[go: up one dir, main page]

USD674361S1 - LED package - Google Patents

LED package Download PDF

Info

Publication number
USD674361S1
USD674361S1 US29/417,114 US201229417114F USD674361S US D674361 S1 USD674361 S1 US D674361S1 US 201229417114 F US201229417114 F US 201229417114F US D674361 S USD674361 S US D674361S
Authority
US
United States
Prior art keywords
led package
view
perspective
led
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/417,114
Inventor
Chen-Hsiu Lin
Yi-Chien Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silitek Electronic Guangzhou Co Ltd, Lite On Technology Corp filed Critical Silitek Electronic Guangzhou Co Ltd
Priority to US29/417,114 priority Critical patent/USD674361S1/en
Assigned to LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. reassignment LITE-ON TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, YI-CHIEN, LIN, CHEN-HSIU
Application granted granted Critical
Publication of USD674361S1 publication Critical patent/USD674361S1/en
Assigned to LITE-ON ELECTRONICS (GUANGZHOU) LIMITED reassignment LITE-ON ELECTRONICS (GUANGZHOU) LIMITED CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of a “LED package” showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and
FIG. 8 is a perspective view viewed from another visual angle thereof; and,
FIG. 9 is a perspective view with a LED chip showing the practical usage thereof.
The dashed lines in the drawings are for illustrative purpose only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a “LED package,” as shown and described.
US29/417,114 2012-03-30 2012-03-30 LED package Active USD674361S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/417,114 USD674361S1 (en) 2012-03-30 2012-03-30 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/417,114 USD674361S1 (en) 2012-03-30 2012-03-30 LED package

Publications (1)

Publication Number Publication Date
USD674361S1 true USD674361S1 (en) 2013-01-15

Family

ID=47471223

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/417,114 Active USD674361S1 (en) 2012-03-30 2012-03-30 LED package

Country Status (1)

Country Link
US (1) USD674361S1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD693780S1 (en) * 2012-09-27 2013-11-19 Lextar Electronics Corporation Light emitting diode package
USD695239S1 (en) * 2012-07-12 2013-12-10 Lextar Electronics Corporation Light emitting diode package
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD709042S1 (en) * 2012-12-27 2014-07-15 Lextar Electronics Corporation Light emitting diode package
USD709040S1 (en) * 2012-11-12 2014-07-15 Lextar Electronics Corporation Light emitting diode package
USD712851S1 (en) * 2012-12-27 2014-09-09 Lextar Electronics Corporation Light emitting diode package
USD763207S1 (en) * 2015-02-05 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
USD784935S1 (en) * 2015-03-10 2017-04-25 Toyoda Gosei Co., Ltd. Light emitting diode
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD1051444S1 (en) * 2024-08-14 2024-11-12 Xingcheng Wu Light fixture

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20070194336A1 (en) * 2006-02-17 2007-08-23 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
USD563333S1 (en) * 2006-04-05 2008-03-04 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
US20090166655A1 (en) * 2007-12-31 2009-07-02 Chien-Feng Lin Light-emitting diode structure
USD619110S1 (en) * 2009-11-20 2010-07-06 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD622677S1 (en) * 2009-02-03 2010-08-31 Everlight Electronics Co., Ltd. Light emitting diode package device
USD624885S1 (en) * 2010-01-27 2010-10-05 Silitek Electronic (Guangzhou) Co., Ltd. LED package structure
US20100307799A1 (en) * 2009-06-06 2010-12-09 Chiang Cheng-Feng Carrier Structure for Electronic Components and Fabrication Method of the same
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
US20120104426A1 (en) * 2010-11-03 2012-05-03 Cree Hong Kong, Ltd. White ceramic led package
US20120132937A1 (en) * 2010-11-30 2012-05-31 Cree Huizhou Opto, Ltd. Waterproof surface mount device package and method
USD664938S1 (en) * 2011-08-12 2012-08-07 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US20070194336A1 (en) * 2006-02-17 2007-08-23 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
USD563333S1 (en) * 2006-04-05 2008-03-04 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
US20090166655A1 (en) * 2007-12-31 2009-07-02 Chien-Feng Lin Light-emitting diode structure
USD622677S1 (en) * 2009-02-03 2010-08-31 Everlight Electronics Co., Ltd. Light emitting diode package device
US20100307799A1 (en) * 2009-06-06 2010-12-09 Chiang Cheng-Feng Carrier Structure for Electronic Components and Fabrication Method of the same
USD619110S1 (en) * 2009-11-20 2010-07-06 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD624885S1 (en) * 2010-01-27 2010-10-05 Silitek Electronic (Guangzhou) Co., Ltd. LED package structure
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
US20120104426A1 (en) * 2010-11-03 2012-05-03 Cree Hong Kong, Ltd. White ceramic led package
US20120132937A1 (en) * 2010-11-30 2012-05-31 Cree Huizhou Opto, Ltd. Waterproof surface mount device package and method
USD664938S1 (en) * 2011-08-12 2012-08-07 Silitek Electronic (Guangzhou) Co., Ltd. Package carrier

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD695239S1 (en) * 2012-07-12 2013-12-10 Lextar Electronics Corporation Light emitting diode package
USD693780S1 (en) * 2012-09-27 2013-11-19 Lextar Electronics Corporation Light emitting diode package
USD709040S1 (en) * 2012-11-12 2014-07-15 Lextar Electronics Corporation Light emitting diode package
USD709042S1 (en) * 2012-12-27 2014-07-15 Lextar Electronics Corporation Light emitting diode package
USD712851S1 (en) * 2012-12-27 2014-09-09 Lextar Electronics Corporation Light emitting diode package
USD763207S1 (en) * 2015-02-05 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
USD784935S1 (en) * 2015-03-10 2017-04-25 Toyoda Gosei Co., Ltd. Light emitting diode
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device
USD1051444S1 (en) * 2024-08-14 2024-11-12 Xingcheng Wu Light fixture

Similar Documents

Publication Publication Date Title
USD674361S1 (en) LED package
USD713716S1 (en) Package
USD704899S1 (en) Faceguard
USD704925S1 (en) Cap
USD714660S1 (en) Package
USD706337S1 (en) Hand held printer
USD705346S1 (en) Hand held printer
USD703051S1 (en) Container
USD703050S1 (en) Container
USD751894S1 (en) Package
USD714275S1 (en) Case
USD711840S1 (en) LED package
USD716420S1 (en) Sink
USD700845S1 (en) Bottle
USD692742S1 (en) Right angle attachment
USD711755S1 (en) Cyclometer
USD704371S1 (en) Lighting device
USD674362S1 (en) LED package
USD750959S1 (en) Package
USD671507S1 (en) LED device
USD689217S1 (en) LED light device
USD720228S1 (en) Bottle
USD656907S1 (en) LED package
USD686173S1 (en) LED chip
USD708032S1 (en) Drill