CN1320607C - Cutting appts. - Google Patents
Cutting appts. Download PDFInfo
- Publication number
- CN1320607C CN1320607C CNB2003101026509A CN200310102650A CN1320607C CN 1320607 C CN1320607 C CN 1320607C CN B2003101026509 A CNB2003101026509 A CN B2003101026509A CN 200310102650 A CN200310102650 A CN 200310102650A CN 1320607 C CN1320607 C CN 1320607C
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- cutting
- suction cup
- partition wall
- suction plate
- area
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
Abstract
一种可防止切削水附着在构成摄象机构的物镜上的切削装置。切削装置包括：保持被加工物，可在切削区域和与其邻接的定位区域移动的吸盘工作台；一面将切削水供给保持在吸盘工作台上的被加工物一面进行切削的切削机构；检测保持在吸盘工作台上的被加工物的要切削的区域的摄象机构；使吸盘工作台在切削进给方向上移动的吸盘工作台移动机，该切削装置具有切削水遮挡机构，该切削水遮挡机构具有隔壁和罩部件，其中隔壁配设在切削区域与定位区域之间，其下端位于吸盘工作台上表面的稍上方，罩部件可与吸盘工作台一起在吸盘工作台的移动方向上移动，配置成其上表面与吸盘工作台的上表面成为大致同一平面。
A cutting device that prevents cutting water from adhering to the objective lens constituting the camera mechanism. The cutting device includes: a suction table that holds the workpiece and can move in the cutting area and the adjacent positioning area; a cutting mechanism that supplies cutting water to the workpiece held on the suction table and cuts; The imaging mechanism of the area to be cut of the workpiece on the suction cup table; the suction cup table moving machine that moves the suction cup table in the cutting feed direction, the cutting device has a cutting water shielding mechanism, and the cutting water shielding mechanism It has a partition wall and a cover part, wherein the partition wall is arranged between the cutting area and the positioning area, and its lower end is located slightly above the upper surface of the suction cup table, and the cover part can move together with the suction cup table in the moving direction of the suction cup table. Make its upper surface become roughly the same plane as the upper surface of the suction cup workbench.
Description
Technical field
The present invention relates to laminal machined objects such as semiconductor wafer are cut the topping machanism of usefulness.
Background technology
As be engaged in this professional people understands, in fabrication of semiconductor device, on the semiconductor wafer surface that roughly is circular plate shape, be divided into several zones, in the zone of this division, form circuit such as IC, LSI with the straight line (cut-out line) that is the clathrate assortment.By along straight line semiconductor wafer being cut off, the zone that just will be formed with circuit is separated and is made one by one semiconductor chip.Cut-out along the straight line of semiconductor wafer is normally undertaken by the topping machanism that is called dicer.This topping machanism has with the lower part: suction plate bench (chuck table), and it is used to keep machined object, is to constitute movably at cutting zone with the locating area of this cutting zone adjacency; Cutting mechanism, it is provided in this cutting zone, and one side will cut water and be supplied with the machined object remain on this suction plate bench, simultaneously cuts; Videotape mechanism, it is provided in this locating area, is used to detect the zone that will cut of the machined object that remains on this suction plate bench; Suction plate bench travel mechanism, it is used for this suction plate bench is moved to this cutting zone from this locating area, and it is moved on the cutting direction of feed.On this topping machanism, in order to keep the cut precision of machined object, when positioning operation, also supply with cutting water, so that can not produce hot flexible because of thermal change moves component parts such as not making cutting mechanism.
On above-mentioned topping machanism, because cutting zone and locating area are in abutting connection with the ground setting, so cutting water videotapes on the object lens of mechanism attached to formation.If cutting water can produce misoperation attached on these object lens during positioning operation.Therefore, operating personnel position the operation that operation all must be cleaned object lens at every turn, become one of reason that reduces productivity ratio.
The present invention In view of the foregoing is developed into, and its major technology problem is to provide the topping machanism that can prevent to cut on water videotapes mechanism attached to formation the object lens.
Summary of the invention
In order to solve above-mentioned major technology problem, the invention provides a kind of topping machanism, this topping machanism comprises: suction plate bench, it is used to keep machined object, is to constitute movably at cutting zone with the locating area of this cutting zone adjacency; Cutting mechanism, it is provided in this cutting zone, is used for one side and will cut water and supply with the machined object remain on this suction plate bench, simultaneously cut; Videotape mechanism, it is provided in this locating area, is used to detect the zone that will cut of the machined object that remains on this suction plate bench; Suction plate bench travel mechanism is used for this suction plate bench is moved to this cutting zone from this locating area, and it is moved on the cutting direction of feed, it is characterized in that,
This topping machanism has cutting water guard mechanism, this cutting water guard mechanism has next door and cap assembly, wherein, the next door is provided between this cutting zone and this locating area, its lower end is positioned at the top slightly of this suction plate bench upper surface, cap assembly is can enough on the moving direction of this suction plate bench to constitute with this suction plate bench movingly, and the upper surface that is adapted to its upper surface and this suction plate bench becomes roughly same plane.
Best, above-mentioned next door is by partition wall and has flexible sealing plate and constitute that the sealing plate is installed on this partition wall, and the lower end is outstanding from the lower ends downward side of partition wall, and best, sealing plate is installed in respectively on the two sides of partition wall.
Topping machanism of the present invention constitutes as described above, has cutting water guard mechanism, this cutting water guard mechanism has next door and cap assembly, wherein, the next door is provided between cutting zone and the locating area, its lower end is positioned at the top slightly of the upper surface of suction plate bench, cap assembly is can constitute movably on the moving direction of suction plate bench with suction plate bench, the upper surface that is adapted to its upper surface and suction plate bench roughly becomes same plane, therefore, by this cutting water guard mechanism, can block cutting water and enter to locating area.Thereby, can prevent to cut water and videotape on the object lens of mechanism attached to formation.
Description of drawings
The axonometric drawing of the topping machanism that Fig. 1 is according to the present invention to be constituted.
Fig. 2 is the major part axonometric drawing of topping machanism shown in Figure 1.
Fig. 3 is mounted in the sectional drawing of the cutting water guard mechanism on the topping machanism shown in Figure 1.
Embodiment
Below, with reference to accompanying drawing, the preferred implementation of the topping machanism that constituted according to the present invention is elaborated.
Fig. 1 is the axonometric drawing of the topping machanism that constituted according to the present invention of expression.
Topping machanism shown in Figure 1 has the device case 1 that is roughly rectangular-shaped.In this device case 1, be equipped with: static chassis 2 shown in Figure 2 with the lower part; Cutting direction of feed, be to be provided in suction plate bench mechanism 3 on this static chassis 2, that keep machined object to use on the direction shown in the arrow X movably; In the index feed direction, be to be provided in main shaft supporting machinery 4 on the static chassis 2 movably on the direction shown in the arrow Y (with the cutting direction of feed, be the perpendicular direction of the direction shown in the arrow X); In the feed direction of feed, be provided in movably on the direction shown in the arrow Z in this main shaft supporting mechanism 4, as the main shaft device 5 of cutting mechanism.
Above-mentioned suction plate bench mechanism 3 has with the lower part: be provided in 2 guide rails 31,32 on the static chassis 2 abreast along the direction shown in the arrow X; Be provided in movably on the direction shown in the arrow X on this guide rail 31,32, as the suction plate bench 33 of machined object maintaining body; Support the suction plate bench supporting device 34 of this suction plate bench 33.This suction plate bench supporting device 34 has with lower member: be provided in the suction plate bench supporting station 341 on the guide rail 31,32 movably; Be provided in the cylinder part 342 on this suction plate bench supporting station 341; Be installed on the upper end of this cylinder part 342 and be provided in bucker 343 from the below of the upper surface specified altitude of suction plate bench 33.Describe with reference to Fig. 3, gyroaxis 35 is provided in the cylinder part of being located on the suction plate bench supporting station 341 342 with freely rotating, and suction plate bench 33 is installed on the upper end of this gyroaxis 35.Gyroaxis 35 usefulness are provided in servomotor driving rotational in the cylinder part 342, not shown.In addition, suction plate bench 33 is connected with not shown attraction mechanism, to attract to keep in the above machined object of mounting, i.e. for example discoid semiconductor wafer.Above-mentioned bucker 343 is set as rectangle, has the hole 343a that inserts logical above-mentioned gyroaxis 35 at central portion, be installed in the mounting flange 342a that is located at cylinder part 342 upper ends above.On the both ends of the surface of the cutting direction of feed X (with reference to Fig. 2) of this bucker 343, the wrinkle device 36,36 (also with reference to Fig. 1) that stretches accordingly with the mobile phase of suction plate bench supporting device 34 is installed.
Get back to Fig. 2 and proceed explanation, the suction plate bench mechanism 3 of illustrated embodiment has driving mechanism 37, is used to make the suction plate bench supporting device 34 of supporting suction plate bench 33 to move on the cutting direction of feed shown in the arrow X along 2 guide rails 31,32.Driving mechanism 37 comprises the male threaded stem 371 that is provided in abreast between above-mentioned 2 guide rails 31 and 32, and is the drive source of the servomotor 372 that drives these male threaded stem 371 revolution usefulness etc.One end of male threaded stem 371 is bearing on the bearing pedestal 373 that is fixed on the above-mentioned static chassis 2 with freely rotating, and its other end is by not shown deceleration device, is in transmission connection with the output shaft of above-mentioned servomotor 372.In addition, male threaded stem 371 is screwed in and is formed at running through in the female threaded hole on the not shown negative thread seat, and this negative thread seat is to be provided with highlightedly below the central portion of the suction plate bench supporting station 341 that constitutes suction plate bench supporting device 34.Therefore, drive male threaded stem 371 with servomotor 372 and rotate and reverse, suction plate bench supporting device 34 is moved on the cutting direction of feed shown in the arrow X along guide rail 31,32.Therefore, 2 guide rails 31,32 and driving mechanism 37 work as the suction plate bench travel mechanism that suction plate bench is moved on the cutting direction of feed.This suction plate bench travel mechanism constitutes like this, can make suction plate bench 33 leave position of readiness shown in Figure 1, moves between locating area A and cutting zone B.In addition, locating area A and cutting zone B adjacency on cutting direction of feed directions X is provided with.
Above-mentioned main shaft supporting mechanism 4 have along the index feed direction shown in the arrow Y be provided in abreast on the static chassis 22 guide rails 41,42 and on the movable support chassis 43 that is provided in movably on the direction shown in the arrow Y on this guide rail 41,42.This movable support chassis 43 is made of the installation portion 432 that is provided in the mobile support portion 431 on the guide rail 41,42 movably and be installed in this mobile support portion 431.Be provided with upwardly extending 2 guide rail 432a, 432a on one side of installation portion 432 abreast in the side shown in the arrow Z.The main shaft supporting mechanism 4 of illustrated execution mode has driving mechanism 44, is used to make movable support chassis 43 to move on the direction shown in the arrow Y along 2 guide rails 41,42.Driving mechanism 44 comprises male threaded stem 441 that is provided in abreast between above-mentioned 2 guide rails 41,42 and the drive sources such as pulse motor 442 that turn round usefulness for this male threaded stem 441 of driving.One end of male threaded stem 441 is bearing in freely rotating and is fixed on the bearing pedestal on the above-mentioned static chassis 2, not shown, and its other end is by not shown deceleration device, be in transmission connection with the output shaft of above-mentioned pulse motor 442.In addition, male threaded stem 441 is screwed in the female threaded hole that is formed on the not shown negative thread seat, and this negative thread seat is arranged on below the central portion of the mobile support portion 431 that constitutes movable support chassis 43 highlightedly.Therefore, drive male threaded stem 441 with pulse motor 442 and rotate and reverse, just can make movable support chassis 43, on the index feed direction shown in the arrow Y, move along guide rail 41,42.
The main shaft device 5 of illustrated execution mode has apparatus support 51, be installed in the collar bush 52 on this apparatus support 51 and be bearing in rotary main shaft 53 on this collar bush 52 pivotally.Apparatus support 51 is provided with 2 velamen guided way 51a, 51a, this is directed to rail and is entrenched in slidably on 2 guide rail 432a, the 432a that are located on the above-mentioned installation portion 432, this is directed to rail 51a, 51a is entrenched on above-mentioned guide rail 432a, the 432a, apparatus support just is being supported on the feed direction of feed shown in the arrow Z movably.Above-mentioned gyroaxis 53 is setting highlightedly from the front end of swivel sleeve 52, and cutting tip 54 is installed in the leading section of this gyroaxis 53.This cutting tip 54 is configured in cutting zone B as shown in Figure 1.The gyroaxis 53 that cutting tip 54 is installed is driven and is turned round by servomotor 55 drive sources such as grade.In addition, in the both sides of cutting tip 54, be equipped with when cutting and will cut the cutting water supply nozzle 57 (in Fig. 2, only having represented a side) that water is supplied with machined object.
Main shaft device 5 in the illustrated embodiment has makes the driving mechanism 56 of retainer 51 along 2 guide rail 432a, 432a mobile usefulness on the direction shown in the arrow Z.Driving mechanism 56 is the same with above-mentioned driving mechanism 34 and 44, comprise the male threaded stem (not shown) that is provided between guide rail 432a, the 432a, with pulse motor 562 drive sources such as grade that drive this male threaded stem revolution usefulness, rotate and reverse by driving not shown male threaded stem, apparatus support 51 and collar bush 52 and rotary main shaft 53 are moved on the feed direction of feed shown in the arrow Z along guide rail 432a, 432a with pulse motor 562.
Be equipped with at the leading section of the collar bush 52 that constitutes above-mentioned main shaft device 5 and videotape mechanism 6.This videotapes mechanism 6 and is made of microscope that formed straight line on semiconductor wafer etc. is videotaped usefulness and CCD gamma camera etc., and the picture intelligence of taking is delivered to not shown controlling organization.Videotape mechanism 6 as shown in Figure 1, be equipped with the 1a of the folding and unfolding portion of mechanism that videotapes in the locating area A that is configured in device case 1.In addition, illustrated topping machanism has indication mechanism 7 as shown in Figure 1, and this indication mechanism is used to show by videotaping image that mechanism 6 takes the photograph etc.
Illustrated topping machanism has cutting water guard mechanism 8 as shown in Figure 3, is used to block the cutting water of supplying with by above-mentioned cutting water supply nozzle 57 and disperses to locating area A, prevents to cut water and videotapes on the microscopical object lens of mechanism 6 attached to formation.This cutting water guard mechanism 8 is made of the next door 81 and the cap assembly 82 that are provided between cutting zone B and the locating area A, and this cap assembly is can go up at the moving direction (left and right directions among Fig. 3) of above-mentioned suction plate bench 33 to set movably with suction plate bench 33.Next door 81 is made of partition wall 811 and the sealing plate 812,812 that is installed in these partition wall 811 both sides.Partition wall 811 is set as rectangular shape, and it has the length dimension bigger than the diameter of suction plate bench 33 (in Fig. 3, perpendicular to the size of paper direction), is provided with the installation portion 811a that bends to the right angle and form in the both sides, top.Sealing plate 812,812 is made of flexible thin-plate members such as rubber, is set as the rectangular shape that has with the same length length dimension of partition wall 811.The lower end than partition wall 811, the lower end of sealing plate 812,812 is installed on the two sides of partition wall 811 highlightedly.Sealing plate 812,812 is pressing plate 813,813 to be provided on sealing plate 812,812 lateral surface separately of being located at partition wall 811 both sides to the structure of installing on the partition wall 811, and is fastening with pressing plate 813,813 with several pins 814,814.The next door 81 of Gou Chenging is provided between cutting zone B and the locating area A like this, and be provided on the direction perpendicular with the moving direction of above-mentioned suction plate bench 33 direction of paper (among the Fig. 3 perpendicular to), its upper end is installed in several mounting screws 851 and is equipped with on the 1a of the folding and unfolding portion of mechanism that videotapes that videotapes mechanism 6.Like this, being installed in the lower end that videotapes sealing plate 812,812 on the 1a of folding and unfolding portion of mechanism, formation next door 81 just is positioned on the position above the upper surface 1-2mm of suction plate bench 33.
The cap assembly 82 that constitutes cutting water guard mechanism 8 is set as rectangular shape, and it has and the width dimensions of the same length in above-mentioned next door 81 size of paper direction (in the Fig. 3 perpendicular to).The central portion of this cap assembly 82 is provided with hole 821, and this hole has the diameter bigger than the diameter of suction plate bench 33, and this hole 821 and suction plate bench 33 loose fits ground are set.In addition, cap assembly 82 has such length dimension, that is, and and in Fig. 3, when cut on the right side, suction plate bench 33 on the position after the mobile total travel on the direction shown in the X1, with above-mentioned next door 81 in opposite directions, and, in Fig. 3, when being positioned in semiconductor wafer on the suction plate bench 33 or when location in the left side, suction plate bench 33 on the position after the mobile total travel on the direction shown in the X2, with above-mentioned next door 81 in opposite directions.The cap assembly 82 usefulness carriages 83 of Gou Chenging are installed on the bucker 343 that constitutes above-mentioned suction plate bench supporting device 34 like this.Like this, being installed in the upper surface that cap assembly 82 on the bucker 343 is positioned at its upper surface and suction plate bench 33 by carriage 83 roughly becomes on the conplane height and position.
The topping machanism that is constituted according to the present invention constitutes as described above, below, its effect is described.
When cutting operation began, suction plate bench 33 was positioned on the position of readiness shown in Figure 1.Semiconductor wafer 9 is positioned on the suction plate bench 33 that is positioned on this position of readiness.Being positioned in the action of semiconductor wafer 9 by not shown attraction mechanism on the suction plate bench 33 is attracted and remains on above the suction plate bench 33.Like this, the suction plate bench 33 that attracts to keep semiconductor wafer 9 moves to locating area A along guide rail 32,32.When suction plate bench 33 is positioned at locating area A, detect formed straight line on the semiconductor wafer 9 (cut-out line) by videotaping mechanism 6, in index direction, be move to regulate main shaft device 5 on the arrow Y direction and carry out accurate contraposition operation.In addition, during positioning operation, under the state of supplying with cutting water, carry out.Its result, though the cutting water that is sprayed from cutter supply nozzle 57 disperses, entering to locating area A blocked in the next door 81 that is configured cutting water guard mechanism 8.That is,, also keep very little gap between the sealing plate 812,812 in formation next door 81 and the cap assembly 82, so block cutting water entering to locating area A even suction plate bench 33 moves.Therefore, cutting water can not videotape on the object lens of mechanism 6 attached to formation.In addition, be installed in respectively on the two sides of partition wall 811,, therefore, prevent to cut the downside of water by sealing plate 812,812 and enter locating area A so play the labyrinth sealed effect owing to constitute the sealing plate 812,812 in next door 81.
After positioning operation as mentioned above like that and finishing, keeping the suction plate bench 33 of semiconductor wafer 9 to move to cutting zone B with attracting, and cutting direction of feed, be to move on the direction shown in the arrow X, like this, the semiconductor wafer 9 that remains on the suction plate bench 33 is cut the cut-out line cutting of cutter 54 along regulation.Promptly, bite 54 is installed in index direction, be direction shown in the arrow Y and direction of feed, be to move on the direction shown in the arrow Z to adjust and on the main shaft device 5 behind the location, carry out high speed rotary (for example 30000rpm) by servomotor 55, so by making suction plate bench 33 along the downside of bite 54, mobile with fixing speed (for example 50mm/sec) on the cutting direction of feed shown in the arrow X, the semiconductor wafer 9 that remains on the suction plate bench 33 just is cut straight line (cut-out line) cutting of cutter 54 along regulation.
During with above-mentioned bite 54 cutting semiconductor wafers 9, cutting water is from the cutting portion of cutting water supply nozzle 57 semiconductor supply wafers 9.Though this cutting water disperses, as mentioned above, the sealing plate 812,812 in next door 81 and cover portion 82 are cut water guard mechanism 8 to entering of locating area A and shelter from so cut water all the time in opposite directions and keep very little gap.Therefore, cutting water can not videotape on the object lens of mechanism 6 attached to formation.
Claims (3)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002312781A JP4216565B2 (en) | 2002-10-28 | 2002-10-28 | Cutting equipment |
| JP312781/02 | 2002-10-28 | ||
| JP312781/2002 | 2002-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1499580A CN1499580A (en) | 2004-05-26 |
| CN1320607C true CN1320607C (en) | 2007-06-06 |
Family
ID=32457579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101026509A Expired - Lifetime CN1320607C (en) | 2002-10-28 | 2003-10-28 | Cutting appts. |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4216565B2 (en) |
| CN (1) | CN1320607C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101402226B (en) * | 2007-10-05 | 2012-10-03 | 株式会社迪思科 | Cutting device |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156481A (en) * | 2004-11-25 | 2006-06-15 | Disco Abrasive Syst Ltd | Ultrasonic vibration cutting equipment |
| JP4664788B2 (en) * | 2005-09-26 | 2011-04-06 | 株式会社ディスコ | Cutting equipment |
| JP5183262B2 (en) * | 2008-03-21 | 2013-04-17 | 株式会社ディスコ | Cutting device and chip production method |
| JP5415184B2 (en) * | 2009-08-21 | 2014-02-12 | 株式会社ディスコ | Cutting equipment |
| JP5467816B2 (en) * | 2009-08-25 | 2014-04-09 | 株式会社ディスコ | Imaging device |
| JP5507294B2 (en) * | 2010-03-05 | 2014-05-28 | 東芝機械株式会社 | Grinding machine with distance measuring function |
| JP5695359B2 (en) * | 2010-07-28 | 2015-04-01 | 株式会社ディスコ | Processing equipment |
| US9804067B2 (en) | 2012-06-21 | 2017-10-31 | Kagoshima University, National University Corporation | Observation and photography apparatus |
| CN105321863A (en) * | 2014-07-30 | 2016-02-10 | 深圳市韵腾激光科技有限公司 | Wafer cutting positioning device and method |
| JP6541546B2 (en) * | 2015-10-21 | 2019-07-10 | 株式会社ディスコ | Cutting device |
| JP6876586B2 (en) * | 2017-09-27 | 2021-05-26 | Ｔｏｗａ株式会社 | Processing equipment |
| JP7100555B2 (en) | 2018-10-05 | 2022-07-13 | オークマ株式会社 | Machine Tools |
| CN112259475A (en) * | 2020-10-21 | 2021-01-22 | 河北圣昊光电科技有限公司 | Compound semiconductor wafer scribing machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1127777A (en) * | 1994-10-25 | 1996-07-31 | 信越半导体株式会社 | Cutting fluid, method for producing same, and method for cutting crystal block |
| US5628673A (en) * | 1993-11-26 | 1997-05-13 | Seiko Seiki Kabushiki Kaisha | Dicing machine with non-contact setup function |
| US5710825A (en) * | 1995-03-31 | 1998-01-20 | Seiko Seiki Kabushiki Kaisha | Cutting line measuring apparatus |
| CN1275799A (en) * | 1999-05-27 | 2000-12-06 | 三洋电机株式会社 | Method for making semiconductor device |
-
2002
- 2002-10-28 JP JP2002312781A patent/JP4216565B2/en not_active Expired - Lifetime
-
2003
- 2003-10-28 CN CNB2003101026509A patent/CN1320607C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5628673A (en) * | 1993-11-26 | 1997-05-13 | Seiko Seiki Kabushiki Kaisha | Dicing machine with non-contact setup function |
| CN1127777A (en) * | 1994-10-25 | 1996-07-31 | 信越半导体株式会社 | Cutting fluid, method for producing same, and method for cutting crystal block |
| US5710825A (en) * | 1995-03-31 | 1998-01-20 | Seiko Seiki Kabushiki Kaisha | Cutting line measuring apparatus |
| CN1275799A (en) * | 1999-05-27 | 2000-12-06 | 三洋电机株式会社 | Method for making semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101402226B (en) * | 2007-10-05 | 2012-10-03 | 株式会社迪思科 | Cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004142086A (en) | 2004-05-20 |
| JP4216565B2 (en) | 2009-01-28 |
| CN1499580A (en) | 2004-05-26 |
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