CN1312735C - Ball attaching device used to attach multiple solder balls to a chip - Google Patents
Ball attaching device used to attach multiple solder balls to a chip Download PDFInfo
- Publication number
- CN1312735C CN1312735C CNB031540333A CN03154033A CN1312735C CN 1312735 C CN1312735 C CN 1312735C CN B031540333 A CNB031540333 A CN B031540333A CN 03154033 A CN03154033 A CN 03154033A CN 1312735 C CN1312735 C CN 1312735C
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- Prior art keywords
- ball
- chip
- planting device
- pond
- tin
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- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title abstract description 7
- 239000011324 bead Substances 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 64
- 239000004744 fabric Substances 0.000 claims description 24
- 239000012634 fragment Substances 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 9
- 239000011435 rock Substances 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 24
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The invention provides a ball-planting device for adhering a plurality of solder balls to a chip, which comprises a porous plate and a positioner. The multi-hole plate is provided with a plurality of bead distribution holes, each bead distribution hole is used for accommodating a solder ball, the positioner is used for fixing the chip below the multi-hole plate, and the chip is coated with a layer of adhesive for adhering the solder balls in the bead distribution holes to the chip.
Description
Technical field
The invention provides a kind of ball-planting device, refer to a kind of ball-planting device that is used for a plurality of tin balls (solder ball) are attached to chip especially.
Background technology
In recent years, along with the fast-developing of electronics technology and be accompanied by LSI, VLSI, and the appearance in succession of ULSI etc., make the density of single silicon improve constantly.Because the rapid increase of I/O number of pins, the power that each silicon consumed also improves thereupon, so passing dual in-line package (Dualin-line Package, DIP), quad flat package (Quad Flat Package even, QFP) actual needs can not have been satisfied, yet this breach has in time been filled up in the appearance of ball lattice type array package (Ball Grid Array Package, BGA Package).
Please refer to Fig. 1, Fig. 1 is the generalized section of existing sphere grid array encapsulation 10, sphere grid array encapsulation 10 comprises a substrate (substrate) 12, substrate 12 comprises a copper conductor layer (Cu trace layer) 16 and is located at the downside of substrate 12, a plurality of tin ball bonding connection pads (solder ball pad) 14 are located at the surface of copper conductor layer 16, and an anti-welding lacquer (solder mask) 18 covers copper conductor layer 16 surfaces outside the tin ball bonding connection pad 14.Tin ball bonding connection pad 14 is made on the surface of copper conductor layer 16, and utilizes anti-welding lacquer 18 to be used as insulating barrier.After sphere grid array encapsulation 10 was finished, (print circuit board PCB) on 22, made sphere grid array encapsulation 10 be electrically connected with printed circuit board (PCB) 22 to utilize a plurality of tin balls 20 that packaging body 10 is fixed in a printed circuit board (PCB).The composition of tin ball is the alloy of 63% tin and 37% lead.
The major advantage of sphere grid array encapsulation is:
1), thereby improved the qualification rate of assembling finished product though the I/O number of pins of sphere grid array encapsulation increases, and pin-pitch is much larger than the pin-pitch of QFP;
2) number of pins of the unit are of sphere grid array encapsulation is many than the number of pins of the unit are of QFP, that is to say, if the sphere grid array encapsulation has identical number of pins with QFP, the area of sphere grid array encapsulation can be littler than the area of QFP;
3) though the power consumption of sphere grid array encapsulation is big than QFP, but the sphere grid array encapsulation can be by the welding method of control collapsed chip connection method (Controlled-Collapse-Chip Connection), be called for short the C4 welding, improve the electric property of sphere grid array encapsulation;
4) thickness of sphere grid array encapsulation reduces over halfly than the thickness of QFP, and the weight of sphere grid array encapsulation more can alleviate than the weight of QFP and reaches more than 3/4;
5) sphere grid array encapsulate applicable frequency far beyond the applicable frequency of QFP for high;
6) the copline welding is adopted in sphere grid array encapsulation assembling, so the fastness that sphere grid array is encapsulated on the printed circuit board (PCB) is good than the fastness of QFP on printed circuit board (PCB).
Yet existing sphere grid array encapsulation is not without at least one drawback yet.For example, when a printed circuit board (PCB) send when repairing, for the QFP on this printed circuit board (PCB), the maintainer only need use simple tools even free-hand, just the QFP on this printed circuit board (PCB) can be disassembled or assemble back.But for the encapsulation of the sphere grid array on this printed circuit board (PCB), thing is not so simple just.The maintainer must be heated to a specific temperature with this printed circuit board (PCB) so that after being used on this printed circuit board (PCB) sphere grid array encapsulation is attached to a plurality of tin balls fusings of this printed circuit board (PCB), could successfully the sphere grid array encapsulation be dismantled from this printed circuit board (PCB).As for the sphere grid array package group is reinstalled on this printed circuit board (PCB), just be again thing that another part more bothers.The maintainer needs ground of a plurality of tin balls is implanted on the welded gasket of sphere grid array package surface.In general, a skilled maintainer on average need spend 10 to 15 minutes and the tin ball could be covered with one by one on all welded gaskets of sphere grid array package surface, this mode of manually planting ball is not only consuming time, and, plant the tin ball of return of serve lattice array package and all can be implanted in exactly on the corresponding welded gasket so that can not guarantee each quilt because the maintainer watches the eyes fatigue that the sphere grid array encapsulation can cause the maintainer for a long time attentively.
Summary of the invention
The object of the present invention is to provide a kind of ball-planting device, it can fast and accurately implant a plurality of tin balls the lip-deep opposite position of ball lattice type array package.
Ball-planting device of the present invention is used for a plurality of tin balls are attached on the chip, and this ball-planting device comprises a porous plate and a locator.This porous plate is provided with a plurality of cloth hole of bead, each cloth hole of bead is used for holding a tin ball, this locator is used for this chip is fixed in the below of this porous plate, scribble one deck adhesive agent on this chip, be used for the tin ball in each cloth hole of bead is attached on this chip, it also comprises a ball pond, is used for loading these a plurality of tin balls, wherein this porous plate is arranged at an end in this ball pond, is used for holding the tin ball that is slided and come by this ball pond with this a plurality of cloth hole of bead when rock in this ball pond.
Description of drawings
Fig. 1 is the generalized section of existing sphere grid array encapsulation;
Fig. 2 is the schematic diagram of ball-planting device of the present invention;
Fig. 3 is the locator of Fig. 2 ball-planting device and the schematic diagram of chip carrier;
Fig. 4 is the side perspective of the locator and the chip carrier of Fig. 2 ball-planting device;
Fig. 5 is the schematic diagram of another ball-planting device of the present invention;
Fig. 6 is the schematic diagram of the container that the ball-planting device among Fig. 4 and is equipped with a plurality of tin balls after engaging.
Description of reference numerals
10 sphere grid arrays encapsulate 12 substrates
14 tin ball bonding connection pads, 16 copper conductor layers
18 anti-welding lacquer 20 tin balls
22 printed circuit board (PCB)s, 32,62 porous plates
34, the 64 cloth hole of beads, 36,66 locators
38 ball ponds, 40 dust caps
42 bracing frames, 44 Connection Blocks
46 lifter plates, 48 load bearing seats
50 shell fragments, 52 shell fragment hole clippings
30,60 ball-planting devices, 68 container interface
70 containers, 72,74 chips
80 chip carriers, 82 chip carriers
84 chips take out perforate 86 first peripheries
88 second peripheral more than 90 salient points
37 shrinkage pools
Embodiment
Please refer to Fig. 2, Fig. 2 is the schematic diagram of desktop ball-planting device 30 of the present invention, ball-planting device 30 is used for the tin ball of a plurality of diameters between 0.35 to 0.7 millimeter is attached on the chip 72, scribble the adhesive agent of skim weld-aiding cream (flux) and so on the chip 72, it is used for the tin ball that ball-planting device 30 is implanted is attached on the chip 72.Ball-planting device 30 comprises a porous plate 32, which is provided with a plurality of cloth hole of bead 34, wherein each cloth hole of bead 34 all is used for holding a tin ball, one locator 36 (being shown in Fig. 3), be arranged at the below of porous plate 32, the below that is used for chip 72 is fixed in porous plate 32 with the position of guaranteeing a plurality of cloth hole of bead 34 on the porous plate 32 all can be exactly corresponding to the position of a plurality of tin balls on should implanted chip 72, and a ball pond 38 is used for loading these a plurality of tin balls.The position of implanted chip 72 is all answered in the position in each cloth hole of bead 34 in the porous plate 32 corresponding to these a plurality of tin balls, can once hold 2,000 to 3,000 tin balls in the ball pond 38, but the also demand of visual reality and adjust the height in ball pond 38 or the area bearing capacity with increase and decrease tin ball.Porous plate 32 in the ball-planting device 30 is arranged at an end in ball pond 38, be used for when ball pond 38 is rocked or is tilted holding the tin ball that the other end slided by ball pond 38 with a plurality of cloth hole of bead 34, the height of the other end in ball pond 38 is then a little less than the height of porous plate 32, with when planting the end of ball process, make things convenient for tin ball unnecessary on the porous plate 32 to slide from porous plate 32.
Ball-planting device 30 also comprises a dust cap 40 and is located at the upper end in ball pond 38 in openable mode, and in the time of in the tin ball is written into ball pond 38, dust cap 40 is opened, and when filling enough tin balls in the ball pond 38, dust cap 40 cuts out, and enters in the ball pond 38 to prevent dust.Ball-planting device 30 comprises also that pair of supporting 42 is used for supporting and fixing ball pond 38, one base 54 is used for bracing frame 42 is fixed thereon, a connecting seat 44 is fixed in an end of bracing frame 42, and a lifter plate 46, and the one end rotatably is connected in Connection Block 44.Lifter plate 46 is provided with a load bearing seat 48, load bearing seat 48 is provided with a chip carrier 80 (more detailed diagram please refer to Fig. 3), be used for carries chips 72, load bearing seat 48 is used for chip 72 is done preliminary location, so that can chip 72 be positioned in the locator 36 of porous plate 32 belows exactly when a end that lifter plate 46 does not link to each other with Connection Block 44 is raised height when lifter plate 46 conforms to ball pond 38.Be provided with a shell fragment 50 outside the ball pond 38, be provided with a shell fragment hole clipping 52 on the lifter plate 46 in addition, when lifter plate 46 conformed to ball pond 38, shell fragment 50 can flexibly insert in the shell fragment hole clipping 52, so that lifter plate 46 is fixed in the below in ball pond 38.
Please refer to Fig. 3 and Fig. 4, Fig. 3 is locator 36 and chip carrier 80 more detailed schematic diagrames in the ball-planting device 30, and Fig. 4 is the side perspective of locator 36 and chip carrier 80.Chip carrier 80 comprises a chip carrier 82, the shape and the size of its shape and size and chip 72 are identical, its degree of depth then need be slightly less than the thickness of chip 72, so that when lifter plate 46 conforms to ball pond 38, be enough to allow chip 72 on chip carrier 80 can conform to the below of porous plate 32 fully, and make and plant the ball personnel and plant after the ball process finishes in whole, convenient chip 72 is taken out from chip carrier 82 apace.Be respectively equipped with on four angles of chip carrier 82 and conveniently plant the ball personnel and plant after the ball process finishes in whole, the chip that chip 72 is taken out from chip carrier 82 apace takes out perforate 84.Chip carrier 80 is a funnel shaped cubic pyramid, that is to say, each limit of first periphery 86 on the chip carrier 80 all with second periphery 88 on parallel with its corresponding one side, and the girth of first periphery 86 is less than the girth of second periphery 88, and the shape in the locator 36 so just can be embedded in chip carrier 80 in the locator 36 easily and exactly corresponding to the profile of chip carrier 80.Refer again to Fig. 3, chip carrier 80 also comprises a plurality of salient points 90, be arranged on the chip bearing seat 48 on the one side of fitting with locator 36 around, and comprise a plurality of and a plurality of salient point 90 corresponding shrinkage pools 37 on the locator 36, the effect of a plurality of salient points 90 and a plurality of shrinkage pool 37 is in chip carrier 80 is embedded in locator 36 time, and chip carrier 80 is positioned in the locator 36 exactly.A plurality of salient points 90 also can be arranged on the chip carrier 80, certainly, just must be arranged in the locator 36 with a plurality of salient point 90 corresponding a plurality of shrinkage pools 37, the distance (distances that shrinkage pool is 37) that the quantity of a plurality of salient points 90 (quantity of shrinkage pool 37), salient point are 90, and the size (size of shrinkage pool 37) of salient point 90 can and change according to actual situation.
The maintainer can utilize ball-planting device 30 of the present invention that a plurality of tin balls are sticked together apace on a chip.At first, this chip is positioned in the chip carrier 82 in the chip carrier 80 on the load bearing seat 48 of lifter plate 46, scribbles one of weld-aiding cream on this chip and face up.Then, after the end that do not link to each other with Connection Block 44 on the lifter plate 46 upwards is promoted to the height of the below of the surface energy of this chip and porous plate 32 fitting fully from the position of base 54, in the shell fragment hole clipping 52 on the 50 insertion lifter plates 46 of the shell fragment on the ball pond 38, so that lifter plate 46 is fixed in the below in ball pond 38.Open dust cap 40 then, inject two to 3,000 tin balls in the ball ponds 38 after, close dust cap 40 and a plurality of tin balls be attached in the process of this chip guaranteeing, impurity such as dust can not influence the qualification rate that the tin ball sticks together.Treat that all objects are all complete or settled appropriate after, rock ball pond 38, or an end of ball-planting device 30 lifted, so that a plurality of tin balls in the ball pond 38 cover on a plurality of cloth hole of bead 34 of porous plate 32, after in each cloth hole of bead 34, all holding a tin ball, just can stop to rock ball-planting device 30, or the end that ball-planting device 30 before had been lifted put down, shell fragment 50 is extracted from shell fragment hole clipping 52, again an end that does not link to each other with Connection Block 44 on the lifter plate 46 is placed on the base 54, take out these chips in the chip carrier 82 of chip carrier 80, all positions that should be covered with the tin ball all have been covered with the tin ball on this moment this chip.Use the whole ball process of planting of ball-planting device 30 of the present invention only to need 10 to 15 seconds, and anyone only training a little, just can utilize ball-planting device 30 to be engaged in the work of planting ball.
Please refer to Fig. 5 and Fig. 6, Fig. 5 is the schematic diagram of another hand held ball-planting device 60 of the present invention, and Fig. 6 is the schematic diagram of the container that the ball-planting device among Fig. 5 60 and is equipped with a plurality of tin balls after engaging.Ball-planting device 60 comprises a porous plate 62, which is provided with a plurality of cloth hole of bead 64, and each cloth hole of bead 64 all is used for holding a tin ball, and the position of an implanted chip 74 is all answered in the position in each cloth hole of bead 64 corresponding to these a plurality of tin balls.Ball-planting device 60 also comprises the top that a locator 66 is arranged at porous plate 62, the top that is used for chip 74 is fixed in porous plate 62 with the position of guaranteeing a plurality of cloth hole of bead 64 on the porous plate 62 all exactly corresponding to the position of a plurality of tin balls on should implanted chip 74.Ball-planting device 60 also comprises the below that a container joint 68 is arranged at porous plate 62, is used for engaging a container 70 (being shown in Fig. 6) that a plurality of tin balls can be housed.When maintainer's desire uses ball-planting device 60 that a plurality of tin balls are attached to chip 74 surperficial, the maintainer can place chip 74 in the locator 66 of ball-planting device 60, the one side that scribbles adhesive agent on its chips 74 inwardly, the another side that does not scribble adhesive agent then outwardly, and with simple tools or only with finger, chip 74 is propped up, on ball-planting device 60, move or landing to prevent chip 74.Then, the maintainer can be engaged in the opening that the container 70 of a plurality of tin balls is housed the container joint 68 of ball-planting device 60, then bottom-up with container 70, and shake container 70 gently, so that the tin ball in the container 70 covers on the porous plate 62, after treating that each cloth hole of bead 64 in the porous plate 62 all holds a tin ball, just can be down with the bottom of container 70, chip 74 is taken out from locator 66, all positions that should be covered with the tin ball all have been covered with the tin ball on this moment chip 74, and the above-mentioned ball process of planting of utilizing ball-planting device 60 was no more than for 5 seconds.Note that the degree of depth of locator 66 had better not surpass the thickness of chip 74, to be convenient to whole planting after the ball process finishes, chip 74 is able to be removed apace from locator 66.
Porous plate in the ball-planting device of the present invention, the number in the cloth hole of bead in it and arrangement mode, and the cloth hole of bead and the cloth hole of bead between distance can encapsulate and do different changes according to different sphere grid arrays, and the locator in the ball-planting device also can be done corresponding change.In addition, mainly as a plurality of tin balls are attached on the chip that keeped in repair, just this chip is not to be brand-new to ball-planting device of the present invention, and certainly, the user also can utilize ball-planting device of the present invention that a plurality of tin balls are implanted on the brand-new chip.At last, one end of the lifter plate 46 among the embodiment of Fig. 2 is rotatably connected on the Connection Block 44, yet the design of lifter plate 46 is not only in this, so long as can be used for carrying a chip and this chip can be moved to locator 36 times so that lifter plate 46 designs that a plurality of tin ball is implanted on this chip exactly all belong to category of the present invention.
Compared to the existing technology that ground of tin ball is implanted in the sphere grid array package surface in artificial mode, ball-planting device of the present invention has following advantage at least, the first, simple to operate, anyone only needs to be trained a little, just can learn how to use the present invention easily; The second,,, therefore just do not need to have a rest with regard to not needing whenever to plant ball a period of time so user's eyes can be tired owing to the user who uses ball-planting device of the present invention need not fix one's eyes upon in the sphere grid array encapsulation yet; Three, because the porous plate in the ball-planting device of the present invention and the design of locator all to guarantee that the surface that the tin ball can be implanted in the sphere grid array encapsulation exactly is a Consideration, therefore use the ball-planting device of the present invention can be with a plurality of tin balls accurately and side by side be implanted in the surface of sphere grid array encapsulation; Four, it also was the most important advantage of the present invention, and the time of using ball-planting device of the present invention that a plurality of tin balls are implanted the required cost of a chip only was about for 10 to 15 seconds, was weak point far beyond 10 to 15 minutes that use the required cost of prior art.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (14)
1. one kind is used for a plurality of tin balls are attached to the ball-planting device of a chip, and it comprises:
One porous plate which is provided with a plurality of cloth hole of bead, and each cloth hole of bead is used for holding a tin ball; And
One locator is used for this chip is fixed in the below of this porous plate;
Wherein scribble one deck adhesive agent on this chip, be used for the tin ball in each cloth hole of bead is attached on this chip, it also comprises a ball pond, be used for loading these a plurality of tin balls, wherein this porous plate is arranged at an end in this ball pond, is used for holding the tin ball that is slided and come by this ball pond with this a plurality of cloth hole of bead when rock in this ball pond.
2. ball-planting device as claimed in claim 1, wherein the height in this ball pond is a little less than the height of this porous plate.
3. ball-planting device as claimed in claim 1, it also comprises a dust cap, and it is located at the upper end in this ball pond in openable mode.
4. ball-planting device as claimed in claim 1, it also comprises a bracing frame, is used for fixing this ball pond.
5. ball-planting device as claimed in claim 4, it also comprises a connecting seat, is fixed in an end of this bracing frame.
6. ball-planting device as claimed in claim 5, it also comprises a lifter plate, the one end is connected in this Connection Block in mode rotatably, this lifter plate is provided with a load bearing seat, be used for carrying this chip and this chip is done preliminary location, so that when the end that does not link to each other with this Connection Block of this lifter plate is raised height when conforming to this ball pond to this lifter plate, this chip can be positioned exactly in this locator of this porous plate below.
7. ball-planting device as claimed in claim 6, wherein this ball pond is provided with a shell fragment, also be provided with a shell fragment hole clipping on this lifter plate, when this lifter plate conformed to this ball pond, this shell fragment can flexibly insert this shell fragment hole clipping this lifter plate is fixed in the below in this ball pond.
8. ball-planting device as claimed in claim 6, it also comprises a base, and this bracing frame is fixed on this base.
9. ball-planting device as claimed in claim 5, it also comprises the chip carrier of an infundibulate quadrangular pyramid body, and the shape in this locator is corresponding to this chip carrier.
10. ball-planting device as claimed in claim 9, wherein this chip carrier is provided with a chip carrier, is used for placing a chip of waiting to plant the tin ball.
11. ball-planting device as claimed in claim 10, wherein the shape of this chip carrier and size all with the shape of this chip and measure-alike.
12. ball-planting device as claimed in claim 10, wherein the degree of depth of this chip carrier is slightly less than the thickness of this chip.
13. ball-planting device as claimed in claim 10, wherein four of this chip carrier jiaos are respectively equipped with the convenient chip taking-up perforate that this chip is taken out from this chip carrier.
14. device as claimed in claim 1, wherein this adhesive agent is a weld-aiding cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031540333A CN1312735C (en) | 2003-08-14 | 2003-08-14 | Ball attaching device used to attach multiple solder balls to a chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031540333A CN1312735C (en) | 2003-08-14 | 2003-08-14 | Ball attaching device used to attach multiple solder balls to a chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1581441A CN1581441A (en) | 2005-02-16 |
| CN1312735C true CN1312735C (en) | 2007-04-25 |
Family
ID=34580128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031540333A Expired - Fee Related CN1312735C (en) | 2003-08-14 | 2003-08-14 | Ball attaching device used to attach multiple solder balls to a chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1312735C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI690040B (en) * | 2019-07-11 | 2020-04-01 | 晶化科技股份有限公司 | Protective diaphragm |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101604618B (en) * | 2009-06-09 | 2011-02-09 | 上海微松工业自动化有限公司 | Ball-planting device of semiconductor packaging equipment |
| CN110729206B (en) * | 2019-10-05 | 2021-06-11 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Universal device for ball planting of ball grid array device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5839191A (en) * | 1997-01-24 | 1998-11-24 | Unisys Corporation | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
| CN2336475Y (en) * | 1997-12-29 | 1999-09-01 | 范光曙 | Tin ball implanting machine for IC element |
| US6003757A (en) * | 1998-04-30 | 1999-12-21 | International Business Machines Corporation | Apparatus for transferring solder bumps and method of using |
| US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
-
2003
- 2003-08-14 CN CNB031540333A patent/CN1312735C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5839191A (en) * | 1997-01-24 | 1998-11-24 | Unisys Corporation | Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
| CN2336475Y (en) * | 1997-12-29 | 1999-09-01 | 范光曙 | Tin ball implanting machine for IC element |
| US6003757A (en) * | 1998-04-30 | 1999-12-21 | International Business Machines Corporation | Apparatus for transferring solder bumps and method of using |
| US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI690040B (en) * | 2019-07-11 | 2020-04-01 | 晶化科技股份有限公司 | Protective diaphragm |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1581441A (en) | 2005-02-16 |
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