CN1480010A - Ultra-thin condenser microphone device and assembly method thereof - Google Patents

Abstract

The present invention relates to the ultra/thin type condenser micriphone assembly and method for assembling the same. The present invention unifies the microphone assembling process into a process of accumulating independent and individual components such as adiaphragm assembly, a spacer ring, the second base ring, a dielectric plate, the first base ring a PCB and so forth. According toa preferred implementation of the present invention, dielectric plates and base rings are not subject to any deformation or other damage caused by press fitting process. Furthermore, the final ultra-thin type condenser microphone may be manufactured with a high productivity and may have significantly improved quality. Thepresent invention naturally integrates dielectric plates and baserings, as independent and individual components, with other structures without any press fitting assembly process. As a result, the high quality of the final ultra-thin type microphone assembly may be maintained.

Description

Ultra-thin condenser microphone device and assembly method thereof

technical field

The present invention relates to a microphone, such as a condenser microphone. In particular, the present invention relates to an ultra-thin condenser microphone device through which the mass production rate is greatly improved because the assembly process of certain components (for example, the insulating plate and the base ring) has been greatly improved. and quality.

Background technique

Recently, with the rapid development of technologies related to communication devices such as telephones or portable phones, and audio devices such as loudspeakers, the demand for microphones that convert sound energy into electrical energy has also increased.

Conventional microphones used for this purpose, such as a condenser microphone, are disclosed in detail in many patents, such as U.S. Patent No. 5,490,220 "Solid State Condenser Microphone Device", U.S. Patent No. 5,870,482 "Miniature Silicon Condenser Microphone ", US Patent No. 6,088,463 "Solid State Silicon Substrate Condenser Microphone", Japanese Patent No. 1999-266,499 "Dielectric Condenser Microphone", Japanese Patent No. 1999-88989 "Dielectric Condenser Microphone", 2000-19963 Korean Patent No. "Condenser Microphone for Mobile Radio Communication Terminals", Korean Patent No. 1999-55502 "Condenser Microphone", etc.

Conventional condenser microphones generally consist of a printed circuit board ("PCB") on which a series of electrical patterns are formed, a vibrating plate positioned on the PCB and vibrating under the action of sound waves entering from the outside, a An insulating plate arranged at a distance from the vibrating plate, and a container capable of accommodating all said components, ie, the PCB, the vibrating plate and the insulating plate.

As shown in Korean Patent No. 2000-12516 "Insulation Ring and Mounting Method of Condenser Microphone", for example, an insulation plate is tightly wound by a base ring group including "a metal base ring and an insulating base ring" , and securely placed in a container. Due to the placement of the base ring set, a rear cavity of defined size is formed between the PCB and the insulating plate.

Here, since "the gap between the vibrating plate and the insulating plate" and "the rear cavity between the PCB and the insulating can greatly affect the overall performance of the microphone. Therefore, considerable effort has been devoted to the study of the gap and the posterior cavity structure. For example, research is often conducted to precisely adjust parallelism.

Generally, a conventional microphone having the above-mentioned structure is assembled through a series of processes such as "the process of installing an insulating plate and a base ring group into the device by press-fitting", "inserting the insulating plate/ The base ring device, and the process of sequentially loading the PCB, the insulating plate/base ring device, and the vibrating plate into the container".

However, if the insulating plate and the base ring set are combined through a series of press-fitting processes, a certain amount of pressing force will inevitably be applied at the junction of the insulating plate and the base ring set, while the insulating plate and the base ring set Under the action of the transmitted pressing force, deformation will inevitably occur. At the same time, each connecting part of the insulating plate and the base ring group will be torn and damaged by the pressing force.

In addition, since the insulating plate and base ring set are usually very small, even a small machining error during the press fit process can cause serious problems for these parts to be damaged.

As mentioned earlier, the "gap formed between the vibrating plate and the insulating plate" is located on the main propagation path of sound waves entering from the outside, thus greatly affecting the overall performance of the microphone. Therefore, if the insulating plate and the base ring are deformed or broken so that, for example, the parallelism of the "gap formed between the vibrating plate and the insulating plate" is Damaged by the action of the microphone, the performance and productivity of the final microphone will be reduced.

Also, as explained earlier, if the "insulating plate and base ring set" form a single unit through a series of press-fit processes, then the two base rings that form the base ring set, that is, the "metal base ring and insulating The base circle", will inevitably be tightly connected together. In this case, an unstable press fit may be created between the insulating plate and the base ring, so that the insulating plate of the final microphone unit is not flat on the "rear cavity formed by the base ring set" and will move toward the Tilt left or right. The result is that the parallelism of the insulating plates is broken, and the performance and productivity of the final microphone are inevitably reduced.

Furthermore, as described above, if the base rings forming the base ring group are connected to each other, the inner space of the rear cavity formed by the base ring group may be closed. Therefore, it is impossible for the pressure in the inner space of the rear cavity to equalize with the surrounding air. Therefore, the frequency characteristics of the final microphone device are severely deteriorated.

In order to assemble the microphone as a self-contained assembly unit, as described earlier, such as "the process of installing an insulating plate and a base ring set into the device by press-fitting" and "inserting the insulating plate between the PCB and the vibration plate" / base ring device, and the process of loading the PCB, insulating plate / base ring device and vibration plate into the container in sequence" will be carried out separately. In this case, the assembly line inevitably splits into two lines. Therefore, the number of steps required will increase, thereby severely lowering productivity.

Contents of the invention

The object of the present invention is to mount an insulating plate and base ring together with other structures to form a complete microphone unit, thus eliminating the conventional press-fit installation of an "insulating plate and base ring" from the general assembly line of the microphone, This prevents "deformation of the insulating plate" or "damage of the insulating plate and base ring" that may occur during the press fit.

Another object of the present invention is to prevent "deformation of the insulating plate" or "damage of the insulating plate and the base ring" that may occur during the previously performed press fit and "slit" parallel, enabling the resulting ultra-thin condenser microphone to maintain high performance and high productivity.

Another object of the present invention is to form a gap of defined size between two base rings, for example, a metal base ring and an insulating base ring, when the insulating plate and the base ring are in an independent single state, It is connected with other structures to prevent the parallelism of the insulating plate from being deteriorated due to the tight combination of the base ring, so the height of the insulating plate can be kept parallel on the "rear cavity formed by the base ring group", and the rear A stable airflow path is formed between the internal space of the internal cavity and the external environment.

Another object of the present invention is to improve the final airflow by keeping the height of the insulating plate parallel on the "rear cavity formed by the base ring group" and forming a stable airflow path between the inner space of the rear cavity and the external environment. Frequency characteristics and productivity of an ultra-thin condenser microphone.

Another object of the present invention is to unify the conventional two-step assembly process including "press fit process" and "fitting process" into a single-step assembly process in which each component is installed sequentially, thereby The assembly line for the slimline microphones is integrated into one line, which greatly improves the productivity of the final slimline condenser microphones.

The objects and characteristics of the present invention will be made clearer by describing preferred embodiments of the present invention with reference to the accompanying drawings.

In order to achieve the above-mentioned goals, the present invention provides a method for assembling an ultra-thin condenser microphone, including the operation of installing a vibrating plate on the bottom plate of the container; The process of installing the second base ring so that it contacts the inner wall of the container; the process of installing an insulating plate inside the second base ring so as to form a defined gap on the vibration plate through the isolation ring ; the process of installing the first base ring on the insulating board so as to form a certain gap on the second base ring, and the process of installing the PCB on the first base ring.

In addition to the method of assembling an ultra-thin condenser microphone according to the present invention, according to the present invention, an ultra-thin condenser microphone device comprising a container, a vibrating plate, an insulating plate, a first base ring, a second base ring, and a PCB Will be explained below. Unlike the conventional case, in this case a gap of defined size is formed between the first and the second base ring.

Brief description of the drawings

FIG. 1 illustrates the assembly process of an ultra-thin condenser microphone device according to the present invention.

Fig. 2 is a combination diagram of an ultra-thin condenser microphone device according to the present invention.

Fig. 3 is an enlarged view of the second base ring of an ultra-thin condenser microphone device according to the present invention.

Detailed ways

Reference will now be made in detail to the preferred structure of the ultra-thin condenser microphone device of the present invention and its method of assembly, which are illustrated in the accompanying drawings.

As shown in Figure 1, the ultra-thin condenser microphone device (10) of the present invention comprises: a cylindrical container (1) with a combination of a series of sound wave inlets and vibrating plate devices (11), an isolation ring (4 ), the second base ring (7), an insulating plate (5), the first base ring (6) and a PCB (9), which are placed in the container (1) in turn and loaded into the The inner space of the container (1). In this case, the vibrating plate arrangement (11) consists of a combination of a pole ring and a vibrating plate.

When these components are loaded into the inner space of the container (1), first, a vibrating plate unit (11) is installed on the bottom of the container (1).

Then, an isolation ring (4) is installed around the vibrating plate device (11), and subsequently, a second base ring (7) is installed around the isolation ring (4), so that the second base ring ( 7) Contact with the inner wall of the container (1).

In the present invention, a circular insulating plate (5) is then mounted around the spacer ring (4) within the second base ring (7). A gap of defined size is thus maintained between the insulating plate (5) and the vibrating plate (3) via the spacer ring (4).

After the above process, the vibration plate device (11), the isolation ring (4), the second base ring (7) and the insulation plate (5) are all loaded into the container (1), the first base ring (6) is installed around the insulating plate (5) in the second base ring (7). Here, as shown in Figure 1, because the diameter of the second base ring (7) is larger than that of the first base ring (6), if the first base ring (6) is installed on the Around the insulating plate and placed inside the second base ring (7), a gap of definite size will naturally be produced.

Thereafter, a PCB (9) is mounted around said first base ring (6). Then, the sides of the container (1) are bent towards the PCB (9) to seal the inner space of the container (1). As a result, the ultra-thin condenser microphone device of the present invention is completed.

As previously explained, in the present invention, the single elements of the ultra-thin condenser microphone, that is, the vibration plate device (11), the isolation ring (4), the second base ring ( 7), the insulating plate (5), the first base ring (6) and the PCB (9) are installed in sequence in an independent state to form a final ultra-thin condenser microphone device (10). This method of installation was not used in the previous process.

In traditional microphones, the process of installing an ultra-thin condenser microphone includes two processes. The first process is "the process of installing an insulating plate and a base ring group into the device by press-fitting", and the second process is "in the The process of inserting the insulating plate/base ring device between the PCB and the vibration plate, and sequentially loading the PCB, the insulating plate/base ring device and the vibration plate into the container”.

In this conventional method, the "insulation plate" and the "joint where the base ring and the insulation plate are connected" are deformed or damaged due to a series of press-fit processes for installing the "insulation plate and base ring set". Therefore, the parallelism of the vibrating plate and the insulating plate cannot be strictly ensured, thus causing serious problems such as uneven parallelism of the gap between the vibrating plate and the insulating plate. At the same time, since the overall process flow is divided into "press-fit process" and "fitting process", the productivity and quality of the final ultra-thin condenser microphone will be greatly reduced.

On the contrary, according to the present invention, since the installation process of the ultra-thin condenser microphone is unified into "one installs a single independent element: a vibrating plate (11), an isolation ring (4), a second base ring (7), an insulating plate (5), the process of the first base ring (6) and a PCB (9), the insulating plate (5) is not easy to produce any deformation and damage under the press fit. As a result, the final ultra-thin condenser microphone (10) has a gap with high parallelism on a certain plane, so the productivity and quality of the ultra-thin condenser microphone are effectively improved.

As shown in Figure 2, according to the present invention, the ultra-thin condenser microphone (10) assembled by the aforementioned process has this structure, wherein a vibrating plate device (11), a spacer ring (4), a second base ring ( 7), an insulating plate (5), a first base ring (6) and a PCB (9), etc. are sequentially packed into a cylindrical metal container (1) with many sound wave inlets.

In this case, a gap G1 of a definite size is formed between the vibration plate (3) and the insulating plate (5) by the isolation ring (4), and the gap G1 is placed in the sound wave The main propagation path of the flow through the sound wave inlet (1a) therefore has a great influence on the overall performance of the ultra-thin condenser microphone. Of course, compared to conventional condenser microphones, the condenser microphone according to the present invention can maintain better parallelism than conventional condenser microphones because the gap G1 is not affected by the press-fitting process. Here, the vibrating plate (3) and the insulating plate (5) are installed separately relative to the gap G1 to form a capacitive structure.

Here, the container (1) is made of aluminum (Al), the pole ring (2) is made of copper plated with nickel (Ni), and the spacer ring (4) is made of PET with a thickness of about 35 microns to 45 microns. (Polyethyleneterephtalate) film.

Meanwhile, as shown in FIG. 2, the vibrating plate (3) has a structure in which gold (Au) or nickel (Ni) coating of about 2.5 to 3.5 microns is on the PET film (3a). The insulating plate (5) placed apart from the vibrating plate (3) by the gap G1 has a structure in which a FEP (fluorinated ethylene propylene) film layer (5a) and gold (Au) or nickel A (Ni) coating (5b) is on the surface of the copper sheet (5c) and another gold (Au) or nickel (Ni) coating (5d) is on the other side of the copper sheet (5c).

The first base ring (6) supports the insulating plate (5) and is electrically connected with the PCB (9). The second base ring (7) wraps around the first base ring (6) and is in contact with the inner wall of the container (1). Here, the first base ring (6) is made of copper sheet containing gold and the second base ring (7) is made of glass container containing plastic material.

When FET (Field Effect Transistor) (8), capacitor etc. are loaded into, the PCB (9) electrically connected with the first base ring (6) also includes installing the first base ring ( 6) The formed rear cavity (9a). The rear cavity (9a) installed on the main path of sound waves passing through the sound wave inlet (1a) of the container (1) has a great influence on the overall performance of the ultra-thin microphone (10).

As mentioned earlier, unlike the traditional complicated press-fit process, according to the present invention, the ultra-thin condenser microphone is installed only by sequentially performing the following process, "Installing the second base on the circumference of the spacer ring (4) circle (7)", "the process of installing the insulation plate (5) on the circumference of the spacer ring (4) in the second base circle (7), "the insulation plate (5) in the second base circle (7) The process of installing the first base ring (6) with a smaller diameter than the second base ring (7) around the surrounding area." Therefore, after completing these installation processes, as shown in Figure 2, between the first base ring (6) and the second base ring (6) A gap G2 is formed between the two base rings (7).

Because in this case, if there is no press fit process of the respective base rings (6, 7) to form the gap G2, the vibrating plate (3), insulating plate (5) etc. are not affected by the press fit process. Therefore, a certain level of parallelism can be guaranteed. In this case, as shown in FIG. 2, the insulating plate (5) forming the final microphone unit (10) can be kept horizontal on the rear cavity (9a). Therefore, the frequency characteristics and productivity of the ultra-thin condenser microphone (10) according to the present invention can be greatly improved.

Meanwhile, when the gap G2 is formed as described above, the air in the rear cavity (9a) quickly flows outward through the airflow path shown in FIG. 2 . Therefore, the air in the rear cavity (9a) and the outside air maintain a stable correspondence. Thus, the final ultra-thin condenser microphone (10) according to the present invention can have good frequency characteristics to a certain level.

As shown in Figure 3, a certain number (for example, 3) of venting grooves (7a) are provided on the side of the second base ring (7), and the venting grooves are closed to the container (1). Because the exhaust groove (7a) forms another exhaust passage together with the gap G2, the exhaust passage is from the "inside of the rear cavity" to the gap of the exhaust groove (7a) and the entrance of the sound wave. (1a) By extension, when these exhaust grooves are provided, the air in the rear cavity (9a) can be easily exhausted to the outside.

In the ultra-thin condenser microphone device (10) according to the present invention, if a certain sound wave, for example, the user's voice, enters from the sound wave inlet (1a) of the container (1), under the action of the sound wave, the vibrating plate (3) Vibrate at a certain rate.

As mentioned above, if the vibrating plate (3) starts to vibrate, the gap G1 between the vibrating plate (3) and the insulating plate (5) changes at a certain speed due to the vibration. Then, the capacitance between the vibrating plate (3) and the insulating plate (5) also changes according to the change of the gap G1. Accordingly, the potential of the insulating plate (5) changes rapidly corresponding to the sound wave.

Then, when the changing value of the potential of the insulating plate (5) as described above is transmitted to the FET (8) in the PCB (9) through the first base ring (6), the FET (8) is The current value will be amplified and output to the outside world. As a result, the ultra-thin condenser microphone device (10) according to the present invention realizes the inherent function of converting sound waves input through the sound wave inlet into electrical signals and amplifying them. Industrial Applicability

As explained in detail above, the assembly process of the ultra-thin condenser microphone according to the present invention can be integrated as a separate unit for installing the vibrating plate assembly, isolation ring, second base ring, insulating plate, first base ring and PCB. process.

According to the present invention, the insulating plate and the base ring are not easily deformed or damaged during the press fit process. Therefore, vibration plates, insulating plates, etc. can strictly guarantee the parallelism. Therefore, the ultra-thin condenser microphone device according to the present invention can improve a certain level of productivity and quality.

Meanwhile, in the present invention, the insulating plate and the base ring are assembled together with other structures in an independent single state, thereby forming the final ultra-thin condenser microphone device according to the present invention without "press-fit assembly process" .

According to an embodiment of the present invention, a series of gaps capable of venting air in the rear cavity may naturally be formed between the first base ring and the second base ring. Therefore, the air pressure in the rear cavity and the outside air can be kept the same. Therefore, the ultra-thin condenser microphone device according to the present invention can maintain high quality to a certain level.

Claims (3)

1. ultra-thin type capacity microphone device comprises:

A hydrostatic column forms serial sound wave inlet on hydrostatic column;

Be installed in the disc oscillating plate in the described container, under the effect of the sound wave that enters by described sound wave inlet, oscillating plate produces vibration;

Be installed in the disc insulation board in the described container, insulation board and described oscillating plate keep certain slit;

Support first base ring of described insulation board;

When twining described first base ring and contacted second base ring of described internal tank; And

Be installed in the PCB in the described container, PCB has a series of electrical models, contacts and have a rear cavity that is formed by described first base ring and described insulation board in described slit with first base ring is electric, it is characterized in that:

Between described first base ring and described second base ring, form the slit of certain size.

2. according to the ultra-thin type capacity microphone device of claim 1, it is characterized in that also having a plurality of air discharge ducts to be installed on the edge of described second base ring towards described container.

3. method that ultra-thin type capacity microphone is installed comprises following operation:

Oscillating plate is installed in bottom surface at container;

On described oscillating plate, shading ring is installed, second base ring is installed then, thereby second base ring can be contacted the inwall of described container on described shading ring;

Fitting insulating panels in described second base ring, thus the slit of certain size on described oscillating plate, formed by shading ring;

First base ring is installed on described insulation board, thereby on second base ring, is formed the slit of certain size;

On described first base ring, PCB is installed; And

Seal the inside of described container.

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