CN1781685A - Cutting processing method - Google Patents

Abstract

The present invention relates to a kind of cutting processing method, and is especially one kind of no-burr cutting processing method. The cutting processing method includes the following steps: forming one thin layer of fragile material in the bottom of the material to be cut, cutting the material with formed fragile thin layer, and eliminating the fragile thin layer to obtain the no-burr cut material. The said fragile material includes nanometer ceramic powder material. The method of the present invention is suitable for cutting metal, plastic and other material.

Description

A cutting method

【Technical field】

The invention relates to a cutting processing method, in particular to a burr-resistant cutting processing method.

【Background technique】

Cutting technology has been used to process profiles and workpieces for more than a hundred years. Traditional cutting methods mainly rely on mechanical energy to cut metal or non-metal materials. With the development of industrial production and science and technology, a variety of special processing methods using other forms of energy have been produced, mainly referring to the method of cutting directly by using electric energy, chemical energy, sound energy and light energy, etc., such as June 2001 The disclosed Chinese patent application No. 00129322 disclosed on March 20 adopts the method for laser cutting and processing mechanical workpieces.

However, burrs often appear on the cut profiles or workpieces, which not only wastes raw materials but also affects the quality of the profiles or workpieces. In the prior art, there is a wire cutting method to reduce burrs. The wire cutting method uses nickel or cobalt metal wires with high hardness and small diameter as the cutting tool, and the material is cut under the control of a computer-aided system, which has high processing accuracy and automation. High, no obvious cutting force in processing, etc., please refer to "Application of wire cutting in reducing plastic molding burrs", Zhou Xuguang, "Mechanical Design and Manufacturing", vol.2, p98 (2003.4).

In addition, the method for reducing burrs in the prior art also includes the improvement of cutting tools. For example, Chinese Patent No. 96208084 announced on October 14, 1998 discloses a pipe cutting device for cutting steel pipes, which can eliminate Cutting burrs and uneven surfaces without manual operation.

However, the prior art can only reduce burrs to a certain extent, and none of the above-mentioned prior art improves the substrate of the profile or workpiece, and the physical and chemical properties of the substrate such as hardness, strength, plasticity and toughness have an impact on its cutting processability. It has a great impact, and improving the machinability of the substrate in the processing process should be of great help to reduce the burrs. Therefore, there is still a lot of room for improvement in the technology of reducing the burrs of profiles or workpieces in the cutting process.

【Content of invention】

The technical problem to be solved by the present invention is to provide an anti-burr cutting processing method by improving the machinability of the substrate and reducing the burrs of profiles or workpieces.

The technical solution of the present invention to solve the above technical problems is to provide a burr-resistant cutting processing method, which includes the steps of: forming a thin layer of brittle material on the surface of the substrate to be cut; cutting the substrate with a thin layer of brittle material formed on the surface; Thin layers of brittle material are removed for burr-free cut material.

The brittle material includes nano ceramic powder material.

The nano-ceramic powder includes aluminum oxide, aluminum nitride or a combination thereof.

The thin layer of brittle material is formed by spray drying or coating.

The thin layer of brittle material is removed by washing with water.

Further included is the step of recovering the brittle material.

Compared with the prior art, the cutting processing method of the present invention reduces the toughness of the substrate surface by forming a thin layer of brittle material on the surface of the substrate, so that chips are easily broken, thereby reducing burrs. The brittle material can be removed by water washing and recycled at low cost.

【Description of drawings】

Fig. 1 is a flow chart of the cutting and processing method provided by the present invention.

【Detailed ways】

The present invention is specifically described below in conjunction with accompanying drawing:

As shown in Figure 1, a kind of cutting processing method comprises steps:

A thin layer of brittle material is formed on the surface of the substrate to be cut. The substrate includes metal, plastic materials, etc., and its shape can be sheet, column, tube, etc. The brittle material can be a nano ceramic powder material, including a nano powder material of aluminum oxide, aluminum nitride or a combination thereof. The brittle material can be dispersed in water or an organic solvent, formed on the surface of the substrate by spraying, drying, etc., or dispersed in water-soluble or fat-soluble glue, and coated on the surface of the substrate, preferably the brittle material is dispersed in a water-soluble Or fat-soluble glue, and then spread it on the surface of the substrate. When the substrate is tubular, the thin layer of the brittle material can be formed on the outer surface or the inner surface, preferably the thin layer of the brittle material is formed on both inner and outer surfaces. The thickness of the thin layer of brittle material can be selected as desired.

Substrates with a thin layer of brittle material formed on the cutting surface. Various cutting processing methods such as mechanical energy, electrical energy, chemical energy, sound energy and light energy can be used for cutting processing, and the above-mentioned surface is cut to form a substrate with a thin layer of brittle material.

Thin layers of brittle material are removed for burr-free cut material. This thin layer of brittle material can be removed by washing with water or organic solvents.

Finally, the brittle material can be recovered and reused. This brittle material layer can be removed by washing with water or organic solvents.

Since a thin layer of brittle material is formed on the surface of the substrate, the toughness of the surface of the substrate is reduced, and the chips are easily broken, thereby reducing burrs.

The brittle material can be removed and recovered by washing with water or an organic solvent, and the cost is low.

Claims (10)

1. A cutting method is characterized in that it comprises the steps of: forming a brittle material thin layer on the substrate surface to be cut; cutting the substrate with a brittle material thin layer; removing the brittle material thin layer to obtain Rough cut material. 2. The cutting method according to claim 1, characterized in that the brittle material comprises nano-ceramic powder material. 3. The cutting method according to claim 2, characterized in that the nano-ceramic powder material comprises aluminum oxide, aluminum nitride or a combination thereof. 4. The cutting method according to claim 1, characterized in that the thin layer of brittle material is formed by spray drying or coating. 5. The cutting process according to claim 1, characterized in that the thin layer of brittle material is removed by washing with water. 6. The cutting and processing method according to claim 1, characterized in that the method further comprises recovering brittle materials. 7. The cutting method according to claim 1, wherein the substrate comprises metal or plastic. 8. The cutting method according to claim 1, characterized in that the shape of the substrate is sheet or column. 9. The cutting method according to claim 1, characterized in that the shape of the substrate is tubular. 10. The cutting method according to claim 9, characterized in that a thin layer of brittle material is formed on at least one of the outer surface and the inner surface of the tubular substrate.

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