: Physical ", NO.64 (1998) pp33-39 page: " High-aspect-ratio, ultrathick, negative-tone near -UV photoresist and its application forMEMS" ("High aspect ratio, ultra-thick, near-ultraviolet negative photoresist and its application in MEMS, "Sensors and Actuators A: Physical Edition"). The discussion is based on UV-LIGA's SU-8 glue technology and its application (preparation of micro-gears, micro-coils, etc.): First, throw SU-8 glue on the substrate with a conductive layer, then expose it to ultraviolet light, and get SU-8 glue after development Mold, then carry out micro-electroforming, and then remove the SU-8 glue and the substrate to get the required metal components. The disadvantage is that the SU-8 glue process is more complicated, the cycle is longer, and each time the glue is removed. Difficult process, so in mass production, use the prepared metal component as a mold, use molding technology, micro-electroforming technology for micro-replication, that is: first prepare a conductive substrate, and then coat a layer of plastic on it, The plastic mold is obtained on the substrate by molding process, and then the sample is subjected to micro-electroforming, and the metal product can be obtained after removing the conductive substrate and plastic. The disadvantage of this technology is that the micro-replication process is cumbersome, and the conductive substrate needs to be prepared every time, and then coated The thickness of the coated plastic must be accurately controlled according to the height of the metal device; and after molding, the plastic microstructure voids will form a plastic residual layer, and the electroformed part cannot be completely conductive, so the residual layer needs to be etched The process is relatively complicated and the cost is high.

Contents of the invention

The purpose of the present invention is to overcome the deficiencies and defects in the prior art, and provide a batch processing method for metal micro components, which can prepare the required components on the high molecular polymer substrate through the preparation of molds, micro-replication technology, and micro-electroforming technology. The metal micro-components, the processing method has the characteristics of simple process, good flexibility, good consistency, low cost, and suitable for mass production.

The present invention is achieved through the following technical solutions. The present invention first prepares molds according to the shape of the micro-components to be prepared, and then uses the molds to emboss high-molecular polymer molds in batches on the high-molecular polymer substrates, and then conducts electricity on the surface of the high-molecular polymers. treatment, and then perform micro-electroforming on the surface-conductive polymer mold, then smooth the excess metal on the surface after electroforming, and finally remove the polymer substrate to obtain the required metal micro-components.

The present invention is further defined below, and concrete steps are as follows:

(1) Prepare a mold according to the shape of the micro-component to be prepared

A mask plate is prepared according to the shape of the micro-component to be prepared, and a mold is prepared by UV-LIGA technology, that is, the mold is prepared by photolithography and electroforming on a conductive substrate. The mold material of the micro-component to be prepared can be metal, silicon, polymer, ceramics. Metal molds are preferably used. The aspect ratio of the micro-component to be prepared is 0.001-2, and the thickness is 5 microns-1000 microns. The depth of the mold for preparation is 5-50 microns larger than the depth of the micro-component to be prepared.

The photolithography method is as follows: clean a silicon wafer or a glass wafer (thickness greater than 1 mm), and bake at 180° C. for more than 4 hours to remove surface water molecules; The titanium film is subjected to wet oxidation and blackening treatment; it is cleaned again and baked at 180°C for 4 hours; the SU-8 glue of the required thickness is spin-coated on the surface of the substrate with a thickness of 5 microns-1000 by using a thick glue spinner. Micron; pre-bake SU8 glue with a programmed oven or hot plate, pre-bake at 65°C for 30 minutes and pre-bake at 95°C for 20-300 minutes; use an optical mask to contact on a SUSS MA6 UV lithography machine Type exposure, the exposure time is 5-1000 seconds, and the exposure intensity is 8mJ/cm ² ; post-baking heat treatment is performed on the exposed SU-8 glue, post-baking at 65°C for 30 minutes and post-baking at 95°C for 10-90 minutes; The developing time is 5-30 minutes to obtain photoresist patterns.

The electroforming process conditions are as follows: ① micro-electroforming nickel: electrolyte type, Watt nickel plating solution system; plating solution working conditions, temperature 50-60°C; pH value 4.5-5.0; plating speed 0.15-1μm/ min. ②Micro-electroforming nickel-iron alloy: electrolyte type, sulfate type dilute solution; plating solution working conditions, temperature 50-60°C, pH value 4.5-5.0; plating speed: 0.05-0.8μm/min.

(2) Using the prepared mould, the high molecular polymer moulds are reproduced in batches by vacuum molding or injection molding technology. Available polymers are polyvinyl chloride (PVC), polystyrene (PS), polymethylmethacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PETG) , Polydimethylsiloxane (PDMS).

The vacuum molding method is as follows: the mold is fixed on the vacuum heat press, and the plastic sheet to be molded is placed on the bottom, such as PMMA, PC, PS, PVC, PETG; the mold cavity is closed and vacuumed to 10 ^-1 Pa ;Add a contact force of 200N; heat the upper and lower hot plates to the required temperature, the temperature range is 100-200°C, and wait for 30 seconds; apply a pressure of 1000-5000N at a certain speed, and keep it for 30-60 seconds; cool down to the demoulding temperature 30-60°C; Demoulding; Open the cavity and take out the plastic sample.

Said injection molding technology, its method is: firstly polydimethylsiloxane prepolymer and corresponding curing agent are mixed and stirred according to 10:1, then put into a vacuum box for degassing for 30 minutes, and then polydimethylsiloxane base silicone is cast on the mold. Put it into an oven at 65°C and bake and solidify for 1 hour. Finally, the polydimethylsiloxane is peeled off from the mold to obtain batches of polydimethylsiloxane polymer molds.

(3) Polymer surface conductive treatment

In order to achieve micro-electroforming of polymer molds, the surface needs to be electrically conductive. The metal thin film can be sputtered on the prepared polymer to form the conductive layer required for electroforming.

The process conditions of the sputtering are: DC sputtering, background vacuum 2*10 ^-6 mbar, DC maximum power 1kW; deposition rate: 20-60nm/min.

(4) Electroforming the surface conductive high molecular polymer mold.

According to requirements, the metal micro-components can be made of electroformed nickel (Ni) or iron-nickel (Fe-Ni).

The process conditions of the electroforming are: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 50-60°C; pH value 4.5-5.0; plating speed 0.15-1 μm/min . Micro-electroforming nickel-iron alloy: electrolyte type, sulfate type dilute solution; plating solution working conditions, temperature 50-60°C, pH value 4.5-5.0; plating speed: 0.05-0.8μm/min.

(5) Use a grinder to smooth and polish excess metal on the surface after electroforming.

According to the requirements of metal micro-components, the excess metal on the surface after electroforming is ground to the required size.

(6) Using a solvent corresponding to the polymer to remove the polymer substrate to obtain the required metal micro-component.

The present invention uses molds to imprint high-molecular polymer molds in batches at low cost on high-molecular polymers, and performs micro-electroforming on the surface-conductive high-molecular polymer molds, instead of repeating high-cost photolithography, electroforming and Glue removal, thereby reducing the process complexity of metal micro-components in mass production, speeding up the process flow, and solving the problems of low cost and mass production of metal micro devices; the present invention uses a surface-conductive polymer mold for micro-electroforming , instead of using a conductive substrate for micro-electroforming, it solves the problem that the residual layer of the polymer polymer can not be completely exposed due to the formation of the polymer microstructure gap after replication, so that the residual layer needs to be etched away. There is no need to etch the residual layer. The processing method has the characteristics of simple process, good flexibility, good consistency, low cost, suitable for mass production and the like.

Detailed ways

Example 1

Preparation of a Ni metal disc with a thickness of 5 microns, a diameter of 5000 microns, and an aspect ratio of 0.001

(1) Prepare a mold according to the shape of the micro-component to be prepared

A mask plate is prepared according to the shape of the micro-component to be prepared, and a mold is prepared by UV-LIGA technology, that is, the mold is prepared by photolithography and electroforming on a conductive substrate. Metallic nickel molds for microcomponents to be fabricated. The depth of the mold for preparation is 5 microns larger than the depth of the micro-component to be prepared.

The photolithography method is as follows: clean a silicon wafer or a glass wafer (thickness greater than 1 mm), and bake at 180° C. for more than 4 hours to remove surface water molecules; The metal titanium film is subjected to wet oxidation blackening treatment; it is cleaned again and baked at 180°C for 4 hours; the SU-8 glue of the required thickness is spin-coated on the surface of the substrate with a thickness of 10 microns using a thick glue spinner; Use a program-controlled oven or a hot plate to perform pre-baking treatment on the SU8 glue, pre-baking at 65°C for 30 minutes and 95°C for 20 minutes; use an optical mask to perform contact exposure on a SUSS MA6 ultraviolet lithography machine, and the exposure time is 5 seconds. The exposure intensity was 8mJ/cm ² ; the exposed SU-8 glue was post-baked at 65°C for 30 minutes and 95°C for 10 minutes; the development time was 5 minutes to obtain a photoresist pattern.

The electroforming process conditions are as follows: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 60° C.; pH value 5.0; plating speed 1 μm/min.

(2) Using the prepared mold, vacuum molding is used to replicate the polymer mold in batches in polymethyl methacrylate (PMMA).

The vacuum molding method is as follows: the metal mold is fixed on the vacuum hot press, and the PMMA plastic sheet to be molded is placed on the bottom; the mold cavity is closed and vacuumed to 10 ^-1 Pa; the contact force is 200N; the upper and lower heating plates Heat to the required temperature, the temperature range is 160°C, and wait for 30 seconds; apply a pressure of 1000N at a certain speed, and keep it for 30 seconds; cool down to the demoulding temperature of 40°C; demould; open the mold cavity, and take out the plastic sample.

(3) Polymer surface conductive treatment

In order to realize the micro-electroforming of the polymer mold PMMA, its surface needs to be conductive. The metal thin film can be sputtered on the prepared polymer to form the conductive layer required for electroforming.

The process conditions of the sputtering are: DC sputtering, background vacuum 2*10 ^-6 mbar, DC maximum power 1kW; deposition rate: 20-60nm/min. A layer of chrome-copper film is sputtered to form the conductive layer required for the next step of electroforming. The thickness of the chromium layer is 800 angstroms, and the thickness of the copper layer is 3000 angstroms.

(4) Nickel electroforming is performed on the surface conductive polymer mold.

The electroforming process conditions are as follows: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 60° C.; pH value 5.0; plating speed 1 μm/min.

(5) Use a grinder to smooth and polish excess metal on the surface after electroforming.

According to the requirements of metal micro-components, the excess metal on the surface after grinding and electroforming reaches the required size of 5 microns thick.

(6) Ethyl acetate is used to remove the PMMA plastic mold to obtain the required metal micro-components.

The invention reduces the process complexity of metal micro-components in mass production, speeds up the process flow, solves the problem of low cost and mass production of metal micro-devices, and solves the problem of high molecular polymer microstructure voids after replication due to the formation of high molecular polymers. The residual layer prevents the conductive substrate from being completely exposed, and the residual layer needs to be etched away. There is no need to etch the residual layer. The invention has the characteristics of simple process, good flexibility, good consistency, low cost, suitable for mass production and the like.

Example 2

Preparation of Ni metal discs with a thickness of 500 microns, a diameter of 500 microns, and an aspect ratio of 1

(1) Prepare a mold according to the shape of the micro-component to be prepared

A mask plate is prepared according to the shape of the micro-component to be prepared, and a mold is prepared by UV-LIGA technology, that is, the mold is prepared by photolithography and electroforming on a conductive substrate. Metallic nickel molds for microcomponents to be fabricated. The depth of the mold for preparation is 30 microns larger than the depth of the micro-component to be prepared.

The photolithography method is as follows: clean a silicon wafer or a glass wafer (thickness greater than 1 mm), and bake at 180° C. for more than 4 hours to remove surface water molecules; Metal titanium thin film and carry out wet oxidation blackening treatment; wash it again and bake it at 180°C for 4 hours; use a thick glue spinner to spin-coat SU-8 glue with the required thickness on the surface of the substrate, with a thickness of 530 microns; Use a program-controlled oven or a hot plate to pre-bake the SU8 glue, pre-baking at 65°C for 30 minutes and 95°C for 150 minutes; use an optical mask to perform contact exposure on a SUSS MA6 ultraviolet lithography machine, and the exposure time is 450 seconds. The exposure intensity was 8mJ/cm ² ; post-baking was performed on the exposed SU-8 glue, and the post-baking time was 30 minutes at 65°C and 60 minutes at 95°C; the development time was 20 minutes to obtain a photoresist pattern.

The electroforming process conditions are as follows: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 60° C.; pH value 5.0; plating speed 1 μm/min.

(2) Using the prepared mold, vacuum molding is used to replicate the polymer mold in batches in polymethyl methacrylate (PMMA).

The vacuum molding method is as follows: the metal mold is fixed on the vacuum hot press, and the PMMA plastic sheet to be molded is placed on the bottom; the mold cavity is closed and vacuumed to 10 ^-1 Pa; the contact force is 200N; the upper and lower heating plates Heat to the required temperature, the temperature range is 160°C, and wait for 30 seconds; apply a pressure of 3000N at a certain speed, and keep it for 30 seconds; cool down to the demoulding temperature of 40°C; demould; open the mold cavity, and take out the plastic sample.

(3) Polymer surface conductive treatment

In order to realize the micro-electroforming of the polymer mold PMMA, its surface needs to be conductive. The metal thin film can be sputtered on the prepared polymer to form the conductive layer required for electroforming.

The process conditions of the sputtering are: DC sputtering, background vacuum 2*10 ^-6 mbar, DC maximum power 1kW; deposition rate: 20-60nm/min. A layer of chrome-copper film is sputtered to form the conductive layer required for the next step of electroforming. The thickness of the chromium layer is 800 angstroms, and the thickness of the copper layer is 3000 angstroms.

(4) Nickel electroforming is performed on the surface conductive polymer mold.

The electroforming process conditions are as follows: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 60° C.; pH value 5.0; plating speed 1 μm/min.

(5) Use a grinder to smooth and polish excess metal on the surface after electroforming.

According to the requirements of metal micro-components, the excess metal on the surface after grinding and electroforming reaches the required size of 500 microns thick.

(6) Ethyl acetate is used to remove the PMMA plastic mold to obtain the required metal micro-components.

The invention reduces the process complexity of metal micro-components in mass production, speeds up the process flow, solves the problem of low cost and mass production of metal micro-devices, and solves the problem of high molecular polymer microstructure voids after replication due to the formation of high molecular polymers. The residual layer prevents the conductive substrate from being completely exposed, and the residual layer needs to be etched away. There is no need to etch the residual layer. The invention has the characteristics of simple process, good flexibility, good consistency, low cost, suitable for mass production and the like.

Example 3

Preparation of a Ni metal disc with a thickness of 1000 microns, a diameter of 500 microns, and an aspect ratio of 2

(1) Prepare a mold according to the shape of the micro-component to be prepared

A mask plate is prepared according to the shape of the micro-component to be prepared, and a mold is prepared by UV-LIGA technology, that is, the mold is prepared by photolithography and electroforming on a conductive substrate. Metallic nickel molds for microcomponents to be fabricated. The depth of the mold for preparation is 30 microns larger than the depth of the micro-component to be prepared.

The photolithography method is as follows: clean a silicon wafer or a glass wafer (thickness greater than 1 mm), and bake at 180° C. for more than 4 hours to remove surface water molecules; The metal titanium film is subjected to wet oxidation and blackening treatment; it is cleaned again and baked at 180°C for 4 hours; the SU-8 glue of the required thickness is spin-coated on the surface of the substrate with a thickness of 1050 microns using a thick glue spinner; Use a program-controlled oven or a hot plate to perform pre-baking treatment on the SU8 glue, pre-baking at 65°C for 30 minutes and 95°C for 300 minutes; use an optical mask to perform contact exposure on a SUSS MA6 ultraviolet lithography machine, and the exposure time is 1000 seconds. The exposure intensity was 8mJ/cm ² ; post-baking was performed on the exposed SU-8 glue, and the post-baking time was 30 minutes at 65°C and 90 minutes at 95°C; the development time was 30 minutes to obtain a photoresist pattern.

The electroforming process conditions are as follows: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 60° C.; pH value 5.0; plating speed 1 μm/min.

(2) Using the prepared mold, vacuum molding is used to replicate the polymer mold in batches in polymethyl methacrylate (PMMA).

The vacuum molding method is as follows: the metal mold is fixed on the vacuum hot press, and the PMMA plastic sheet to be molded is placed on the bottom; the mold cavity is closed and vacuumed to 10 ^-1 Pa; the contact force is 200N; the upper and lower heating plates Heat to the required temperature, the temperature range is 160°C, and wait for 30 seconds; apply a pressure of 5000N at a certain speed, and keep it for 60 seconds; cool down to the demoulding temperature of 40°C; demould; open the mold cavity, and take out the plastic sample.

(3) Polymer surface conductive treatment

In order to realize the micro-electroforming of the polymer mold PMMA, its surface needs to be conductive. The metal thin film can be sputtered on the prepared polymer to form the conductive layer required for electroforming.

The process conditions of the sputtering are: DC sputtering, background vacuum 2*10 ^-6 mbar, DC maximum power 1kW; deposition rate: 20-60nm/min. A layer of chrome-copper film is sputtered to form the conductive layer required for the next step of electroforming. The thickness of the chromium layer is 800 angstroms, and the thickness of the copper layer is 3000 angstroms.

(4) Nickel electroforming is performed on the surface conductive polymer mold.

The electroforming process conditions are as follows: micro-electroforming nickel: type of electrolyte, Watts nickel plating solution system; working conditions of the plating solution, temperature 60° C.; pH value 5.0; plating speed 1 μm/min.

(5) Use a grinder to smooth and polish excess metal on the surface after electroforming.

According to the requirements of metal micro-components, the excess metal on the surface after grinding and electroforming reaches the required size of 1000 microns thick.

(6) Ethyl acetate is used to remove the PMMA plastic mold to obtain the required metal micro-components.

The invention reduces the process complexity of metal micro-components in mass production, speeds up the process flow, solves the problem of low cost and mass production of metal micro-devices, and solves the problem of high molecular polymer microstructure voids after replication due to the formation of high molecular polymer The residual layer prevents the conductive substrate from being completely exposed, and the residual layer needs to be etched away. There is no need to etch the residual layer. The invention has the characteristics of simple process, good flexibility, good consistency, low cost, suitable for mass production and the like.

Claims (10)

1. metal micro member batch processing method, it is characterized in that, at first the shape according to little member to be prepared prepares mould, utilize mould on the high molecular polymer substrate, to impress out the high molecular polymer mould in batches then, then the high molecular polymer surface conductance is handled, high molecular polymer mould to surface conductance carries out little electroforming again, and the ordinary telegram of regrinding casting rear surface excess metal is removed the high molecular polymer substrate at last and obtained needed metal micro member.

2. metal micro member batch processing method according to claim 1, it is characterized in that, described shape according to little member to be prepared prepares mould, be meant: adopt that the method for photoetching and electroforming prepares mould on conductive substrates, the mold materials of little member to be prepared is metal, silicon, polymer, pottery, the depth-to-width ratio of little member to be prepared is 0.001-2,5 microns-1000 microns of thickness, the big 5-50 micron of depth ratio little member degree of depth to be prepared of preparation mould.

3. metal micro member batch processing method according to claim 2 is characterized in that, described photoetching, and its method is: silicon chip or the sheet glass of thickness greater than 1 millimeter cleaned, and dry by the fire more than 4 hours to remove the surface water molecule at 180 ℃; The Titanium film of silicon chip one side sputter 2 micron thickness also carries out the wet oxidation blackout and handles; Once more to its clean and 180 ℃ the baking 4 hours; Utilize the SU-8 glue of thick glue photoresist spinner, 5 microns-1000 microns of thickness at the required thickness of substrate surface spin coating; Baking is handled before utilizing program control baking oven or hot plate that SU8 glue is carried out, 65 ℃ of preceding bakings, 30 minutes time and 95 ℃ of preceding bakings, time 20-300 minute; Utilize optical mask, on SUSS MA6 ultraviolet photolithographic machine, carry out contact exposure, time for exposure 5-1000 second, exposure intensity 8mJ/cm ²SU-8 glue after the exposure is warmed processing after carrying out, 65 ℃ of back bakings, 30 minutes time and 95 ℃ of back bakings, time 10-90 minute; Developing time 5-30 minute, obtain the photoresist figure.

4. metal micro member batch processing method according to claim 2 is characterized in that, described electroforming, its process conditions are: 1. little electroformed nickel: the electrolyte type is watt nickel plating bath system, the plating bath condition of work is temperature 50-60 ℃, and pH value 4.5-5.0 plates fast 0.15-1 μ m/min; 2. little electroformed nickel ferroalloy: the electrolyte type is the sulfate type weak solution, and the plating bath condition of work is temperature 50-60 ℃, pH value 4.5-5.0, plating speed: 0.05-0.8 μ m/min.

5. metal micro member batch processing method according to claim 1, it is characterized in that, the described mould that utilizes impresses out the high molecular polymer mould in batches on the high molecular polymer substrate, its method is: adopt vacuum molding or injection molded technology batch duplicating to go out the high molecular polymer mould, high molecular polymer has polyvinyl chloride, polystyrene, polymethyl methacrylate, Merlon, PETG, dimethyl silicone polymer.

6. metal micro member batch processing method according to claim 5 is characterized in that, described vacuum molding, and its method is: mould is fixed on the vacuum hotpressing machine, and the plastic sheet for the treatment of mold pressing is put in the bottom, as PMMA, PC, PS, PVC, PETG; Close die cavity and be evacuated down to 10-1Pa; Add contact force 200N; Up and down hot plate be heated to temperature required, temperature range 100-200 ℃, and wait for 30 seconds; Plus-pressure 1000-5000N under certain speed, and keep 30-60 second; Be cooled to calcining temperature 30-60 ℃; The demoulding; Open die cavity, take out plastic sample.

7. metal micro member batch processing method according to claim 5, it is characterized in that, described injection molded technology, its method is: at first dimethyl silicone polymer performed polymer and corresponding curing agent are pressed 10: 1 mixed stirrings, then put into the vacuum tank degassing 30 minutes, then dimethyl silicone polymer is cast on the mould, put into 65 ℃ of baking-curings of baking oven 1 hour, open dimethyl silicone polymer from mould at last, obtain dimethyl silicone polymer high molecular polymer mould in batches.

8. metal micro member batch processing method according to claim 1 is characterized in that, described high molecular polymer surface conductance is handled, and is meant: sputtered metal film on the high molecular polymer for preparing, and to form the required conductive layer of electroforming.

9. metal micro member batch processing method according to claim 8 is characterized in that, described sputter, and its process conditions are: d.c. sputtering, base vacuum 2*10-6mbar, direct current peak power 1kW, sedimentation rate: 20-60nm/ minute.

10. metal micro member batch processing method according to claim 1 is characterized in that, described little electroforming, its process conditions are: 1. little electroformed nickel: the electrolyte type is watt nickel plating bath system, the plating bath condition of work is temperature 50-60 ℃, and pH value 4.5-5.0 plates fast 0.15-1 μ m/min; 2. little electroformed nickel ferroalloy: the electrolyte type is the sulfate type weak solution, plating bath condition of work, temperature 50-60 ℃, pH value 4.5-5.0, plating speed: 0.05-0.8 μ m/min.