CN115543044A - A kind of server equipment and heat dissipation protection device thereof - Google Patents

Abstract

The application discloses a server device and its heat dissipation protection device, which relates to the technical field of servers. The heat dissipation protection device includes a chassis, an upper cover and a protective cover, wherein a fan and a heat dissipation channel connected with the fan are arranged in the chassis, and the upper cover and the chassis The cover is closed and connected, the protective cover is arranged on the inner side of the upper cover, the protective cover is connected to the chassis, and the protective cover is used to cover at least part of the heat dissipation channel. The above-mentioned heat dissipation protection device is provided with a protective cover on the inner side of the upper cover, and the protective cover covers at least part of the heat dissipation channel, so that when the upper cover is removed, the heat dissipation airflow blown by the fan can flow along the preset heat dissipation channel, thereby ensuring heat dissipation. Increase the time for fan maintenance or replacement. In addition, the protective cover also has the function of protecting electronic components such as the motherboard.

Description

A kind of server equipment and heat dissipation protection device thereof

technical field

The present application relates to the technical field of servers, in particular to a heat dissipation protection device. The present application also relates to a server device with the heat dissipation protection device.

Background technique

As one of the vulnerable parts of the server, the fan plays an important role in ensuring the heat dissipation of the system. When the customer runs the server, if the fan is damaged, it will affect the heat dissipation of the server to a certain extent. If the ambient temperature of the customer's server is just on the edge of the maximum ambient temperature supported by heat dissipation when the fan fails, it may cause downtime due to the overheating protection mechanism of the server itself, which will seriously affect the customer's business.

In the prior art, for a server with an external fan, it is more convenient to replace and maintain the fan, the required maintenance time is shorter and the air duct of the system will not be seriously affected, and the impact on the heat dissipation of the system is greatly reduced. However, for a server with a built-in fan, the maintenance of the fan generally requires removing the upper cover of the chassis before replacing the fan. When the upper cover is removed, the system air duct has been severely damaged. For components that generate large amounts of heat such as CPU is very prone to overheating protection and cause downtime.

Therefore, how to avoid affecting the heat dissipation air passage due to the replacement of the built-in fan is a technical problem to be solved by those skilled in the art.

Contents of the invention

The purpose of this application is to provide a heat dissipation protection device, which can prevent the heat dissipation channel from being damaged when the fan is replaced or maintained, so as to ensure the heat dissipation effect and the stability of the server operation. Another object of the present application is to provide a server device including the above heat dissipation protection device.

In order to achieve the above purpose, the application provides a heat dissipation protection device, including:

A chassis, the chassis is provided with a fan and a cooling channel connected with the fan;

The upper cover is connected to the chassis;

The protective cover is arranged on the inner side of the upper cover and connected to the chassis, and is used to cover at least part of the heat dissipation channel.

In some embodiments, the protective cover is rotatably connected to the case, and the protective cover is used to rotate relative to the case around an axis in a first direction.

In some embodiments, an end of the protective cover away from the fan is rotatably connected to the chassis.

In some embodiments, a baffle is provided inside the chassis, and an edge of the protective cover away from the fan is rotatably connected to the baffle through glued foam.

In some embodiments, the two adhesive foams are distributed along the first direction at intervals.

In some embodiments, an escape groove is provided on the protective cover, and the avoidance groove is used for avoiding the locking structure connected with the upper cover.

In some embodiments, an end of the protective cover close to the fan is detachably connected to the chassis.

In some embodiments, an end of the protective cover close to the fan is fixed to the case by magnetic attraction.

In some embodiments, an end of the protective cover close to the fan is fixed to the case by bonding.

The present application also provides a server device, including the heat dissipation protection device described in any one of the above.

With respect to the above-mentioned background technology, the heat dissipation protection device provided by the embodiment of the present application includes a chassis, an upper cover and a protective cover, wherein a fan and a heat dissipation channel communicating with the fan are arranged in the chassis, and the upper cover is connected with the chassis cover to protect the The cover is arranged on the inner side of the upper cover, the protective cover is connected to the chassis, and the protective cover is used to cover at least part of the cooling channel. In this way, when the fan needs to be maintained or replaced, the upper cover needs to be removed because the upper cover covers the fan. Allows more time for fan maintenance or replacement while compromising heat dissipation. In traditional devices, the upper cover needs to be disassembled when maintaining or replacing the fan. At this time, the heat dissipation channel is destroyed (the heat dissipation channel is exposed as a whole), and the position impedance of the components in the chassis is relatively large. The heat dissipation airflow blown by the fan involved in maintenance or replacement will be lost along the slope with less resistance, affecting normal heat dissipation. Compared with the traditional device, the heat dissipation protection device provided by the embodiment of the present application is provided with a protective cover on the inner side of the upper cover, and the protective cover covers at least part of the heat dissipation channel, so that when the upper cover is removed, the heat dissipation airflow blown by the fan can be guaranteed along the predetermined direction. The flow of the heat dissipation channel is provided, thereby increasing the maintenance or replacement time of the fan while ensuring heat dissipation. In addition, the protective cover also has the function of protecting electronic components such as the motherboard.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present application, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

Fig. 1 is a schematic diagram when the protective cover of the heat dissipation protection device in the embodiment of the present application is opened;

FIG. 2 is a schematic diagram of the heat dissipation protection device in the embodiment of the present application when the protective cover is closed.

in:

1-chassis, 2-protective cover, 21-avoidance groove, 3-fan, 4-partition, 5-adhesive master parts.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

It should be noted that the orientation words such as "upper end, lower end, left side, and right side" mentioned below are all defined based on the drawings in the description.

Please refer to FIG. 1 and FIG. 2, FIG. 1 is a schematic diagram of the heat dissipation protection device in the embodiment of the application when the protective cover is opened; FIG. 2 is a schematic diagram of the heat dissipation protection device in the embodiment of the application when the protective cover is closed.

The heat dissipation protection device provided by the embodiment of the present application includes a chassis 1, an upper cover and a protective cover 2, wherein a fan 3 and a heat dissipation channel communicating with the fan 3 are arranged in the chassis 1, and the upper cover is connected with the chassis 1 to protect the The cover 2 is arranged on the inner side of the upper cover, the protective cover 2 is connected to the chassis 1, and the protective cover 2 is used to cover at least part of the cooling channel.

In this way, when the fan 3 needs to be maintained or replaced, since the upper cover covers the fan 3, the upper cover needs to be disassembled. At this time, the protective cover 2 covers at least part of the cooling channel, which can protect the cooling channel to a greater extent. Thereby allowing more fan 3 maintenance or replacement time without affecting heat dissipation.

It should be noted that, in the traditional device, the heat dissipation channel inside the server is jointly formed by the upper cover and the chassis 1, and the heat dissipation channel communicates with the fan 3. After the fan 3 is started, the heat dissipation airflow flows along the direction in which the heat dissipation channel is set, thereby realizing the Heat dissipation of internal electronic components. It can be understood that, since the upper cover needs to be disassembled when maintaining or replacing the fan 3, the heat dissipation channel is destroyed at this time (the heat dissipation channel is exposed as a whole), and the position impedance of the components in the chassis 1 is relatively large. , the heat dissipation airflow blown by the fan 3 that is not involved in maintenance or replacement will be lost along the oblique upper direction with a smaller impedance, affecting normal heat dissipation.

Compared with the traditional device, the heat dissipation protection device provided by the embodiment of the present application is provided with a protective cover 2 inside the upper cover, and the protective cover 2 covers at least part of the heat dissipation channel, so that the heat dissipation blown out by the fan 3 can be guaranteed when the upper cover is removed. The airflow flows along the preset heat dissipation channel, thereby increasing the maintenance or replacement time of the fan 3 while ensuring heat dissipation.

In addition, the protective cover 2 also has the function of protecting electronic components such as the motherboard.

Of course, according to actual needs, the protective cover 2 can be a protective cover 2 made of polyester film or polyester resin. The protective cover 2 is a plate structure.

In some embodiments, in order to facilitate assembly and maintenance of electronic components inside the server, the protective cover 2 is rotatably connected to the chassis 1, and the protective cover 2 is used to rotate relative to the chassis 1 around an axis in a first direction.

Preferably, the end of the protective cover 2 away from the fan 3 is rotatably connected with the chassis 1 .

It should be noted that the above-mentioned first direction may be the width direction of the chassis 1 or the arrangement direction of the fans 3 . In order to facilitate assembly, a partition 4 or a baffle is arranged along the width direction inside the case 1 , and the end of the protective cover 2 away from the fan 3 is rotatably connected to the top of the partition 4 .

In this way, when parts such as the motherboard or memory need to be replaced, the end of the protective cover 2 close to the fan 3 can be opened, and the end of the protective cover 2 away from the fan 3 can be rotated relative to the chassis 1. On the one hand, the protective cover 2 can be opened and prevent The protective cover 2 is separated from the chassis 1. On the other hand, when closing the protective cover 2, there is no need to re-align the various parts, just turn the protective cover 2 in the opposite direction until the end of the protective cover 2 close to the fan 3 overlaps the fan 3 side.

In some embodiments, an edge of the protective cover 2 away from the fan 3 is rotatably connected to the chassis 1 through rubberized foam.

Specifically, the edge of the end edge of the protective cover 2 away from the fan 3 and the structure of the partition 4 (or baffle) in the chassis 1 are fixed on the outside by using foam with glue, so that not only can it be ensured that the protective cover 2 will not be separated from the chassis 1, Moreover, the rotation of the protective cover 2 relative to the chassis 1 can be realized.

Of course, according to actual needs, the end of the protective cover 2 away from the fan 3 can also be rotatably connected to the baffle or partition 4 on the chassis 1 through a rotating shaft. In this paper, the connection method with glued foam is preferably used.

In some embodiments, the two glued foams are spaced apart along the first direction.

It should be noted that in order to avoid the locking structure inside the chassis 1, the locking structure is used to connect with the upper cover to realize the cover connection between the upper cover and the chassis 1, and the locking structure protrudes from the upper surface of the chassis 1 for Here, an escape groove 21 is provided on the protective cover 2, and the escape groove 21 is used for avoiding the locking structure connected with the upper cover.

The escape groove 21 is located between the two rubberized foams. Of course, in order to match the locking structure, the escape groove 21 is a square groove.

In some embodiments, one end of the protective cover 2 close to the fan 3 is detachably connected to the chassis 1 . In this way, when components such as the motherboard or memory need to be replaced, the end of the protective cover 2 close to the fan 3 can be opened, and the end of the protective cover 2 away from the fan 3 can be rotated relative to the chassis 1 .

In some embodiments, the end of the protective cover 2 close to the fan 3 is fixed to the chassis 1 by magnetic attraction, for example, the protective cover 2 is fixed by using a magnetic suction sub-piece.

Specifically, at the end where the protective cover 2 is close to the fan 3, several magnetic female parts are arranged at intervals along the first direction. 3) to set the magnetic sub-parts, the number of the magnetic sub-parts corresponds to the magnetic parent part one by one, through the suction of the magnetic sub-parts and the magnetic parent part, the protective cover 2 is close to One end of fan 3 is fixed.

In some embodiments, the end of the protective cover 2 close to the fan 3 is fixed to the chassis 1 by bonding, for example, the fixing of the protective cover 2 is realized by using the adhesive sub-piece 5 .

Specifically, at the end of the protective cover 2 close to the fan 3, several adhesive female parts (such as Velcro female parts or Velcro female parts) are arranged at intervals along the first direction. On the shell (for overlapping with the end of the protective cover 2 close to the fan 3) adhesive sub-pieces (such as gluing sub-pieces or Velcro sub-pieces), the number of bonding sub-pieces is the same as that of the bonding parent part one by one Correspondingly, the fixing of the end of the protective cover 2 close to the fan 3 is achieved by bonding the sub-adhesive part and the parent part.

Using the above fixing method to fix the end of the protective cover 2 close to the fan 3 can ensure that the protective cover 2 will not be blown up when the fan 3 is working.

To sum up, in the heat dissipation protection device provided by the embodiment of the present application, a protective cover 2 is added between the bottom of the upper cover of the chassis 1 and the main board components, and the protective cover 2 is fixed above the main board, so that it can be increased when the upper cover is removed. As for the protection of the heat dissipation channel or the heat dissipation air duct, it can also protect the main board.

A server device provided by the present application includes the heat dissipation protection device described in the above specific embodiments; other parts of the server device can refer to the prior art, and will not be elaborated herein.

It should be noted that in this specification, relational terms such as first and second are only used to distinguish one entity from several other entities, and do not necessarily require or imply any such relationship between these entities. Actual relationship or sequence.

The server equipment and the heat dissipation protection device provided by the present application have been introduced in detail above. In this paper, specific examples are used to illustrate the principles and implementation methods of the present application, and the descriptions of the above embodiments are only used to help understand the solutions and core ideas of the present application. It should be pointed out that those skilled in the art can make some improvements and modifications to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims (10)

1. A heat dissipation ensuring device, comprising:

the fan and the heat dissipation channel communicated with the fan are arranged in the case;

the upper cover is connected with the case;

and the protective cover is arranged on the inner side of the upper cover, is connected with the case and is used for covering at least part of the heat dissipation channel.

2. The heat dissipation assurance device of claim 1, wherein the protective cover is rotatably coupled to the housing, the protective cover being configured to rotate relative to the housing about an axis in the first direction.

3. The heat dissipation assurance device of claim 2, wherein an end of the protective cover remote from the fan is rotatably coupled to the chassis.

4. The heat dissipation assurance device of claim 3, wherein a partition is provided in the housing, and an edge of the protective cover at an end remote from the fan is rotatably connected to the partition by a foam tape.

5. The heat dissipation assurance device of claim 4, wherein two of the foam-bearing pieces are spaced apart along the first direction.

6. The heat dissipation assurance device of claim 1, wherein the protective cover is provided with an avoidance groove for avoiding the locking structure connected to the upper cover.

7. The heat dissipation assurance device of any one of claims 1 to 6, wherein an end of the protective cover adjacent the fan is removably attached to the chassis.

8. The heat dissipation assurance device of claim 7, wherein an end of the protective cover adjacent to the fan is magnetically attached to the housing.

9. The heat dissipation assurance device of claim 7, wherein an end of the protective cover adjacent to the fan is adhesively secured to the chassis.

10. A server device characterized by comprising the heat dissipation ensuring apparatus as recited in any one of claims 1 to 9.

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