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CN1679168A - 表面安装电源的发光晶粒封装 - Google Patents

表面安装电源的发光晶粒封装 Download PDF

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CN1679168A
CN1679168A CNA038208490A CN03820849A CN1679168A CN 1679168 A CN1679168 A CN 1679168A CN A038208490 A CNA038208490 A CN A038208490A CN 03820849 A CN03820849 A CN 03820849A CN 1679168 A CN1679168 A CN 1679168A
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die package
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CN100414698C (zh
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班·P·罗
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Cree Huizhou Solid State Lighting Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract

本发明揭示一种发光晶粒封装(10)。所述晶粒封装(10)包括一个基板(20)、一个反光板(40)和一个透镜(50)。所述基板(20)由具有导热性的电绝缘材料制成。所述基板(20)具有用于将外部电源连接到安装垫片(28)处的发光二极管(LED)(60)的迹线(22、24)。所述反光板(40)耦合到所述基板(20)，并大体围绕所述安装垫片(28)。通过将一密封材料(46)弄湿并附着于所述透镜(50)上，从而使所述透镜(50)能够相对于所述反光板(40)自由移动并被抬高或降低，并且所述透镜被置于距离(多个)LED晶片的最佳位置处。所述透镜(50)可以被任何影响所述装置(10)性能的化学物质的光学系统所涂布。在操作期间，所述LED(60)产生的热量可通过所述基板(20)(充当底部散热器)与所述反光板(40)(充当顶部散热器)而从所述LED(60)被驱散。所述反光板(40)包括一个反光面(42)以将来自LED(60)的光线导向所要的方向。

Description

表面安装电源的发光晶粒封装
技术领域
本申请案主张于2002年9月4日申请的标题为“Power-SMT，LEDPackage with Dual Heat-Sinks and an Optical System or Chemical-CoatedLens”的美国临时专利申请案第60/408,254号的权利。
背景技术
本发明涉及封装半导体装置的领域，且尤其涉及封装发光二极管。
发光二极管(LED)通常被封装于引线框(leadframe)封包内。一个引线框封包通常包括一个密封一LED的模制或铸塑塑料主体、一个透镜部分和连接到所述LED并延伸到所述主体外部的细金属引线。所述引线框封包的金属引线作为向LED提供电能的导管，并且同时也可用于从LED趋散热量。当将能量施加到LED以产生光时，便从LED产生热量。一部分引线从封装主体延伸出来以连接到所述引线框封包外部的电路上。
LED产生的某些热量通过塑料封装主体被趋散；然而，大部分热量是经由所述封装的金属组件而从LED被趋散的。所述金属引线通常很薄并具有很小的横截面。因此，所述金属引线从LED移除热量的能力是有限的。这也限制了输送到LED的能量的数量，进而限制了LED所能产生的光的数量。
为了增加LED封装的散热能力，在一个LED封装设计中将一个散热器棒引入到所述封装中。所述散热器棒从LED晶片将热量趋散。因此，其增加了LED封装的散热能力。然而此设计在封装内引入空闲空间，其中填充密封材料以保护LED晶片。此外，归因于LED封装内的各种组件之间的CTE(热膨胀系数)的明显差异，在密封材料内容易产生气泡或密封材料容易从封装内的各个部分脱层。这会对产品的光线输出和可靠度产生不良影响。此外，此设计包括一对通常通过热烫(hot-iron)焊接的脆弱的引线。此制造方法与现今流行于电路板组合领域中的便利的表面安装技术(SMT)互不兼容。
在另一个LED封装设计中，引线框封包的引线具有不同厚度，并(以各种形状和构造)延伸于LED封装主体的边缘之外。一条较厚的引线作为均热片，并且其上安装有LED晶片。此配置使得由LED晶片产生的热量穿过通常连接于外部散热器的较厚引线而被趋散。由于塑料主体与引线框材料之间热膨胀系数(CTE)的显著差异，所以此设计固然并不可靠。当经受温度循环时，附着到金属引线上的硬塑料主体会受到许多不同方向上的高度热应力。这潜在地引发各种不想要的结果，诸如塑料主体破裂、塑料主体从LED晶片脱离、接合线断裂、塑料主体在其结合到各部件的界面处脱层或导致这些结果的组合。此外，所述延长的引线增加封装的尺寸及其占地面积。因此，很难将这些LED封装普遍地用于印刷电路板(PCB)上的密集簇(dense cluster)中以产生较亮的光线。
引线框封包设计的另一个缺陷为无法使厚引线为进入或印入到LED覆晶安装的精密电路上——所述LED覆晶安装技术因其具有成本效益的制造过程和装置性能而为制造商所普遍使用。
因此，目前仍需要一种克服或减少现有技术封装的一或多项缺点的经改进的LED封装。
发明内容
本发明即满足上述需求，本发明的实施例提供一种用于诸如发光二极管的半导体晶粒的封装，所述封装包括：一个具有迹线以连接到安装垫片处的发光二极管的基板；一个耦合到所述基板并大体围绕所述安装垫片的反光板；和大体覆盖所述安装垫片的透镜。
本发明的其它实施例提供一种包括一个底部散热器和一个顶部散热器的半导体晶粒封装。所述底部散热器的顶面上具有迹线。一个半导体晶片被安装于所述底部散热器的顶面上并电连接到所述迹线。所述顶部散热器耦合到所述底部散热器。
从结合随附图式并以实例方式说明本发明原理的详细描述中易了解本发明的其它方面和优势。
附图说明
图1A为根据本发明的一个实施例的半导体晶粒封装的透视图；
图1B为图1A的半导体封装的分解透视图；
图2A为图1A的半导体封装的一部分的顶视图；
图2B为图1A的半导体封装的一部分的侧视图；
图2C为图1A的半导体封装的一部分的前视图；
图2D为图1A的半导体封装的一部分的仰视图；
图3为图1A的半导体封装的多个部分的剖视图；
图4为具有额外元件的图1A的半导体封装的侧视图；
图5为根据本发明的另一实施例的半导体晶粒封装的分解透视图；
图6A为图5的半导体封装的一部分的顶视图；
图6B为图5的半导体封装的一部分的侧视图；
图6C为图5的半导体封装的一部分的前视图；和
图6D为图5的半导体封装的一部分的仰视图。
具体实施方式
现将参考说明本发明的各种实施例的图1到图6D来详细描述本发明。如图所示，层或区域的大小出于说明的目的而被放大，且因此用来说明本发明的一般结构。此外，参考一个形成于一基板上或形成于其它层或结构上的层或结构来描述本发明的各种方面。所属领域技术人员应了解，形成于另一层或基板“上”的一个层涵盖额外的层可介于其间的情形。本文将在另一个层或基板上形成一个层且其间无介入层的情形描述为“直接形成于所述层或基板上”。此外，本文中使用诸如位于下方的相对术语来描述如图所示的一个层或区域与另一个层或区域之间的关系。应理解，这些术语旨在包含除图中所描绘的定位之外的所述装置的不同定位。例如，如果将图中的装置倒置，那么描述为“位于其它层或区域下方”的层或区域现将被定位为“位于这些其它层或区域上方”。所述术语“位于下方”旨在包含此情形中的上方和下方两者。在所有图式中，类似参考数字指代类似元件。
出于说明的目的，如图所示，本发明的实施例以一种发光晶粒封装为例，其包括：一个具有迹线以连接到一安装垫片处的发光二极管的底部散热器(基板)和一个大体围绕所述安装垫片的顶部散热器(反光板)。一个透镜覆盖所述安装垫片。实际上，根据本发明的某些实施例的晶粒封装包含一个两部分散热器，其具有一个用作其上安装LED并与所述LED相连接的基板的底部散热器(其另一用途为驱散热量)和一个用作反光板以导引LED产生的光的顶部散热器(其另一用途为驱散热量)。由于所述底部散热器与所述顶部散热器都可以从LED驱散热量，因此可将更多能量传递到LED，且进而LED可产生更多的光。
另外，在本发明中，所述晶粒封装的主体本身可以充当散热器以从LED移除并驱散热量。因此，本发明的LED晶粒封装可不需要延伸到所述封装之外的独立的散热器棒或引线。因此，本发明的LED晶粒封装比现有技术的晶粒封装更紧凑、更可靠且制造成本更低。
图1A为根据本发明的一个实施例的半导体晶粒封装10的透视图，且图1B为图1A的半导体封装的分解透视图。参考图1A和图1B，本发明的发光晶粒封装10包括一个底部散热器20、一个顶部散热器40和一个透镜50。
所述底部散热器20可在图2A到图2D中更详细地加以说明。图2A、2B、2C和2D分别为图1A的底部散热器20的顶视图、侧视图、前视图和仰视图。另外，图2C除展示所述底部散热器20的前视图之外，还展示一个LED组合60。所述LED组合60也在图1B中得以说明。参看图1A到图2D，底部散热器20支撑如下部件：电迹线22和24、焊盘26、32和34和LED组合60。因此，所述底部散热器20也被称为基板20。为了避免图中标识混乱，仅代表性焊盘26、32和34标注有参考数字。可以使用传导性材料来制造电迹线22和24以及焊盘32、34和36。另外，额外的迹线和接点亦可形成于基板20的顶面、侧面或底面上或在基板20内部成层。所述迹线22和24、焊盘32、34和36以及任何其它接点都可以使用已知的方法(例如通孔)以任意组合而彼此相连接。
所述基板20由具有高导热性的电绝缘材料制成，例如氮化铝(AlN)或氧化铝(Al2O3)。基板20的尺寸可根据用于制造晶粒封装10的应用和处理而广泛地变化。例如在所说明的实施例中，基板20可具有处于从若干分之几毫米(mm)到数十毫米范围内的尺寸。虽然本发明不限于特定尺寸，但本发明的晶粒封装10的一个特定实施例在图式中被说明为具有其中所指示的尺寸。图中所示的所有尺寸均以毫米(对于长、宽、高和半径而言)和度(对于角而言)为单位，除非在附图或在本说明书中或在两者中另外指出。
在所说明的实施例中，基板20具有一个包括电迹线22和24的顶面21。所述迹线22和24提供从焊盘(例如顶部焊盘26)到安装垫片28的电连接。所述顶部焊盘26是迹线22和24的大体接近基板20侧边的一部分。所述顶部焊盘26电连接到侧部焊盘32。所述安装垫片28为安装有LED组合60的顶面(包括迹线22、迹线24或两者的部分)的一部分。安装垫片28一般通常位于邻近顶面21的中心位置处。在本发明的另一实施例中由其它半导体电路或晶片来取代LED组合60。
迹线22和24提供允许LED组合60电连接到焊盘26、32或34的电路径。因此，某些迹线被称为第一迹线22，而其它迹线被称为第二迹线24。在所说明的实施例中，安装垫片28包括部分所述第一迹线22和部分所述第二迹线24。在所说明的实例中，LED组合60被放置于安装垫片28的第一迹线22部分上，进而与第一迹线22接触。在所说明的实施例中，LED组合60顶部与第二迹线24经由一接合线62而彼此相接。根据LED组合60的构造与定位，第一迹线22可为LED组合60提供阳极(正极)接点，并且第二迹线24可包含阴极(负极)接点(或反之亦然)。
LED组合60可包括额外元件。例如，在图1B和图2C中，LED组合60被图解为包括所述LED接合线62、一个LED次组合64和一个发光二极管(LED)66。所述LED次组合64在此技术领域中是已知的且出于论述本发明的目的加以说明，而非旨在限制本发明。在图中，LED组合60展示为以晶粒附着到基板20上。在另一实施例中，安装垫片28可配置为允许LED组合60以覆晶方式加以附着。此外，安装垫片28上可安装多个LED组合。在替代性实施例中，LED组合60可安装于多个迹线的上方。如果使用覆晶技术，那么这尤其可以实现。
迹线22和24的拓朴可与图中所说明的拓朴相差很大，但仍属于本发明范畴内。在图中展示出三个独立的阴极(负极)迹线24以说明安装垫片28上可放置三个LED组合，且其各自连接于一个不同的阴极(负极)迹线；因此可分别电控制所述三个LED组合。迹线22和24是由诸如金、银、锡或其它金属的导电材料制成。迹线22和24具有如图所示的尺寸，并且其厚度依据不同的应用可为微米或数十微米级。例如，迹线22和24的厚度可为15微米。图1A和图2A图解出一个定向记号27，所述记号甚至在组装晶粒封装10之后可用于识别晶粒封装10的适当定位。所述定位记号27并非一个通孔或穿孔。如所说明，迹线22和24可以从安装垫片28延伸到基板20的侧边。
继续参看图1A到图2D，基板20界定了与其侧边相邻的半圆柱空间23和四分之一圆柱空间25。为避免图中标识混乱，仅代表性空间23和25标注有参考数字。当晶粒封装10附着到一个印刷电路板(PBC)或附着到晶粒封装10作为其中一个组件的另一设备时(未图示)，所述半圆柱空间23和所述四分之一圆柱空间25为焊料提供了流过并凝固于其中的空间。此外，在制造处理期间，半圆柱空间23和四分之一圆柱空间25提供便利的轮廓和断点。
基板20可被制作成一具有复数个相邻区段的条带或平板的一个个别区段，每一区段均为基板20。或者，基板20可被制作成一区段阵列的一个个别区段，所述阵列具有多行和多列相邻区段。在所述构造中，半圆柱空间23和四分之一圆柱空间25可用作制造处理期间的条带、平板或阵列的定工具孔。
此外，结合以区段之间的划线沟槽或其它蚀刻部分的半圆柱空间23和四分之一圆柱空间25可有助于将每一个别基板从条带、平板或晶圆分离出来。可通过弯曲所述条带、平板或晶圆而将物理应力施加于孔眼(在邻近间距(close pitch)的半穿孔)或施加于由雷射、预先模制而成的划线或蚀刻线(穿过半圆柱空间23和四分之一圆柱空间25)来完成所述分离动作。这些特性简化了制造过程，因此在制造过程期间通过消除对于用来处理基板20的个别单元的特殊载体夹具的需求而降低生产成本。此外，半圆柱空间23和四分之一圆柱空间25可用作连接顶部焊盘26、侧部焊盘32和底部焊盘34的通孔。
基板20具有一个包括一热接触垫片36的底面29。所述热接触垫片36可使用诸如以下具有高导热性和导电性的材料制成：金、银、锡或包括(但不限于)贵金属的其它材料。
图3为说明图1A和图1B的半导体封装的部分的侧面剖视图。具体而言，图3说明了顶部散热器40和透镜50的侧面剖视图。参看图1A、图1B和图3，顶部散热器40由高导热性材料制成，诸如铝、铜、陶瓷、塑料、复合材料或这些材料的组合。可将一种高温且高机械强度的介电材料涂布到迹线22和24(除中心的晶粒附着区域之外)，以将其密封并防止其受到例如刮伤和氧化的物理及环境的侵害。所述涂布处理可为基板制造处理的一部分。当使用所述涂布处理时，其可使基板20与顶部散热器40绝缘。接着所述涂布物可覆盖有一层高温粘着剂，诸如THERMOSET所制造的热界面材料，从而将基板20接合到顶部散热器40。
顶部散热器40可包括一个大体围绕安装于(图2A和图2C的)安装垫片28上的LED组合60的反光面42。当顶部散热器40用于驱散晶粒封装10中的LED所产生的热量时，其可以由粘着剂或焊接点直接“顶部安装”到外部散热器上以更有效散热。在另一实施例中，如果必须以一个可压缩或非可压缩介质(如空气或冷却流体)来驱散热量，那么可使所述顶部散热器40配备有冷却片或任何可增强所述顶部散热器40与冷却介质之间热转移的部件。在所述的两个实施例中，电端子和晶粒封装10的底部散热器20仍可使用(例如)通常的表面安装技术(SMT)方法而连接于其应用的印刷电路板(PCB)上。
反光面42反射部分的来自LED组合60的光，如试样光线63所说明。所述光的其它部份则不会被反光面42所反射，如试样光线61所说明。说明性光线61和63并非旨在代表通常用于光学领域中的光轨迹。为使光线有效反射，顶部散热器40优选地由可经抛光的材料、经铸造的材料、经模制的材料或其任意组合的材料制成。或者，为实现高反射率，可使所述反光面42或整个散热器40被如下高反射性材料电镀或沉积：例如银、铝或任何可用于达到所述目的的物质。因此，顶部散热器40也被称为反光板40。如果要求晶粒封装10具有热性能和当要求其具有热性能时，所述反光板40可由高导热性材料制成。在所说明的实施例中，反光面42被说明为一个相对于反光片的水平面呈(例如)45°角的平坦表面。本发明并不限于所说明的实施例。例如，反光面42可相对于反光片的水平面呈一个不同的角。或者，反光片可呈抛物面、超环面或任何有助于满足封装所需光谱发光性能的其它形状。
反光板40包括一个用于支撑并耦合到透镜50的支架44。通过使用密封材料46(仅例如，柔软并有弹性的硅材或聚合物)将LED组合60，密封于(图1A和图1B的)晶粒封装10内。所述密封材料46优选为高温聚合物，其具有高度的光穿透性且具有与透镜50的折射系数相匹配或大致匹配的折射系数。所述密封材料46优选地不受可改变其光穿透性和清晰度的大部分波长的影响。
透镜50由诸如以下具有高光穿透性的材料，仅例如玻璃、石英、高温透明塑料或其组合材料。所述透镜50被置于密封材料46顶上并附着于所述密封材料46。透镜50并非牢固地接合于反光板40。此“浮动式透镜”设计将确保密封材料46可以在高、低温条件下伸缩无虞。例如，当晶粒封装10在高温环境下运作或经受高温环境时，密封材料46比包含所述密封材料46的腔空间经历更大的体积膨胀。通过允许透镜50可稍微自由地浮动于密封材料46的顶部，那么将无任何密封材料可从其腔空间中被挤出。同样，当晶粒封装10经受低温时，所述密封材料46将比构成密封材料46腔空间的其它组件收缩得更多；透镜由于密封材料46的收缩及其高度下降而自由地浮动于密封材料46的顶部。因此，由于浮动透镜设计降低了密封材料46上的热应力，所以可在一个相对宽广的温度范围内保持晶粒封装10的可靠性。
在某些实施例中，透镜50界定了一个具有弧形、半圆形或其它几何形状的凹槽52，其中填补有光学材料，从而在(多个)LED晶片发出的光离开晶粒封装10之前影响或改变所述光的特性。一类光学材料的实例为发光转换磷、染料、荧光聚合物或其它可吸收(多个)晶片发出的光并再发出不同波长的光的材料。另一类光学材料的实例为光扩散剂，诸如碳酸钙、散射粒子(诸如氧化钛)或为可分散或散射光的孔洞。可将上述材料中任何单独的一种材料或其组合应用到透镜上以获得某种光谱发光性能。
图4说明耦合到一个外部散热器70的晶粒封装10。参看图4，热接触垫片36可通过使用如下材料而附着到所述外部散热器70：环氧树脂、焊料或任何其它导热性粘着剂、导电性粘着剂或具有导热性和导电性的粘着剂74。外部散热器70可以是印刷电路板(PCB)或是其它可驱散晶粒封装10的热量的结构。所述外部散热器可包括电路元件(未图示)或各种构造中的散热片72。
图5到图6D中展示出具有某种替代构造的本发明的一个实施例。此第二实施例的部分与图1A到图4中所说明的第一实施例的对应部分相类似。为方便起见，与第一实施例的部分相类似的图5到图6D中所说明的第二实施例的部分被配以相同的参考数字，相类似但已改变的部分被配以相同参考数字并附字母“a”，并且不同部分被配以不同的参考数字。
图5为根据本发明的其它实施例的LED晶粒封装10a的分解透视图。参看图5，本发明的发光晶粒封装10a包括一个底部散热器(基板)20a、一个顶部散热器(反光板)40a和一个透镜50。
图6A、图6B、图6C和图6D分别提供图5的基板20a的顶视图、侧视图、前视图和仰视图。参看图5到图6D，在所说明的实施例中，所述基板20a包括一个第一迹线22a和四个第二迹线24a。所述迹线22a和24a与图2A的迹线22和24的配置不同。基板20a包括凸缘31，所述凸缘31界定了闩锁空间33，以接纳反光板40a的支脚35，进而使反光板40a机械地啮合于基板20a。
如上所述，易了解：本发明具新颖性并提供相对于目前技术的优势。虽然上文中描述并说明了本发明的特定实施例，但本发明并非局限于所描述和说明的部件的特定形式或配置。例如，不同的构造、尺寸或材料都可用来实践本发明。本发明受限于上述权利要求。上文中起草的权利要求中所利用的35 USC第112节的条款“的构件或步骤”与词组“的构件”等同。

Claims (40)

1.一种发光晶粒封装，其包含：
一个具有迹线的基板，其用于连接到一安装垫片处的一个发光二极管组合；
一个反光板，其耦合到所述基板并大体环绕所述安装垫片；和
大体覆盖所述安装垫片的透镜。
2.根据权利要求1所述的发光晶粒封装，其进一步包含一个安装于所述基板上并连接到所述基板的所述迹线的发光二极管(LED)。
3.根据权利要求2所述的发光晶粒封装，其中所述LED被密封于光学透明聚合物内。
4.根据权利要求1所述的发光晶粒封装，其中所述基板包含具高导热性的电绝缘材料。
5.根据权利要求1所述的发光晶粒封装，其中所述基板包含导热材料。
6.根据权利要求1所述的发光晶粒封装，其进一步包含一个耦合到所述基板的外部散热器。
7.根据权利要求7所述的发光晶粒封装，其中所述基板具有一个电镀有金属的底面，以用来与所述外部散热器相耦合。
8.根据权利要求1所述的发光晶粒封装，其中至少一条迹线从所述安装垫片延伸到所述基板的一侧。
9.根据权利要求1所述的发光晶粒封装，其中所述基板在沿至少一侧边上包含凸缘，以用来机械地啮合所述反光板。
10.根据权利要求1所述的发光晶粒封装，其中所述反光板大体环绕所述安装垫片。
11.根据权利要求1所述的发光晶粒封装，其中所述反光板界定一个反光面。
12.根据权利要求1所述的发光晶粒封装，其中所述反光板包含高导热性材料。
13.根据权利要求1所述的发光晶粒封装，其中所述反光板包含至少一个机械地啮合于所述基板以增强热转移的支脚。
14.根据权利要求1所述的发光晶粒封装，，其中所述反光板连接到一个外部散热器以允许来自所述封装的热量被驱散。
15.根据权利要求1所述的发光晶粒封装，其中所述反光板包含供散热用的冷却翼。
16.根据权利要求1所述的发光晶粒封装，其中所述透镜包含一个适用于接收光化学物质的凹槽。
17.根据权利要求1所述的发光晶粒封装，其中所述透镜包含发光转换磷。
18.根据权利要求1所述的发光晶粒封装，其中所述透镜包含扩散剂。
19.根据权利要求1所述的发光晶粒封装，其中所述透镜包含磷。
20.一种半导体晶粒封装，其包含：
一个在其顶面上具有迹线的底部散热器；
一个安装于所述底部散热器的所述顶面上的半导体晶片，所述半导体晶片电连接到所述底部散热器的所述迹线上；和
一个机械地耦合到所述底部散热器的顶部散热器。
21.根据权利要求20所述的半导体晶粒封装，其进一步包含一个安装于所述基板上并连接到所述基板的所述迹线的发光二极管(LED)。
22.根据权利要求21所述的半导体晶粒封装，其中所述LED被密封。
23.根据权利要求20所述的半导体晶粒封装，其中所述基板包含具有高导热性的电绝缘材料。
24.根据权利要求20所述的半导体晶粒封装，其进一步包含一个耦合到所述基板的外部散热器。
25.根据权利要求24所述的半导体晶粒封装，其中所述基板具有一个带有热接触垫片的底面，以与所述外部散热器相耦合。
26.根据权利要求20所述的半导体晶粒封装，其进一步包含多个邻近所述安装垫片的安装垫片，所述多个安装垫片适用于允许一个发光二极管被安装于所述基板上。
27.根据权利要求20所述的半导体晶粒封装，其中至少一条迹线从所述基板的顶面延伸到所述基板的一侧。
28.根据权利要求20所述的半导体晶粒封装，其中所述基板界定出沿至少一侧边的凸缘，以机械地啮合所述反光板。
29.根据权利要求20所述的半导体晶粒封装，其中所述反光板大体环绕所述安装垫片。
30.根据权利要求20所述的半导体晶粒封装，其中所述反光板界定一个反光面。
31.根据权利要求20所述的半导体晶粒封装，其中所述反光板包含高导热性材料。
32.根据权利要求20所述的半导体晶粒封装，其中所述反光板包含机械地啮合于所述基板以增加热接触面积的支脚。
33.根据权利要求20所述的半导体晶粒封装，其中所述透镜所包含的材料选自一个由玻璃、石英和高温塑料组成的群组。
34.根据权利要求20所述的半导体晶粒封装，其中所述透镜包含发光转换磷。
35.根据权利要求20所述的半导体晶粒封装，其中所述透镜包含光学扩散剂。
36.根据权利要求20所述的半导体晶粒封装，其中所述透镜包含磷。
37.根据权利要求20所述的半导体晶粒封装，其中所述透镜被放置于密封材料的上方并附着于所述密封材料。
38.根据权利要求37所述的半导体晶粒封装，其中所述密封材料包含弹性材料。
39.根据权利要求20所述的半导体晶粒封装，其中所述透镜包含选自一个由玻璃和石英所组成的群组的材料。
40.根据权利要求20所述的半导体晶粒封装，其中所述透镜包含高透明的塑料材料。
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