CN1635824A - Multilayer circuit board with high heat dissipation and manufacturing method thereof - Google Patents

Abstract

The invention relates to a high heat-dissipating multilayer circuit board and a manufacturing method thereof, which comprises a substrate, a multilayer circuit structure and an electronic component, wherein the multilayer circuit structure comprises a plurality of insulating layers and a combination of circuit layers stacked on the surface of the substrate, the circuit layers are attached to the surfaces of the insulating layers, the multilayer circuit structure comprises a heat conduction hole filled with heat conduction glue, the heat conduction hole penetrates through the multilayer circuit structure until the heat conduction hole is contacted with the substrate, and the electronic component is connected to the opening of the heat conduction hole on the surface of the topmost circuit layer and is contacted with the heat conduction hole.

Description

Multilayer circuit board with high heat dissipation and manufacturing method thereof

technical field

The invention relates to a multilayer circuit board and a manufacturing method thereof, in particular to a high heat dissipation multilayer circuit board and a manufacturing method thereof.

Background technique

With the gradual development of electronic products in the direction of high performance, high frequency, high speed and thinness, under the design concept of "light, thin, short, small and multifunctional", various electronic related main parts such as central processing Processors (CPUs), chipsets (Chipsets), etc. are all researched and developed in the direction of high speed, multi-function, high power, and small size. Therefore, the calorific value per unit volume in the components is constantly increasing, and the heat dissipation of the components has become the key to the improvement of the performance of electronic components.

Multilayer circuit board is a good solution to increase the density of electronic components and circuits. The general multilayer circuit board structure and manufacturing process usually use a flat substrate as the base, and then form an adhesive layer or insulating layer on one or both sides of the base. layer, which in turn covers the metal circuit layer. Or after the first metal circuit layer is formed on the substrate, several circuit layers and adhesive layers are laminated through a gluing process, and finally processed to complete the production of a multilayer printed circuit board. Increasing the relative density of components and circuits also leads to the problem of poor heat dissipation efficiency. The components on the circuit board need to use air as the heat transfer medium. However, heat dissipation through air conduction cannot quickly and effectively dissipate the heat accumulated in the components, which reduces the performance of the components and even shortens the life of the components. This situation is more serious in multi-layer circuit boards.

In the development trend of packaging design, it is no longer possible to dissipate enough heat only by the package design of components, and the heat dissipation function must be enhanced through the design of the circuit board. Therefore, in order to prevent the heat accumulation of multilayer circuit boards, the practice of using thermally conductive adhesive as the adhesive layer of the metal circuit layer has been produced, but the amount of thermally conductive adhesive used to bond the components, each metal circuit layer and the substrate is quite large, so It also increases the manufacturing cost of the multilayer circuit board.

Contents of the invention

The purpose of the present invention is to provide a multilayer circuit board with high heat dissipation and its manufacturing method to solve the problems of the traditional technology. Through the design of the heat dissipation structure of the multilayer circuit board, its heat dissipation properties can be effectively improved and the use of thermally conductive adhesive can be reduced. Reduce manufacturing costs.

The multilayer circuit board with high heat dissipation of the present invention comprises a substrate, a multilayer circuit structure and an electronic component. The multilayer circuit structure includes a combination of several insulating layers and circuit layers stacked on the surface of the substrate. The circuit layer is attached to the surface of the insulating layer, and includes a heat conduction hole in its multilayer circuit structure, which runs through the multilayer circuit structure until it is connected to the substrate. Contact, the thermal conduction hole is filled with thermal conductive glue. The electronic component is connected to the opening of the heat conduction hole on the surface of the topmost circuit layer and is in contact with the heat conduction hole, so that the heat dissipated by the electronic component during operation can be conducted to the substrate through the heat conduction hole, increasing the surface area for heat dissipation.

In conjunction with the above structure, another object of the present invention is to provide a method for manufacturing a multilayer circuit board with high heat dissipation. Firstly, a combination of several insulating layers and circuit layers is stacked on the surface of the substrate; Other perforation methods form heat conduction holes; then, fill heat conduction glue into the heat conduction holes; then connect the electronic components to the openings of the heat conduction holes on the surface of the topmost circuit layer and make contact with the heat conduction holes. Or provide a substrate and several circuit layers first, and each circuit layer has pre-reserved via holes; then each circuit layer is bonded to the substrate with an insulating adhesive layer, and the via holes of each circuit layer are connected to each other. Then, fill the heat conduction hole with heat conduction glue; then connect the electronic component to the opening of the conduction hole on the surface of the topmost circuit layer to make it contact with the heat conduction hole.

Description of drawings

Fig. 1 is a schematic cross-sectional view of the structure of an embodiment of the present invention; and

2 to 4 are schematic diagrams of the production process of the embodiment of the present invention.

Explanation of reference signs

10 Aluminum metal substrate 20 Multilayer circuit structure

21 insulation layer 22 circuit layer

23 heat conduction hole 24 heat conduction glue

30 integrated circuit chips

Detailed ways

In order to have a further understanding of the purpose of the present invention, structural features and functions thereof, the accompanying drawings are described in detail as follows:

The multi-layer circuit board with high heat dissipation disclosed by the present invention makes the cooling speed of the multi-layer circuit board faster through the structural design of the substrate, and reduces the use of heat-conducting glue.

Its highly heat-dissipating multi-layer circuit board structure matches the design of the substrate structure. A combination of several insulating layers and circuit layers is stacked on the surface of the substrate, and the thermal conduction holes connecting the substrate and electronic components are used to improve heat dissipation efficiency. It is only for the operation of electronic components. The heat generated provides transfer without the need for the full use of thermally conductive adhesives to bond substrates, insulating layers, and circuit layers. Its characteristic is that it conducts the heat generated by electronic components to the entire substrate, increasing the surface area for heat dissipation. Embodiments of the substrate structure design are disclosed as follows:

Please refer to FIG. 1 , which is a schematic cross-sectional structure diagram of an embodiment of the present invention, using an integrated circuit chip as an electronic component. It mainly includes an aluminum metal substrate 10 , a multilayer circuit structure 20 and an integrated circuit chip 30 . The multilayer circuit structure 20 includes a combination of three insulating layers 21/circuit layer 22 stacked on the surface of the aluminum metal substrate 10, the circuit layer 22 is attached to the surface of the insulating layer 21, and includes a heat conduction hole 23 in its multilayer circuit structure, Through the multi-layer circuit structure 20 until it contacts the aluminum metal substrate 10 , the heat conduction hole 23 is filled with a heat conduction adhesive 24 . The integrated circuit chip 30 is connected to the opening of the heat conduction hole 23 on the surface of the topmost circuit layer 22 and contacts the heat conduction hole 23. Based on the design of the above heat dissipation structure, the heat emitted by the integrated circuit chip 30 during operation can be directly passed through heat conduction. The holes 23 conduct to the aluminum metal substrate 10 . The surface area for heat dissipation is increased, and the amount of thermal conductive adhesive is saved.

Please refer to FIG. 2 to FIG. 4 , which are schematic diagrams of the manufacturing process of the embodiment of the present invention.

As shown in FIG. 2 , firstly, an aluminum metal substrate 10 is provided, and a multilayer circuit structure 20 formed by combining several insulating layers 21 and circuit layers 22 is stacked on the surface of the aluminum metal substrate 10 .

As shown in FIG. 3 , a thermal conduction hole 23 penetrating through the multilayer circuit structure 20 is formed by laser at the predetermined joint of the integrated circuit chip.

As shown in FIG. 4 , fill the heat conduction hole with heat conduction glue so that the heat conduction hole 23 connects the topmost circuit layer 22 and the aluminum metal substrate 10 . Finally, the integrated circuit chip 30 is connected to the opening of the heat conduction hole 23 on the surface of the topmost circuit layer 22 and attached to the heat conduction hole 23 , that is, the structure shown in FIG. 1 is formed.

In addition, the present invention can also reserve a conduction hole before each circuit layer and then connect it into a thermal contact hole, and then carry out the subsequent manufacturing process, so that the circuit layer can be combined with the aluminum metal substrate through the gluing process to form an insulating adhesive layer, and each After the thermal contact holes of the circuit layer are aligned and bonded, the steps of filling thermal conductive glue into the thermal contact holes and bonding integrated circuit chips are also carried out.

Although the preferred embodiments of the present invention are disclosed as above, they are not intended to limit the present invention. Any ordinary skilled person may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection shall be subject to what is defined in the claims of this specification.

Claims (11)

1. the multilayer circuit board of a high heat radiation is characterized in that, comprising:

One substrate;

One multilayer circuit structure, contain the combination of several insulating barriers and circuit layer, each this circuit layer is attached to respectively this surface of insulating layer, the combination of this insulating barrier and circuit layer and then be stacked on this substrate, in this multilayer circuit structure, comprise a heat conduction hole, run through this multilayer circuit structure until with this substrate contacts, be filled with a heat-conducting glue in this heat conduction hole; And

One electronic building brick, be linked to top this circuit layer surface this heat conduction hole opening part and contact with this heat conduction hole, the heat that this electronic building brick is dispersed when operation conducts to this substrate by this heat conduction hole.

2. the multilayer circuit board of high heat radiation as claimed in claim 1 is characterized in that this substrate is the aluminum metal substrate.

3. the multilayer circuit board of high heat radiation as claimed in claim 1 is characterized in that this electronic building brick is an integrated circuit (IC) chip.

4. the manufacture method of the multilayer circuit board of a high heat radiation is characterized in that, its step comprises:

One substrate is provided;

Storehouse one multilayer circuit structure is in this substrate surface, and this multilayer circuit structure comprises the combination of several insulating barriers and circuit layer, and each this circuit layer is attached to respectively this surface of insulating layer;

Formation runs through a heat conduction hole of this multilayer circuit structure, certainly a predetermined electronic building brick joint on this circuit layer surface of this multilayer circuit structure top;

Insert a heat-conducting glue in this heat conduction hole; And

This electronic building brick is connected in this electronic building brick joint, this electronic building brick is contacted with this heat conduction hole.

5. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 4 is characterized in that this substrate is the aluminum metal substrate.

6. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 4 is characterized in that this electronic building brick is an integrated circuit (IC) chip.

7. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 4 is characterized in that this formation runs through the step in a heat conduction hole of this multilayer circuit structure, forms this heat conduction hole in the laser beam perforation mode.

8. the manufacture method of the multilayer circuit board of a high heat radiation is characterized in that, its step comprises:

One substrate is provided;

Several circuit layers are provided, and each circuit layer contains a via;

Each this circuit layer is followed on this substrate with an insulation adhesion coating, and made the mutual conducting of this via of each this circuit layer;

Insert a heat-conducting glue in this heat conduction hole; And

One electronic building brick is connected in the via opening part on this circuit layer surface of top, this electronic building brick is contacted with this heat conduction hole.

9. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 8 is characterized in that this substrate is the aluminum metal substrate.

10. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 8 is characterized in that this electronic building brick is an integrated circuit (IC) chip.

11. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 8 is characterized in that, this with the then step on this substrate of an insulation adhesion coating, follows this circuit layer and this substrate by a gummed processing procedure with each this circuit layer.

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