CN1313331C - Clean container structure - Google Patents
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- CN1313331C CN1313331C CNB2004100748837A CN200410074883A CN1313331C CN 1313331 C CN1313331 C CN 1313331C CN B2004100748837 A CNB2004100748837 A CN B2004100748837A CN 200410074883 A CN200410074883 A CN 200410074883A CN 1313331 C CN1313331 C CN 1313331C
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Abstract
Description
技术领域technical field
本发明涉及一种洁净容器结构,尤指一种适用于合理化荷重承载作用力传递方式、并可提高结构强度与精度、气密性、及静电防护的洁净容器结构。The invention relates to a clean container structure, in particular to a clean container structure which is suitable for rationalizing the transmission mode of load-carrying force, and can improve structural strength and precision, air tightness, and electrostatic protection.
背景技术Background technique
目前半导体厂所生产的晶圆片往往是容纳并水平排列于一晶舟内,此晶舟具有多个支撑凸缘而可用以插置多个晶圆片,此晶舟可再组设于一洁净容器本体的下侧板上,之后再通过洁净容器本体的盒盖加以罩盖以保护各个晶圆片,使其于生产制造的传送、储放及载卸的过程中,保持超高洁净度的环境,而不会受到微粒粉尘的污染。At present, the wafers produced by the semiconductor factory are often accommodated and arranged horizontally in a wafer boat. The wafer boat has a plurality of supporting flanges and can be used to insert multiple wafers. The lower side plate of the clean container body is then covered by the cover of the clean container body to protect each wafer, so that it can maintain ultra-high cleanliness during the process of transmission, storage, loading and unloading during production and manufacturing environment without being polluted by particulate dust.
请参阅图1,其是公知洁净容器结构的立体分解图,其中显示有一洁净容器本体91、一上取付板92、以及一晶舟93,且洁净容器本体91的上侧板911开设有一上组设孔913、下侧板912开设有一下组设孔914,而晶舟93则是由下组设孔914置入并容置于洁净容器本体91的内部容室910内,且上取付板92再穿经上组设孔913而与晶舟93的顶部931相互组设。Please refer to Fig. 1, which is a three-dimensional exploded view of a known clean container structure, wherein a clean container body 91, an upper board 92, and a wafer boat 93 are shown, and an upper side plate 911 of the clean container body 91 is provided with an upper group The hole 913 and the lower side plate 912 are provided with a lower set of holes 914, and the crystal boat 93 is inserted into the inner chamber 910 of the clean container body 91 by the lower set of holes 914, and the upper plate 92 is taken out. Then pass through the upper assembly hole 913 to be assembled with the top 931 of the wafer boat 93 .
然而,直接于洁净容器本体91的上侧板911与下侧板912直接开设有一上组设孔913与一下组设孔914的设计方式,不仅于制造上及组装上非常不易且成本高昂,且亦容易造成洁净容器本体91的结构强度受到破坏。此外,洁净容器本体91的开孔过多且面积过大,其内部容室910的气密性亦容易受到影响,因而容易造成外界水气或是微尘粒子进入,并非十分理想,仅能增设气密垫圈以强化其气密效果。此外,由于洁净容器本体91等组件的死角过多,容易造成其利用相关清洗设备进行清洗时,清洗及烘干不易的现象。However, the design in which an upper assembly hole 913 and a lower assembly hole 914 are directly provided on the upper side plate 911 and the lower side plate 912 of the clean container body 91 is not only difficult and expensive to manufacture and assemble, but also It is also easy to cause the structural strength of the clean container body 91 to be damaged. In addition, the clean container body 91 has too many openings and the area is too large, and the airtightness of the inner chamber 910 is also easily affected, so it is easy to cause external moisture or dust particles to enter, which is not very ideal, and can only be added. Airtight gasket to strengthen its airtight effect. In addition, since there are too many dead angles in components such as the clean container body 91 , it is easy to make cleaning and drying difficult when using related cleaning equipment for cleaning.
发明内容Contents of the invention
本发明的主要目的是在提供一种洁净容器结构,使能提高洁净容器本体的结构强度,且承载荷重时作用力传递方式较佳,洁净容器于自动化传送时,不会因荷重产生变形而影响精度,同时可维持洁净容器本体内部容室的气密性,还可提供静电防护的效果,并易于清洗、烘干等维护作业。The main purpose of the present invention is to provide a clean container structure, which can improve the structural strength of the clean container body, and the force transmission mode is better when the load is heavy, and the clean container will not be affected by deformation due to the load when it is automatically transported. Precision, while maintaining the airtightness of the inner chamber of the clean container body, it can also provide the effect of electrostatic protection, and it is easy to clean, dry and other maintenance operations.
为达到上述目的,本发明的洁净容器结构主要包括有一洁净容器本体、一支撑架、一上取付板、以及一下取付板。其中,洁净容器本体还包括有一内部容室、一前侧开口、一上板、以及一下板,且于上板贯设有数个通孔,于下板贯设有数个穿孔。In order to achieve the above purpose, the clean container structure of the present invention mainly includes a clean container body, a support frame, an upper take-off plate, and a lower take-off plate. Wherein, the clean container body also includes an inner chamber, a front opening, an upper plate, and a lower plate, and several through holes are formed on the upper plate, and several through holes are formed on the lower plate.
此外,支撑架是容设于上述洁净容器本体的内部容室内部,且此支撑架包括有一上横板、以及二侧板,其中的二侧板是分别由上横板的二侧向下延伸,而上横板的上方还向上凸设有数个上固定结构,二侧板的底部还分别向下凸设有数个下固定结构,且二侧板还分别包括有一内侧面,于二内侧面上还分别设有数条插槽。In addition, the support frame is accommodated in the inner chamber of the above-mentioned clean container body, and the support frame includes an upper horizontal plate and two side plates, wherein the two side plates extend downward from the two sides of the upper horizontal plate respectively. , and the top of the upper horizontal plate is also protruding upwards with several upper fixing structures, and the bottom of the two side plates is respectively protruding downwards with several lower fixing structures, and the two side plates also include an inner surface respectively, on the two inner surfaces There are also several slots respectively.
另外,上取付板是设置于上述洁净容器本体上板的上方,且此上取付板包括有数个上固定组件,其是分别对应穿经洁净容器本体上板的数个通孔且分别固定于支撑架上横板的数个上固定结构。而下取付板则是设置于上述洁净容器本体下板的下方,且此下取付板包括有数个下固定组件,其是分别对应穿经洁净容器本体下板的数个穿孔分别固定于支撑架二侧板底部的数个下固定结构。In addition, the upper take-off plate is arranged above the upper plate of the clean container body, and the upper take-off plate includes several upper fixing components, which respectively correspond to several through holes passing through the upper plate of the clean container body and are respectively fixed on the support Several upper fixing structures of the horizontal plates on the frame. The lower take-off plate is arranged under the lower plate of the above-mentioned clean container body, and the lower take-off plate includes several lower fixing components, which are respectively fixed to the two supporting frames corresponding to several perforations passing through the lower plate of the clean container body. Several lower fixing structures at the bottom of the side panels.
由上述可知,本发明的支撑架可由洁净容器本体的前侧开口直接置入并容设于洁净容器本体的内部容室内部,因此,本发明的洁净容器本体并无须如公知技术般再于其它位置开设开孔以作为组装时容置支撑架之用,于此情形下,洁净容器本体不仅于制造上以及组装上极为方便,承载荷重时作用力传递方式较为优异,且洁净容器本体的结构强度亦不会受到破坏,有助于洁净容器于自动化传送时,不会因荷重产生变形而影响支撑架插槽位置精度。同时,于洁净容器本体开孔面积减少的情形下,亦可维持洁净容器本体内部容室的气密性,有效隔离外界水气或是微尘粒子进入洁净容器本体,还可提高洁净容器因功能或制造工艺需求须进行惰性气体充填时的保持效果。此外,支撑架更因模块化的组设方式与创新概念,对洁净容器本体整体的制作质量、材料选用的弹性、与生产成本的降低,皆有显著的效益。As can be seen from the above, the support frame of the present invention can be directly inserted into and accommodated in the inner chamber of the clean container body through the front opening of the clean container body. A hole is set at the position for accommodating the support frame during assembly. In this case, the clean container body is not only very convenient in manufacture and assembly, but also has an excellent force transmission method when bearing a heavy load, and the structural strength of the clean container body It will also not be damaged, which helps clean containers not be deformed due to load and affect the position accuracy of the support frame slot during automatic transmission. At the same time, when the opening area of the clean container body is reduced, the airtightness of the inner chamber of the clean container body can also be maintained, effectively isolating external moisture or dust particles from entering the clean container body, and the function of the clean container can also be improved. Or the maintenance effect when the manufacturing process needs to be filled with inert gas. In addition, due to the modular assembly method and innovative concept of the support frame, it has significant benefits on the overall production quality of the clean container body, the flexibility of material selection, and the reduction of production costs.
另外,上述用以承载晶圆片的支撑架可以使用导电材质所制成,如此即可形成一静电防护功能(Electrostatic Discharge,ESD),因此,对于洁净容器本体与支撑架的静电防护功能亦可获得良好的建立。In addition, the above-mentioned supporting frame for carrying the wafer can be made of conductive material, so that an electrostatic protection function (Electrostatic Discharge, ESD) can be formed. Therefore, the electrostatic protection function of the clean container body and the supporting frame can also be used. Get a good build.
又本发明的支撑架尚可于其二侧板的底部连接有一下横板。此外,前述的支撑架其上横板、二侧板、与下横板则可以一体成形方式制造。The bracing frame of the present invention can still be connected with a horizontal plate at the bottom of its two side plates. In addition, the upper horizontal plate, the two side plates, and the lower horizontal plate of the aforementioned support frame can be manufactured in an integrated manner.
附图说明Description of drawings
图1是公知洁净容器结构的立体分解图。Fig. 1 is a three-dimensional exploded view of a known clean container structure.
图2是本发明第一较佳实施例的立体分解图。Fig. 2 is an exploded perspective view of the first preferred embodiment of the present invention.
图3是本发明第一较佳实施例的立体组合图。Fig. 3 is a three-dimensional assembled view of the first preferred embodiment of the present invention.
图4是图3的固定结构与固定组件的剖面图。FIG. 4 is a cross-sectional view of the fixing structure and the fixing assembly in FIG. 3 .
图5是本发明第二较佳实施例的立体分解图。Fig. 5 is an exploded perspective view of the second preferred embodiment of the present invention.
图6是本发明第二较佳实施例的立体组合图。Fig. 6 is a three-dimensional assembled view of the second preferred embodiment of the present invention.
其中,附图标记说明如下:Wherein, the reference signs are explained as follows:
1洁净容器本体 11内部容室 12前侧开口1
13上板 131通孔 14下板13
141穿孔 15左侧板 151左侧握把141
16右侧板 2支撑架 21上横板16
211上固定结构 212扣合孔 22侧板211
221底部 222下固定结构 223顶部221
224扣合勾 225内侧面 226插槽224
3上取付板 31上固定组件 311上螺栓3 Upper take-
312上贯孔 4下取付板 41下固定组件312 upper through holes 4 lower take-
411下螺栓 412下贯孔 5支撑架411
51上横板 52侧板 521底部51 upper horizontal plate 52 side plate 521 bottom
53下横板 61,62晶圆片 7 O形环53 lower horizontal plates 61, 62 wafers 7 O-rings
8接地件8 grounding piece
具体实施方式Detailed ways
为使本发明的技术内容得到更进一步的了解,特举二较佳具体实施例说明如下。In order to further understand the technical content of the present invention, two preferred specific embodiments are illustrated as follows.
请同时参阅图2是本发明第一较佳实施例的立体分解图、图3是本发明第一较佳实施例的立体组合图、及图4是图3的固定结构与固定组件的剖面图,其中显示有一洁净容器结构,其包括有一洁净容器本体1、一支撑架2、一上取付板3、以及一下取付板4。Please also refer to FIG. 2 which is an exploded perspective view of the first preferred embodiment of the present invention, FIG. 3 is a perspective combined view of the first preferred embodiment of the present invention, and FIG. 4 is a sectional view of the fixing structure and fixing components of FIG. 3 , which shows a clean container structure, which includes a clean container body 1, a
所附附图中的洁净容器本体1还包括有一内部容室11、一前侧开口12、一上板13、一下板14、一左侧板15、以及一右侧板16,于左侧板15的外侧组设有一左侧握把151,于右侧板16的外侧相对组设有一右侧握把(图未示),且于上板13贯设有数个通孔131,于下板14的二侧贯设有数个穿孔141。The clean container body 1 among the accompanying drawings also includes an
此外,附图中的支撑架2于本实施例中是为一用以插置晶圆片61的晶舟,且其是由洁净容器本体1的前侧开口12直接置入并容设于洁净容器本体1的内部容室11内部,且此支撑架2包括有一上横板21、以及二侧板22,其中的二侧板22是分别由上横板21的二侧向下延伸,且此二侧板22分别包括有一内侧面225,于二内侧面225上则分别设有数条插槽226,其是用以插置数个晶圆片61。而上横板21的上方向上凸设有数个上固定结构211,二侧板22的底部221分别向下凸设有数个下固定结构222,且于本实施例中,上固定结构211与下固定结构222分别使用一螺孔。In addition, the
另外,附图中的上取付板3设置于洁净容器本体1上板13的上方,且此上取付板3包括有数个上固定组件31,于本实施例中,每一上固定组件31分别包括有一上螺栓311、以及一上贯孔312,每一上螺栓311则分别穿经每一上贯孔312与洁净容器本体1上板13的每一通孔131,并再对应螺锁于支撑架2上横板21的每一上固定结构211的螺孔。In addition, the upper take-
同样的,下取付板4是设置于洁净容器本体1下板14的下方,且此下取付板4的二侧分别包括有数个下固定组件41,于本实施例中,每一下固定组件41分别包括有一下螺栓411、以及一下贯孔412,每一下螺栓411则分别穿经每一下贯孔412与洁净容器本体1下板14的每一穿孔141,并再对应螺锁于支撑架2二侧板22底部221的每一下固定结构222的螺孔。Similarly, the lower take-off plate 4 is arranged under the
于上述组装过程中,左侧握把151与右侧握把(图未示)分别与下取付板4之间连接有一左接地件8与一右接地件(图未示),其分别是由导电材质所制成,且左侧握把151、右侧握把(图未示)亦由导电材质所制成。此外,于每一上固定组件31与每一上固定结构211之间、以及于每一下固定组件41与每一下固定结构222之间,可分别组设有三个O形环7,其可用以密封洁净容器本体1的内部容室11而形成气密。In the above-mentioned assembly process, a
另上述结构于组装完成后,上、下取付板3,4与支撑架2之间是彼此直接组设而可形成一体受力的情形,如此当施力于上取付板3时,是直接由支撑架2受力而与洁净容器本体1无关,故可避免洁净容器本体1因为受不当外力而造成变形而影响支撑架的精度功能或损坏的问题。In addition, after the above-mentioned structure is assembled, the upper and lower take-off
由上述可知,支撑架2是直接由洁净容器本体1的前侧开口12置入并容设于洁净容器本体1的内部容室11内部,因此,洁净容器本体1无须如公知技术般再于其它位置开设开孔以作为容置支撑架2之用,于此情形下,洁净容器本体1不仅于制造上以及组装上皆极为方便,且洁净容器本体1的结构强度亦不会受到破坏,同时,于洁净容器本体1开孔面积减少的情形下,亦可维持洁净容器本体1内部容室11的气密性,而可避免外界水气或是微尘粒子进入洁净容器本体1。此外,支撑架2更因模块化的组设方式与创新概念,对洁净容器本体1整体的制作质量、材料选用的弹性、与生产成本的降低,皆有显著的效益。另外,由于洁净容器本体1的开孔面积已大为减少,相对使其不会产生死角过多的问题,因此于利用相关清洗设备进行清洗时,可易于清洗以及烘干。From the above, it can be seen that the
请再参阅图2,于本实施例中,上述的支撑架2的上横板21的二侧是分别包括有二扣合孔212,且二侧板22的顶部223分别包括有二扣合勾224,其是可分别对应扣合于上横板21二侧的二扣合孔212,亦即上横板21与二侧板22于本实施例中是采用分件方式设计,当然亦可以一体成形方式设计。Please refer to FIG. 2 again. In this embodiment, the two sides of the upper
请再参阅图3,上述用以承载晶圆片61的支撑架2于本实施例中是使用聚醚酰亚胺加碳纤(Polyetherimide,PEI & Carbon Fiber)的导电材质所制成,借此即可形成一静电防护功能(Electrostatic Discharge,ESD),当然亦可使用聚醚醚酮加碳纤(Polyetheretherketon,PEEK & Carbon Fiber)等其它等效材质。通过前述设计方式,洁净容器本体1与支撑架2的静电防护功能亦可获得良好的建立。当然,上、下取付板3,4亦可使用导电材质所制成,如此可进一步增加静电防护功能。同时,左侧握把151与右侧握把(图未示)可配合亦由导电材质所制成的左、右接地件8而增加其静电防护功能。Please refer to FIG. 3 again, the above-mentioned
请同时参阅图5是本发明第二较佳实施例的立体分解图、及图6是本发明第二较佳实施例的立体组合图,其主要结构皆与上述第一较佳实施例相同,差别仅在于本实施例中用以承载晶圆片62的支撑架5还包括有一下横板53,此下横板53是连接于支撑架5二侧板52的底部521,且此支撑架5的上横板51、二侧板52、与下横板53是以一体成形方式制造。当然,前述的上横板51、二侧板52、与下横板53亦可如同上述第一较佳实施例以分件方式制造。Please also refer to Fig. 5, which is a three-dimensional exploded view of the second preferred embodiment of the present invention, and Fig. 6, which is a three-dimensional assembly view of the second preferred embodiment of the present invention, and its main structure is the same as that of the above-mentioned first preferred embodiment, The only difference is that the support frame 5 used to carry the wafer 62 in this embodiment also includes a lower horizontal plate 53, which is connected to the bottom 521 of the two side plates 52 of the support frame 5, and the support frame 5 The upper horizontal plate 51, the two side plates 52, and the lower horizontal plate 53 are manufactured in an integral molding manner. Of course, the above-mentioned upper horizontal plate 51 , the two side plates 52 , and the lower horizontal plate 53 can also be manufactured in a separate way as in the above-mentioned first preferred embodiment.
上述实施例仅是为了方便说明而举例而已,本发明所主张的权利范围自应以权利要求所述为准,而非仅限于上述实施例。本发明的承载物自然亦不限于半导体,如晶圆片,其它如光罩、玻璃基板等需要洁净制造工艺环境的产品皆是其应用。The above-mentioned embodiments are only examples for convenience of description, and the scope of rights claimed by the present invention should be determined by the claims, rather than limited to the above-mentioned embodiments. The carrier of the present invention is naturally not limited to semiconductors, such as wafers, and other products such as photomasks and glass substrates that require a clean manufacturing process environment are all used.
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2004100748837A CN1313331C (en) | 2004-08-30 | 2004-08-30 | Clean container structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100748837A CN1313331C (en) | 2004-08-30 | 2004-08-30 | Clean container structure |
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| CN1743248A CN1743248A (en) | 2006-03-08 |
| CN1313331C true CN1313331C (en) | 2007-05-02 |
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| CNB2004100748837A Expired - Fee Related CN1313331C (en) | 2004-08-30 | 2004-08-30 | Clean container structure |
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| CN109841548B (en) * | 2017-11-27 | 2021-09-17 | 北京北方华创微电子装备有限公司 | Transfer chamber and semiconductor processing equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5482161A (en) * | 1994-05-24 | 1996-01-09 | Fluoroware, Inc. | Mechanical interface wafer container |
| CN1378515A (en) * | 1999-07-08 | 2002-11-06 | 恩特格里斯公司 | Transport module with latching door |
| WO2003042073A1 (en) * | 2001-11-14 | 2003-05-22 | Entegris, Inc. | Wafer support attachment for a semi-conductor wafer transport container |
| EP1339097A2 (en) * | 1999-04-20 | 2003-08-27 | Shin-Etsu Polymer Co., Ltd. | Wafer container box |
| US20040074808A1 (en) * | 2002-07-05 | 2004-04-22 | Entegris, Inc. | Fire retardant wafer carrier |
-
2004
- 2004-08-30 CN CNB2004100748837A patent/CN1313331C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5482161A (en) * | 1994-05-24 | 1996-01-09 | Fluoroware, Inc. | Mechanical interface wafer container |
| EP1339097A2 (en) * | 1999-04-20 | 2003-08-27 | Shin-Etsu Polymer Co., Ltd. | Wafer container box |
| CN1378515A (en) * | 1999-07-08 | 2002-11-06 | 恩特格里斯公司 | Transport module with latching door |
| WO2003042073A1 (en) * | 2001-11-14 | 2003-05-22 | Entegris, Inc. | Wafer support attachment for a semi-conductor wafer transport container |
| US20040074808A1 (en) * | 2002-07-05 | 2004-04-22 | Entegris, Inc. | Fire retardant wafer carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1743248A (en) | 2006-03-08 |
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