CN1417868A - Multiple-chip package structure of LED chip - Google Patents

Abstract

A multi-chip packaging structure of light emitting diode chips is that a plurality of light emitting diode chips are arranged in a printed circuit board, and then the light emitting diode chips are fixed on the printed circuit board with a colloid. Wherein, one side of the printed circuit board has a plurality of flat-bottomed concave cups, the bottom of the flat-bottomed concave cups is a plane, a conductor layer is provided on the flat-bottomed concave cups, and a conductor plug runs through the printed circuit board under the bottom of the flat-bottomed concave cups, The other side of the printed circuit board has a heat conducting layer connected with the conductor plug. A plurality of light-emitting diode chips are arranged on the plane bottom of a flat-bottomed concave cup, and the plurality of light-emitting diode chips are fixed in the flat-bottomed concave cup with colloid. The packaged structure can effectively improve the integration level of the package, and can effectively improve the heat dissipation problem after the package.

Description

Multi-chip Packaging Structure of Light Emitting Diode Chips

technical field

The present invention relates to a package of light emitting diode chips, and in particular to a multi-chip package structure in which light emitting diode chips are arranged on a printed circuit board with a flat-bottomed concave cup.

Background technique

At present, all advanced countries in the world have actively developed the optoelectronic material industry, especially the manufacturing technology of high-level chips in the upstream is changing with each passing day, and because light-emitting diodes have a long service life and low power consumption, the application of light-emitting diodes is tending to Universalization, such as large-scale display of electronic signage, traffic lights, car direction lights, and lighting applications. The current light-emitting diode industry is moving towards the goal of high brightness and low light loss, so that light-emitting diodes can replace traditional lighting measures. However, in order to increase the brightness of LEDs and reduce their light loss, in addition to improving the structure of the LED itself, the packaging method of the LED chip is the key to affecting the brightness, uniformity and lifetime of the components. Among them, the multi-chip packaging method of LED chips can make the brightness and color of the LEDs after packaging have more changes by using multiple LED chips. However, since the multi-chip packaging structure of general light-emitting diodes still needs breakthroughs in terms of luminous efficiency, packaging integration and heat dissipation after packaging, the application of multi-chip packaging structures of light-emitting diode chips in the general required high-brightness lighting is still not possible. universal.

First, please refer to FIG. 1 , which is a schematic diagram of a conventional multi-chip packaging structure of LED chips. In a known multi-chip packaging structure, a plurality of LED chips 102 are arranged on a planar printed circuit board 100 for packaging. Wherein, the printed circuit board 100 has an electrode 104 a and a metal layer 104 b corresponding to each LED chip 102 , and each LED chip 102 has an output terminal 106 . A plurality of LED chips 102 are directly disposed on the metal layer 104b by dispensing and coupling, and then each electrode 104a is coupled to the output terminal 106 of each LED chip by a bonding wire 108 . Finally, the plurality of LED chips 102 , the electrodes 104 a and the metal layer 104 b are fixed on the printed circuit board 100 with the glue 110 , that is, the multi-chip packaging of the LED chips 102 is completed.

Although the way of arranging a plurality of light emitting diode chips 102 on the plane printed circuit board 100 has a good package integration degree, the brightness of the light emitting diode chips 102 after packaging is not good, and the effect of mixing light is also poor (there is no light concentrating light). structure). Therefore, the following methods are proposed to solve the problems of brightness and light mixing in multi-chip packaging.

Next, please refer to FIG. 2 , which is a schematic diagram of another known multi-chip packaging structure of LED chips. The LED chips 202 are disposed on a printed circuit board 200 having a plurality of cup-shaped bases 212 for packaging. There are a plurality of electrodes 204 corresponding to the cup-shaped base 212 on the printed circuit board 200, and each cup-shaped base 212 has a metal layer 203 on the surface to configure a light-emitting diode chip 202, and the light-emitting diode chip 202 has two output ends 206a and 206b. Wherein, the electrode 204 is coupled with the output terminal 206b by a bonding wire 208, and the metal layer 203 is directly coupled with the output terminal 206a by dispensing glue. Finally, the multiple LED chips 202 , the metal layer 203 and the electrodes 204 are fixed on the printed circuit board 200 with the glue 210 , that is, the multi-chip packaging of the LED chips 202 is completed.

In the above-mentioned multi-chip packaging of light-emitting diode chips, although the outline of the cup-shaped base 212 on the printed circuit board 200 and the metal layer 203 thereon have the functions of concentrating light and increasing brightness, the cup-shaped base 212 has an arc-shaped outline. , so that one cup-shaped base 212 cannot be configured with multiple light-emitting diode chips 202 at the same time, and one light-emitting diode chip 202 must be configured in a manner corresponding to one cup-shaped base 212, which reduces the integration level of the package.

However, when the output terminal 206a at the bottom of the light emitting diode chip 202 is directly coupled with the metal layer 203, the light emitting diode chip 202 cannot be stably placed on the bottom of the cup-shaped base 212, causing stress to concentrate on the light emission during the subsequent wire bonding process. The corner of the diode chip 202 causes the light emitting diode chip 202 to crack and affects the yield of the package. In addition, after each light emitting diode chip 202 emits light for a period of time, due to the resistance effect, each light emitting diode chip 202 will gradually generate heat energy, and at the place where the output terminal 206a at the bottom of each light emitting diode chip 202 is directly coupled with the metal layer 203, it will be due to light emission. The heat dissipation of the diode chip 202 is not good enough to cause peeling.

To sum up, it is known that the packaging structure using a flat printed circuit board has poor performance in terms of brightness and light mixing, while the packaging structure using a printed circuit board with a cup-shaped base will have difficulty in controlling the pass rate, lower packaging integration, and Poor heat dissipation and other issues.

Contents of the invention

Therefore, the purpose of the present invention is to provide a multi-chip packaging structure for light emitting diode chips, which can effectively improve the yield of packaging, increase the integration of packaging, and effectively improve the heat dissipation problem after packaging.

In order to achieve the above object of the present invention, a multi-chip packaging structure of LED chips is proposed, which is to arrange multiple LED chips in a printed circuit board, and then fix the LED chips on the printed circuit board with a glue. Wherein, one side of the printed circuit board has a plurality of flat-bottomed concave cups, the bottom of the flat-bottomed concave cups is a plane, there is a conductor layer on the flat-bottomed concave cups, and there is a conductor plug penetrating the printed circuit board under the bottom of the flat-bottomed concave cups, The other side of the printed circuit board has a heat conduction layer connected with the conductor plug. A plurality of light-emitting diode chips are arranged on the plane bottom of a flat-bottomed concave cup, and the plurality of light-emitting diode chips are fixed in the flat-bottomed concave cup with colloid. The packaged structure can effectively improve the integration level of the package, and can effectively improve the heat dissipation problem after the package.

Description of drawings

1 is a schematic diagram of a known multi-chip packaging structure for light emitting diode chips;

FIG. 2 is a schematic diagram of a known multi-chip packaging structure of light-emitting diode chips;

3 is a schematic diagram of a multi-chip packaging structure of light emitting diode chips according to the first embodiment of the present invention;

FIG. 4 is a schematic diagram of the packaging of LED chips arranged on a printed circuit board with a flat-bottomed concave cup according to the first embodiment of the present invention;

5 is a schematic diagram of a multi-chip packaging structure of LED chips according to a second embodiment of the present invention; and

FIG. 6 is a schematic diagram of packaging of LED chips disposed on a printed circuit board with a flat-bottomed concave cup according to a second embodiment of the present invention.

Explanation of reference signs:

100: Printed circuit board 102: LED chip

104a: Electrode 104b: Metal layer

106: Output terminal 108: Welding wire

110: colloid 200: printed circuit board

202: LED chip 203: Metal layer

204: electrode 206a, 206b: output terminal

208: Welding wire 210: Colloid

300: Printed circuit board 302: LED chip

304: flat bottom concave cup 305: flat bottom

306: conductor layer 308: conductor plug

310: heat conduction layer 312: output terminal

314: Electrode 316: Welding wire

318: colloid 320: control chip

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Please refer to FIG. 3 , which is a schematic diagram of a multi-chip package structure of LED chips according to a first embodiment of the present invention. The front of the printed circuit board 300 has, for example, a flat-bottomed concave cup 304 and at least one electrode 314 . Wherein, the surface of the flat-bottomed concave cup 304 on the front of the printed circuit board 300 has a conductor layer 306 , and the back of the printed circuit board 300 has a heat conduction layer 310 . In addition, there is a conductor plug 308 penetrating through the printed circuit board 300 under the bottom of the flat-bottomed concave cup 304 for connecting the conductor layer 306 and the heat conduction layer 310 .

Also referring to FIG. 3 , the surface of the flat-bottomed concave cup 304 on the printed circuit board 300 has a conductor layer 306, such as a copper metal layer. The light emitted by the diode chip 302 is reflected in the flat-bottomed concave cup 304 multiple times and exits the flat-bottomed concave cup 304, so that the light emitted from the flat-bottomed concave cup 304 has the same directionality, so the arc profile of the side of the flat-bottomed concave cup 304 has spotlight function. In addition, in view of the known light-emitting diode placed on the arc-shaped bottom of the cup-shaped base, there will be a shortcoming of breaking the light-emitting diode chip during the subsequent wire bonding process, the present invention designs the bottom of the flat-bottomed concave cup 304 as a plane, so that, The light emitting diode chip 302 will not have the risk of breaking during the subsequent wire bonding process, so that the device has good reliability. In the present invention, the structure of the flat-bottomed concave cup 304 on the printed circuit board 300 can be manufactured by mechanical processing or laser drilling, for example. The flat-bottomed concave cups 304 of different depths and sizes can be manufactured by mechanical processing or laser drilling, and the manufactured flat-bottomed concave cups 304 are very consistent in size. In the present invention, the depth and size of the flat-bottomed concave cup 304 can be controlled by mechanical processing or laser drilling, so as to adjust the focal length and luminous flux intensity of the flat-bottomed concave cup 304 .

Also referring to FIG. 3 , there is a conductor plug 308 penetrating the printed circuit board 300 below the plane bottom 305 of the flat-bottomed concave cup 304 , and this conductor plug 308 has the function of deriving heat. After the flat-bottomed concave cup 304 is formed by mechanical processing or laser drilling, a through hole (through hole) through the printed circuit board 300 is formed at the center of the bottom of the flat-bottomed concave cup 304 or at an appropriate position, and then the conductive material is filled into the through hole. A conductor plug 308 is formed in the hole, and the diameter of the through hole is, for example, between 0.05 mm and 0.4 mm. Since the conductor plug 308 runs through the printed circuit board 300 , the conductor plug 308 has the same effect as the rivet in addition to the function of dissipating heat. The conductor plug 308 is connected to the conductor layer 306 on the surface of the flat-bottomed concave cup 304 like a rivet, so that the conductor layer 306 will not be peeled off due to heat. In addition, there is a heat conduction layer 310 on the back of the printed circuit board 300, the material of the heat conduction layer 310 is a material with good thermal and electrical conductivity, such as copper metal, and the heat conduction layer 310 has a layer on the back of the printed circuit board 300 for The larger area for heat dissipation can dissipate the heat energy released by the light emitting diode chip 302 as soon as possible.

The front of the printed circuit board 300 has a flat-bottomed concave cup 304, the surface of the flat-bottomed concave cup 304 has a conductor layer 306, and the back side of the printed circuit board 300 has a heat-conducting layer 310, and the conductor layer 306 and the heat-conducting layer 310 are connected by a conductor that runs through the printed circuit board 300. The plug 308 is connected. The structure of the above-mentioned printed circuit board 300 has good electrical conductivity and heat conduction path, so the yield rate of the LED chip 302 after packaging can be improved.

Next, please refer to FIG. 4 , which is a schematic diagram of packaging a plurality of LED chips arranged on a printed circuit board with a flat-bottomed concave cup according to the first embodiment of the present invention. The multi-chip packaging of light emitting diode chips in the present invention is to place a plurality of light emitting diode chips 302 on the flat bottom 305 of a flat bottom concave cup 304, and use colloid such as silver glue to connect the light emitting diode chips 302 and the flat bottom concave cup 304 The flat bottom 305 is connected. After a plurality of light emitting diode chips 302 are arranged on the flat bottom 305 of the flat concave cup 304, the output terminal 312 on each light emitting diode chip 302 and the electrode 314 on the printed circuit board 300 are coupled by bonding wires 316. The wire machine uses the output end 312 and the electrode 314 as the first welding point and the second welding point respectively, and press-welds the welding wire 316 on the output end 312 and the electrode 314 by means of ultrasonic vibration. Finally, the glue sealing step is performed, and the LED chip 302 is fixed on the flat bottom 305 of the flat concave cup 304 with the glue 318 .

Please also refer to FIG. 4 , the plurality of LED chips 302 are, for example, a red LED chip, a green LED chip, and a blue LED chip, and a total of three chips are used to configure a control chip 320 on the heat conduction layer 310 to control Current flowing through the three chips to achieve different color display. However, the selection of the plurality of LED chips 302 can be changed according to needs, for example, one red LED chip, one green LED chip, and two blue LED chips for a total of four chips and other combinations. A plurality of light emitting diode chips 302 are mixed in the flat-bottomed concave cup 306 before being emitted with very good uniformity, and different numbers or different specifications of the light-emitting diode chips 302 can be arranged on the same flat-bottomed concave cup 306, which is a light-emitting diode chip. The design of 302 increases a lot of flexible space. second embodiment

Please refer to FIG. 5 , which is a schematic diagram of a multi-chip packaging structure of LED chips according to a second embodiment of the present invention. The front of the printed circuit board 300 has, for example, a flat-bottomed concave cup 304 and at least one electrode 314 , and the back of the printed circuit board 300 has, for example, a flat-bottomed concave cup 304 . The flat-bottomed concave cup 304 on the front of the printed circuit board 300 is used to dispose a plurality of LED chips 302 , and the flat-bottomed concave cup 304 on the back of the printed circuit board 300 is used to dispose a control chip 320 , for example. Wherein, the surface of the flat-bottomed concave cup 304 on the front and back of the printed circuit board 300 has, for example, a conductor layer 306 . In addition, the flat-bottomed concave cups 304 on the front and back of the printed circuit board 300 are connected by, for example, a plurality of conductor plugs 308 penetrating the printed circuit board 300 , so that the flat-bottomed concave cups 304 on both sides of the printed circuit board 300 are connected to each other. The structure of the above-mentioned printed circuit board 300 has good electrical conductivity and heat conduction path, so the yield rate of the LED chip 302 after packaging can be improved.

Please also refer to FIG. 5 , the surface of the flat-bottomed concave cup 304 on the front of the printed circuit board 300 has a conductive layer 306, such as a copper metal layer. The light emitted by the diode chip 302 is reflected in the flat-bottomed concave cup 304 multiple times and exits the flat-bottomed concave cup 304, so that the light emitted from the flat-bottomed concave cup 304 has the same directionality, so the arc profile of the side of the flat-bottomed concave cup 304 has The function of concentrating light, while the surface of the flat-bottomed concave cup 304 on the back of the printed circuit board 300 has a conductor layer 306 such as a copper metal layer, which has the same function as the heat conduction layer 310 in the first embodiment, that is, has the function of heat conduction. In this embodiment, the flat-bottomed concave cup 304 on the front of the printed circuit board 300 can be used to arrange a plurality of LED chips 302 , and there will be no shortcoming of LED chip breakage during the subsequent wire bonding process of each LED chip 302 . In this embodiment, the flat-bottomed concave cup 304 on the back of the printed circuit board 300 can accommodate one or more control chips 320 , which further reduces the overall packaged volume of the LED chip 302 .

In this embodiment, the bottom of the flat-bottomed concave cup 304 is also designed as a plane, so that the LED chip 302 will not have the risk of breaking during the subsequent wire bonding process, so that the device has good reliability. In the present invention, the structure of the flat-bottomed concave cup 304 on the printed circuit board 300 can be manufactured by mechanical processing or laser drilling, for example. The flat-bottomed concave cups 304 of different depths and sizes can be manufactured by mechanical processing or laser drilling, and the manufactured flat-bottomed concave cups 304 are very consistent in size. In the present invention, the depth and size of the formed flat-bottomed concave cup 304 can be controlled by mechanical processing or laser drilling, so as to adjust the focal length and luminous flux intensity of the flat-bottomed concave cup 304 .

Also referring to FIG. 5, the flat-bottomed concave cup 304 on the front and back of the printed circuit board 300 has a flat bottom 305, and between the two flat bottoms 305, for example, there are a plurality of conductor plugs 308 penetrating the printed circuit board 300. Each conductor plug 308 will have stronger thermal conductivity. The way the conductor plug 308 is formed is, for example, after the flat-bottomed concave cup 304 is formed by mechanical processing or laser drilling, and then a plurality of through holes (through holes) penetrating the printed circuit board 300 are formed at appropriate positions on the bottom of the flat-bottomed concave cup 304. , and then fill the conductor material into each through hole to form a plurality of conductor plugs 308 , and the diameter of the formed through hole is, for example, between 0.05 mm and 0.4 mm. Since the conductor plug 308 runs through the printed circuit board 300 , the conductor plug 308 has the same effect as the rivet in addition to the function of dissipating heat. The conductor plug 308 is connected to the conductor layer 306 on the surface of the flat-bottomed concave cup 304 like a rivet, so that the conductor layer 306 will not be peeled off due to heat. In addition, there is also a flat-bottomed concave cup 304 on the back of the printed circuit board 300 , and the conductive layer 306 on the flat-bottomed concave cup 304 has the function of heat conduction, so the heat energy released by the LED chip 302 can be dissipated as soon as possible.

Next, please refer to FIG. 6 , which is a schematic package diagram of disposing a plurality of LED chips on a printed circuit board with a flat-bottomed concave cup according to the second embodiment. The multi-chip packaging of light emitting diode chips in the present invention is to place a plurality of light emitting diode chips 302 on the flat bottom 305 of a flat concave cup 304 on the front of the printed circuit board 300, and use colloid such as silver glue to wrap the light emitting diode chips 302 is connected to the planar bottom 305 of the flat-bottomed concave cup 304 . After a plurality of light-emitting diode chips 302 are arranged on the flat bottom 305 of the flat-bottomed concave cup 304 on the front of the printed circuit board 300, the output terminal 312 on each light-emitting diode chip 302 is coupled with the electrode 314 on the printed circuit board 300 by a bonding wire 316, and the coupling For example, using a wire bonder, the output terminal 312 and the electrode 314 are respectively used as the first welding point and the second welding point, and the welding wire 316 is pressure-welded to the output terminal 312 and the electrode 314 by means of ultrasonic vibration. Finally, the glue sealing step is performed, and the LED chip 302 is fixed on the flat bottom 305 of the flat concave cup 304 with the glue 318 . The flat-bottomed concave cup 304 on the back of the printed circuit board 300 is used to configure one or more control chips 320 .

The above-mentioned control chip 320 can control the luminous intensity or flicker frequency of a plurality of LED chips 302, and the control chip 320 can make the LED chips controlled by it present various changes, such as controlling the flicker frequency of the LED chips 302 to present different The visual effect, while the LED chips 302 of different colors controlled by the control chip 320 can present different color changes. The difference in color of the light emitting diode chip 302 is combined with the luminous intensity and flicker frequency controlled by the control chip 320 , so that the overall presentation is varied. In addition, in the first embodiment and the second embodiment, the flat-bottomed concave cups on the printed circuit board can be made into a dot matrix arrangement, so that a plurality of point light sources after packaging can form a surface light source, because the diode chip of the present invention The multi-chip packaging structure presents a very uniform point light source, so it is quite suitable for lighting applications.

In addition, the present invention places multiple light-emitting diode chips on the flat bottom of the same flat-bottomed concave cup, so that the multiple light-emitting diode chips have higher brightness after packaging, which is about three times the known brightness, and the service life of the components It can be increased to about 100,000 hours, and the reliability of the light-emitting diode is increased due to the good heat dissipation path in the present invention.

To sum up, the multi-chip packaging structure of the LED chip of the present invention has at least the following advantages:

1. The multi-chip packaging structure of the light emitting diode chip of the present invention simultaneously arranges multiple light emitting diode chips in the same flat-bottomed concave cup, and the multiple light-emitting diode chips can mix light in the flat bottom concave cup before shooting out, and the light mixing effect is better And it can be applied in lighting.

2. The multi-chip packaging structure of the light emitting diode chip of the present invention arranges multiple light emitting diode chips in the same flat-bottomed concave cup at the same time, which has better packaging integration and makes the size of the multi-chip packaging structure more miniaturized.

3. The multi-chip packaging structure of the light emitting diode chip of the present invention arranges multiple light emitting diode chips in the same flat-bottomed concave cup. Since there is a plug and a heat conduction layer under the flat-bottomed concave cup, a good heat dissipation path can be provided to increase the life of the component .

4. In the multi-chip package structure of light-emitting diode chips of the present invention, the flat-bottomed concave cup structure on the printed circuit board can be manufactured by mechanical processing, so flat-bottomed concave cups of different depths and sizes can be made to configure different numbers of light-emitting diode chips or It is a light-emitting diode chip of different specifications.

5. In the present invention, multiple flat-bottomed concave cups are arranged on the printed circuit board, and each flat-bottomed concave cup is equipped with multiple light-emitting diode chips, and a control chip controls the current flowing through each light-emitting diode chip to control the color presented.

6. The flat-bottomed concave cups on the front and back of the printed circuit board in the present invention can make the back of each chip (including the light-emitting diode chip and the control chip) stick on its flat bottom completely, and there will be no known curved surface in the process of welding wires. The problem of chip breakage caused by the concave cup structure increases the pass rate of the package.

7. Both sides of the printed circuit board in the present invention have a flat-bottomed concave cup structure, and the two flat-bottomed concave cups are used to arrange the light-emitting diode chip and the control chip respectively, so that the thickness after packaging is greatly reduced. In addition, the two flat-bottomed concave cups are connected by one or more conductor plugs, which can provide a very good heat conduction path.

Although the present invention has been described above with an embodiment, it is not intended to limit the present invention. Any person familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the claims.

Claims (12)

1. A multi-chip packaging structure for light-emitting diode chips, characterized in that it includes at least: A printed circuit board, the printed circuit board has a flat-bottomed concave cup, an electrode, a heat-conducting layer and a conductive plug, wherein the flat-bottomed concave cup and the electrode are located on one side of the printed circuit board, and the surface of the flat-bottomed concave cup There is a conductor layer, and the heat conduction layer is located on the other side of the printed circuit board, the conductor plug penetrates the printed circuit board and is connected between the conductor layer and the heat conduction layer; A plurality of LED chips are disposed on a flat bottom of the flat-bottomed concave cup, and each of the LED chips has an output terminal connected to the electrode; and A colloid, the colloid fixes the LED chips in each of the flat-bottomed concave cups. 2 . The multi-chip packaging structure of LED chips according to claim 1 , further comprising a control chip disposed on the heat conduction layer for controlling the LED chips. 3 . 3 . The multi-chip packaging structure of LED chips according to claim 1 , wherein the flat-bottomed concave cup is manufactured by mechanical processing. 4 . 4 . The multi-chip packaging structure of LED chips according to claim 1 , wherein the flat-bottomed concave cup is made by laser drilling. 5 . 5 . The multi-chip packaging structure of LED chips as claimed in claim 1 , wherein the conductor layer is made of copper metal. 6 . 6 . The multi-chip packaging structure of LED chips as claimed in claim 1 , wherein a material of the conductor plug includes copper metal. 6 . 7. A light-emitting diode light source, characterized by: at least comprising: A printed circuit board, the printed circuit board has a flat-bottomed concave cup, an electrode, a heat-conducting layer and a conductive plug, wherein the flat-bottomed concave cup and the electrode are located on one side of the printed circuit board, and the surface of the flat-bottomed concave cup There is a conductor layer, and the heat conduction layer is located on the other side of the printed circuit board, the conductor plug penetrates the printed circuit board and is connected between the conductor layer and the heat conduction layer; A printed circuit board, the printed circuit board has a plurality of flat-bottomed concave cups, and the flat-bottomed concave cups correspond to a plurality of electrodes, a heat conduction layer and a conductive plug respectively, wherein the flat-bottomed concave cups and the electrodes are located on the printed circuit board One side of the circuit board, and the surface of each of the flat-bottomed concave cups has a conductor layer, and the heat conduction layers are arranged on the other side of the printed circuit board, and the conductor plugs penetrate the printed circuit board and are connected to the printed circuit board between the conductor layers and the heat conduction layers; A plurality of light-emitting diode chips are arranged on a plane bottom of each of the flat-bottomed concave cups, and each of the light-emitting diode chips has an output terminal connected to the electrodes; and A colloid, the colloid fixes the LED chips in each of the flat-bottomed concave cups. 8. The light emitting diode light source according to claim 7, further comprising at least one control chip or a control circuit disposed on the heat conducting layers for controlling the light emitting diode chips. 9. The LED light source as claimed in claim 7, characterized in that: the flat-bottomed concave cup is made by mechanical processing. 10. The LED light source as claimed in claim 7, wherein the flat-bottomed concave cup is made by laser drilling. 11. The light emitting diode light source as claimed in claim 7, wherein the material of the conductor layer includes copper metal. 12. The light emitting diode light source as claimed in claim 7, wherein the conductor plug is made of copper metal.

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