CN1680749A - Light-emitting diode device, light-emitting diode cooling system and lighting device containing same - Google Patents

Abstract

The invention provides a light-emitting diode device, a light-emitting diode heat dissipation system and a lighting device comprising the same. The light emitting diode device is provided with a heat dissipation structure, which comprises a heat conduction column, a heat conduction net, cooling liquid, a heat dissipation body and a radiator. The heat generated by the LED chip is absorbed by the heat-conducting net and the cooling liquid within the first time through the heat-conducting column, and then is transferred to the heat-radiating body and directly radiated to the environment through the heat radiator. Therefore, the operation temperature of the light emitting diode can be kept, and the light emitting diode is driven by higher current to achieve higher power.

Description

Light-emitting diode device, light-emitting diode cooling system and lighting device containing same

technical field

The invention relates to a light emitting diode device, in particular to a light emitting diode device with a heat dissipation structure.

Background technique

Light Emitting Diode (LED for short) is widely used in various display products because of its advantages of high brightness, small size, light weight, unbreakable, low power consumption and long life. Its light emitting principle is as follows : Apply a voltage to the diode to drive electrons and holes in the diode to combine and further generate light.

A general commercial LED 10 , please refer to FIG. 1 , has an LED chip 11 placed on a lead frame 14 , and the LED chip 11 is electrically connected to the lead frame 14 by wires 12 . In addition, the light emitting diode 10 also includes a packaging material 13 covering the light emitting diode chip 11 and the lead frame 14 and exposing the pins 15 for protecting the light emitting diode chip 11 and the wire 12 . Although light-emitting diodes are called cold light sources, the temperature of the central light-emitting layer can reach as high as about 400 degrees because the chip emits light while converting part of the energy into heat. However, the packaging material used to package diodes is usually a resin compound with heat-insulating effect, and its thermal conductivity is not good. Therefore, the heat cannot be transmitted upwards by epoxy resin and dissipated to the air, but can only be slowly downwards by wires. conduction.

When the heat accumulation in the light-emitting diode 10 is too high, it is easy to cause the packaging material 13 covering the light-emitting diode 10 to have different expansion degrees due to different heating, resulting in a gap between the lead frame 14 and the packaging material 13, which is easy to make air or moisture The infiltration of gas will affect the use and shorten the life, and even cause the solder joints or wires 12 to fall off in severe cases.

On the other hand, if the heat generated by the diode chip is not dissipated but stored and accumulated, the excessively high operating temperature will cause the energy gap (junction) of the light-emitting layer of the p-n junction of the light-emitting diode to collapse. In this way, the unit current can make the luminous The brightness produced by the diode will be greatly reduced, so the luminous efficiency will be reduced or even destroyed. Because heat limits the higher current the LEDs can inject, the LEDs can't meet the standards that really set the specs.

Please refer to FIG. 2 , which shows a light emitting diode device array 50 , which is a further application of light emitting diodes. The light emitting diode device array 50 includes several light emitting diodes 10 adhered to a base material 60 in a high-density array type. Since the heat source is more concentrated, the above-mentioned degradation phenomenon of the light emitting diode crystal grains caused by the heat will not occur in the light emitting diode device array 50. more obvious in .

In order to solve the above problems and obtain higher brightness LEDs, many improved methods have been proposed by the industry. Wherein the most successful typical example is the Luxeon® light-emitting diode 100 of the U.S. LumiLeds company, please refer to Fig. The heat conduction to the air, only 18 LEDs can be equivalent to the brightness of 100 traditional LEDs. However, the operating current of the light emitting diode 100 is limited to about 20mA at a proper operating temperature, and has not been widely adopted due to high production cost.

In order to meet the needs of the current market, it is imperative to break through the limitation of the operating current of the LED to improve the luminous efficiency of the LED device. Therefore, developing a light emitting diode device with higher heat dissipation efficiency has become an urgent problem to be solved for light emitting diodes.

Contents of the invention

In view of this, the purpose of the present invention is to provide a light emitting diode device with a heat dissipation structure, which includes a heat conductor, and the heat conductor is a heat dissipation post or a heat dissipation base. Wherein, one end of the heat conduction body is used as a bearing seat for LED crystal grains, and the other end of the heat conduction body directly extends to a heat dissipation body, and the heat dissipation body is inside a high-efficiency refrigeration cavity. Due to the relationship between the temperature difference between the crystal grain and the heat dissipation body, the heat generated by the LED grain can be quickly transferred to the outside of the LED grain through the heat conductor and the heat dissipation body. In this way, even if the operation of the LED is further improved current to increase the brightness, the diode light-emitting grains can still be pushed and maintained at a suitable working temperature, effectively avoiding the deterioration of the grains.

Another object of the present invention is to provide a heat dissipation system for LEDs, which combines one or several LED devices and one or several coolant supply devices to form a liquid-cooled circulation heat dissipation system, which can more effectively improve the heat dissipation of LEDs The problem.

Another object of the present invention is to provide a lighting device with high luminous efficiency, wherein the lighting device includes the LED device with heat dissipation structure of the present invention.

To achieve the above object, a light emitting diode device with a heat dissipation structure according to the present invention includes: a heat dissipation body, which has an open end; a substrate, which is arranged on the heat dissipation body, and has a first surface and A second surface, wherein the second surface is located on the opposite side of the first surface and abuts against the opening end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least A heat conductor is arranged on the substrate in a manner of penetrating the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located in the first cavity; and at least one light emitting diode die is arranged on the bearing part of the heat conductor.

The above invention also includes a cooling liquid filled in the cavity.

In the above invention, at least a part of the extension part of the heat conductor is in contact with the cooling liquid.

The above invention also includes a lens formed on the first surface, wherein the lens forms a second cavity with the first surface, and at least one light-emitting diode die is disposed in the first cavity in the second cavity. On the surface.

The above invention also includes a circuit pattern formed on the first surface of the substrate to be electrically connected with the LED.

The above invention also includes a reflective layer disposed on the bearing portion of the heat conductor.

In the above invention, the heat conductor is a heat conduction column made of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof.

In the above invention, the heat dissipation body is made of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof.

In the above invention, the heat dissipation body is formed by stamping, die-casting, powder metallurgy, injection, lathe processing or welding.

In order to achieve another purpose of the present invention, the present invention provides a LED heat dissipation system, which includes: one or several cooling liquid supply devices; and one to several LED devices with heat dissipation structure, the heat dissipation The light emitting diode device of the structure communicates with the cooling liquid supply device. Wherein, the light-emitting diode device with heat dissipation structure respectively includes: a heat dissipation body with an open end, and communicated with the cooling liquid supply device; a substrate, arranged on the heat dissipation body, with a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface, and abuts against the opening end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body, wherein the cooling liquid The supply device is to supply a cooling liquid into the first cavity; at least one heat conductor is arranged on the substrate in the manner of penetrating the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located at in the first cavity; and at least one light emitting diode crystal grain is arranged on the bearing part of the heat conductor.

According to the light-emitting diode device with heat dissipation structure of the present invention, wherein the several light-emitting diode devices with heat dissipation structure utilize at least one circulation pipeline and the cooling liquid supply device (various types of water tanks, buckets, water tanks, such as steam, locomotive cooling water tank) connected. In addition, the cooling liquid supply device is a cooling liquid tank with a pressurized pump or an injection cooling liquid tank, or it can be a closed self-circulation system without external power that only uses the heat energy absorbed by the cooling liquid to generate pressurized kinetic energy .

The cooling liquid supply device of the present invention uses a circulation pipeline to communicate with several cooling bodies.

According to the present invention, at least a part of the extending portion of the heat conductor is in contact with the cooling liquid.

The light emitting diode device with heat dissipation structure of the present invention further includes a lens formed on the first surface of the substrate, and the lens forms a second cavity with the first surface, and at least one light emitting diode die is It is arranged on the first surface in the second cavity.

The invention also includes a circuit pattern formed on the first surface of the substrate to be electrically connected with the LED.

The light emitting diode device with heat dissipation structure of the present invention further includes a reflective layer disposed on the bearing portion of the heat conductor.

The heat conductor described in the present invention is a heat conduction column, and its material is one of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof.

The heat dissipation body described in the present invention is one of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof.

The heat dissipation body described in the present invention is formed by stamping, die-casting, powder metallurgy, injection, lathe processing or welding.

To achieve another object of the present invention, the present invention provides a lighting device, which includes: a control unit; and at least one LED device with a heat dissipation structure, electrically connected to the control unit. Wherein, the light-emitting diode device with heat dissipation structure respectively includes: a heat dissipation body with an open end; a substrate, arranged on the heat dissipation body, with a first surface and a second surface, wherein the second surface is located on the The opposite side of the first surface is in contact with the opening end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least one heat conductor is arranged on the substrate in a manner penetrating through the substrate on the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located in the first cavity; and at least one LED die is arranged on the bearing part of the heat conductor, wherein the control The unit is to turn on or off the LED die.

The light-emitting diode device with a heat dissipation system structure according to the present invention, no matter it uses a closed or circulating liquid cooling system, through various heat-conducting seats or heat-conducting columns as the bearing seats of light-emitting diode chips, the The heat generated by the light-emitting diode chip is absorbed by the cooling liquid, and then the heat is transferred to the heat dissipation body and directly dissipated into the environment. In this way, under the premise of keeping the LED at a normal operating temperature, the LED can be driven with a higher current to exert higher power.

In addition, the traditional LED device uses a large-area metal substrate as the heat dissipation component of the LED device. However, the substrate also has several wires (usually gold wires) for electrical connection with the LED die. Therefore, when the substrate absorbs the heat generated by the crystal grains and the temperature rises, the excessively high temperature will cause the wires on the substrate to fall off or even break. The light emitting diode device with heat dissipation structure of the present invention utilizes different components for multiple heat conduction or heat dissipation, thus avoiding the problems caused by the known technology.

The method, characteristics and advantages of the present invention are further described below through several examples and comparative examples together with the accompanying drawings, but they are not intended to limit the scope of the present invention. The scope of the present invention should be based on the attached application The scope of the patent shall prevail.

Description of drawings

FIG. 1 is a schematic diagram illustrating a cross-sectional structure of a known LED device.

FIG. 2 is a top view illustrating a known array of LED devices.

FIG. 3 is a schematic cross-sectional view illustrating a known light emitting diode device with a heat dissipation structure.

4a to 4l are schematic cross-sectional structure diagrams illustrating a light emitting diode device according to a preferred embodiment of the present invention.

5a-5h are schematic diagrams illustrating the relative relationship between the heat dissipation column and the substrate of the LED device of the present invention.

6a to 6y are three-dimensional cross-sectional views illustrating a heat dissipation body having a geometric shape according to the present invention.

FIGS. 7a to 7y are cross-sectional views showing the heat dissipation body having a geometric shape corresponding to FIGS. 6a to 6y, wherein the peripheral folded edge does not scratch hands.

FIG. 8 is a three-dimensional assembly view showing the array type LED device according to Embodiment 1 of the present invention.

FIG. 9 a and FIG. 9 b are diagrams illustrating the steps of bonding the light-emitting diode die to the bearing surface of the heat dissipation column according to Embodiment 1 of the present invention.

FIG. 10 is a three-dimensional assembly view showing the array type LED device according to Embodiment 2 of the present invention.

Fig. 11a is a block diagram showing a LED cooling system according to a preferred embodiment of the present invention.

Fig. 11b is a perspective view showing the LED cooling system according to a preferred embodiment of the present invention.

FIG. 12 is a block diagram illustrating a display device according to a preferred embodiment of the present invention.

FIG. 13 is a schematic diagram illustrating a display device according to a preferred embodiment of the present invention.

FIG. 14 is a schematic perspective view showing a vehicle light system according to a preferred embodiment of the present invention.

Detailed ways

In order to make the above-mentioned and other purposes, features, and advantages of the present invention more clearly understood, the preferred embodiments are specifically listed below, together with the accompanying drawings, and are described in detail as follows:

Light emitting diode device with heat dissipation structure

The invention discloses a light emitting diode device with a heat dissipation structure, which has excellent heat dissipation capability and can avoid problems such as low luminous efficiency and grain deterioration of light emitting diodes caused by poor heat conduction efficiency of known light emitting diode devices.

First, please refer to FIGS. 4a and 4b , which show a single-chip LED device 200 according to the present invention to illustrate the basic structure of the present invention. The LED device 200 includes an LED die 210 , several heat conductors 220 , a substrate 230 , a heat dissipation body 240 , and an optical lens 250 .

The heat conductor 220 is divided into a carrying portion 222 and an extending portion 224 . The extension portion 224 is a portion of the heat conductor 220 protruding downward from the second surface 233 of the substrate 230 , please refer to FIG. 5 a . The carrying portion 222 is used to place the LED die 210 . The substrate 230 has a first surface 231 and a second surface 233 , and the second surface 233 is located on the opposite side of the first surface 231 . The substrate 230 further includes a through hole 234 , and the through hole 234 penetrates from a first surface 231 of the substrate to the second surface 233 . The heat conductor 220 passes through the substrate 230 through the through hole 234 , and is disposed on the substrate 230 in a manner of penetrating the substrate 230 , with its extension portion 224 on the same side as the second surface 233 of the substrate. The LED device 200 can have a single or several LED dies 210 . The heat conductor 220 can be designed as a strip-shaped heat conduction column (as shown in Figures 4a to 4c), a ring-shaped heat conduction column (as shown in Figures 4d to 4f), a m-shaped heat conduction column (as shown in Figures 4g to 4i) or a Elongated heat conduction columns (as shown in Figures 4j to 4l), if the heat conductor 220 is an annular heat conduction column, a rice-shaped heat conduction column or a long strip heat conduction column, the heat conductor 220 can have several light-emitting diode crystal grains 210 or more at the same time. The linear arrangement (one-dimensional array) is disposed on a carrying surface 227 of the carrying portion 222 thereof.

One of the main functions of the substrate 230 is to fix the heat conductor 220, and the first surface 231 of the substrate 230 can have a patterned circuit 236, which can be electrically connected with the LED die 210 by wires 237, as its drive circuit. In the LED device 200, the substrate 230 is in contact with the heat dissipation body 240 with the second surface 233, and the substrate 230 and the heat dissipation body 240 form a completely sealed cavity 260, wherein the heat conductor 220 The extension part 224 is disposed in the cavity 260 . In the light emitting diode device of the present invention, the cavity 260 may further include a fixed amount of cooling liquid 280 , the purpose of which is to accelerate the heat dissipation from the diode die 210 to the heat conductor 220 more quickly.

According to the light-emitting diode device of the present invention, the bearing part 222 and the extension part 224 of the heat conductor 220 both have high heat conduction capability, and can be made of the same or different heat conduction materials, wherein the heat conduction material It can be, for example, metals such as silver, copper, aluminum or alloys thereof, ceramic composite materials, metal oxides or mixtures thereof. The heat dissipation body can be formed by stamping, die-casting, powder metallurgy, injection, lathe processing or welding. The carrying portion 222 has a carrying surface 227 with an area of 0.5-2mm ² , and the carrying portion 222 may further include a reflective layer 228 formed thereon, please refer to FIGS. 5d and 5g, wherein the reflective layer may be gold, Metals such as silver, aluminum, silicon, copper, chromium, titanium, tungsten or molybdenum or their alloy materials. The present invention has no limitation on the type of LED crystal grains 210 used, which can be blue light, green light, red light, white light or electroluminescent light emitting diodes. Since the main heat dissipation path of the present invention is the heat conductor 220 rather than the substrate 230, the present invention has no limitation on the type of substrate 230, it can be a general printed circuit board, and a reflective reflector can be deposited on the substrate. layer, such as a silver layer. The heat dissipation column is arranged on the substrate in a manner that penetrates the substrate, and the relative relationship between the heat conductor 220 and the substrate 230 is not limited, and can be adjusted as required. Please refer to FIGS. 5a-5c and 5e. shown. In addition, the width of the extending portion 224 of the heat conductor 220 can be greater than the width of the through hole, as shown in FIG. 5f and FIG. 5h . The carrying surface 227 can be a plane or a concave surface.

In addition, the heat dissipation body 240, such as a heat dissipation cup, can further have a plurality of protrusions, which can be formed on the inside or outside of the heat dissipation body, wherein the material of the heat dissipation body 240 can be silver, copper, tungsten, Nickel, silicon, aluminum, molybdenum, ceramic composites, diamond-like carbon materials, metal oxides or mixtures thereof. The present invention has no further limitation on the shape of the heat dissipation body, which may be a cylinder or a cube with an opening.

In addition, the geometric heat dissipation body 240, such as a heat dissipation barrel, can further have various high heat dissipation geometric shapes, so as to highlight the heat transfer energy of phonons, free electrons, and holes in metal materials. The material can be silver, Copper, aluminum, ceramic composites, metal oxides or mixtures thereof. The geometric heat dissipation body described in the present invention can have many variations, and can be preferably divided into cylinder type (Fig. 6a to Fig. 6e), tetrahedral barrel type (Fig. 6p to 6t), elliptical barrel shape and other four types (Fig. 6u to 6y), and the heat dissipation body can also have one or several retracted holes. Please refer to Figures 6a to 6y, which are three-dimensional cross-sectional views of 25 kinds of heat dissipation bodies with geometric shapes according to the present invention, and please refer to Figures 7a to 7y, which are the corresponding cross sections of Figures 6a to 6y picture. The cooling body with a geometric shape described in the present invention can be enlarged, reduced, and changed in height due to the working environment and power requirements. In addition, the liquid level of the injected cooling liquid 280 in the cavity 260 is preferably in contact with the cooling post 220 or various heat-conducting seats, and it is more preferable if it is in contact with the second surface 233 of the substrate 230 . In the present invention, the applicable cooling liquid 280 can be water, organic solution, liquid hydrocarbon, liquid helium, liquid nitrogen... various high endothermic liquids, wherein the organic solution can be, for example, alcohols, alkanes, ethers or ketones.

The following example 1 is specifically cited, and an array-type light-emitting diode device is taken as an example to illustrate the manufacturing method of the light-emitting diode device with a heat dissipation structure according to the present invention, and further measure its photoelectric properties, in order to make the characteristics of the present invention And the advantages are more clear:

Example 1:

Please refer to FIG. 8 , which is an assembly diagram showing an array type LED device 300 . Firstly, 20 cylindrical aluminum heat conductors 310 are taken, and a light-emitting diode die 320 (produced by Taiwan Guangga Corporation, model 514) is fixed on the bearing surface 312 on each heat dissipation column. The cylindrical heat dissipation column has a length of 25 mm and a diameter of 1.5 mm. The diameter of the light-emitting diode grain 320 is 14mil, and when its driving power is 20mA, its luminous brightness is 40-50mcd. The method of bonding the light-emitting diode die 320 to the bearing surface 312 on the heat dissipation column includes the following steps: first, on the bearing surface 312, several strips with a length of about 3-6 mil and a width of about 0.1-2.0 mil (about 2.5 μm) are formed. -50 μm) trench 313, see Fig. 9a. Next, an adhesive (or solder) is formed in the groove, and the LED die 320 is fixed on the carrying surface 312 by the adhesive (or solder), see FIG. 9 b. Using the above steps to bond the LED die 320 can not only increase the bonding strength between the die 320 and the bearing surface 312 , but also maintain a good heat conduction effect.

Next, take a 40*40mm printed circuit board 330 on which a circuit pattern has been completed. The thickness of the printed circuit board is 2 mm, and there are 20 through holes 332 on it, and the diameter of each through hole is 1.5 mm. Next, the above-mentioned cooling column passes through the substrate 330 through the through hole, and is disposed on the substrate 330 in a manner of penetrating the substrate 330 . Wherein, the supporting surface 312 of the heat conductor 310 is approximately aligned with the top 334 of the substrate 330 , and the rest of the heat conductor 310 exposes the bottom 336 of the substrate 330 . After completing the setting of the heat dissipation column, the light-emitting diode chip and the circuit pattern are electrically connected with gold wires.

Next, a heat dissipation body 340 is provided, such as a square heat dissipation barrel made of copper, silver, or aluminum, with an inner volume of 30ml. Next, take cooling liquid with a volume of 90-97% of the volume of the heat dissipation body and add it to the heat dissipation body 340, and fix the heat dissipation body 340 to the bottom of the substrate 330, so that the exposed part of the heat conductor 310 is completely covered by the heat dissipation body. Covered by the heat dissipation body 340 . Finally, a projection optical lens 360 is formed on the top 334 of the substrate 330 to cover the LED die 320, wherein the optical lens 360 is kept at a specific distance from the LED die, and the specific distance is not Less than 0.5mm. So far, the array type LED device 300 of the present invention is completed.

In order to further verify the excellent heat dissipation capability of the light-emitting diode device 300 with a heat dissipation structure of the present invention, the array-type light-emitting diode device obtained in Example 1 was lighted for eight hours with different operating voltages and currents, and measured The brightness and operating temperature of the crystal grains are shown in Table 1.

Table 1 Operating voltage (V) Operating current (mA) Brightness (Start) (W) Brightness (after eight hours of lighting) (W) Brightness decay (%) Grain temperature (after lighting for eight hours) (□) 3.0 200 3.5 3.4 <3 twenty three 3.3 400 5 4.76 <5 29～33 3.6 800 15 13.6 <10 40～50

When the LED grains are combined in multiple grains, it is easy to cause the working temperature of the LED grains to be too high due to the excessive concentration of heat sources and the reduction of the average heat dissipation area of each diode grain, which will cause a decrease in luminous efficiency and even cause the LED grain deterioration. The original maximum applicable current range of the LED chip used in Example 1 is 20mA. In the above test, when the operating voltage was increased to 3.6V, each die was lit up with twice the current (40mA) under normal conditions. At this time, the working temperature of the LED grain is still within the normal working temperature range (80° C.) of the LED, so it can be seen that the LED device with heat dissipation structure of the present invention has an advantageous heat dissipation mechanism, which can quickly heat transfer outside the diode die.

Example 2:

Carry out in the same manner as in Example 1, but replace the 20 cylindrical aluminum heat conductors 310 with 3 annular heat conductors (25mm-85mm in length, 0.5mm, 1.0mm and 1.5mm in diameter respectively. mm, and the thickness of the ring is 0.1mm-0.5mm), and the bearing surface 312 of each ring-shaped heat conductor is bonded with 3, 7 and 10 LED dies 320 respectively. In addition, the square cooling bucket is replaced with a round cooling bucket, as shown in FIG. 10 .

LED Cooling System

The present invention also relates to a light-emitting diode heat dissipation system based on the second law of thermodynamics: heat never flows automatically from a cold object to a hot one-way flow law, and the basic concept of a heat engine, heat flows from high temperature to low temperature to obtain mechanical work, and the heat engine does work when it operates between the two temperatures of Thot and Tcold, that is, the theory that the temperature difference after being subject to the action of the heat sink of the heat dissipation body is used as the internal energy or work of the automatic cycle, which is to combine at least one original The light-emitting diode device with heat dissipation system structure of the invention uses at least one circulation pipeline to connect its heat dissipation body with a cooling liquid supply device, so as to achieve the purpose of circulating and cooling the light-emitting diode device. Please refer to FIG. 11 a and FIG. 11 b , which are block diagrams showing a preferred embodiment of the LED cooling system 400 of the present invention. In this preferred embodiment, the LED heat dissipation system includes four LED devices 300, a cooling liquid circulation pipeline 410, a hot water curved circulation pipe 410A pressurized after the temperature is elevated, and a cooling liquid supply device 420 , and the coolant supply device 420 provides a coolant 430 to circulate in the system formed by the heat dissipation body 340 and the circulation pipelines 410 and 410A of the LED device 300 . Wherein the cooling liquid supply device can be a cooling liquid tank containing a pressurized pump or an injection cooling liquid tank or a closed self-circulation system without external power that only utilizes the heat energy absorbed by the cooling liquid to generate pressurized kinetic energy. Among them, the curved hot water circulation pipe 410A, which is pressurized after the temperature is raised, can control the energy point for pressurization and heating during circulation, and has the special function of cooling while circulating.

The light-emitting diode heat dissipation system of the present invention can be further applied to the integration of light-emitting diode lighting equipment for vehicles, such as headlights, fog lights, and direction lights designed according to the light-emitting diode device with heat dissipation structure described in the present invention. And car lights or lighting systems for household and people's livelihood only need to be combined with a pressurized water tank, or use the pressurized kinetic energy of the thermal expansion of the coolant to form an automatic circulation system.

lighting device

Please refer to FIG. 12 , the light emitting diode device 300 with a heat dissipation structure according to the present invention can further utilize a circuit 510 to be electrically connected with a control unit 520 to form a lighting device 500, which can be, for example, an indoor lamp or a large outdoor lamp. , Projector lights, traffic lights, street lights and car lights. Wherein, the control unit is used to turn on or off the LED chip of the LED device, such as a switch. Please refer to FIG. 13 , which is a schematic diagram of a preferred embodiment of a lighting device 500 according to the present invention. On a control unit 520 , and the control unit 520 is electrically connected to the LED device 300 with the circuit 510 . In addition, the illuminating device 500 has a wide-angle lampshade 530 with several protruding lens parts 540 thereon, which can increase the illumination angle of the LED devices 300 . In addition, please refer to FIG. 14 , which shows a car light system 600 combined with a light emitting diode device 300 and a mesh radiator radiator 610 for a vehicle.

To sum up, the light-emitting diode device with heat dissipation system structure according to the present invention, no matter it uses a closed or circulating liquid cooling system, through various heat-conducting seats or heat-conducting columns as the bearing seats of light-emitting diode chips, The cooling liquid absorbs the heat generated by the light-emitting diode chip in the first time, and then transmits the heat to the heat dissipation body, and dissipates it directly into the environment. In this way, under the premise of keeping the LED at a normal operating temperature, the LED can be driven with a higher current to exert higher power.

In addition, the traditional LED device uses a large-area metal substrate as the heat dissipation component of the LED device. However, the substrate also has several wires (usually gold wires) for electrical connection with the LED die. Therefore, when the substrate absorbs the heat generated by the crystal grains and the temperature rises, the excessively high temperature will cause the wires on the substrate to fall off or even break. The light emitting diode device with heat dissipation structure of the present invention utilizes different components for multiple heat conduction or heat dissipation, thus avoiding the problems caused by the known technology.

Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any skilled person can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore The scope of protection of the present invention should be defined by the scope of the appended patent application.

To sum up, the light-emitting diode device with heat dissipation structure of the present invention, no matter it uses a closed or circulating liquid cooling system, through the heat-conducting column as the bearing seat of the light-emitting diode chip, in the first time with The heat-guiding net and the cooling liquid absorb the heat generated by the light-emitting diode chip, and then transfer the heat to the heat dissipation body, and directly dissipate the heat into the environment. In this way, under the premise of keeping the LED at a normal operating temperature, the LED can be driven with a higher current to exert higher power.

In addition, the traditional LED device uses a large-area metal substrate as the heat dissipation component of the LED device. However, the substrate also has several wires (usually gold wires) for electrical connection with the LED die. Therefore, when the substrate absorbs the heat generated by the crystal grains and the temperature rises, the excessively high temperature will cause the wires on the substrate to fall off or even break. The light emitting diode device with heat dissipation structure of the present invention utilizes different components for heat conduction or heat conduction, thus avoiding the problems caused by the known technology.

Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any skilled person can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore The scope of protection of the present invention should be defined by the appended claims.

Symbol Description

known technology

LED: 10; LED chips: 11;

Wire: 12; Packaging material: 13;

Lead frame: 14; Pin: 15;

LED device array: 50; Substrate: 60;

LED: 100; metal base: 110;

Radiator: 130.

Technology of the present invention

LED devices: 200; LED grains: 210;

Cooling column: 220; Bearing part: 222;

Extension: 224; Bearing surface: 227;

Reflective layer: 228; Substrate: 230;

First surface: 231; Second surface: 233;

Through hole: 234; patterned circuit: 236;

Wire: 237; Heat dissipation body: 240;

Body wall of cooling body: 241; Lens: 250;

Cavity: 260; Coolant: 280;

Array type light-emitting diode device: 300; various shapes of heat conduction seat or heat conduction column: 310;

Bearing surface: 312; Groove: 313;

Adhesive: 314; LED grain: 320;

Printed circuit board: 330; Through hole: 332;

PCB top: 334; PCB bottom: 336;

Heat dissipation body: 340; Optical lens: 360;

LED cooling system: 400; Circulation pipeline: 410;

Coolant supply device: 420; Coolant: 430;

Lighting device: 500; Circuit: 510;

Control unit: 520; Wide-angle lampshade: 530;

Lens part: 540; Headlight system: 600;

Mesh type vehicle cooling water tank: 610;

Claims (21)

1. A light-emitting diode device, characterized in that it comprises: A heat dissipation body with an open end; A substrate, arranged on the heat dissipation body, has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface, and abuts against the opening end of the heat dissipation body, and the second surface is in contact with the opening end of the heat dissipation body A first cavity is formed between the heat dissipation bodies; At least one heat conductor is disposed on the substrate in a manner of penetrating the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located in the first cavity; and At least one light emitting diode crystal grain is arranged on the bearing part of the heat conductor. 2. The LED device according to claim 1, further comprising a cooling liquid filled in the cavity. 3. The light emitting diode device as claimed in claim 2, wherein at least a part of the extending portion of the heat conductor is in contact with the cooling liquid. 4. The light emitting diode device according to claim 1, further comprising a lens formed on the first surface, wherein the lens forms a second cavity with the first surface, and at least one light emitting diode crystal The particles are arranged on the first surface in the second cavity. 5. The light emitting diode device according to claim 1, further comprising a circuit pattern formed on the first surface of the substrate to be electrically connected with the light emitting diode. 6. The light emitting diode device according to claim 1, further comprising a reflective layer disposed on the carrying portion of the heat conductor. 7. The light emitting diode device according to claim 1, wherein the heat conductor is a heat conduction column made of one of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof. 8. The light emitting diode device according to claim 1, wherein the heat dissipation body is made of one of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof. 9. The LED device according to claim 1, wherein the heat dissipation body is formed by stamping, die-casting, powder metallurgy, injection, lathe processing or welding. 10. A light-emitting diode cooling system, characterized by comprising: a coolant supply device; and Several light-emitting diode devices with a heat dissipation structure communicate with the cooling liquid supply device; Wherein, the light emitting diode devices with heat dissipation structure respectively include: a heat dissipation body communicated with the coolant supply device, wherein the heat dissipation body has an open end; A substrate, arranged on the heat dissipation body, has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface, and abuts against the opening end of the heat dissipation body, and the second surface is in contact with the opening end of the heat dissipation body A first cavity is formed between the cooling bodies, and the cooling liquid supply device supplies a cooling liquid into the first cavity; At least one heat conductor is disposed on the substrate in a manner of penetrating the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located in the first cavity; and At least one light emitting diode crystal grain is arranged on the bearing part of the heat conductor. 11. The LED heat dissipation system according to claim 10, wherein the coolant supply device communicates with several heat dissipation bodies through a circulation pipeline. 12. The heat dissipation system for LEDs according to claim 10, wherein at least a part of the extending portion of the heat conductor is in contact with the cooling liquid. 13. The LED heat dissipation system according to claim 10, wherein the LED device with heat dissipation structure further comprises a lens formed on the first surface of the substrate, and the lens forms a second surface with the first surface. A cavity, and at least one light emitting diode crystal grain is arranged on the first surface in the second cavity. 14. The LED cooling system according to claim 10, further comprising a circuit pattern formed on the first surface of the substrate to be electrically connected to the LED. 15. The LED heat dissipation system according to claim 10, wherein the LED device with heat dissipation structure further comprises a reflective layer disposed on the bearing portion of the heat conductor. 16. The LED heat dissipation system according to claim 10, wherein the heat conductor is a heat conduction column made of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof. 17. The LED cooling system according to claim 10, wherein the cooling body is made of silver, copper, aluminum, ceramic composite material, metal oxide or a combination thereof. 18. The LED cooling system according to claim 10, wherein the cooling body is formed by stamping, die-casting, powder metallurgy, injection, lathe processing or welding. 19. The LED cooling system according to claim 10, wherein the cooling liquid supply device is a cooling liquid tank. 20. The LED cooling system according to claim 19, characterized in that the coolant tank is a self-circulating system with a pressurized pump or without external power. 21. A lighting device, characterized by comprising: a control unit; and At least one light-emitting diode device with a heat dissipation structure is electrically connected to the control unit: Wherein, the light emitting diode devices with heat dissipation structure respectively include: A heat dissipation body, wherein the heat dissipation body has an open end; A substrate, arranged on the heat dissipation body, has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface, and abuts against the opening end of the heat dissipation body, and the second surface is in contact with the opening end of the heat dissipation body A first cavity is formed between the heat dissipation bodies; At least one heat conductor is disposed on the substrate in a manner of penetrating the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located in the first cavity; and At least one LED crystal grain is arranged on the bearing part of the heat conductor, wherein the control unit is to light or extinguish the LED crystal grain.

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