CN1332285C - Radiating system for four-path frame server - Google Patents

Abstract

The invention relates to a heat dissipation system for a four-way rack server, comprising a radiator installed on a processor; a chassis body with ventilation holes on the front and rear panels; a partition installed in the middle of the chassis body; An axial flow fan group is installed on the top; an air guide cover is arranged between the main board in the rear box of the chassis and the upper case cover of the chassis, and the radiator is installed in the air guide cover. The air inlet of the air guide cover is wider than the air outlet at the other end ; and an air duct partition is installed in the front box body of the chassis, one end of which is connected to the air inlet of the air guide hood, and the other end is connected to the front panel of the chassis, and the chassis is divided into two parts by the air duct partition and the air duct Adjacent isolated vertical ducts. Prevent the concentration of hot spots through the reasonable layout of the equipment in the chassis, and take measures to enhance the air convection inside and outside the chassis to reduce the heat accumulation in the chassis caused by insufficient convection inside and outside the chassis; by isolating the air duct, reduce the mutual influence between devices, Thereby making the whole cooling system more effective.

Description

A cooling system for a four-way rack server

technical field

The invention relates to a computer cooling system, in particular to a cooling system for a four-way rack server.

Background technique

A rack server is a server whose appearance is designed according to a unified standard and used in conjunction with a cabinet. The width of the rack server is 19 inches, and the height is in U (1U = 1.75 inches = 44.45 mm). There are usually several standard servers such as 1U, 2U, 3U, 4U, 5U, 6U, and 7U. The size of the cabinet also adopts common industrial standards, usually ranging from 22U to 42U; there are detachable sliding brackets in the cabinet according to the height of U, and users can flexibly adjust the height according to the height of their own servers to store servers, hubs, and disks. Array cabinets and other network devices. Rack servers allow users to place a large number of servers in a limited space, and can easily provide high-density computing power, high bandwidth and system redundancy, and good scalability. These features make rack servers widely used.

In order to increase the density of the arrangement, it is generally desirable that the size of the server be as small as possible, especially in space-sensitive cluster systems and when server hosting is required. However, the reduction in space has brought obstacles to the design of the heat dissipation system. At present, the four-way servers using processors with a main frequency above 1GHz in the market basically use 4U or higher chassis. Especially for Opteron (a processor brand of American AMD company), which generates a lot of heat, the design of the 2U chassis cooling system is undoubtedly a difficult problem.

The traditional technology uses a radiator with a fan to dissipate heat for the chip with a large amount of heat. When the chassis is small, the wind pressure generated by the fan on the radiator will have a negative impact on the convection inside and outside the chassis. When the internal and external strength of the chassis is insufficient, The heat generated by the radiator is accumulated in the chassis, which increases the temperature in the chassis, and the high temperature in the chassis in turn affects the cooling effect of the radiator.

Whether the server cooling system is effective or not plays a decisive role in the stable operation of the entire system. Practical experience shows that many system failures are directly or indirectly related to system heat dissipation.

Contents of the invention

The purpose of the present invention is to overcome the defects of the above-mentioned existing four-way rack server cooling system, in order to improve the heat dissipation effect of the four-way rack server, and make the whole system run stably; thereby providing a cooling system for the four-way rack server .

In order to solve the above-mentioned technical problems, the present invention provides a cooling system for a four-way rack server, which includes a radiator installed on the processor, and is characterized in that it also includes a chassis body with ventilation holes on the front and rear panels, a Installed in the middle of the chassis body, separating the chassis body into front and rear cabinet partitions, an axial flow fan group mounted on the partition, a wind guide cover and an air duct partition, the There are corresponding ventilation holes on the partition plate; wherein, an air guide cover is arranged between the main board in the rear box body of the chassis and the upper case cover of the case, the radiator is installed in the air guide cover, and the air guide cover The air inlet of the hood is wider than the air outlet at the other end; and an air duct partition is installed in the front box body of the chassis, one end of which is connected to the air inlet of the leftmost wind guide hood, and the other end is connected to the front panel of the chassis connected; the chassis is divided into two adjacent and isolated longitudinal air ducts by the air duct partition and the air guide cover.

In the above solution, there is at least one axial fan in one of the air ducts.

In the above solution, there are N axial flow fans in another air duct of the air duct.

In the above solution, the inlet of one end of the wind guide hood close to the installation of the N axial fans is wider.

In the above solution, the radiator located at the end of the air duct has a larger heat dissipation area.

In the above solution, the heat sink is a metal heat sink, four metal heat sinks are arranged in a staggered manner, and the fins of the metal heat sink are parallel to the wind direction.

The air guide cover is Y-shaped, trumpet-shaped or an exhaust cover with any air inlet wider than the other end air outlet, etc.

In the above solution, a vertical partition is also included, and the vertical partition is installed in the middle of the air guide cover.

In addition, the present invention also provides a cooling system for a four-way rack server, including a heat sink installed on the processor; a chassis body with ventilation holes on the front and rear panels; one piece is installed in the middle of the chassis body, and the The chassis body is divided into front and rear partitions; an axial flow fan group is installed on the partition; a wind guide is arranged between the main board in the rear cabinet of the chassis and the upper case cover of the chassis. The radiator is installed in the air guide cover, the air inlet of the air guide cover is wider than the air outlet at the other end; The air inlet of the hood is connected, and the other end is connected with the front panel of the chassis to prevent the airflow from the left air duct from entering the right air duct. The chassis is divided into two adjacent and isolated longitudinal air ducts by the air duct partition and the air guide cover. When N air guide covers are used, the right air duct is divided into N sub-air ducts in the rear box.

It can be seen from the above that in the heat dissipation system of the present invention, all the axial fans push the airflow to flow in one direction along the air duct, and at the same time, sufficient ventilation holes and the installation method of the heat sink ensure that the resistance in the air duct is very small, Thereby, a better convection effect can be obtained, and the problem of high overall temperature in the chassis caused by insufficient convection inside and outside the chassis can be solved. In addition, the air guide cover can maintain the high wind pressure output by the axial flow fan group, thereby enhancing the heat dissipation effect of the processor heat sink located in it; the air guide cover and the air duct partition form a separate air channel, reducing the heat dissipation of the processor. Effects on other components in the chassis.

Description of drawings

Fig. 1 is the top view of the cooling system of a kind of four-way rack server of the present invention installed in the four-way server cabinet;

FIG. 2 is a three-dimensional structural schematic diagram of a cooling system for a four-way rack server of the present invention installed in a four-way server chassis.

In the above figures, the same number marks represent the same components, where 1 is the heat sink of the four processors; 5 is the air guide cover; 6 is the axial fan group; 8 is the switching power supply; 9 is the PCI slot; 10 11 is the rear panel of the chassis, and there are sufficient ventilation holes on both panels; 12 is the air duct partition; 13 is the main board; 14 is the airflow direction in the right air duct; 15 is the airflow direction in the left air duct ; 16 is the chassis casing; 17 is the hard disk; 18 is the motherboard chipset; 19 is the clapboard. 20 is the central processing unit, and in this example, four AMD Opteron processors are used, and the operating frequency is 2.2GHz; the dotted line marked at 24 is the projection of the air guide cover on the motherboard, that is, the assembly position of the air guide cover; 25 is an air guide cover; 32 and 33 are respectively the cover plates of the front and rear two casings of the chassis.

Detailed ways

Referring to accompanying drawings 1 and 2, the front panel 10 and the rear panel 11 of the chassis body 16 of the 2U chassis are covered with ventilation holes, the chassis is divided into two front and rear boxes by a partition 19, and the axial flow fan group 6 is installed on this partition. At the installation position of the axial flow fan, the partition plate is provided with corresponding ventilation holes to allow the air flow to pass through. The front box body is divided into two air passages of the left air passage 15 and the right air passage 14 by the air duct dividing plate 12 . Power supply 8 is installed in the left air passage of front casing, and equipment such as optical drive, hard disk 17 is installed in the right air passage.

Motherboard 13 and PCI slot 9 are installed in the rear casing. Wind guide cover 5 is horn-shaped, is made of insulating material. The bell mouth of the air guide cover is an inlet, and a plurality of axial flow fans are installed at the inlet. The air guide duct formed by the air guide cover and the main board 13 continues the right air duct, and the heat sink 1 installed on the processor 20 is located therein, and the fins of the heat sink are parallel to the airflow direction 14 driven by the axial flow fan. The four heat sinks are arranged in a parallelogram, and the size of the heat sink near the fan end is smaller than that of the other end. Looking from the direction of the axial flow fan to the radiator, it can be found that the horizontal surface in the entire air guide cover is covered with fins of the radiator.

The part other than the air guide cover of the rear box is the left air duct, and at least one axial flow fan is installed on the box partition. The airflow 15 of the left air passage is discharged from the chassis through the motherboard chipset 18 and the PCI slot 9 .

The dotted line marked by 24 is the projection of the windshield 25 on the motherboard 13, that is, the assembly position of the windshield 25. The radiators 1 of the four processors are all located in the windshield 25, and the height of the windshield 25 is slightly higher. As for the radiator 1, one end of the air guide cover 25 is fixed on the partition plate 19 through a buckle, and the other end is fixed on the rear panel 11, leaving a small amount of space between the air guide cover 25 and the main board 13; 32 and 33 are chassis Covers for the front and rear cabinets.

Accompanying drawing 2 is the three-dimensional structural diagram of the heat dissipation system of the 2U chassis, which clearly shows the positional relationship between the various components.

The present invention is a solution considered holistically. First of all, the layout of the equipment in the chassis is uniformly planned to prevent the concentration of heating points, and then two air paths are separated by the air guide cover and the air duct partition to separate different heating equipment, and then through a group of axial flow placed in the middle of the chassis The fan pushes the air convection inside and outside the chassis, so as to achieve the best cooling effect.

In the present invention, the inside of the cabinet is divided into front and back two cabinets, and the front cabinet is used to put equipment such as power supply, hard disk, optical drive; component interconnection). The heat dissipation system is composed of partitions, axial fans, radiators, wind guides, air duct partitions, and chassis boxes. The front panel and rear panel of the chassis box have sufficient ventilation holes. The air duct partition and the air guide cover divide the chassis into two left and right air ducts: the left air duct mainly passes through the switching power supply, motherboard chipset and external PCI card; the right air duct mainly passes through the hard disk, optical drive and processor radiator.

The benefits of split duct design are:

1. Scatter heating equipment to avoid hot spot concentration. In the chassis, the device that generates the most heat is the processor, followed by the switching power supply. Putting them in different air ducts can prevent the heat dissipation of the switching power supply from adversely affecting the heat dissipation of the processor.

2. A relatively sealed air guide duct is formed between the air guide cover and the main board. The high wind pressure generated by the axial flow fan group can be better maintained in the air guide cover, which is suitable for directly discharging the heat of the processor from the chassis. , to reduce the accumulation of heat in the chassis.

3. Isolate the high temperature generated by the processor. The processor is a device that generates serious heat, and it can also work at a higher temperature, while many other devices are more sensitive to temperature, such as clock circuits, and temperature changes are likely to cause frequency drift. If there is no isolated air duct, the heat generated by the processor will cause the overall temperature in the chassis to rise. Even if the processor can work normally at this temperature, other devices may not work properly. After the air duct is separated, two different temperature zones are generated, which reduces the influence of the heat generated by the processor on other devices.

In the entire heat dissipation system, the heat dissipation of the processor is the top priority. Due to space constraints, it is impossible for the four processors to be arranged in a straight line. When placed, the processor placed near the end of the fan will get a lower wind temperature and higher wind pressure, while the heat dissipation of the processor at the back will be higher. The effect will be affected to a certain extent. The present invention uses two methods to reduce this effect:

1. The radiators of the four processors adopt a parallelogram layout, and the wind can blow to the rear radiator through the gap next to the front radiator, so that the rear radiator can also obtain the cold air blown from the fan.

2. The processor placed at the back end uses a larger radiator, which compensates for the negative effects of the reduction in wind pressure and temperature difference through a larger heat dissipation area, so that the processor at the back end can obtain the same level as the processor at the front end. same cooling effect.

The processor's heat sink does not have its own fan, but is driven by a set of axial fans to move the air. Such a design has an additional advantage. When a fan is damaged, although the wind speed generated by the fan group will decrease, the temperature of the processor will not rise sharply to the point where it cannot work or be damaged, so that the processor will not be damaged to a certain extent. Improve the reliability of the cooling system.

The cooling system of the present invention is mainly used for 2U four-way servers. Of course, the cooling system suitable for 2U chassis can also be used for chassis above 2U, but in larger chassis, traditional technology can also meet the requirements. For a 1U chassis, if the area of the heat sink is increased and the power consumption of the processor is limited, the present invention is also applicable. No matter how many U chassis are used, the implementation form of the present invention is the same, only the air guide is changed accordingly height of the shroud and processor heat sink.

The only requirement for the air baffle to fit is to be able to contain the processor's heatsink, the location of the heatsink is determined by the layout of the processor on the motherboard. At present, the design of most motherboards follows the ATX standard. The ATX standard requires that the PCI expansion slot be arranged on the left side of the motherboard. In order to avoid conflicts with the processor heat sink when installing the PCI expansion card, the processor is usually arranged on the other side. That is to say, the wind deflector is usually placed on the right side of the chassis.

Finally, it should be noted that the above embodiments are only used to illustrate and not limit the technical solutions of the present invention, although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: the present invention can still be modified Or an equivalent replacement, any modification or partial replacement without departing from the spirit and scope of the present invention shall fall within the scope of the claims of the present invention. For example, the air guide cover can be decomposed into multiple parts, for example, divided into two parts, each containing two radiators, and the shape of the air guide cover can be changed.

The air guide cover can also be decomposed into multiple parts, for example, when divided into two, each air guide cover contains two processor radiators; After being placed together, the overall shape remains unchanged (like adding a vertical partition in the middle of the original windshield to divide it into left and right halves). The two heat sinks in the windshield are also staggered, and the radiator placed at the back has a larger heat dissipation area.

Claims (7)

1, a kind of cooling system of four road rack servers, comprise the heating radiator that is installed on the processor, it is characterized in that: comprise that also the cabinet casing that is furnished with air vent on the front and back panel, one are installed in described cabinet casing middle part, the dividing plate, one that is separated into forward and backward casing in the cabinet casing is installed in aerofoil fan group on the described dividing plate, one wind scooper and an air channel dividing plate have corresponding air vent on the described dividing plate; Wherein, a wind scooper is arranged between the upper box lid of interior mainboard of described cabinet rear box and cabinet, and described heating radiator is installed in the wind scooper, and the air intake vent of this wind scooper is wideer than other end air outlet; Reach an air channel dividing plate and be installed in the preceding casing of described cabinet, the air intake vent of the described wind scooper of one end and high order end joins, and the other end and case front panel join; Described cabinet is divided into vertical air channel of two adjacent isolation by this air channel dividing plate and described wind scooper.

2, the cooling system of a kind of four road rack servers as claimed in claim 1 is characterized in that, in a described air channel, has an aerofoil fan at least.

3, the cooling system of a kind of four road rack servers as claimed in claim 1 is characterized in that, in described another air channel, N aerofoil fan is arranged; Wherein N is at least 2.

4, the cooling system of a kind of four road rack servers as claimed in claim 1 is characterized in that, described heating radiator is at least 4, and this heating radiator is a metal fin.

5, the cooling system of a kind of four road rack servers as claimed in claim 4 is characterized in that, described metal fin is staggered, and the fin of described metal fin is parallel with wind direction.

6, the cooling system of a kind of four road rack servers as claimed in claim 1 is characterized in that, described wind scooper is the Y shape or is horn shape.

7. the cooling system of a kind of four road rack servers as claimed in claim 1 is characterized in that, also comprises a vertical partition plate, and this vertical partition plate is installed in the middle of the wind scooper.

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