JP2018181931A - Cutting device - Google Patents

Abstract

An object of the present invention is to perform alignment efficiently and inexpensively. A first chuck table and a second chuck table are disposed adjacent to each other in a first direction parallel to the holding surface, and the first chuck table and the second chuck table are arranged adjacent to each other. A first cutting unit and a second cutting unit, which are disposed above and are capable of cutting a workpiece held on each of the holding surfaces, and a first chuck table and a second chuck table, A first camera, a second camera, and a camera base supporting the first camera and the second camera, the first camera and the second camera being arranged above and capable of capturing an image of a workpiece held on each of the holding surfaces; And a camera base moving unit capable of moving the camera base in the first direction, wherein the first camera and the second camera are provided with a center of the first chuck table, Of the second chuck table Apart by a distance in mind and, first direction is fixed to the camera base. [Selection diagram] Fig. 1

Description

  The present invention relates to a cutting apparatus provided with two cutting units for cutting a workpiece such as a wafer.

  The surface of the semiconductor wafer is partitioned by a plurality of planned dividing lines arranged in a lattice, and devices such as ICs are formed in each of the partitioned areas. When the wafer is finally divided along the dividing lines, individual device chips are formed.

  A cutting device provided with a cutting unit is used to divide the wafer. The cutting unit is mounted with a cutting blade having an annular cutting blade. The annular cutting edge of the cutting blade is formed, for example, by sintering a binder in which abrasive grains are dispersed.

  During cutting, the cutting blade, which rotates in a plane perpendicular to the surface of the workpiece, is positioned at a predetermined height, and the blade and the workpiece are parallel to the surface of the workpiece. Move relative to the cutting feed direction. Then, the workpiece is cut.

  The cutting device comprises a chuck table below the cutting unit. The upper surface of the chuck table is a holding surface, and the workpiece is held on the holding surface. The chuck table can be moved in the cutting feed direction and can be rotated about an axis perpendicular to the holding surface. The cutting unit can be moved in an indexing feed direction parallel to the holding surface of the chuck table and perpendicular to the cutting feed direction.

  Before cutting a workpiece, the relative positions of the cutting blade and the workpiece are adjusted (aligned) so as to have a relation suitable for processing. That is, the chuck table is rotated about an axis perpendicular to the holding surface, the dividing planned line of the workpiece is aligned with the cutting feed direction, and the cutting unit is moved in the indexing feeding direction to divide the planned dividing line. Position the cutting blade above the extension line of. Then, as described above, cutting of the workpiece is performed.

  The cutting apparatus further includes a camera or a microscope used when performing alignment, and when performing alignment, the camera or the like captures a planned dividing line of the workpiece.

  The cutting apparatus is capable of cutting various types of workpieces, and for example, has a frame formed of metal or the like, and cuts a package substrate mounted with a device chip and sealed by a resin on the frame. It can also be processed. Since the package substrate may change the position of the planned dividing line due to the expansion and contraction of the resin, etc., the position of the planned dividing line may be appropriately grasped for each substrate and the alignment may be carried out at the time of cutting. Especially important.

  By the way, in recent years, development of a highly productive cutting device is actively conducted. For example, a cutting device has been developed that includes two cutting units each having a cutting blade and two chuck tables each holding a workpiece (see Patent Document 1). In the cutting device, the cutting blades respectively included in the two cutting units face each other. When this cutting device is used, cutting can be simultaneously performed on two workpieces, so that the productivity of cutting is increased.

JP, 2006-156809, A

  Even when cutting is performed in a cutting device having two cutting units and two chuck tables, it is important to properly align the cutting blade with the workpiece. In order to carry out alignment appropriately and efficiently in the cutting device, two cameras etc. capable of independently capturing the workpieces respectively held on two chuck tables are attached to the cutting device. It is good to do.

  For example, if one camera or the like is provided in the cutting device, alignment can not be performed simultaneously in two cutting units and a chuck table. In addition, it is necessary to move the camera or the like between the upper sides of the two chuck tables, which takes time. On the other hand, when two cameras and the like are attached to the cutting device, it is not necessary to wait for arrival of the cameras and the like, so that cutting with high accuracy and productivity can be performed.

  However, installing two cameras etc. only for performing alignment, and providing a mechanism that enables each camera etc. to be moved independently to the cutting device complicates the configuration of the cutting device and increases costs. .

  The present invention has been made in view of the above problems, and an object of the present invention is to perform alignment efficiently and inexpensively in a cutting device having two cutting units and two workpieces. It is providing a cutting device.

  According to one aspect of the present invention, a first chuck table and a second chuck, each having a holding surface for holding a workpiece, are disposed adjacent to each other in a first direction parallel to the holding surface. The table is disposed below the first chuck table and the second chuck table, and the first chuck table and the second chuck table are parallel to the holding surface in the first direction. A first cutting feed unit and a second cutting feed unit capable of cutting feed in a second direction orthogonal to each other, and the holding surface disposed above the first chuck table and the second chuck table, respectively A first cutting unit and a second cutting unit capable of cutting a workpiece held thereon, and disposed above the first chuck table and the second chuck table, respectively A first camera capable of capturing an image of a workpiece held on a holding surface, a second camera, a camera base for supporting the first camera and the second camera, and the camera base A camera base moving unit movable in a first direction, wherein the first camera and the second camera include a center of the first chuck table and a center of the second chuck table; A cutting device is provided, which is fixed to the camera base at a distance in the first direction of.

  A cutting apparatus according to an aspect of the present invention includes a first chucking table and a second chucking table, and a first cutting unit that cuts a workpiece held by each chucking table, And 2 cutting units. Further, a first camera and a second camera are provided above the respective chuck tables.

  The first camera can be used when performing alignment of the first chuck table and the first cutting unit. The second camera can be used to align the second chuck table with the second cutting unit. In the cutting device, the first camera and the second camera are supported by one camera base.

  The first camera and the second camera are fixed to the camera base at a position separated by the distance between the center of the first chuck table and the center of the second chuck table. . Therefore, in the cutting apparatus, the second camera is positioned above the second chuck table at the same time as the first camera is positioned above the first chuck table. Therefore, alignment using the first camera and alignment using the second camera can be performed simultaneously.

  In the case of providing the cutting device with two moving mechanisms for moving the first camera and the second camera independently, the configuration and operation of the cutting device become complicated and expensive. Therefore, in the cutting device according to the present embodiment, the first camera and the second camera are supported by one camera base and shared. Then, one moving unit used to move the camera can be omitted.

  Therefore, according to one aspect of the present invention, there is provided a cutting device capable of performing alignment efficiently and inexpensively in a cutting device having two cutting units and two work pieces.

It is a perspective view which shows a cutting device typically. It is a top view which shows the cutting device at the time of alignment typically. It is a top view which shows typically the cutting device at the time of cutting.

  Embodiments according to one aspect of the present invention will be described with reference to the attached drawings. First, the cutting device according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view schematically showing the cutting device 2. As shown in FIG. 1, the cutting device 2 includes an apparatus base 4 that supports each component.

  At the front corner of the device base 4 of the cutting device 2, a cassette elevator 30 capable of moving up and down is installed. On the upper surface of the cassette elevator 30, a cassette 32 capable of containing a plurality of workpieces is placed. In the vicinity of the cassette elevator 30, a transport unit (not shown) for transporting the workpiece to the chuck tables 14a and 14b (described later) is provided.

  On the device base 4, the two X-axis moving tables 6a and 6b adjacent in the Y-axis direction and the X-axis moving tables 6a and 6b are slidably supported in the X-axis direction and extended in the X-axis direction Two pairs of X axis guide rails 8a and 8b are disposed. Nut portions (not shown) are provided on the lower surface sides of the X-axis moving tables 6a and 6b, respectively, and X-axis ball screws 10a parallel to the X-axis guide rails 8a and 8b are provided on the nut portions. 10b is screwed respectively.

  X-axis pulse motors 12a and 12b are connected to one end of the X-axis ball screws 10a and 10b, respectively. When the X axis ball screws 10a and 10b are rotated by the X axis pulse motors 12a and 12b, the X axis moving tables 6a and 6b move in the X axis direction along the X axis guide rails 8a and 8b.

  Chuck tables 14a and 14b are provided on the X-axis moving tables 6a and 6b, respectively, for sucking and holding the workpiece. The chuck tables 14a and 14b are connected to a rotational drive source (not shown) such as a motor, and rotate around a rotation axis substantially parallel to the Z-axis direction (vertical direction). The chuck tables 14a and 14b are independently cut and fed (processed and fed) in the X-axis direction when the X-axis pulse motors 12a and 12b are operated.

  The surfaces (upper surfaces) of the chuck tables 14a and 14b become holding surfaces 16a and 16b for sucking and holding the workpieces 1a and 1b, respectively. The holding surfaces 16a and 16b are connected to a suction source (not shown) through flow paths (not shown) respectively formed inside the chuck tables 14a and 14b.

  The workpiece to be processed by the cutting device 2 will be described. The workpieces 1a and 1b are, for example, package substrates having a frame formed of metal or the like and having a device chip mounted on the frame and sealed with a resin. The surface of the package substrate is partitioned by a plurality of planned dividing lines arranged in a lattice, and devices such as ICs are formed in each of the areas partitioned by the plurality of planned dividing lines. Finally, the package substrate is divided along the dividing lines to form individual device chips.

  A support structure 20 is erected on the upper surface of the device base 4 so as to straddle the two pairs of X-axis guide rails 8a and 8b. The support structure 20 supports cutting units 18a and 18b (see FIG. 2) for cutting the workpieces 1a and 1b, respectively. A pair of Y-axis guide rails 22c (see FIG. 2) parallel to the Y-axis direction is disposed at the upper part of the rear surface of the support structure 20. Two Y-axis moving plates 22a and 22b are slidably attached to the Y-axis guide rails 22c.

  A nut portion (not shown) is provided on the back surface side of the Y-axis moving plate 22a, and a first Y-axis ball screw (not shown) parallel to the Y-axis guide rail 22c is engaged with this nut portion. It is done. In addition, a nut portion (not shown) is provided on the back surface side of the Y-axis moving plate 22b, and a second Y-axis ball screw (not shown) parallel to the Y-axis guide rail 22c is provided on this nut portion. It is screwed together.

  A Y-axis pulse motor 24a is connected to one end of the first Y-axis ball screw. A Y-axis pulse motor 24b (see FIG. 2) is connected to one end of the second Y-axis ball screw. When the first Y-axis ball screw is rotated by the Y-axis pulse motor 24a, the Y-axis moving plate 22a moves in the Y-axis direction along the Y-axis guide rail 22c. Also, when the second Y-axis ball screw is rotated by the Y-axis pulse motor 24b, the Y-axis moving plate 22b moves in the Y-axis direction along the Y-axis guide rail 22c.

  Two pairs of Z-axis guide rails 26c and 26d parallel to the Z-axis direction are provided on the surfaces of the Y-axis moving plates 22a and 22b, respectively. Z-axis moving plates 26a and 26b are slidably attached to the Z-axis guide rails 26c and 26d, respectively.

  A nut portion (not shown) is provided on the back surface side of the Z axis moving plate 26a, and a first Z axis ball screw (not shown) parallel to the Z axis guide rail 26c is screwed to this nut portion. It is united. A Z-axis pulse motor 28a is connected to one end of the first Z-axis ball screw, and when the first Z-axis ball screw is rotated by the Z-axis pulse motor 28a, the Z-axis movement plate 26a is rotated to the Z direction. It can move in the Z-axis direction along the axis guide rail 26c.

  A nut (not shown) is provided on the back surface side of the Z-axis moving plate 26b, and a second Z-axis ball screw (not shown) parallel to the Z-axis guide rail 26d is screwed to this nut. It is united. A Z-axis pulse motor 28b is connected to one end of the second Z-axis ball screw, and when the second Z-axis ball screw is rotated by the Z-axis pulse motor 28b, the Z-axis movement plate 26b is rotated to Z. It can move in the Z-axis direction along the axial guide rail 26d.

  Cutting units 18a and 18b for processing the workpieces 1a and 1b are fixed to lower portions on the surface side of the Z-axis moving plates 26a and 26b, respectively. If the Y-axis moving plates 22a and 22b are moved in the Y-axis direction, the cutting units 18a and 18b move in the Y-axis direction, and if the Z-axis moving plates 26a and 26b are moved in the Z-axis direction, the cutting unit 18a and 18b move up and down respectively.

  The cutting units 18a and 18b each include an annular cutting blade mounted on one end side of a spindle that constitutes a rotation axis parallel to the Y-axis direction. A rotational drive source such as a motor is connected to the other end side of the spindle, and can rotate the cutting blade mounted on the spindle. The cutting blade has a disk-like base. At the central portion of the base, a substantially circular mounting hole is provided which penetrates the base. An annular cutting blade for cutting into a workpiece is fixed to the outer periphery of the base.

  The workpiece 1a can be cut by cutting into the workpiece 1a held by the chuck table 14a while rotating the cutting blade attached to the cutting unit 18a. The workpiece 1b can be cut by cutting the workpiece 1b held by the chuck table 14b while rotating the cutting blade attached to the cutting unit 18b. Since the cutting device 2 according to the present embodiment includes the two cutting units 18a and 18b, cutting can be performed simultaneously on the two workpieces 1a and 1b.

  A camera base 44 provided with two cameras (imaging units) 46 a and 46 b and a camera base moving unit 36 for moving the camera base 44 are disposed on the upper front of the support structure 20. The camera base moving unit 36 will be described in detail.

  The camera base moving unit 36 has a pair of camera base moving guide rails 38 parallel to the Y-axis direction at the upper front of the support structure 20. A camera base 44 is slidably attached to the camera base moving guide rail 38. A nut portion (not shown) is provided on the back side of the camera base 44, and a ball screw 40 for camera base movement parallel to the camera base movement guide rail 38 is screwed to this nut portion. It is united.

  A camera base moving pulse motor 42 is connected to one end of the camera base moving ball screw 40. When the camera base moving ball screw 40 is rotated by the camera base moving pulse motor 42, the camera base 44 moves in the Y-axis direction (index feed direction) along the camera base moving guide rail 38. Do. The camera base moving unit 36 is configured as described above. The width in the Y-axis direction of the camera base 44 is larger than the distance in the Y-axis direction between the center of the chuck table 14a and the chuck table 14b.

  Under the surface of the camera base 44, cameras 46a and 46b are disposed via Z-axis moving mechanisms 48a and 48b. The camera 46a and the camera 46b are fixed to the camera base 44 at a distance in the Y-axis direction between the center of the chuck table 14a and the center of the chuck table 14b. The camera 46a and the camera 46b respectively have lenses 50a and 50b (see FIG. 2) on the lower side.

  When cutting the workpiece 1a, the relative position between the cutting blade of the cutting unit 18a and the workpiece 1a held by the chuck table 14a is adjusted to a relationship suitable for processing (hereinafter, alignment) Do.

  In alignment, the front side of the workpiece 1a is imaged by the camera 46a through the lens 50a, and the position of the planned dividing line of the workpiece 1a is specified from the captured image. Then, the cutting blade is positioned so that the workpiece 1a can be divided along the planned dividing line of the workpiece 1a. The alignment between the cutting blade of the cutting unit 18b and the workpiece 1b held by the chuck table 14b is also carried out in the same manner.

  The Z axis moving mechanisms 48a and 48b respectively move the cameras 46a and 46b in the Z axis direction. When focusing the cameras 46a and 46b on the workpiece, the Z axis moving mechanisms 48a and 48b are operated.

  In the cutting device 2, the alignment of the cutting blade of the cutting unit 18a with the workpiece 1a and the alignment of the cutting blade of the cutting unit 18b with the workpiece 1b can be simultaneously performed. When performing alignment, the two cameras 46a and 46b can be simultaneously moved by operating the camera base moving unit 36.

  For example, in the case of providing two camera movement units in the cutting device to move the two cameras 46a and 46b used in performing the alignment, the cutting device must be controlled separately. The operation of is complicated. On the other hand, in the cutting device 2 according to the present embodiment, by supporting two cameras on one camera base, the moving unit used to move the cameras can be made common and cost can be suppressed. The operation of the cutting device 2 can be simplified.

  At the other corner in front of the device base 4, the cleaning unit 34 is installed. The washing unit 34 has, for example, a washing space inside. The workpiece after cutting is transported from the chuck tables 14a and 14b into the cleaning space by a transport mechanism (not shown). The cleaning unit 34 has a function of cleaning a workpiece after cutting.

  Inside the cleaning unit 34, an injection nozzle (not shown) for injecting a cleaning fluid (typically, a two-fluid mixture of water and air) toward the workpiece is disposed. When the cleaning fluid is sprayed from the spray nozzle, the workpiece can be cleaned. The workpiece cleaned by the cleaning unit 34 is accommodated in the cassette 32 by, for example, a transport mechanism (not shown).

  Next, cutting using the cutting device 2 will be described with reference to FIGS. 2 and 3. FIG. 2 is a top view schematically showing the cutting device 2 when performing alignment, and FIG. 3 is a top view schematically showing the cutting device 2 when performing cutting.

  First, the workpiece 1a carried out of the cassette 32 by the transport mechanism (not shown) is placed on the holding surface 16a of the chuck table 14a, and the workpiece 1a is sucked and held by the chuck table 14a. Similarly, the workpiece 1b carried out of the cassette 32 is placed on the holding surface 16b of the chuck table 14b, and the workpiece 1b is sucked and held by the chuck table 14b.

  Next, alignment is performed as shown in FIG. First, the camera base moving pulse motor 42 is operated to rotate the camera base moving ball screw 40 to move the camera base 44. The lens 50a of the camera 46a is positioned above the workpiece 1a held by the chuck table 14a, and the lens 50b of the camera 46b is positioned above the workpiece 1b held by the chuck table 14b.

  Thereafter, the camera 46a causes the lens 50a to image the workpiece 1a, and the chuck table 14a is rotated about an axis perpendicular to the holding surface 16a to divide the planned dividing line of the workpiece 1a in the X axis direction (cutting feed Align to the direction). Further, the Y-axis pulse motor 24a is operated to position the cutting unit 18a so that the cutting blade of the cutting unit 18a is disposed above the extension line of the planned division line.

  At the same time, the camera 46b is made to image the workpiece 1b through the lens 50b, and the chuck table 14b is rotated about an axis perpendicular to the holding surface 16b to divide the planned dividing line of the workpiece 1b in the X axis direction Align to the direction). Further, the Y-axis pulse motor 24b is operated to position the cutting unit 18b so that the cutting blade of the cutting unit 18b is disposed above the extension line of the planned division line.

  The position of the planned dividing line may change along with the expansion and contraction of the resin, etc. Therefore, when cutting the package substrate, it is particularly preferable to appropriately grasp the position of the planned dividing line for each substrate and carry out alignment. It becomes important.

  After the alignment is completed, cutting is performed. First, the respective rotating cutting blades of the cutting units 18a and 18b are positioned at a predetermined height. Next, the chuck tables 14a and 14b are cut and fed in the X-axis direction, and cutting blades are cut into the workpieces 1a and 1b along planned dividing lines. After cutting is performed along one planned dividing line, cutting units 18a and 18b are respectively indexed and fed, and cutting is performed along adjacent planned dividing lines.

  After cutting is performed along all planned dividing lines of the workpieces 1a and 1b extending in the X-axis direction, the chuck tables 14a and 14b are respectively rotated about axes perpendicular to the holding surfaces 16a and 16b. The cutting feed direction is switched to carry out cutting. When the workpieces 1a and 1b are cut along all the planned dividing lines, cutting is completed.

  The workpieces 1a and 1b subjected to the cutting process are transported to the cleaning unit 34 by the transport mechanism (not shown), and are each cleaned to remove deposits such as machining waste. The workpieces 1a and 1b which have been cleaned are carried into the cassette 32 by the transport mechanism (not shown).

  As described above, with the cutting device 2 according to the present embodiment, two cutting units can simultaneously perform cutting on two workpieces. In the cutting device 2, the cameras 46a and 46b are fixed to the camera base 44 at a position separated by the distance between the centers of the two chuck tables 14a and 14b. Therefore, in this cutting device 2, alignment in two places can be implemented simultaneously.

  In the case of providing the cutting device with two moving mechanisms for moving the two cameras 46a and 46b independently for moving the two cameras 46a and 46b, the configuration and operation of the cutting device become complicated and expensive. On the other hand, in the cutting device 2 according to the present embodiment, by supporting the two cameras 46a and 46b on one camera base 44, only one moving unit used to move the cameras is sufficient. Therefore, in the cutting device according to the present embodiment, efficient alignment can be performed at low cost.

  In the cutting device according to the above embodiment, the two cameras are fixed to the camera base while being separated by the distance between the centers of the two chuck tables, but one aspect of the present invention is not limited to this. The distance between the two cameras fixed to the camera base may be any distance at which the two cameras can simultaneously image the object to be imaged.

  Moreover, in the cutting device which concerns on the said embodiment, although two cameras were fixed to one camera base, the one aspect | mode of this invention is not limited to this. The cutting device may include two camera bases that respectively support two cameras, and a nut portion provided on the back of each of the two camera bases may be screwed into one ball screw. In this case, when the ball screw is rotated by the pulse motor, the two camera bases can be similarly moved, so that only one set of the ball screw and the pulse motor is required, and the cutting device becomes inexpensive.

  Further, in one aspect of the present invention, two cameras included in the cutting device may be respectively provided with a high magnification lens and a low magnification lens together, or may be provided with one variable magnification lens. In addition, when a resin package substrate or the like that expands and contracts is used as a workpiece, the camera may be set so that the expansion and contraction of the workpiece can be contained within the imaging field of the camera.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

1a, 1b Workpiece 2 Cutting device 4 Device base 6a, 6b X axis moving table 8a, 8b X axis guide rail 10a, 10b X axis ball screw 12a, 12b X axis pulse motor 14a, 14b Chuck table 16a, 16b holding Surface 18a, 18b Cutting unit 20 Support structure 22a, 22b Y axis moving plate 22c Y axis guide rail 24a, 24b Y axis pulse motor 26a, 26b Z axis moving plate 26c, 26d Z axis guide rail 28a, 28b Z axis pulse motor 30 Cassette elevator 32 Cassette 34 Cleaning unit 36 Camera base moving unit 38 Guide rail for moving the camera base 40 Ball screw for moving the camera base 42 Pulse motor for moving the camera base 44 Camera base 46a, 46b Camera 48a, 48b Camera Moving mechanism 50a, 50b lens

Claims (1)

A first chuck table and a second chuck table, each having a holding surface for holding a workpiece and arranged adjacent to each other in a first direction parallel to the holding surface;
The first chuck table and the second chuck table are disposed below the first chuck table and the second chuck table, respectively, and the first chuck table and the second chuck table are parallel to the holding surface and orthogonal to the first direction. A first cutting feed unit and a second cutting feed unit capable of cutting feed in a second direction;
A first cutting unit and a second cutting unit disposed above the first chuck table and the second chuck table and capable of cutting the workpieces held on the respective holding surfaces;
A first camera and a second camera disposed above the first chuck table and the second chuck table and capable of imaging the workpiece held on the respective holding surfaces;
A camera base supporting the first camera and the second camera;
A camera base moving unit capable of moving the camera base in the first direction;
The first camera and the second camera are fixed to the camera base at a distance in the first direction between the center of the first chuck table and the center of the second chuck table Cutting device characterized by being.