CN1318151C - Device and method for forming coating film - Google Patents

Abstract

To provide an apparatus and a method for forming a coating film which suppress the occurrence of transfer marks on the surface of a substrate and can prevent the attachment of particles to the rear face of the substrate. A resist applicator (CT) 23a comprises a stage 12 formed with a plurality of gas injection ports 16a for jetting out a gas, a substrate transfer mechanism 13 for transferring the LCD substrate G in the X direction on the stage 12, and a resist supply nozzle 14 for supplying a resist liquid onto the surface of the LCD substrate G during transportation of the LCD substrate G on the stage 12. The LCD substrate G is levitated nearly horizontally above the surface of the stage 12 by the gas jet out from the gas injection ports 16a, and is transferred in the levitated state on the stage 12 by means of the substrate transfer mechanism 13.

Description

Apparatus for forming coating film and method for forming coating film

technical field

The present invention relates to a coating film forming apparatus and a coating film forming method for forming a coating film by supplying a coating liquid on a substrate such as a glass substrate of an FPD (flat panel display) used in a liquid crystal display (LCD) or the like.

Background technique

For example, in the manufacturing process of a liquid crystal display device (LCD), a predetermined circuit pattern is formed on a glass substrate using photolithography. In other words, a resist is supplied on a glass substrate to form a coating film, and after drying and heat treatment, exposure treatment and development treatment are sequentially performed.

Here, as an apparatus for supplying a resist liquid to a glass substrate to form a coating film, there is known a mounting table that has a glass substrate that is vacuum-suctioned horizontally, and a resist that supplies a resist liquid to a substrate held on the mounting table. A resist supply nozzle, and a coating film forming apparatus that relatively moves the stage and the resist supply nozzle in the horizontal direction (for example, refer to Patent Document 1).

However, since the thickness of the glass substrate for LCD is very thin, there is a problem that the suction holes provided on the mounting table are transcribed on the surface of the glass substrate. In addition, there is a problem that many particles adhere to the back surface of the substrate. Furthermore, since a predetermined time is required for detachment of the substrate from the mounting table, not to mention high productivity. In addition, since the size of the mounting table and the resist supply nozzle have been increased along with the increase in the size of the glass substrate in recent years, the structure of the moving mechanism for relatively moving them has also become large-scale, so it is more necessary to use as simple as possible The structure moves the substrate.

[Patent Document 1] Japanese Unexamined Patent Publication No. H10-156255

Contents of the invention

The present invention was made in view of the above problems, and an object of the present invention is to provide a coating film forming apparatus and a coating film forming method that prevent particles from adhering to the back surface of the substrate while suppressing the occurrence of copy marks on the substrate surface. Another object of the present invention is to provide a coating film forming apparatus and a coating film forming method capable of forming a coating film with a simple structure of a mechanism for conveying a substrate and with high productivity.

In other words, according to the present invention, it is possible to provide a coating film forming apparatus for forming a coating film by supplying a predetermined coating liquid to the substrate while transporting the substrate in one direction. A stage with a plurality of gas injection ports that inject a predetermined gas at a position; a substrate transport mechanism that transports a substrate in one direction on the above stage; a coating liquid supply nozzle that supplies a predetermined coating liquid to the surface of the substrate moving on the above stage , wherein the substrate is conveyed by the substrate conveying mechanism in a horizontal posture and in a state floating from the surface of the table by the gas injected from the gas injection port.

In addition, according to the present invention, it is possible to provide a coating film forming method in which a coating film is formed by supplying a coating liquid to the substrate while transporting the substrate in one direction, the method comprising: holding a part of the periphery of the substrate, and using The process of floating the above-mentioned substrate in a substantially horizontal posture on the table on which a predetermined gas is sprayed from the surface, and supplying a predetermined coating liquid to the above-mentioned substrate while maintaining the above-mentioned substrate in a state of floating upward while transporting the above-mentioned table in one direction And the process of forming a coating film.

According to the present invention, since the substrate is conveyed in a state of floating upward from the stage, it is possible to suppress the adhesion of particles to the back surface of the substrate without causing copying on the surface of the stage, and to convey the substrate with a small force. In addition, since the entire substrate is supported by the gas injected from the lower side, the posture of the substrate can be easily maintained horizontally, thereby suppressing the occurrence of thickness unevenness in the coating film. In addition, since substrates can be conveyed gradually for coating treatment, high productivity can be obtained.

Description of drawings

FIG. 1 is a schematic plan view of a resist coating/development processing system including a resist coating apparatus according to an embodiment of a coating film forming apparatus of the present invention.

FIG. 2 is a side view showing part of a first heat treatment unit of the resist coating and development treatment system shown in FIG. 1 .

FIG. 3 is a side view showing part of a second heat treatment unit of the resist coating and development treatment system shown in FIG. 1 .

4 is a side view showing part of a third heat treatment unit of the resist coating and development treatment system shown in FIG. 1 .

Fig. 5 is a schematic plan view of a resist processing unit.

6 is a cross-sectional view showing a schematic configuration of a substrate transport mechanism.

FIG. 7 is an explanatory view schematically showing the transport form of the LCD substrate at each of the introduction stage, the coating stage, and the carry-out stage.

8 is a schematic perspective view of a resist supply nozzle.

9 is a plan view and a cross-sectional view showing a schematic configuration of another substrate transport mechanism provided in the resist coating apparatus.

FIG. 10 is an explanatory diagram schematically showing a transport form of an LCD substrate by the substrate transport mechanism shown in FIG. 9 .

11 is a cross-sectional view showing a schematic structure of another substrate transport mechanism provided in the resist coating apparatus.

FIG. 12 is an explanatory diagram schematically showing a transport form of an LCD substrate by the substrate transport mechanism shown in FIG. 11 .

Label description

1. Box table

2. Processing table

3. Connection table

12. Taiwan

12a. Import station

12b. Coating station

12c. Ship out of Taiwan

13. Substrate transport mechanism

14. Resist supply nozzle

15a～15d holding parts

16a. Gas injection port

16b. Suction port

23. Resist processing unit

23a. Resist coating device

23b. Reduced pressure drying device

100. Resist coating and development processing system

G. LCD substrate

Detailed ways

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, the case where the present invention is applied to an apparatus and method for forming a resist film on the surface of a glass substrate for LCD (hereinafter referred to as "LCD substrate") will be described.

FIG. 1 shows a schematic plan view of a resist coating and development processing system for forming a resist film on an LCD substrate and developing a resist film after exposure processing. This resist coating and development processing system 100 is equipped with a cassette station (in/out unit) 1 on which a cassette C accommodating a plurality of LCD substrates G is placed, and is equipped with a system for carrying out resist processing including on the LCD substrate G. A processing station (processing section) 2 of a plurality of processing units for a series of processing of agent application and development, and a connecting station (connecting section) 3 for transferring the LCD substrate G to and from the exposure device 4, and the cartridge The stage 1 and the connection stage 3 are arranged at both ends of the processing stage 2, respectively. In addition, in FIG. 1 , the longitudinal direction of the resist coating/development processing system 100 is referred to as the X direction, and the direction perpendicular to the X direction on a plane is referred to as the Y direction.

The cassette table 1 is equipped with a mounting table 9 capable of mounting cassettes C in parallel in the Y direction, and a transport device 11 for carrying in and out the LCD substrate G between the processing table 2, and the mounting table 9 Cartridge C is transported to and from the outside. The conveyance device 11 has a conveyance arm 11a, and can move on a conveyance path 10 provided along the Y direction as the arrangement direction of the cassettes C, and carries out the LCD substrate G between the cassettes C and the processing table 2 by the conveyance arm 11a. in and out.

The processing station 2 has two rows of parallel conveying lines A and B for conveying the LCD substrate G extending substantially along the X direction, and along the conveying path A, scrubbing and cleaning processing units (SCR) are arranged from the box stage 1 side to the connection stage 3 ) 21, the first heat treatment unit part 26, the resist treatment unit 23 and the second heat treatment unit part 27.

In addition, along the conveyance line B, the second heat treatment unit section 27, the development treatment unit (DEV) 24, the i-line UV irradiation unit (i-UV) 25, and the third heat treatment unit section are arranged from the connection station 3 to the cassette station 1 side. 28. An excimer laser (Ekishima) UV irradiation unit (e-UV) 22 is provided on a part of the upper surface of the scrub cleaning processing unit (SCR) 21 . In addition, an excimer laser UV irradiation unit (e-UV) 22 is provided to remove organic matter on the LCD substrate G before scrub cleaning, and an i-line UV irradiation unit (i-UV) 25 is provided for decolorization treatment of development.

In the scrub cleaning processing unit (SCR) 21, the LCD substrate G is conveyed in a substantially horizontal posture, and cleaning processing and drying processing are performed therein. In the development processing unit (DEV) 24 , while the LCD substrate G is transported in a substantially horizontal posture, developer application, rinsing, and drying processes are sequentially performed. In these scrub cleaning processing unit (SCR) 21 and developing processing unit (DEV) 24, the LCD substrate G is conveyed by, for example, roller conveyance or belt conveyance, and the import and export of the LCD substrate G are set at relatively short distances. side. Further, the conveyance of the LCD substrate G to the i-line UV irradiation unit (i-UV) 25 is continuously carried out by the same mechanism as the conveyance mechanism of the development processing unit (DEV) 24 .

The resist processing unit 23 is equipped with a resist coating device (CT) 23a for forming a coating film by supplying a resist solution while transporting the LCD substrate G in a substantially horizontal posture as will be described in detail later; and The vacuum drying device (VD) 23b is a vacuum drying device (VD) 23b for evaporating volatile components contained in a coating film formed on the LCD substrate G by exposing the LCD substrate G to a reduced-pressure atmosphere, thereby drying the coating film.

The first heat treatment unit part 26 has two heat treatment unit blocks (TB) 31, 32 formed by stacking heat treatment units for heat treatment of the LCD substrate G, and the heat treatment unit block (TB) 31 is arranged on the scrub cleaning treatment unit (SCR) 21 On one side, a heat treatment unit block (TB) 32 is provided on the resist treatment unit 23 side. A first transport device 33 is provided between the two thermal treatment unit blocks (TB) 31 , 32 .

As shown in the side view of the first heat treatment unit part 26 of FIG. 61 , two dehydration baking units (DHP) 62 and 63 for dehydrating and baking the LCD substrate G, and an adhesion treatment unit (AD) 64 for dehydrating the LCD substrate G. In addition, the heat treatment unit block (TB) 32 has a four-layer structure stacked sequentially from bottom to top as follows, a transfer unit (PASS) 65 for transferring the LCD substrate G, and two cooling units (COL) 66 for cooling the LCD substrate G , 67, an adhesion treatment unit (AD) 68 for performing drainage treatment on the LCD substrate G.

The first conveying device 33 accepts the LCD substrate G from the scrub cleaning processing unit (SCR) 21 through the transfer unit (PASS) 61, and carries out the LCD substrate G in and out between the above-mentioned heat treatment units, and passes through the transfer unit ( PASS) 65 transfers the LCD substrate G to the resist processing unit 23 .

The first transport device 33 has a guide rail 91 extending up and down, an elevating member 92 that moves up and down along the guide rail 91, a base member 93 that is rotatably provided on the elevating member 92, and a base member 93 that is rotatably provided on the base member 93 and that holds the LCD substrate. The substrate holding arm 94 of G. The elevating member 92 is raised and lowered by a motor 95 , the base member 93 is rotated by a motor 96 , and the substrate holding arm 94 is moved back and forth by a motor 97 . In this way, the first conveying device 33 can move up and down, back and forth, and rotate, and can also approach any one of the heat treatment unit blocks (TB) 31 , 32 .

The second heat treatment unit portion 27 has two heat treatment unit blocks (TB) 34 and 35 formed by stacking heat treatment units for heat treatment of the LCD substrate G, and the heat treatment unit block (TB) 34 is provided on the etchant treatment unit 23 side. , a heat treatment unit block (TB) 35 is provided on the development treatment unit (DEV) 24 side. Furthermore, a second transport device 36 is provided between the two thermal treatment unit blocks (TB) 34 , 35 .

As shown in the side view of the second heat treatment unit part 27 of FIG. 69, and three prebake units (PREBAKE) 70, 71, 72 for performing prebake treatment on the LCD substrate G. In addition, the heat treatment unit block (TB) 35 has a four-layer structure stacked sequentially from bottom to top, a transfer unit (PASS) 73 for transferring the LCD substrate G, a cooling unit (COL) 74 for cooling the LCD substrate G, and a cooling unit (COL) 74 for cooling the LCD substrate G. Two prebake units (PREBAKE) 75, 76 for performing prebake treatment on the LCD substrate G.

The second transport device 36 receives the LCD substrate G from the resist processing unit 23 through the transfer unit (PASS) 69, and carries out the LCD substrate G in and out between the above-mentioned heat treatment units, and passes through the transfer unit (PASS) 73 The delivery of the LCD substrate G to the development processing unit (DEV) 24, and the delivery and reception of the LCD substrate G facing the extension and cooling stage (EXT·COL) 44 which is a substrate delivery part of the connection station 3 described later are carried out. . In addition, the second transport device 36 has the same structure as the first transport device 33 , and can approach any one of the heat treatment unit blocks (TB) 34 , 35 .

The third heat treatment unit portion 28 has two heat treatment unit blocks (TB) 37, 38 formed by stacking heat treatment units for heat treatment of the LCD substrate G. The heat treatment unit block (TB) 37 is provided on the development treatment unit (DEV) 24. On one side, a heat treatment unit block (TB) 38 is provided on the cassette stage side. Furthermore, a third transport device 39 is provided between the two heat treatment unit blocks (TB) 37 , 38 .

As shown in the side view of the third heat treatment unit part 28 of FIG. 77 and three post-bake units (POBAKE) 78, 79, 80 for post-baking the LCD substrate G. In addition, the heat treatment unit block (TB) 38 has the following four-layer structure stacked sequentially from bottom to top, a post-baking unit (POBAKE) 81, a transfer cooling unit (PASS·COL) for transferring and cooling the LCD substrate G 82, and two post-baking units (POBAKE) 83, 84 for post-baking the LCD substrate G.

The third transport device 39 receives the LCD substrate G from the i-line UV irradiation unit (i-UV) 25 through the transfer unit (PASS) 77, carries the LCD substrate G in and out between the above-mentioned heat treatment units, and passes through The transfer and cooling unit (PASS·COL) 82 is used to transfer the LCD substrate G to the cassette station 1 . In addition, the third transport device 39 has the same structure as the first transport device 33 , and can also approach any one of the heat treatment unit blocks (TB) 37 , 38 .

In the processing station 2, two lines of transport lines A, B are formed as described above, and the respective processing units and transport devices are basically arranged in the order of processing, and a space 40 is provided on these transport lines A, B. Furthermore, a reciprocating member (mounting board member) 41 capable of reciprocating in the space 40 is provided. The reciprocating member 41 is configured to hold the LCD substrate G, and the transfer of the LCD substrate G is performed between the transport lines A and B via the reciprocating member 41 . The transfer of the LCD substrate G to and from the reciprocating member 41 is performed by the first to third transfer devices 33 , 36 , and 39 described above.

The connection table 3 has a conveying device 42 for carrying in and out the LCD substrate G between the processing table 2 and the exposure device 4, a buffer table (BUF) 43 equipped with a buffer box, and an extended board transfer section with a cooling function. - The cooling table (EXT·COL) 44 is provided adjacent to the transport device 42, and the external device part 45 of the upper and lower laminated writing unit (TITLER) and the peripheral exposure device (EE) is provided. The transport device 42 is provided with a transport arm 42a, and carries in and out the LCD substrate G between the processing table 2 and the exposure device 4 by the transport arm 42a.

In the resist coating/development processing system 100 configured in this way, first, the LCD substrate G in the cassette C placed on the mounting table 9 of the cassette table 1 is directly transported into the preparation stage of the processing table 2 by the transport device 11. In the molecular laser UV irradiation unit (e-UV) 22, pre-treatment for scrubbing is performed. Next, the LCD substrate G is carried into the scrub cleaning processing unit (SCR) 21 by the conveying device 11, and scrub cleaning is performed. After scrub cleaning, the LCD substrate G is carried out to the transfer unit (PASS) 61 of the heat treatment unit block (TB) 31 belonging to the first heat treatment unit portion 26 by, for example, roller conveyance.

First, the LCD substrate G arranged in the transfer unit (PASS) 61 is transported to any one of the dehydration baking units (DHP) 62 and 63 of the heat treatment unit block (TB) 31 for heat treatment, and then, after being transported to the heat treatment unit After being cooled by any one of the cooling units (COL) 66, 67 of the block (TB) 32, in order to improve the adhesiveness of the resist, it is transported to the adhesion processing unit (AD) of the heat treatment unit block (TB) 31. ) 64 and any one of the adhesion treatment unit (AD) 68 of the heat treatment unit block (TB) 32, where the adhesion treatment (drainage treatment) is performed by HMDS. Thereafter, the LCD substrate G is transported to any one of the cooling units (COL) 66 , 67 to be cooled, and then transported to the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 . The conveying process of the LCD substrate G when the above series of processes are performed is carried out by the first conveying device 33 .

The LCD substrate G placed in the pass unit (PASS) 65 is transported into the resist processing unit 23 by a substrate transport mechanism such as a roller transport mechanism provided in the pass unit (PASS) 65 . As will be described in detail later, in the resist coating device (CT) 23a, while transporting the LCD substrate G in a horizontal posture, a resist solution is supplied to form a coating film, and thereafter, the coating film is formed by a vacuum drying device (VD). 23b performs reduced-pressure drying treatment on the coating film. Thereafter, the LCD substrate G is handed over from the resist processing unit 23 to the transfer unit of the thermal processing unit block (TB) 34 belonging to the second thermal processing unit portion 27 by the substrate transfer arm provided in the vacuum drying device (VD) 23b (PASS)69.

The LCD substrate G disposed in the transfer unit (PASS) 69 is transported to the prebaking units (PREBAKE) 70, 71, 72 of the heat treatment unit block (TB) 34 and the heat treatment unit block (TB) 35 by the second transport device 36 Any one of the prebaking units (PREBAKE) 75, 76 is prebaked, and thereafter, it is transported to the cooling unit (COL) 74 of the heat treatment unit block (TB) 35 and cooled to a predetermined temperature. Furthermore, it is further transported to the transfer unit (PASS) 73 of the heat treatment unit block (TB) 35 by the second transport device 36 .

Thereafter, the LCD substrate G is transported to the extension/cooling stage (EXT·COL) 44 of the connection table 3 by the second transportation device 36, and is carried to external device components by the transportation device 42 of the connection table 3 as necessary. The peripheral exposure apparatus (EE) of 45 performs exposure for removing the peripheral portion (unnecessary portion) of the resist film therein. Next, the LCD substrate G is conveyed by the conveyance device 42 to the exposure device 4, where the resist film on the LCD substrate G is exposed in a predetermined pattern. In addition, once the LCD substrate G is housed in a buffer box on the buffer table (BUF) 43 , it may be transported to the exposure device 4 thereafter.

After the exposure is completed, the LCD substrate G is transported to the writing unit (TITLER) on the upper stage of the external device part 45 by the transport device 42 of the connection table 3, and the specified information is recorded on the LCD substrate G, and then placed On the extension · cooling table (EXT · COL) 44. The LCD substrate G is transported from the extension·cooling table (EXT·COL) 44 to the transfer unit (PASS) 73 of the heat treatment unit block (TB) 35 belonging to the second heat treatment unit part 27 by the second transport device 36 .

The LCD substrate G is transported from the pass unit (PASS) 73 to the development process unit (DEV) 24 by operating, for example, a roller transport mechanism extending from the pass unit (PASS) 73 to the development process unit (DEV) 24 . In the developing processing unit (DEV) 24, for example, while transporting the substrate in a horizontal posture, the developer is filled on the LCD substrate G, and thereafter, when the conveyance of the LCD substrate G is stopped, the LCD substrate is tilted at a predetermined angle. Here, the developing solution on the LCD substrate G is flowed and dropped, and the rinse solution is supplied to the LCD substrate G in this state, and the developing solution is rinsed and drained. Thereafter, the LCD substrate G is returned to a horizontal posture to start conveyance again, and the LCD substrate G is dried by blowing the LCD substrate G with drying nitrogen or air.

After the development process is completed, the LCD substrate G is transported from the development processing unit (DEV) 24 to the i-line UV irradiation unit (i-UV) 25 by a continuous transport mechanism, such as roller transport, and the LCD substrate G is decolorized. deal with. Thereafter, the LCD substrate G is transported to the transfer unit (PASS) 77 of the heat treatment unit block (TB) 37 belonging to the third heat treatment unit section 28 by the roller transport mechanism in the i-line UV irradiation unit (i-UV) 25 .

The LCD substrate G arranged in the transfer unit (PASS) 77 is transported to the post-baking units (POBAKE) 78, 79, 80 of the heat treatment unit block (TB) 37 and the heat treatment unit block (TB) 38 by the third transport device 39 Any one of the post-baking units (POBAKE) 81, 83, 84 to carry out post-baking treatment, thereafter, after it is transported to the transfer · cooling unit (PASS · COL) 82 of the heat treatment unit block (TB) 38 to make After cooling to a predetermined temperature, the LCD substrate G is housed in a predetermined cassette C arranged on the cassette table 1 by the transport device 11 of the cassette table 1 .

Next, the resist processing unit 23 will be described in detail. FIG. 5 is a schematic plan view of the resist processing unit 23 .

The resist coating device (CT) 23a is equipped with a table 12 provided with a plurality of gas injection ports 16a for injecting a predetermined gas at a predetermined position on the surface, and a substrate transport system for transporting the LCD substrate G in the X direction on the table 12. The mechanism 13 and the resist supply nozzle 14 supply a resist liquid to the surface of the LCD substrate G moving on the stage 12 . Moreover, the vacuum drying apparatus (VD) 23b is equipped with the mounting table 17 for mounting the LCD board|substrate G, and the chamber 18 which accommodates the LCD board|substrate G mounted on the mounting table 17. In addition, in the resist processing unit 23, there are provided not only from the resist coating device (CT) 23a to the vacuum drying device (VD) 23b, but also from the vacuum drying device (VD) 23b to the thermal processing unit. The transfer unit (PASS) 69 in the block (TB) 34 transfers the substrate transfer arm 19 of the LCD substrate G.

FIG. 6 is a cross-sectional view showing a schematic configuration of the substrate transport mechanism 13 . The substrate conveyance mechanism 13 is equipped with, the holding members 15a, 15b that hold a part of the Y direction end of the LCD substrate G; 15b and the connecting member 50 fitted to the linear guide rails 51a and 51b, and the X-axis drive mechanism 53 for reciprocating the connecting member 50 in the X direction.

The holding members 15a, 15b each have a structure provided with one or more suction flanges 48 for suction-holding the LCD substrate G on the pedestal unit 49, and by operating a decompression mechanism 52 such as a vacuum pump, the The suction flange 48 suctions and holds the LCD substrate G. As shown in FIG. The suction flange 48 holds the LCD substrate G on the rear side of the portion of the LCD substrate G where the resist solution is not applied, that is, the peripheral portion of the rear surface of the LCD substrate G. As the X-axis drive mechanism 53, for example, a belt drive mechanism, a roller, an air slider, an electric slider, and the like can be cited.

From upstream to downstream in the transport direction of the LCD substrate G, the stage 12 is divided into an introduction stage portion 12a, a coating stage portion 12b, and a carry-out stage portion 12c. The introduction table portion 12a is an area for conveying the LCD substrate G from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 to the coating table portion 12b. The resist supply nozzle 14 is arrange|positioned on the coating stage part 12b, and the coating liquid is supplied to the LCD board|substrate G here, and the coating film is formed. The carry-out stage part 12c is an area for carrying out the LCD substrate G on which the coating film was formed to the vacuum drying apparatus (VD) 23b.

7( a ) to ( c ) are explanatory diagrams schematically showing the transport form of the LCD substrate G in each of the introduction stage 12 a , coating stage 12 b , and carry-out stage 12 c .

As shown in Fig. 5 and Fig. 7 (a), on the introduction table portion 12a, a gas injection port 16a for injecting gases such as nitrogen and air from its surface to the top is provided at a predetermined position, so that the gas passing through the gas injection port 16a The ejected gas keeps the LCD substrate G in a substantially horizontal posture in a state of floating upward from the introduction table portion 12a. In order to improve the flatness of the LCD substrate G, it is preferable to reduce the diameter of the gas injection ports 16a or to increase the number of gas injection ports 16a arranged.

As shown in FIG. 5 and FIG. 7(b), in addition to the gas injection port 16a, an air suction port 16b is provided at a predetermined position on the surface of the coating table portion 12b. In the coating table portion 12b, by adjusting the gas injection amount from the gas injection port 16a and the gas suction amount from the suction port 16b, the LCD substrate G can be adjusted with higher precision than the introduction table portion 12a and the delivery table portion 12c. The height of the upward float.

As shown in FIG. 5 and FIG. 7( c), on the carry-out stage portion 12c, on the basis of the gas injection port 16a for floating the LCD substrate G upward, in order to transport the LCD substrate G to the carry-out stage portion 12c, Transferred to the substrate transport arm 19, there is also provided a lifting rod 47 for holding the LCD substrate G thereon.

In this way, in the resist coating device (CT) 23a, the LCD substrate G can be held in a state of being lifted upward by a predetermined distance from the table 12 . Therefore, a large force is not required to move the coupling member 50 to hold the LCD substrate G on the holding members 15a and 15b. In other words, a large torque is not required in the X drive mechanism 53 , so that the size of the substrate transport mechanism 13 can be reduced.

FIG. 8 shows a schematic perspective view of the resist supply nozzle 14 . The resist supply nozzle 14 has a structure in which a strip-shaped resist discharge port 14b for jetting out a resist liquid in a substantially strip-shaped manner is provided on a long box 14a extending in one direction. With the longitudinal direction of the box 14a aligned with the Y direction, the resist supply nozzle 14 can be freely raised and lowered by the nozzle elevating mechanism 30 on the nozzle holder arranged in the approximate center of the coating table portion 12b. part 20.

A sensor 29 for measuring the distance between the resist discharge port 14b and the LCD substrate G is attached to the resist supply nozzle 14, and the nozzle lift mechanism 30 controls the position of the resist supply nozzle 14 based on the measured value of the sensor 29. . The length of the resist supply nozzle 14 is smaller than the width (Y-direction length) of the LCD substrate G so that no coating film is formed in a certain area around the LCD substrate G.

On the surface of the mounting table 17 installed on the vacuum drying device (VD) 23b, a close-up support rod (not shown) for supporting the LCD substrate G is provided at a predetermined position. The chamber 18 has a structure divided into upper and lower parts consisting of a fixed lower container and a freely liftable upper cover. The substrate transport arm 19 can move in the X direction, the Y direction, and the Z direction (vertical direction).

Next, we describe the processing steps of the LCD substrate G in the resist processing unit 23 constituted as above. In addition, the transfer of the LCD substrate G from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 to the resist processing unit is performed by a roller transport mechanism using the rotation of the roller 46 provided on the transfer unit (PASS) 65. 23 shipping.

Initially, the holding members 15a and 15b stand by on the heat treatment unit block (TB) 32 side, and the LCD substrate G can be lifted up by a predetermined height in each unit on the stage 12 . Next, the LCD substrate G enters the introduction stage 12a from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 through the roller transport mechanism, and the LCD substrate G is placed in a state where a part of the LCD substrate G is still supported by the rollers 46. One end in the Y direction of the LCD substrate G is held by the holding members 15a, 15b. Next, the LCD substrate G is carried into the introduction table portion 12 a of the stage 12 by making the conveying speed by the rollers 46 coincide with the moving speeds of the holding members 15 a and 15 b. On the introduction stage portion 12a, for example, the LCD substrate G is conveyed in a state of being lifted up by 150 μm from its surface.

The LCD substrate G is transported into the coating table portion 12b as the holding members 15a, 15b are moved in the X direction by the driving of the substrate driving mechanism 13 . On the coating table portion 12b, by performing air suction from the air suction port 16b while performing gas injection from the gas injection port 16a, for example, the LCD substrate G can be raised from the surface to a height of about 40 μm. .

When the LCD substrate G passes under the resist supply nozzle 14, the resist liquid is sprayed from the resist supply nozzle 14 to the LCD substrate G to form a coating film. For example, the substrate conveyance speed on the coating table portion 12b can be 150 mm/sec. In this way, since the flatness of the LCD substrate G can be further improved by reducing the raised height of the LCD substrate, a coating film with a uniform thickness can be formed.

In addition, although it is also possible to adjust the height of the resist supply nozzle 14 for each LCD substrate G based on the measurement signal of the sensor 29, usually since the conveyance state of a plurality of LCD substrates G is the same, if the LCD substrate G to be processed initially is adjusted If the height of the resist supply nozzle 14 on the substrate G or the dummy substrate G is lower, there is little need to adjust the height of the resist supply nozzle 14 thereafter. In addition, the measurement signal of the sensor 29 may be used to determine the time selection of the discharge start/discharge end of the resist liquid from the resist supply nozzle 14, or another method may be provided to detect the position of the LCD substrate G. sensor, and the timing is determined based on a signal from the sensor.

With the movement of the holding members 15a and 15b, the LCD substrate G on which the coating film was formed by passing through the coating stage part 12b is conveyed to the carry-out stage part 12c. In the carry-out stage portion 12c, for example, the LCD substrate G is brought into a state of being lifted upward by 150 μm from the surface thereof. When the entire LCD substrate G reaches the carry-out table portion 12c, the suction holding by the holding members 15a and 15b is released, and the lifting rod 47 is raised to hold the LCD substrate G at a predetermined height.

Next, the substrate carrying arm 19 approaches the LCD substrate G held above by the lifting rod 47 . When the substrate transfer arm 19 holds the LCD substrate G at one end of the LCD substrate G in the Y direction, the lifting rod 47 is lowered. In addition, the substrate transport arm 19 places the held LCD substrate G on the stage 17 of the vacuum drying device (VD) 23b. Thereafter, the inside of the chamber 18 is depressurized by sealing the chamber 18 to dry the coating film under reduced pressure.

When the treatment in the vacuum drying device (VD) 23b of the LCD substrate G is completed, the chamber 18 is opened, and the substrate transport arm 19 is brought close to the LCD substrate G placed on the mounting table 17 to hold the LCD substrate G, And the LCD substrate G is transported to the transfer unit (PASS) 69 of the heat treatment unit block (TB) 34 . On the other hand, the holding members 15a, 15b after the LCD substrate G is handed over to the lifting rod 47 return to the side of the heat treatment unit block (TB) 32 in order to transport the LCD substrate G to be processed next time, and thereafter, the above-mentioned processing steps are repeated. .

In this coating film forming method, since the LCD substrate G is transported in a state of floating upward from the stage 12, transfer of the surface of the stage 12 does not occur, and particle adhesion to the back surface of the LCD substrate G can be suppressed. In addition, since the interval between applying the resist solution to the LCD substrate G can be shortened, high productivity can be obtained.

Thus, in this method of transporting the LCD substrate G in the resist coating apparatus (CT) 23a, the LCD substrate G is handed over to the lifting rod 47 of the carrying-out table portion 12c at the holding members 15a, 15b, and returned to the other side. The LCD substrate G to be processed next is not carried into the introduction stage 12a until it reaches the heat treatment unit block (TB) 32 side. Therefore, below we describe a further preferable substrate conveying mechanism equipped in the resist coating apparatus (CT) 23a.

FIG. 9 shows a plan view ( FIG. 9( a )) and a cross-sectional view ( FIG. 9( b )) of a schematic configuration of another substrate transport mechanism provided in the resist coating device (CT) 23 a. This substrate conveyance mechanism 55 has the holding member 85a, 85b that holds the Y direction one end of LCD substrate G; , 85b are movable bodies 86a, 86b that are slidably held in the Y direction; and X-axis drive mechanisms 53a, 53b that can move the movable bodies 85a, 85b to the other X direction, respectively.

The holding members 85a, 85b each have an elongated shape along the X direction and are provided with a plurality of suction flanges 48 so that one end of the LCD substrate G in the Y direction can be held over a wide range in the X direction. Thus, even if the LCD substrate G is individually held on the holding members 85a, 85b and the holding members 85a, 85b are moved in the X direction, deviation of the LCD substrate G in the Y direction can be prevented, and the LCD can be transported stably. The pose of the substrate G. In addition, the holding members 85a and 85b are each slidable in the Y direction by a Y direction slide mechanism not shown.

FIG. 10 is an explanatory diagram schematically showing the transport form of the LCD substrate G by the substrate transport mechanism 55 . Initially, the holding member 85b is arranged at a position away from the Y direction so as not to be in contact with the LCD substrate G brought into the introduction stage 12a, while the holding member 85a is arranged on the introduction stage 12a to hold the LCD. The LCD substrate G carried into the introduction stage 12a is held by the holding member 85a at the position of one end of the substrate G in the Y direction. (Fig. 10(a)).

Next, the holding member 85a is moved in the X direction, and the LCD substrate G is carried into the coating table portion 12b, where a coating film is formed. In addition, if the LCD substrate G as a whole is transported into the coating stage portion 12b, the LCD substrate G that can be transported into the next process in the introduction stage portion 12a can be held by moving the holding member 85b onto the introduction stage portion 12a. The position of one end in the Y direction of the LCD substrate G ( FIG. 10( b )).

Next, the holding member 85b holds the LCD substrate G' newly carried into the introduction stage 12a, and starts conveyance to the coating stage 12b. On the other hand, the holding member 85a transports the LCD substrate G on which the coating film has been formed to the stage unit 12c, and delivers it to the lifting rod 47 there ( FIG. 10( c )). Thereafter, the holding member 85a is returned to the introduction stage 12a side in a state away from the stage 12 so as not to collide with the LCD substrate G' conveyed by the holding member 85b ( FIG. 10( d )). Next, if the LCD substrate G' held in the holding member 85b is carried in as a whole to the coating stage 12b, a new LCD substrate G is to be carried in to the introducing stage 12a, so that the holding member 85a is moved to a position where it can hold At one end of the LCD substrate G in the Y direction. Thereafter, the holding members 85a, 85b repeat the same operation as that of the above-mentioned holding member 85a.

Next, we describe another substrate transport mechanism. FIG. 11 is a cross-sectional view showing a schematic structure of another substrate transport mechanism provided in the resist coating device (CT) 23a. This substrate transport mechanism 56 has linear guide rails 51a to 51d arranged in pairs on the Y-direction side surface of the table 12; moving bodies 88a to 88d respectively fitted to the linear guide rails 51a to 51d; The lifting mechanism 89a, 89b on the upper; the holding parts 15a, 15b respectively held on the lifting mechanism 89a, 89b; the holding parts 15c, 15d respectively arranged on the moving body 88c, 88d; Y-axis drive mechanisms 89c and 89d that slide; and X-axis drive mechanisms 53a to 53d that slide the movable bodies 88a to 88d in the X direction, respectively.

FIG. 11( a ) shows a state where the LCD substrate G is held by a set of holding members 15 a and 15 b , and FIG. 11 ( b ) shows a state where the LCD substrate G is held by a set of holding members 15 c and 15 d. When the holding parts 15a, 15b convey the LCD substrate G, in order to make the respective movements of the holding parts 15a, 15b be carried out in the vertical plane S (refer to FIG. 11(a)), the X-axis driving mechanisms 53a, 53b and Driving of the lifting mechanism 89a, 89b. When the holding members 15c and 15d transport the LCD substrate G, the X-axis drive mechanisms 53c and 53d and the Y-axis drive mechanisms 89c and 89d are controlled in the same manner.

FIG. 12 is an explanatory diagram showing the operation of the holding members 15a to 15d. First, when holding the LCD substrate G conveyed from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 to the introduction stage 12a with the holding members 15a, 15b, the holding members 15c, 15d are placed away from each other in the Y direction. The state of the station 12 (FIG. 12(a)).

When the holding members 15a, 15b hold the LCD substrate G, the holding members 15a, 15b are moved toward the coating table portion 12b side to coat the resist liquid on the LCD substrate G. FIG. On the other hand, next, the holding members 15c and 15d are brought close to the table 12 so that the holding members 15c and 15d can receive the LCD substrate G conveyed from the transfer unit (PASS) 65 ( FIG. 12( b )).

The holding members 15a and 15b holding the LCD substrate G on which the coating film has been formed move to the carry-out stage 12c, where the held LCD substrate G is handed over to the lifting rod 47 (not shown in FIG. 12 ). . On the other hand, the holding members 15c, 15d hold the LCD substrate G' conveyed from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 to the introduction stage 12a, and start moving to the coating stage 12b side (Fig. 12(c)).

Next, after the holding members 15a, 15b are lowered to a position lower than the holding members 15c, 15d, it is returned to the side of the introduction table portion 12a in this state (please refer to FIG. 11(b)), and thereafter, the holding member 15a is adjusted. , The height position of 15b makes it possible to hold a new LCD substrate. On the other hand, the holding members 15c and 15d convey the LCD substrate G' to the side of the coating stage 12b, and form a coating film on the LCD substrate G' (FIG. 12(d)).

Reaching the holding members 15c and 15d of the carry-out stage portion 12c, the LCD substrate G′ held in the carry-out stage portion 12c is handed over to the lifting rod 47 (shown in FIG. 12 ). In addition, the holding members 15a, 15b hold the LCD substrate G″ conveyed from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 to the introduction stage 12a, and start moving to the coating stage 12b side (FIG. 12 (e)).

Next, keep the holding members 15c, 15d away from the stage 12, and then return to the side of the introduction stage 12a in this state (Fig. Substrate G. In the case of using such substrate conveyance mechanisms 55 and 56, since LCD substrates can be conveyed continuously for coating film formation processing, high productivity can be obtained.

As mentioned above, although embodiment of this invention was described, this invention is not limited to this form. For example, the conveyance of the LCD substrate G from the transfer unit (PASS) 65 of the heat treatment unit block (TB) 32 to the resist coating device (CT) 23a may be provided with a substrate transfer arm on the transfer unit (PASS) 65 , and a lifting rod is provided on the introduction table part 12a, so that by handing over the LCD substrate held by the substrate transport arm to the lifting rod and lowering the lifting rod, the LCD is placed near the surface of the introduction table part 12a. The substrate G is held by the holding members 15a, 15b and the like.

In addition, although the holding members 15a, 15b are shown in the form in which the LCD substrate G is pulled while holding the front part in the carrying direction, the holding members 15a, 15b may be pushed while holding the rear part in the carrying direction. The LCD substrate G is transported in the same way as the LCD substrate G. In addition, in the substrate transport mechanism 56, although the holding members 15c and 15d are slidable in the Y direction, the holding members 15c and 15d may be between the height at which the LCD substrate G is transported and a position higher than the height at which the LCD substrate G is transported. A structure that moves up and down freely. Thereby, the holding members 15a, 15b and the holding members 15c, 15d do not collide, and the LCD substrate G can be transported alternately on them. In the above description, the resist film as the coating film was taken out, but the coating film is not limited thereto, and may be an antireflection film, an insulating film having no photosensitivity, or the like.

The present invention is applicable to a resist film forming apparatus and a resist film forming method for forming a resist film on a large substrate such as an LCD substrate.

Claims (13)

1. A coating film forming apparatus that supplies a predetermined coating liquid to the substrate while conveying the substrate in one direction to form a coating film, wherein: The device has: a table provided with a plurality of gas injection ports for injecting prescribed gas at prescribed positions on the surface; a substrate transport mechanism that transports substrates in one direction on the stage; supplying a prescribed coating liquid to a coating liquid supply nozzle on the surface of the substrate moving on the stage, The substrate is transported by the substrate transport mechanism in a state of floating upward from the surface of the table in a substantially horizontal posture by injecting gas from the gas injection port. 2. The coating film forming apparatus according to claim 1, wherein: The station has: a coating stage to supply coating liquid from the coating liquid supply nozzle; an introduction station for transporting substrates into said coating station; a carry-out stage for carrying out substrates from the coating stage, The coating platform also has an air suction port at a predetermined position on its surface, On the coating stage, by adjusting the amount of gas injection from the gas injection port and the amount of gas suction from the suction port, the floating height of the conveyed substrate is adjusted. 3. The coating film forming apparatus according to claim 1 or 2, wherein: The substrate transport mechanism has: a retaining member that retains the substrate; and a slide mechanism that moves said holding member in a prescribed direction, The holding member suction-holds the substrate near both ends in a direction perpendicular to the substrate conveyance direction. 4. The coating film forming apparatus according to claim 3, wherein: The device is provided with 2 sets of the holding members, The slide mechanism alternately transports substrates to the 2 sets of holding members. 5. The coating film forming apparatus according to claim 1 or claim 2, wherein: The substrate transport mechanism has: holding means for holding the substrate; a slide mechanism that moves said holding member in a prescribed direction, The holding member suction-holds the substrate at one end in a direction perpendicular to the substrate transport direction. 6. The coating film forming apparatus according to claim 5, wherein: The holding member is configured to be independently drivable on both sides of the direction perpendicular to the substrate conveying direction, The sliding mechanism alternately transports the substrates to the holding members. 7. The coating film forming apparatus according to claim 1 or 2, wherein: The device also has: a reduced-pressure drying device for drying the coating film formed on the substrate under reduced pressure, provided on the downstream side of the table in the substrate conveying direction; The substrate transported to the carry-out stage is received from the holding member, and transported to another substrate transport mechanism of the reduced-pressure drying apparatus. 8. The coating film forming apparatus according to claim 1 or 2, wherein: The coating liquid supply nozzle has a slit-shaped coating liquid discharge port that extends in a direction perpendicular to the substrate conveyance direction and discharges the coating liquid in a strip shape. 9. The coating film forming apparatus according to claim 8, wherein: The device also has: a sensor for measuring a distance between a substrate surface moving directly under the coating liquid supply nozzle and a coating liquid discharge port of the coating liquid supply nozzle; A nozzle raising and lowering mechanism that lifts and lowers the coating liquid supply nozzle so that the coating liquid supply nozzle is arranged at a predetermined height position based on the measured value of the sensor. 10. A method for forming a coating film, wherein a coating liquid is supplied to the substrate while transporting the substrate in one direction, thereby forming a coating film, characterized in that, The methods include: a step of holding a part of the periphery of the substrate, and floating the substrate in a substantially horizontal posture on a stage on which a predetermined gas is ejected from the surface; and A step of supplying a predetermined coating liquid to the substrate while being transported in one direction on the stage while maintaining the substrate in a floating state to form a coating film. 11. The coating film forming method according to claim 10, wherein: During supply of the coating liquid to the substrate, when the gas is sprayed from the surface of the stage, suction is performed from the surface of the stage simultaneously, thereby adjusting the height at which the substrate floats upward from the stage. 12. The coating film forming method according to claim 10 or 11, wherein The substrates are conveyed continuously by a plurality of independently driven substrate conveying mechanisms. 13. The coating film forming method according to claim 10 or 11, wherein: The coating liquid is supplied to the substrate in a substantially strip shape extending in a direction perpendicular to the substrate conveying direction.

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