CN1638919A - Improved method and apparatus for bi-directionally polishing a workpiece - Google Patents

Abstract

A chemical mechanical polishing apparatus utilizes a portion of a polishing pad (130) positioned under tension between a supply reel (160) and a take-up reel (162) to prevent degradation, a single drive system capable of efficient bidirectional linear motion, and a mechanism for applying tension to either the supply reel or the take-up reel, with the other reel being locked during processing. If a new section of the polishing pad is required, the polishing pad is advanced a predetermined amount using the same motor (770) that provides the tension. Additionally, a feedback mechanism (FIG. 8) ensures that the tension on the polishing pad remains consistent throughout the process.

Description

Improved method and apparatus for bidirectional polishing of workpieces

technical field

The present invention relates to the manufacture of semiconductor wafers, and more particularly, to methods and apparatus for polishing semiconductor wafers or workpieces to high flatness and uniformity at high bilinear or reciprocating speeds. In particular, the present invention relates to a dual linear chemical mechanical polishing apparatus comprising a moving portion of a polishing belt arranged such that when it is supported in a support mechanism disposed between a supply spool and a take-up spool Its front side is not degenerated. Also provided are a single drive method and system for a dual linear chemical mechanical polishing apparatus, and a method and system for polishing a backing plate under tension in a chemical mechanical polishing apparatus.

Background technique

Chemical mechanical polishing (CMP) of materials for VLSI and ULSI applications is important and widely used in the semiconductor industry. CMP is a semiconductor wafer planarization and polishing process that combines chemical removal of layers such as insulators, metals, and photosensitive resins with mechanical polishing or buffering of the wafer layer surface. CMP is generally used to planarize surfaces during wafer fabrication and is a process that provides spherical planarization to the wafer surface. For example, during wafer fabrication, CMP is often used to planarize/polish profiles built up in multi-level metal interconnect lines. Achieving the desired flatness of the wafer surface must be done without contaminating the desired surface. In addition, the CMP process must avoid polishing away useful circuit portions.

A conventional system for chemical mechanical polishing of semiconductor wafers will now be described. One conventional CMP process calls for the wafer to be positioned on a holder that rotates about a first axis and lowered onto a polishing pad that rotates in the opposite direction about a second axis. The wafer holder presses the wafer against the polishing pad during planarization. Wafers are typically polished by applying a polish or slurry to a polishing pad. In another conventional CMP process, a wafer holder positions and presses the wafer against a tape-shaped polishing pad while continuously moving the pad in the same direction relative to the wafer. A so-called belt-shaped polishing pad can be moved in a continuous path during the polishing process. These conventional polishing processes may further include a conditioning station located in the path of the polishing pad for conditioning the pad during polishing. Factors that need to be controlled to achieve the desired flatness and planarity include: polishing time, pressure between the wafer and the backing plate, rotational speed, slurry particle size, slurry delivery rate, slurry chemistry, and backing plate material.

Although the above-described CMP process is widely used and accepted in the semiconductor industry, problems remain. For example, there is the problem of predicting and controlling the rate and uniformity with which the process removes material from the substrate. As a result, CMP is a labor-intensive and expensive process because the thickness and uniformity of layers on the substrate surface must be permanently monitored to prevent over-polishing or inconsistent polishing of the wafer surface.

U.S. Patent 6,103,628, assigned to the assignee of the present invention, describes an inverse linear chemical mechanical polisher, also known as a dual linear chemical mechanical polisher, which uses a single dual linear motion to perform chemical mechanical polishing . In use, a rotating wafer carrier located in the polishing area holds wafers being polished.

Although advantageous, there remains a need for a more efficient and inexpensive method and apparatus, including a system that does not degrade the front side of the wafer, a more efficient drive system that provides reverse linear (or bilinear) motion, and a more efficient tensioning system for polishing belts.

Contents of the invention

The present invention overcomes the above limitations and provides an improved method and apparatus for bi-directional polishing of workpieces. Accordingly, various advantages can be obtained with the present invention including the following.

It is an advantage of the present invention to provide a method and apparatus for polishing semiconductor wafers with uniform flatness.

Another advantage of the present invention is to provide methods and apparatus for polishing semiconductor wafers with pads having high bilinear or reciprocating velocities.

Another advantage of the present invention is to provide a polishing method and apparatus that provides a "fresh" polishing pad to the wafer polishing area, thereby increasing polishing efficiency and productivity.

It is yet another advantage of the present invention to provide a drive system that provides incremental motion for a polishing pad disposed between a supply reel and a take-up reel in such a way that the polishing pad disposed between the supply reel and the take-up reel A portion of the polishing pad between which the support mechanism is used to hold the portion of the polishing pad does not degrade the front side of the polishing pad, thereby maximizing the life of the polishing pad.

Another advantage of the present invention is that it provides a single casting that houses the polishing pad, including supply spools, take-up spools, and pad path rollers.

Among other things, these and other advantages of the present invention, whether singly or in combination, are achieved by providing methods and apparatus for polishing wafers with pads having high dual linear velocities. The present invention involves a polishing pad or belt fastened to a mechanism that allows the pad or belt to move in a reciprocating manner at high speeds, ie, in forward and reverse directions. The constant bi-directional motion of the polishing pad or belt as the wafer is polished provides superior flatness and uniformity across the wafer surface. When a new portion of the backing plate is required, and during polishing with a portion of the backing plate, the backing plate is moved by a drive system that includes rollers that contact the backside of the backing plate, thereby eliminating the sources of friction and maximize the life of the polishing pad. In one aspect of the invention, the rollers only contact the back side of the backing plate so that the rollers do not degrade the backing plate surface.

In another embodiment, the present invention provides the advantages described above with a method and apparatus for bi-directional linear polishing with a flexible pad. In one aspect, a horizontal drive assembly moves a horizontally movable horizontal slide member on rails attached to a single casting. There are several openings in the casting to include the supply reel, take-up reel and backing plate path rollers. A drive assembly converts the motor's rotational motion into horizontal bi-directional linear motion of the horizontal slide element. When the polishing pad is properly locked in place, preferably coupled between the supply spool and the take-up spool, horizontal bi-directional linear movement of the horizontal slide element results in corresponding horizontal bi-linear motion of a portion of the polishing pad. Accordingly, the portion of the polishing pad disposed in the polishing region of the chemical mechanical polishing apparatus can polish the top front surface of the wafer with the bidirectional linear motion of the portion of the polishing pad.

In another embodiment, a portion of the polishing pad of the present invention is disposed under tension between a supply spool and a take-up spool, with one motor providing tension to either the supply spool or the take-up spool, and the other spool being processed locked in. If a new section of the polishing pad is required, the same motor that provides the tension, if coupled to the take-up spool, advances the polishing pad a defined amount. Additionally, a feedback mechanism is used to ensure that the polishing pad is held consistently during processing.

Description of drawings

These and other advantages of the present invention will become apparent and more readily understood from the following detailed description of presently preferred exemplary embodiments, taken in conjunction with the accompanying drawings, in which:

Fig. 1 shows a two-way linear polishing machine according to the present invention;

Fig. 2 is a simplified diagram showing a drive mechanism for providing a fresh partial polishing pad in accordance with the present invention.

3A and 4B show side and cross-sectional views of a polishing apparatus including a drive mechanism for supplying a fresh partial polishing pad according to the present invention.

Figure 4 shows a perspective view of a dunnage drive system including a horizontal slide element movable horizontally on a stationary casting using drive members in accordance with the present invention.

Figure 5 shows a polishing pad passing through a cast member provided for a machining zone, wherein the polishing pad produces bi-directional linear motion.

Figure 6 shows a side view of a horizontal slide element and drive system according to the invention.

Figures 7A and 7B illustrate a tensioning and stepping mechanism according to the present invention.

Figure 8 shows a controller for controlling the tensioning and stepping mechanism according to the present invention. and

Figure 9 shows a flow diagram of a preferred operation of the tensioning and stepping mechanism in accordance with the present invention.

Detailed ways

The present invention relates to CMP methods and apparatus capable of operating with high bilinear pad or reciprocation speeds and reduced trajectories. High bilinear pad speeds optimize planarity, while reduced trajectory reduces polishing station costs. Additionally, since the polishing pad is adapted to run in bilinear directions, this reduces the polishing effect of the pad, which is a common problem in conventional CMP polishers. Since the backing plate runs in a bilinear direction, the backing plate (or the backing plate attached to the carrier) is essentially self-adjusting.

Figure 1 shows a processing area 120 for a bilinear polishing apparatus. A portion of the bilinear moving backing plate 130 for polishing the front wafer surface 112 of the wafer 110 in the processing area is driven by a drive mechanism. Wafer 110 is held in place by wafer carrier 140 and may be rotated during polishing operations as described herein.

Below the backing plate 130 is a deck support 150 . During operation, the two-way moving portion of the backing plate 130 is due to the tensioning of the backing plate 130 in combination with fluid such as air, water, or a combination of different fluids being emitted through openings 154 provided in the top surface 152 of the deck support 150. Supported above the platen support 150 in the processing area, the front side 132 of the backing plate 130 contacts the front surface 112 of the wafer 110 and the back side 134 of the backing plate 130 floats on the top surface 152 of the platen support 150 . Although the portion of the backing plate 130 located in the processing area moves in a bilinear fashion (see reference numeral 136), both ends of the backing plate 130 are preferably coupled to source and target reels 160 and 162, respectively, as shown in FIG. The stepped portion of the backing plate 130 is placed into the processing area and then removed.

Additionally, during operation, nozzles 180 may be used to direct a polishing compound without abrasive particles or a slurry with abrasive particles, depending on the type of backing plate 130 and the desired type of polishing. For example, polishing pad 130 may contain an abrasive embedded in front side 132 and may be used with a polishing agent but not a directed slurry, or polishing pad 130 may contain no such embedded abrasive but instead be used with a slurry. used together, or other combinations of pads, slurries, and/or polishes may be used. The polish or slurry may include a chemical that oxidizes material that is then mechanically removed from the wafer. Polishing compounds containing silica gel, fumed silica, alumina particles, etc. are typically used with abrasive or non-abrasive pads. As a result, high contours on the wafer surface are removed until an extremely flat surface is obtained.

Although polishing pads may vary in whether or not they contain abrasives, any polishing pad 130 according to the present invention needs to be sufficiently flexible and lightweight so that the variable fluid flow from each opening 154 on the platen support Ability to influence the polishing profile at various locations on the wafer. It is further preferred that the backing plate 130 is made of a single material with or without abrasive impregnated therein. Monomeric material means a single layer of material, or, if more than one layer is introduced, retains the flexibility as achieved by thin polymeric materials as described herein. An example of a polishing pad having these characteristics is a fixed abrasive pad, such as MWR66 sold by 3M Company, which has a thickness of 6.7 mils (0.0067 inches) and a density of 1.18 grams per cubic centimeter. These polishing pads are made of flexible materials, such as polymers, generally only in the 4-15 mil thickness range. Thus, as described further below, the fluid ejected from the opening 154 on the platen support 150 can vary by less than 1 pound per square inch and significantly affect the amount of polishing that occurs on the front side 112 of the wafer 110 being polished. For the pad 130, the environment in which the pad 130 is used, such as whether it is a linear, bilinear or non-constant velocity environment, allows other pads to be used, although not required for the same effectiveness. It has also been determined that backing plates having a structure having a lower weight per square centimeter, such as less than 0.5 grams per square centimeter, are acceptable in combination with the type of flexibility achievable with polymeric backing plates.

Another consideration regarding the backing plate 130 is its width relative to the diameter of the wafer 110 being polished, which may substantially correspond to the width of the wafer 110 , or be larger or smaller than the width of the wafer 110 .

As will also be noted below, the backing plate 130 is preferably substantially optically transparent at certain wavelengths, thus a continuous backing plate 130 without any cut-out windows may allow detection of removal from the front surface 112 of the wafer 110 being polished. material layer (endpoint detection) and implement a feedback loop based on the detected signal to ensure that the polishing performed will polish all regions of the wafer 110 to the desired degree.

Platen support 150 is made of a hard machinable material, such as titanium, stainless steel, or a hard polymeric material. The machinable material allows the opening 154 to be formed, as well as a channel for fluid to pass through the deck support 150 to the opening 154 . With the fluid ejected from the opening 154, the deck support 150 is able to float the backing plate. During operation, the deck support 150 will spray a fluid medium, preferably air, although water or some other fluid could also be used. The injected fluid thus causes the dual linearly moving backing plate 130 to float on the platen support 150 and push against the wafer surface when performing chemical mechanical polishing.

The supporting plate for supporting the polishing pad will now be described. The polishing pad is held on the wafer surface by the support of the support plate, which may be covered with a magnetic film. The rear side of the support material to which the polishing pad is attached may also be covered with a magnetic film so that the polishing pad floats off the support plate when moved at the desired speed. It should be understood that other conventional methods may be used to float the polishing pad off the support while polishing the wafer surface, such as air, magnets, lubricants, and/or other suitable liquids.

Figure 2 shows a simplified diagram of a drive mechanism for providing a fresh portion of a polishing pad according to the present invention, the drive mechanism converting rotational motion into linear up and down motion. As shown, rotation of a shaft, such as shaft 231 shown coupled to motor 232 , will cause rotation of the two drive mounts 238 and 240 . Connected to each of these drive brackets, respectively, are motion translation mechanisms 242 and 244 that are coupled to drive brackets 238 and 240 approximately 180 degrees out of phase. Although a slotted adapter is shown for converting rotary motion to linear motion, the mechanism could be configured in a number of other ways, such as using a coupling rod. These mechanisms are supports attached to different ends 210a and 210b of the polishing belt 210, respectively. In addition, the polishing belt is preferably supported in position by a support mechanism such as roller 212 as shown and the rear side of the polishing belt, particularly at a suitable location in the polishing area (not shown). Rotation of drive brackets 238 and 240 results in complementary reciprocating linear motion such that when drive bracket 238 moves in an upward linear direction, drive bracket 240 moves in a downward linear motion direction. Thus, this movement of the drive carriages 238 and 240 results in bilinear movement in accordance with the present invention by properly positioning the polishing belt 210 between the supply and take-up spools (not shown). Since the support mechanism supports the polishing tape from the rear side and the polishing side (ie, the front side) is not in contact with the support mechanism, sources of friction other than the wafer being polished are minimized from the polishing side of the backing plate. Thus the polishing side of the backing plate is not degraded by the support mechanism.

3A and 3B show a side view and a cross-sectional view, respectively, of a particular embodiment of the drive mechanism of the present invention described above with respect to FIG. 7 .

Polishing apparatus 300 includes a drive mechanism having a dual linear or reverse linear polishing belt 310 for polishing a wafer (not shown) supported by a wafer housing (not shown). Processing area 316 has a portion of polishing tape 310 supported by a platen 323 capable of providing a "gimbal" action for leveling/suspending the portion of polishing tape 310 above it. Additionally, an air or magnetic bearing may be positioned below the processing region 316 for controlling the pressure between that portion of the polishing tape 310 and the wafer surface during polishing.

In addition to processing area 316, polishing apparatus 300 includes a supply reel 311 at its top, a take-up reel 315, and a polishing tape support shown as rollers 312a, 312b, 312c, 312d, 312e, 312f, 312g, and 312h. Agency 312. Rollers 312a, 312d, 312e and 312h are fixed in place, while roller pairs 312b, 312c and 312f and 312g are connected to respective drive supports 320 and 322, respectively, in complementary reciprocating linear motion obtained by drive mechanism 330 while moving. The drive mechanism includes a motor 332 which drives a shaft 336 via a belt 334 which in turn rotates each of two drive mounts 338 and 340 which in turn drive towards elbows 342 and 344 respectively. Provide exercise. Each end of elbows 342 and 344 is rotatable about a respective pivot point, such as pivot points 342a and 342b shown in FIG. 3B.

As the polishing tape 310 is conveyed between the supply reel 311 and the take-up reel 315, it will be apparent that the front side of the polishing tape 310 will only contact the surface being polished of the wafer or workpiece, while the rear side of the polishing tape will contact each surface to Alignment is ensured, including the rollers 312 described above.

It will be apparent that rotation of the shaft associated with motor 332 will result in rotation of belt 334 and corresponding shaft 336 , as well as rotation of the two drive mounts 338 and 340 . One of elbows 342 and 344 is connected to each of these drive mounts, and the connections are preferably 180 degrees out of phase. Rotation of drive mounts 338 and 340 results in complementary reciprocating linear motion such that drive support 322 moves in a downward linear direction while drive support 320 moves in an upward linear direction. Thus, when the polishing belt 310 is properly positioned between the supply spool 311 and the take-up spool 315, and is connected to the drive supports 320 and 322, respectively, by means of the roller pairs 312b, 312c and 312f, 312g, the drive supports 320 and 322 Such motion will result in a bilinear motion according to the invention.

advancing the polishing belt 310, whether the advancing is accomplished as a step displacement portion of the movement or as a larger displacement portion of the movement, whether the movement is accomplished while the polishing belt 310 is polishing the wafer or between times the polishing belt 310 is polishing the wafer, Both will cause a new section of polishing tape 310 to come off the supply spool 311 and the previously used section to be lifted by the take-up spool 315 . The mechanism for effecting this movement is preferably a conventional clutch mechanism coupled to the supply spool for adjusting the tension of the polishing belt 310 between the supply spool 311 and the take-up spool 315 .

After one or more wafers have been polished with the section of polishing tape 310 in the processing area, a new section of polishing tape 310 is transported into the processing area in the manner described above. In this way, after a section of polishing tape 310 is worn, damaged, etc., a new section can be used. Thus, with the present invention, all or part of the section of polishing tape 310 in supply spool 311 will be used. Note that the delivery of a new section of polishing tape 310 to the processing area can be done between the time the wafer is polished, or the polishing tape 310 can be advanced incrementally so that the new section of polishing tape 310 is a new section, and the previously used and the portion of polishing tape 310 that is closest to the most used receiving spool 315 in the polishing area, and the portion of polishing tape 310 that is closest to the least used supply spool 311 in the polishing area.

A second conventional motor (not shown) is coupled to the take-up spool 315 for rotating the take-up spool 315 so that the section of polishing tape 310 can be drawn from the supply spool 311 to the take-up spool 315 . For example, when the second motor is activated and the clutch resistance is properly adjusted, the second motor rotates the take-up spool 311 with the section or portion of the polishing tape 310 received therein. In a similar manner, the tension of the polishing belt 310 between the supply spool 311 and the take-up spool 315 can be adjusted by providing appropriate motor torque and clutch resistance. This technique can be used to provide the correct contact pressure between the polishing tape 310 and the wafer surface in the processing area 316 .

4 to 9 illustrate an improved drive system 400 which provides highly reliable smooth and continuous bi-directional reciprocating motion to the portion of the polishing pad. Referring to FIG. 5 , a path 536 along which a polishing pad 530 travels between a supply spool 560 and a take-up spool 562 in the pad drive system 400 is shown. As shown, starting from supply spool 560 and registration roller 514B, path 536 includes passing through top 528C and then through bottom 528D, the right side of slide member 520 sliding the rollers, then passing each roller in a rectangular shaped path 512A, 512B, 512C, and 512D, then around each bottom 528B and top 528A, the left side of slide member 520 slides the rollers, then to alignment rollers 514A and take-up spool 562 . As is apparent from FIG. 5 , with reference to points A1, A2, B1, B2 and C, when the polishing pad 530 is properly locked in place, preferably connected between the supply spool 560 and the take-up spool 562, the movement of the horizontal slide member 520 The horizontal bilinear motion causes a corresponding horizontal bilinear motion of a portion of the polishing pad. Specifically, for example, when horizontal slide member 520 moves from right to left from position P1 to position P2, point A1 on backing plate 530 will remain in the same position relative to receiving spool 562, but point A2 will move across the horizontal slide Left side rollers 528A and 528B of element 520 . Similarly, point B1 on backing plate 530 will remain in the same position relative to supply spool 560 and point B2 will move across right side rollers 528D and 528C of horizontal slide member 520 . Clearly, with this movement, point C will move linearly through the processing area. Note that point C will move twice as far horizontally compared to the horizontal movement of horizontal slide element 520 . Movement of horizontal slide element 520 in the opposite direction will cause point C of polishing pad 530 to also move in the opposite direction. Therefore, the portion of the polishing pad disposed in the polishing region of the chemical mechanical polishing apparatus (point C) can polish the top front surface of the wafer with the bilinear motion of the polishing pad 530 of this portion.

Having described path 536 and the dual linear pad motion mechanism, further description will now be given of the components in path 536 and the horizontal motion drive assembly 550 associated therewith.

As additionally illustrated in FIGS. 4 and 6 , the horizontal slide element 520 is a horizontally movable traverse rail 540 . These guide rails 540 are connected to a casting 510 made of metal, such as coated aluminium, which is also connected to all other pad path forming components. There are therefore various openings in the casting 510 for including the dunnage path components, including the supply spool 560 and the take-up spool 562 (which are each attached to a spool pin associated therewith), and each roller 512A, 512B, 512C, 512D, 514A and 514B, and a large opening for the roller housing 521 and the pin coupling plate 522A coupling the side plates 522B1 and 522B2 of the horizontal slide member 520 together. Rails 540 on each side of casting 510 provide a surface for mounting rails 540 on which horizontal slide member 520 moves. As shown in FIG. 6 , horizontal slide element 520 is mounted on rail 540 with bracket element 526 . Support elements 526 movably hold wafers in position above and below the rails and may serve to reduce friction between rails 540 and horizontal slide elements 520 . The support element 526 may include sliding members, such as metal balls or posts (not shown), to facilitate the sliding action of the horizontal sliding element 520 .

As shown in Figures 4 and 6, for a horizontal slide member 520, a support structure 522 is shaped to have side walls 522B1 and 522B2 with a gusset plate 522A connected therebetween. The bracket element 526 is connected to the inside of the side walls 522B1, 522B2. In addition, the roll shell 521 is shaped to have side plates 521A1 and 512A2 with the coupling plate 521B connected therebetween. The roll shell 521 is supported by a support structure 522 . In this respect, the side plates 521A1 and 521A2 of the roller housing 521 are connected to the side walls 522B1 , 522B2 of the support structure 522 with support plates 523 . Attached between the two side plates 521A1 and 521A2 near gusset plate 521B are four rollers 528A-D, with left side rollers 528A-B on one side of gusset plate 521B and right side rollers 528C-D on gusset plate 521B. the other side of the

Additionally, downwardly from the pin coupling plate 522A shown in FIG. 6 is a pin 530 which will couple to a link 564 described below associated with the horizontal drive assembly 550 . The horizontal drive assembly 550 will cause horizontal bilinear movement of the pin 530 and thus the entire horizontal sliding member 520 along the rail 540 .

As shown in FIG. 5 , the horizontal drive assembly 550 consists of a motor 552 that rotates an axis 554 . Shaft 554 is coupled to a transmission assembly 556 that converts the rotational motion of shaft 554 into horizontal bilinear motion of horizontal slide element 520 . In a preferred embodiment, transmission assembly 556 includes a gearbox 558 that converts horizontal rotational motion of shaft 554 into vertical rotational motion of shaft 560 . A crank 562 is coupled to the shaft 560 to which one end 564A of a connector 564 is connected and the other end 564B of the connector 564 is connected to the pin 530 to allow relative rotational movement of the pin 530 in the other end 564B of the connector 564, This movement also results in horizontal bilinear movement of the pin 530 as it proceeds.

Thus, operation of the horizontal drive assembly 550 will result in bilinear movement of the horizontal slide element 520, and a corresponding horizontal bilinear movement of a portion of the polishing pad 530 in the processing zone.

During processing, the polishing pad can be locked in position between the supply spool 560 and the take-up spool 562 . In this way, when a part of the backing plate 530 in the processing area moves in a horizontal bilinear manner, the backing plate can also be released, so that another part of the polishing backing plate moves in the processing area, and the backing plate of the stepping part is put into the processing area Then remove from it.

When the backing plate 530 is locked in position at the supply spool 560 and take-up spool 562, it has been found that a tensioning mechanism at one end of the backing plate 530 can be used in conjunction with the drive system to achieve more effective results. In particular, as shown in FIGS. 7A and 7B , a processing system having the components required herein is shown, including a horizontal slide element 720 comprising rollers 728A and 728A coupled together with a link plate 722. 728B. The polishing pad 530 travels in a pad path 536 similar to the path previously described with reference to FIG. to horizontal slide element roller 728A, then through registration roller 714A to take-up spool 762. It should be noted, however, that this simplified version is not preferred because a portion of the front side of backing plate 530 will be in contact with rollers 728A and 728B.

Additionally, as shown in FIGS. 7A and 7B , a belt 772 is coupled between a tensioning and stepping motor 770 , hereinafter referred to as motor 770 , and take-up reel 762 . Additionally, a locking mechanism 780, such as a clamping mechanism, is shown. In this embodiment, tensioning of the pad is accomplished by locking supply spool 760 with locking mechanism 780 and activating motor 770 with a predetermined torque value to rotate take-up spool 762 coupled to motor 770 via belt 772. Additionally, stepping of the backing plate is accomplished by releasing the supply spool 760 by releasing the locking mechanism, preferably by rotating the motor 770 at a low RPM until the spent section of the backing plate is lifted, for example, by the take-up spool 762 , and direct a new backing section over the machining area.

FIG. 8 shows more detailed details of the control system for controlling the tensioning and stepping motor 770 and locking mechanism 780 . As shown, power for motor 770 and controller 820 is provided by power supply 810 which provides appropriate power to driver 824 along line 814 and similarly provides a different appropriate power to controller 820 along line 812 . Controller 820 includes some type of computer or microprocessor known in the art. In addition, a line 822 from the controller inputs a predetermined torque value as a TORQUE signal into the motor control unit 804 , specifically into the torque control unit 826 . The predetermined torque value for the motor 770 may be a torque value that is about 10% less than the certified torque value of the locking mechanism 780 . Line 823 from the torque control unit inputs the TORQUE signal into driver 824 . Line 816 returns the TORQUE signal received from driver 824 to the controller for feedback or self-check purposes. If self-checking is not required, line 816 is eliminated. As will be described below, the TORQUE signal is used to maintain tension on take-up spool 762 at a desired level during processing. Driver 824 applies this torque value to motor 770 as a current through line 828a.

But if the pad needs to be stepped with an appropriate signal from the controller, the motor 770 is preferably rotated at a low speed and the pad is advanced. As the motor rotates, it generates a predetermined number of encoder pulses per revolution. The encoder pulses generated by motor 770 are fed back to driver 824 via line 828b, and from there to controller 820 via line 828c. By counting the pulses, the controller 820 tracks the position of the pad as it is advanced by the motor 770 . In one example, one revolution of the motor 770 advances the pad 280 millimeters. An exemplary motor may be model number SG255SA-GA05ACC available from Yaskawa Electric Co., Tokyo, Japan. In this particular example, motor 770 produces 8192 pulses per revolution. These pulses are sent sequentially to the driver. But the code pulse is generally ignored by the controller when tensioning is done because the motor 770 can try to rotate at a certain speed, but it can of course also move because the backing plate is held to the supply spool by the locking mechanism 280.

After receiving process sequence commands and external signals such as the TORQUE signal described above, the controller 820 generates control signals along line 822 which are used by the motor control circuit 804 to control the motor 770 . In particular, the generated signals include an ON/OFF signal, and a TENSION signal, which is used to prompt the motor control unit 804 to supply the correct amount of power to the motor 770, so that it can be realized on the receiving reel 562 during processing. tension required. Controller 820 also generates a BRAKE signal along line 830, which preferably passes through a relay 832 to locking mechanism 780, preferably implemented as an electromagnetic clamping brake for locking supply spool 560 in place. A monitor 840 and a user input device 850 such as a keyboard are preferably coupled to the controller 820 .

The motor control unit 804 includes a driver 824 and a torque regulation unit 826 . The electrical power supplied to driver 824 is a function of a signal generated by torque regulation unit 826 .

Referring now to the flowchart shown in FIG. 9, the operation of tensioning and stepping the portion of the backing plate 530 according to the present invention will be further described with reference to the other figures described above.

As shown in the figure, during the processing, firstly in step 910, the controller 820, the motor control unit 804 and the locking mechanism 780 provide an OFF signal. This allows the supply spool 760 and take-up spool 762 to rotate freely, allowing the dunnage 530 to first pass through the dunnage path 536 as shown above with reference to FIG. 7A . When processing will be performed after passing through, followed by step 920, at this time, the controller 820 provides an ON signal to the locking mechanism 780, and then provides a TENSION signal to the motor control unit 804, and the TENSION signal turns on the motor 770 and applies the force to the receiving reel 762. tension. The supply spool 760 is thereby locked, and the take-up spool 762 is held under tension, thereby properly tensioning the entire portion of the backing plate 530 therebetween, including the portion of the backing plate 530 located in the processing area 120 shown in FIG. 1 .

After that, step 930 starts to process. During processing, the controller 820 initiates bilinear motion of the backing plate 530 using the backing plate drive system 500 described above, for example, with reference to FIG. 5 . During processing with a particular portion of the backer 530, typically some number of wafers 110 may be processed, which will cause the backer drive system 500 to be turned on and off.

But at some point, it is necessary to replace the part of the backing plate 530 used for polishing and provide another part of the backing plate 530 . While entirely new sections of backing plate 530 may be provided, it is contemplated that stepped or continuous sections may also be provided. The same will be done when any new portion of dunnage plate 530 needs to be supplied from supply reel 760 . Specifically, the controller 820 will firstly send an OFF signal to the motor control unit in step 930 to indicate that the motor 770 should be turned off. This is followed by step 940 in which an OFF signal is also provided to the locking mechanism 780, thereby closing the brake and releasing the supply spool 760. Step 960 is then executed in which the controller 820 sends a signal to the motor control unit 804 to step the backing plate 530 a certain amount corresponding to the linear distance the backing plate 530 needs to move. Upon receiving this signal, the motor control unit 804 turns on the motor 770 to advance the backing plate by rotating the take-up spool 762 . This particular amount of pad stepping can be determined by the encoder pulses generated by the rotary motor 770 as previously described. Once the backing plate is advanced, step 920 is initiated again so that the supply spool 760 can be locked and the take-up spool tensioned as described above.

The above description shows a preferred way of applying tension to the portion of the backing plate 530 located in the processing area during machining, and stepping the backing plate 530 with the same motor 770 . It will be appreciated that while tensioning the receiving spool 762 and locking the supply spool 760 during processing is described, tensioning the supply spool 760 and locking the receiving spool 762 during processing is another embodiment of the invention.

Although tensioning and stepping are preferably accomplished with a single motor 770, it will be appreciated that if one of the two motors is connected to the take-up spool and the other to the supply spool, there are multiple ways for tensioning and stepping. Structure.

It will be appreciated that the second embodiment of the present invention with receiving and supplying spools may use various numbers of rollers, various types of drive mechanisms, etc., which cooperate to provide bilinear or reciprocating motion, and in the context of the present invention spirit and scope. Furthermore, the above-mentioned components and devices may be replaced by other similar components and devices.

Furthermore, the layout or geometry of the polishing pad and/or belt in the first and second embodiments may be varied from that described herein to other locations. For example, one may position the polishing pad/strip above the wafer, orient the polishing pad/strip perpendicular to the wafer, and so on.

It will be understood that in the preceding discussion and in the appended claims, the terms "wafer surface" and "surface of a wafer" include, but are not limited to, the surface of the wafer prior to processing, and the surface of any layers formed on the wafer, including semiconductor , oxidized metals, oxides, rotating glass, ceramics, etc.

Although several preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and / or replace.

The subject matter of the present invention includes at least the following features.

1. A method of providing bilinear polishing comprising the steps of:

Disposing a polishing tape having a first end and a second end and a polishing side and a rear side on a support mechanism between a supply area and a receiving area such that the first end first disengages from the supply area and coupled to the receiving area, the second end remains coupled to the supply area; polished by bilinearly moving the portion of the polishing belt positioned in the polishing area; advancing the polishing belt to obtain another portion for polishing, wherein the advancing step pushes the polishing belt Go above the support mechanism so that the polishing side of the belt does not degrade due to the support mechanism; polish by bilinearly moving the other part of the polishing belt; repeat the advancing and polishing steps with the other part.

2. The method above, wherein the advancing step advances the polishing tape over a plurality of rollers in a support mechanism that supports the polishing tape from a rear side of the polishing tape rather than a polishing side of the polishing tape.

3. According to the above-mentioned method, the following steps are also included: before polishing with the part of the polishing tape, a first workpiece is guided to the polishing area; when the polishing of the first workpiece is finished, the first workpiece is taken out; A second workpiece is introduced into the polishing area prior to polishing.

4. The method according to the above, wherein in the step of polishing, further comprising the step of tensioning the portion of the polishing tape located in the polishing area.

5. The method as described above, wherein the tensioning step uses a plurality of rollers disposed between the supply area and the reception area.

6. The method as described above, wherein the step of polishing with the portion of the polishing tape comprises the steps of: vertically reciprocating the first plurality of rollers, thereby causing the portion to move bilinearly; causing the second plurality of rollers to rotate about a stationary axis , thereby providing a polishing area therebetween; and keeping a workpiece in contact with a portion of the polishing tape located in the polishing area.

7. The method as above, wherein the causing step is performed by converting the rotational motion to linear motion with a drive system.

8. The method as described above, wherein the step of polishing with another portion of the polishing tape comprises the steps of: causing the first plurality of rollers to reciprocate vertically, thereby causing the other portion to move bilinearly; causing the second plurality of rollers to rotate about the stationary axis , thereby providing a polishing area therebetween; and keeping another workpiece in contact with the portion of the polishing tape located in the polishing area.

9. The method as described above, wherein the causing step comprises the step of: polishing with the part, the causing step in the step of polishing with the other part is carried out by converting rotational motion into linear motion with a drive system.

10. The method as above, wherein causing the first plurality of rollers to reciprocate vertically results in vertical movement of at least one roller in one direction while at least one other roller moves vertically in an opposite direction.

11. The method as above, wherein the advancing step progressively advances to the other portion such that there is an overlap between the portion and the other portion.

12. The method as described above, wherein in the advancing step a previously used part is received into the receiving area and a new part is released from the supply area.

13. The method as described above, wherein the step of polishing accomplishes abrasive polishing.

14. The method above, wherein the step of polishing accomplishes non-abrasive polishing.

15. The method as described above, wherein in the step of polishing, a concurrent step is applying a force to the rear side of the polishing tape located in the polishing region.

16. The method as above, wherein the step of applying force uses air.

17. The method as described above, wherein the polishing step uses a polishing tape having a width greater than the width of the workpiece being operated thereon.

18. The method as described above, wherein the polishing step uses a polishing tape having a width smaller than the width of the workpiece being operated thereon.

19. The method as above, wherein the incrementally advancing step advances the other part. Make an overlap between this part and another part.

20. The method as described above, wherein in the advancing step a previously used part is received in the receiving area and a new part is released from the supply area.

21. The method as described above, wherein the step of polishing accomplishes abrasive polishing.

22. The method above, wherein the step of polishing accomplishes non-abrasive polishing.

23. The method as described above, wherein during the step of polishing, a concurrent step is applying a force to the polishing tape located in the polishing region.

24. The method as above, wherein the step of applying force uses air.

25. The method as described above, wherein the polishing step uses a polishing tape having a width greater than the width of the workpiece being operated thereon.

26. The method as described above, wherein the polishing step uses a polishing tape having a width smaller than the width of the workpiece being operated thereon.

27. A polishing apparatus for polishing with a polishing tape, the polishing tape having a first end and a second end, and a polishing side and a rear side, comprising: a receiving area coupleable to the first end of the polishing tape a supply area connectable to the second end of the polishing belt; a support structure that provides the polishing belt with a path to run between the receiving area and the supply area so that there is a workpiece processing area along the path, the the support structure is configured such that the polishing side of the polishing belt is not used by the support structure to support the polishing belt; a first drive mechanism capable of bilinearly moving a portion of the polishing belt in the processing region by bilinearly moving polishing; and a second drive mechanism that advances the polishing tape so that another portion of the polishing tape can be located in the processing area for bilinear polishing by bilinearly moving the other portion of the polishing tape located in the processing area .

28. The apparatus as described above, further comprising a tensioning mechanism for tensioning the portion of the polishing tape located in the polishing area.

29. The apparatus as above, wherein the tensioning mechanism is a clutch.

30. The apparatus as described above, wherein the support structure comprises a plurality of rollers disposed on the polishing belt path between the supply area and the receiving area, wherein the polishing belt pushes the plurality of rollers so that only the rear of the polishing belt The side other than the polishing side of the polishing belt is in contact with the plurality of rollers.

31. Apparatus according to above, wherein the plurality of rollers comprises: a first plurality of rollers reciprocating vertically to cause bilinear movement of the portion; and a second plurality of rollers rotating about a stationary axis to provide a polishing zone therebetween.

32. The apparatus as described above, wherein the first plurality of rollers includes at least one roller that moves vertically in one direction when at least one other roller moves vertically in the opposite direction.

33. The apparatus as described above, wherein the first drive mechanism converts rotational motion to linear motion at two different ends of the polishing belt.

34. The apparatus according to the above, wherein the first drive mechanism comprises: a motor; at least one shaft rotatable by the motor; a pair of drive mounts coupled to the at least one shaft; and a pair of polishing belt attachment mechanisms such that each A polishing belt coupling mechanism is coupled between one end of the polishing belt and a different one of the pair of drive mounts, wherein the motor rotates the at least one shaft, the rotation of the pair of drive mounts, and the pair of polishing belt Reciprocating linear movement of the connecting mechanism and the end of the polishing belt.

35. The method as described above, wherein the step of polishing by bidirectionally moving the portion of the polishing tape located in the polishing region moves the portion of the polishing tape above the support mechanism so that only the rear side of the polishing tape is in contact with the support mechanism; by bidirectionally moving the polishing tape The step of polishing another portion located in the polishing area moves the other portion of the polishing tape over the support mechanism so that the rear side of the polishing tape contacts the support mechanism.

36. The method as above, wherein the steps of providing and advancing the polishing tape respectively position the first end and the second end of the polishing tape so that the portion and the other portion are respectively movable during the polishing step.

37. The method as described above, wherein in the step of polishing, further comprising the step of tensioning the portion of the polishing tape located in the polishing region.

38. The method as described above, wherein during the step of polishing, the first end and the second end of the polishing tape remain stationary in the supply area and the reception area, respectively.

39. The method as described above, wherein in the step of polishing, further comprising the step of tensioning the portion of the polishing tape in the polishing region.

40. The method according to the above, wherein the steps of polishing each further comprise the step of: floating a portion of the polishing tape in the polishing area on a platen to cause contact so that the front side of the polishing tape and the front side of the workpiece to be polished Polish in between.

41. The method according to the above, wherein each of the polishing steps further comprises the step of: floating a portion of the polishing tape in the polishing region on a platen to cause contact so that there is a gap between the front side of the polishing tape and the front side of the workpiece being polished. between polishing.

42. The apparatus as described above, wherein the support structure supports the portion of the polishing tape such that the polishing side of the polishing tape is not used by the support structure to support the portion of the polishing tape that is used for bilinear polishing in the processing region.

43. Apparatus according to above, wherein the receiving area is adapted to position the first end of the polishing tape and the supply area is adapted to position the second end of the polishing tape such that the part and the other part are respectively bilinearly movable by the first drive mechanism And bilinear polishing in the processing area.

44. The apparatus as described above, wherein the second drive mechanism also tensions the portion and the other portion of the polishing tape located in the processing area when the portion and the other portion are respectively located in the processing area.

45. The apparatus as described above, wherein the second drive mechanism also tensions the portion of the polishing tape and the other portion of the polishing tape located in the processing area when the portion and the other portion of the polishing tape are respectively located in the processing area.

46. A method for chemical mechanical polishing of a workpiece for imparting bilinear motion to a polishing pad disposed in a processing area, comprising the steps of: imparting rotational motion to a drive shaft; The rotational motion of the sliding element is converted into a bilinear motion of a sliding element; causing the bilinear motion of the portion of the polishing pad in the processing area to correspond to the bilinear motion of the sliding element, which is used when chemically mechanically polishing a workpiece Bilinear motion of backing plate.

47. The method above, wherein in the causing step, the polishing pad is disposed between the supply spool and the take-up spool.

48. The method as described above, wherein in the causing step, the polishing pad is passed through rollers disposed on the slide member.

49. The method as described above, wherein the converting step provides horizontal bilinear movement of the slide member, such that the causing step provides horizontal bilinear movement of the portion of the polishing pad in the processing zone.

50. The method as described above, wherein the portion of the polishing pad moves horizontally at least twice as far as the slide member moves horizontally.

51. The method as described above, wherein the portion of the polishing pad moves by a greater amount than the sliding member.

52. The method as above, wherein the causing step includes providing a shim path over the plurality of rollers.

53. The method as described above, wherein the pad path is such that only the back side of the polishing pad is in physical contact with the plurality of rollers.

54. The method as described above, wherein in the causing step, the polishing pad is passed through rollers disposed on the slide member.

55. The method as described above, wherein the converting step provides horizontal bilinear movement of the slide member, such that the causing step provides horizontal bilinear movement of the portion of the polishing pad in the processing zone.

56. The method above, wherein the portion of the polishing pad moves horizontally at least twice as far as the slide member moves horizontally.

57. The method as above, wherein the portion of the polishing pad moves by a greater amount than the sliding member.

58. The method as above, wherein the causing step includes providing a shim path over the plurality of rollers.

59. The method as described above, wherein the pad path is such that only the back side of the polishing pad is in physical contact with the plurality of rollers.

60. An apparatus for chemical mechanical polishing of a workpiece with a solution for producing bilinear motion in a predetermined area with a portion of a polishing pad corresponding to the processing area, comprising: a drive including a rotatable shaft assembly; a sliding element movable in a sliding region, the sliding element being mechanically coupled to the drive assembly such that rotation of the rotatable shaft causes bilinear motion of the sliding element; wherein the polishing pad is disposed through the sliding element, thereby The bilinear motion of the sliding element results in a corresponding bilinear motion of the portion of the polishing pad that is used during chemical mechanical polishing of the workpiece.

61. The apparatus as described above, wherein the drive assembly comprises: a gearbox coupled to the rotatable shaft and including another rotatable shaft; a crank coupled to the other rotatable shaft; and a coupling A link between a link and a sliding element.

62. Apparatus according to above, wherein the sliding element comprises a plurality of rollers.

63. Apparatus according to above, wherein the bilinear movement of the sliding element is horizontal.

64. The apparatus as described above, wherein the bilinear movement of the portion of the polishing pad in the processing zone is horizontal.

65. The apparatus as above, further comprising a plurality of rollers providing a dunnage path between the supply spool and the take-up spool.

66. The apparatus as described above, wherein the plurality of rollers are positioned such that the pad path is such that only the back side of the polishing pad is in physical contact with the plurality of rollers.

67. A drive assembly for providing a path for horizontal linear motion of a portion of a polishing pad disposed between a supply spool and a take-up spool in a processing zone, the drive assembly comprising: a A drive for a rotatable shaft; a one-piece casting made of metal containing openings, the casting also including a horizontal sliding area; a supply pin, a receiving pin, and a plurality of openings disposed in the casting rollers on which the supply pin and the receiving pin can connect the supply reel and the receiving reel respectively, with the polishing pad disposed therebetween; and a horizontal slide member movable horizontally in a horizontal slide region, the horizontal slide member and the The drive device is mechanically coupled, couplable to the polishing pad, such that rotation of the rotatable shaft results in horizontal motion of the slide element and results in horizontal linear motion of the polishing pad.

68. The apparatus as described above, wherein the horizontal slide element moves in a direction of bilinear motion and is capable of causing horizontal bilinear motion of the portion of the polishing pad.

69. The apparatus according to the above, wherein the drive means comprises: a gearbox coupled to the rotatable shaft and containing another rotatable shaft; a crank coupled to the other rotatable shaft; and A fixing member is coupled between the connecting member and the horizontal sliding member.

70. Apparatus according to above, further comprising a plurality of rails connected to the casting, the horizontal slide member being movable horizontally on the casting.

71. A method for tensioning a portion of a polishing pad in a processing area, comprising the steps of: providing a polishing pad, a portion of which is disposed in a processing area, connected at one end to a supply spool, The other end is attached to a take-up spool, locking one of the supply and take-up spools so that the corresponding end of the polishing pad does not move; a tensioning mechanism is used to tension the polish from the other of the supply and take-up spools The other end of the backing plate, so that while the polishing backing plate is tensioned by the tensioning mechanism, another driving mechanism is used to make the part of the polishing backing plate move bilinearly in the processing area.

72. The method as described above, wherein the locking step locks the supply spool; the tensioning step tensions from the receiving spool; further comprising the step of stepping the polishing pad so that another portion is placed in the processing area, the stepping step using tensioning mechanism to move the polishing pad step by step.

73. The method as above, wherein the stepwise moving step comprises the steps of: removing tension from the take-up spool; unwinding the supply spool; and stepping the polishing pad with the tensioning mechanism while unwinding the supply spool.

74. The method above, wherein the step of tensioning comprises the steps of: continuously monitoring the tension applied to the polishing pad; and continuously adjusting the tension based on the continuously monitored tension.

75. The method as above, wherein the step of continuously monitoring tension monitors the current supplied to the motor used in the tensioning step.

76. The method as above, wherein the tensioning step uses a motor to tension the take-up spool and move the polishing pad in steps.

77. The method as described above, wherein the step of providing further provides a plurality of rollers disposed on a slide member, and an additional plurality of rollers.

78. The method as described above, wherein the step of providing provides a pad path with a backside of the polishing pad in physical contact with the plurality of rollers and the additional plurality of rollers.

79. The method as above, wherein the tensioning step uses a motor to tension the take-up spool and move the polishing pad in steps.

80. The method as above, wherein the step of tensioning tensions the entire portion of the polishing pad between the supply spool and the take-up spool.

81. The method as described above, wherein the shim path passes through the plurality of rollers and the further plurality of rollers.

82. The method above, wherein the step of tensioning comprises the steps of: continuously monitoring the tension applied to the polishing pad; and continuously adjusting the tension based on the continuously monitored tension.

83. The method as above, wherein the step of continuously monitoring tension monitors the current supplied to the motor used in the tensioning step.

84. The method as above, wherein the tensioning step uses a motor to tension the take-up spool and move the polishing pad in steps.

85. Apparatus for chemical-mechanical polishing of a workpiece with a solution for tensioning and stepping a portion of a polishing pad in a processing zone, comprising: a drive mechanism containing a rotatable shaft; a movable in a sliding zone a sliding element mechanically coupled to the drive assembly such that rotation of the rotatable shaft causes bilinear movement of the sliding element, wherein the polishing pad is disposed through the sliding element such that bilinear movement of the sliding element causes the corresponding bilinear motion of a portion of the polishing pad; and a supply spool; a take-up spool; a plurality of rollers forming a pad path between the supply spool and the take-up spool; and a tensioning mechanism, when the portion of the polishing pad When the plate is used for chemical mechanical polishing of a workpiece, the tensioning mechanism provides tension to the take-up spool and thus to the portion of the polishing pad.

86. The apparatus as above, wherein the tensioning mechanism is coupled to the receiving spool.

87. The apparatus above, further comprising a locking mechanism coupled to the supply reel.

88. The apparatus according to above, further comprising a controller for controlling the tension provided by the tensioning mechanism.

89. The apparatus as above, wherein the controller receives a feedback signal that assists in controlling the tension provided by the tensioning mechanism.

90. The apparatus according to above, wherein the tensioning mechanism also steps the polishing pad.

91. The apparatus as described above, wherein the tensioning mechanism steps the polishing pad when the locking mechanism releases the supply spool.

Claims (56)

1. a method that is used to provide the bidirectional linear polishing comprises the following steps:

On a supporting device between a feed region and the receiving area, provide a sand belt, this sand belt has one first end and one second end and a polished side and a rear side, make first end at first break away from feed region and connect with the receiving area, second end keeps connecting with feed region;

Moving the part that sand belt is arranged in polishing area by bidirectional linear polishes;

Advance sand belt and obtain another part of being used to polish, wherein forward step is pushed to the supporting device top with sand belt, and the polished side of sand belt can not degenerated owing to supporting device;

The another part that moves sand belt by bilinearity polishes;

Repeat to advance and polishing step with another part.

2. advance sand belt according to the process of claim 1 wherein on a plurality of rollers of forward step in supporting device, this supporting device is from the rear side of sand belt rather than the polished side supporting sand belt of sand belt.

3. according to the method for claim 2, also comprise the following steps:

Before the partially polished band polishing one first workpiece is being directed into polishing area with this;

After finishing, the polishing of first workpiece takes out first workpiece; And

Before with the polishing of another part sand belt, one second workpiece is directed into polishing area.

4. according to the method for claim 3, wherein in polishing step, comprise that also the tensioning sand belt is arranged in the step of this part of polishing area.

5. according to the method for claim 4, wherein tensioning step is used a plurality of rollers that are arranged between feed region and the receiving area.

6. according to the method for claim 2, wherein forward step advances to another part gradually, and making has an overlap joint between this part and another part.

7. according to the process of claim 1 wherein in forward step, a used part in front is received in the receiving area, a new portion breaks away from feed region.

8. according to the method for claim 2, wherein in polishing step, a simultaneous step is that the rear side to the sand belt that is arranged in polishing area applies a power.

9. according to the method for claim 9, the step that wherein applies power is used air.

10. according to the process of claim 1 wherein that forward step advances to another part gradually, making an overlap joint is arranged between this part and another part.

11. according to the process of claim 1 wherein in forward step, a used part in front is received in the receiving area, a new portion breaks away from feed region.

12. according to the process of claim 1 wherein:

The step that the part that is positioned at polishing area by two-way mobile sand belt is polished should partially polished Tape movement to the supporting device top, thereby have only the rear side of sand belt to contact with supporting device; And

The step that the another part that is arranged in polishing area by two-way mobile sand belt polishes moves to the supporting device top with this another part sand belt, and the rear side of sand belt is contacted with supporting device.

13. according to the method for claim 12, wherein provide and advance the step of sand belt to locate first end and second end of sand belt respectively, thereby can in polishing step, move this part and this another part respectively.

14. method according to claim 13, wherein in polishing step, the end that sand belt is not used in polishing keeps twisting in respectively in feed region and the receiving area, and the polished side that twists in the sand belt in feed region and the receiving area can not degenerated in polishing process.

15. according to the method for claim 14, wherein:

The step of polishing in the part that is arranged in polishing area by two-way mobile sand belt is with only moving with the supporting device of the back side contacts of this partially polished band a plurality of and rotatable roller moves this partially polished band; And

The step of polishing at the another part that is arranged in polishing area by two-way mobile sand belt is with only moving with the supporting device of the back side contacts of this another part sand belt a plurality of and rotatable roller moves this another part sand belt.

16., wherein in polishing step, comprise that also the tensioning sand belt is arranged in this part of polishing area and the step of another part according to the method for claim 15.

17. according to the method for claim 13, wherein in polishing step, it is static that first end of sand belt and second end keep in feed region and receiving area respectively.

18., wherein in polishing step, comprise that also the tensioning sand belt is arranged in the step of this part of polishing area according to the method for claim 17.

19. method according to claim 18, wherein polishing step also comprises the following steps: respectively certain part that sand belt is arranged in polishing area swum on the platen and causes contact, thereby polishes between the front side of the front side of sand belt and polished workpiece.

20. method according to claim 12, wherein polishing step also comprises the following steps: respectively certain part that sand belt is arranged in polishing area swum on the platen and causes contact, thereby polishes between the front side of the front side of sand belt and polished workpiece.

21. according to the method for claim 20, wherein:

The step of polishing in the part that is arranged in polishing area by two-way mobile sand belt is with only moving with the supporting device of the back side contacts of this partially polished band a plurality of and rotatable roller moves this partially polished band; And

The step of polishing at the another part that is arranged in polishing area by two-way mobile sand belt is with only moving with the supporting device of the back side contacts of this another part sand belt a plurality of and rotatable roller moves this another part sand belt.

22. the polissoir with the sand belt polishing, this sand belt has one first end and one second end, and a polished side and a rear side, comprising:

The receiving area that can connect with first end of sand belt;

The feed region that can connect with second end of sand belt;

A supporting structure, this supporting structure provides a path of moving to sand belt between receiving area and feed region, thereby there are a workpiece machining area, this supporting structure to be configured such that the polished side of sand belt is not supported structure and is used for supporting sand belt along this path;

One first driving mechanism, this first driving mechanism can move the part that sand belt is arranged in machining area by bidirectional linear and carry out the bidirectional linear polishing; And

One second driving mechanism, this second driving mechanism advances sand belt, makes another part sand belt can be arranged in machining area, and is used for moving sand belt by bidirectional linear and is positioned at another part of machining area and the bidirectional linear polishing.

23. according to the equipment of claim 22, also comprise a strainer, be used for the part that the tensioning sand belt is positioned at polishing area.

24. equipment according to claim 22, wherein supporting structure comprises a plurality of rollers, these a plurality of rollers are set in place on the sand belt path between feed region and the receiving area, wherein sand belt promotes these a plurality of rollers, makes to have only the rear side of sand belt rather than the polished side of sand belt to contact with these a plurality of rollers.

25. according to the equipment of claim 22, this supporting structure supporting this partially polished band wherein makes to be used for when the machining area bidirectional linear polishes when this partially polished band that the polished side of sand belt is not supported structure and is used for supporting this partially polished band.

26. equipment according to claim 25, wherein the receiving area is suitable for locating first end of sand belt, feed region is suitable for locating second end of sand belt, makes this part and this another part can be moved and bilinearity polishing in machining area by the first driving mechanism bilinearity respectively.

27. according to the equipment of claim 26, wherein when this part and this another part lay respectively in the machining area, second driving mechanism also tensioning is arranged in this part and this another part of the sand belt of machining area.

28. according to the equipment of claim 22, wherein when this part of sand belt and this another part lay respectively in the machining area, second driving mechanism also tensioning is arranged in this part and this another part of the sand belt of machining area.

29. a method that is used for workpiece is carried out chemically mechanical polishing is used for making the polishing backing plate that is arranged at machining area to produce bidirectional linear motion, comprises the following steps:

A driving shaft is produced to rotatablely move;

Rotatablely moving on this driving shaft converted to the bilinearity motion of a sliding members;

Cause the bilinearity motion of this partially polished backing plate in machining area corresponding, when the chemically mechanical polishing workpiece, use the bilinearity motion of this partially polished backing plate with the bilinearity motion of sliding members.

30. according to the method for claim 29, wherein in causing step, the polishing backing plate is through being arranged at the roller on the sliding members.

31. according to the method for claim 30, wherein switch process provides the horizontal bilinearity motion of sliding members, causes step that the horizontal bilinearity motion of this partially polished backing plate in the machining area is provided.

32. according to the method for claim 30, wherein the amount of movement of this partially polished backing plate is greater than sliding members.

33. according to the method for claim 32, wherein this backing plate path makes and has only the back side of polishing backing plate to contact with these a plurality of roller entities.

34. according to the method for claim 29, wherein switch process provides the horizontal bilinearity motion of sliding members, causes step that the horizontal bilinearity motion of this partially polished backing plate in the machining area is provided.

35. according to the method for claim 29, wherein the amount of movement of this partially polished backing plate is greater than sliding members.

36. according to the method for claim 29, wherein this backing plate path makes in causing step, has only the back side of polishing backing plate to contact with these a plurality of roller entities.

37. one kind with solution to the equipment that workpiece carries out chemically mechanical polishing, be used for producing the bilinearity motion in the presumptive area that has part polishing backing plate corresponding to of machining area, comprising:

A driven unit that comprises a rotatable shaft;

The sliding members that can in a sliding area, move, this sliding members and this driven unit machinery couple, and make the rotation of rotatable shaft cause the bilinearity of sliding members to be moved;

Wherein polish backing plate and pass the sliding members setting, thereby the motion of the bilinearity of sliding members causes the bilinearity motion of the correspondence of this partially polished backing plate, when workpiece is carried out chemically mechanical polishing, use the bilinearity motion of this partially polished backing plate.

38. according to the equipment of claim 37, wherein driven unit comprises:

A gear-box, this gear-box and rotatable shaft couple and comprise another rotatable shaft;

A crank that couples with this another rotatable shaft; And

A connector that is coupled between connector and the sliding members.

39. according to the equipment of claim 38, wherein sliding members comprises a plurality of rollers.

40. according to the equipment of claim 39, wherein the motion of the bilinearity of sliding members is a level.

41. according to the equipment of claim 40, also comprise a plurality of rollers, these a plurality of rollers provide a backing plate path between supply spool and reception spool.

42. according to the equipment of claim 41, wherein these a plurality of rollers are provided with like this, the backing plate path makes to have only the back side of polishing backing plate to contact with these a plurality of roller entities.

43. a method that is used at machining area tensioning part polishing backing plate comprises the following steps:

A polishing backing plate is provided, and the part of this polishing backing plate is arranged in the machining area, and an end is connected on the supply spool, and the other end is connected to one and receives on the spool;

One in spool and the reception spool is supplied in locking, and the corresponding end of polishing backing plate can be moved; And

With the other end of another tensioning polishing backing plate of a strainer from supply spool and reception spool, thereby in by strainer tensioning polishing backing plate, in machining area, make this partially polished backing plate bilinearity motion with another driving mechanism.

44. according to the method for claim 43, wherein:

Lock step locking supply spool;

The tensioning step is from receiving the spool tensioning; And

Also comprise stepping move the polishing backing plate step, make another part place machining area, stepping is moved step and is moved the polishing backing plate with strainer with coming stepping.

45. according to the method for claim 44, wherein stepping is moved step and is comprised the following steps:

Elimination is from the tension force that receives spool;

Unclamp the supply spool; And

When unclamping the supply spool with the strainer stepping move the polishing backing plate.

46. according to the method for claim 43, wherein tensioning step comprises the following steps:

Connect monitoring and be applied to the tension force that polishes on the backing plate; And

Adjustment of tonicity continuously on the basis of the tension force of this continuous monitoring.

47. according to the method for claim 46, wherein tensioning step uses motor to come tensioning to receive spool, and stepping move the polishing backing plate.

48., wherein provide step that an a plurality of roller and other a plurality of rollers on the sliding members that are arranged at also are provided according to the method for claim 47.

49. according to the method for claim 43, wherein the backing plate path is through these a plurality of rollers and these other a plurality of rollers.

50. one kind with solution to the equipment that workpiece carries out chemically mechanical polishing, be used for comprising at machining area tensioning and stepping part polishing backing plate:

A drive unit that comprises a rotatable shaft;

The sliding members that can in a sliding area, move, this sliding members and driven unit machinery couple, thereby the rotation of this rotatable shaft causes the bilinearity motion of sliding members, wherein polish backing plate and pass the sliding members setting, thereby the motion of the bilinearity of sliding members causes the bilinearity motion of the correspondence of this partially polished backing plate; And

A supply spool;

One receives spool;

A plurality of rollers that between supply spool and reception spool, form a backing plate path; And

A strainer, when this partially polished backing plate was used for the chemically mechanical polishing workpiece, this strainer was to receiving spool, thereby provided tension force to this partially polished backing plate.

51. according to the equipment of claim 50, wherein this strainer is couple on this reception spool.

52., also comprise a locking mechanism that couples with the supply spool according to the equipment of claim 51.

53. according to the equipment of claim 52, also comprise a controller, be used to control the tension force that provides by strainer.

54. according to the equipment of claim 52, wherein this controller receives a feedback signal, the tension force that the auxiliary control of this feedback signal is provided by strainer.

55. according to the equipment of claim 52, strainer stepping polishing backing plate also wherein.

56. according to the equipment of claim 55, wherein when locking mechanism unclamped the supply spool, backing plate was polished in the strainer stepping.

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