TWM240765U - Planting device for planting solder balls onto a chip - Google Patents

Description

M240765 4. Creation Instructions (l) [Technical Field] This creation provides a ball planting device, especially a ball planting device for adhering a plurality of solder balls to a wafer. [Previous technology] In recent years, with the rapid development of electronic technology and the successive appearance of LSI, VLSI, and ULS I, the density of a single silicon wafer has been continuously improved. Due to the sharp increase in the number of I / 0 pins, the power consumed by each silicon chip also increases. Therefore, in the past, dual in-line packages (DIP), and even quad flat packages ( The Quad FUt Package (QFP) can no longer meet the actual needs, but the appearance of the Ball Grid Array Package (BGA Package) has filled this gap in a timely manner. Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view of a conventional ball grid array package. The ball grid array package 10 includes a substrate 12. The substrate 12 includes a copper trace layer 16 provided under the substrate 12. On the side, a plurality of solder bal 1 pads 14 are provided on the surface of the copper wire layer 16 and a solder mask 18 covers the surface of the copper wire layer 16 outside the solder ball pads 16 . The solder ball pads 14 are made on the surface of the copper wire layer 6 and the solder resist 18 is used as the insulation layer. Ball grid array ^ installation i 〇 After completion ’, the package body is fixed to a printing path using a plurality of solder balls 20

Page 5 M240765 Creative Instructions (2) ϋΛΓΐη1: CirCUit b〇ard (PCB) 22, the ball grid array package Tin 2 Hi circuit board 22 can be electrically connected together. The composition of the solder ball is 63% and 3 to 7 alloys in total. The main advantage of the f-grid array package is that although the number of 1/0 pins of the large ^ package is increased, the pin pitch is far away. 2) The two-ball pitch of the ball grid array improves the yield of the assembled product. The number of pins is The number of pins in the = area is the same as that of the unit area of the QFP. +, ^ 疋 said that if the ball grid array package has the same phase as the QFP 3) Although the area of the ball grid array 2 2 1 will be larger than- Small area, package can be larger than Γ, but the ball grid array Chip C0nnectin, ^: said chip connection method (Controlled-C0llapse- array package electrical interconnection method, referred to as C4 welding) to improve the ball Grid 4) Ball grid array Feng Meng grid array package's quantity ί QFP thickness reduced-more than half, and ball 5) Ball grid array seal # ^ QFP weight can be reduced by more than 3/4, high early 歹] package The applicable frequency is much higher than the applicable frequency of QFp. 6) The ball grid array package is assembled on a printed circuit board and bonded with a thousand-sided soldering, so the ball grid array has better sealing. The upper solidity is stronger than the QFP on the printed circuit board. However, the conventional ball cooker printed circuit board is finished ^ = the package is not without its disadvantages. For example, for a μ, the field inspection for QFP on this printed circuit board

(3) The repairer only needs to remove it with a simple QFP on the work board. * The master can freely package the ball grid array of the printed circuit with /, and, < back ^. / Once the printed circuit board is necessary for the printed circuit board; heating the second order. The maintenance personnel board is used to package the ball grid array ^ 洫, so that the printed circuit: the ball grid array can be successfully assembled after the spring is melted; tin: the ball grid array package is assembled back to the printed dagger and planted in jit Second = something happened. The maintenance personnel need to put a plurality of solder balls one by one! =) It takes an average of 10 to 15 minutes for the staff-on all the solder pads on the surface of the package, ... the balls are planted, and the maintenance personnel stare at the ball grid array for a long time The encapsulation will guide the fatigue of G eyes, so that it cannot be guaranteed that every solder ball implanted back into the ball grid array package can be accurately implanted on the corresponding solder pad. [Content] The purpose of this creation is to provide a ball planting device that can quickly and accurately implant a plurality of solder balls into corresponding positions on the surface of a ball grid array package. The ball planting device created in the present invention is used to adhere a plurality of solder balls to a wafer. The ball planting device includes a perforated plate and a positioner. The perforated plate is provided with a plurality of bead holes. Each bead hole is used to receive a solder ball. The positioner is used to fix the wafer below the perforated plate. The wafer is coated with a layer.

M240765

Adhesive agent is used to adhere the solder balls in each cloth bead hole to the chip. [Implementation method] Please refer to Figure 2. Figure 2 is a schematic diagram of the creative table-top ball planting device 30, and the ball planting device 30. It is used to adhere a plurality of solder balls with a diameter of 305 to 007 mm to a wafer 72. The wafer 72 is coated with a thin layer of an adhesive such as flux. The solder balls implanted in the ball device 30 are adhered to the wafer 72. The ball planting device 30 includes a perforated plate 32, which is provided with a plurality of cloth bead holes 34, wherein each of the cloth bead holes 34 is used to receive a solder ball, and a positioner 36 (shown in FIG. 3) ) Is arranged below the perforated plate 32 to fix the wafer 7 2 below the perforated plate 32 to ensure that the positions of the plurality of bead holes 34 on the perforated plate 32 can accurately correspond to the plurality of solder balls. It should be implanted in a position on the wafer 72, and a ball pool 38 is used to load the plurality of solder balls. The position of each cloth bead hole 34 in the perforated plate 32 corresponds to the position where the plurality of solder balls should be implanted in the wafer 72. The ball pool 38 can hold 2,000 to 3,000 solder balls at a time, but it is also visible. The actual need adjusts the height or area of the ball pool 38 to increase or decrease the carrying capacity of the solder balls. The perforated plate 32 in the ball planting device 30 is provided at one end of the ball pool 38. When the ball pool 38 is shaken or tilted, a plurality of bead holes 34 are used to accommodate the slide from the other end of the ball pool 38. Solder ball, and the height of the other end of the ball pool 38 is slightly lower than the height of the porous plate 32, so that at the end of the ball planting process, it is convenient for the extra solder balls on the porous plate 32 to slide back from the porous plate 32 . The ball planting device 3 0 also includes a dust cover 4 0 which can be opened in the ball pool 3 8

Page 8 M240765 IV. Creative Instructions (5)

Upper end 'When the solder ball is loaded into the ball pool 38, the dust cover 40 is opened, and when the ball pool 38 is filled with enough solder balls, the dust cover 40 is closed to prevent dust from entering Within the ball pool 38. The ball planting device 30 further includes a pair of support frames 42 for supporting and fixing the ball pool 38, a base 54 for fixing the support frame 42 thereon, a connecting seat 44 for fixing one end of the support frame 42, and a lifting One end of the plate eight 46 is connected to the connecting base 44 in a rotatable manner. A lifting seat 46 is provided on the lifting plate 46, and a wafer carrier 80 (for a more detailed illustration, please refer to FIG. 3) is provided on the bearing seat 48 to carry the wafer 72. The bearing seat 48 is used to carry the wafer 72 Initial positioning so that the wafer 72 can be accurately positioned under the porous plate 32 when one end of the lifting plate 4 6 not connected to the connection base 4 4 is lifted to the height when the lifting plate 46 is attached to the ball pool 38 Inside the positioner 36. There is a shrapnel 50 on the periphery of the ball pool 3 8 and a shrapnel hole 5 2 on the lifting plate 4 6. When the lifting plate 4 6 is attached to the ball pool 3 8, the shrapnel 5 0 can be elastically inserted into the shrapnel hole 5 2 so that the lifting plate 46 can be fixed below the ball pool 38.

Please refer to FIGS. 3 and 4. FIG. 3 is a more detailed schematic diagram of the positioner 36 and the wafer carrier 80 in the ball planting device 30, and FIG. 4 is a side perspective view of the positioner 36 and the wafer carrier 80. The wafer carrier 80 includes a wafer holder 82, whose shape and size are exactly the same as those of the wafer 72, and its depth needs to be slightly smaller than the thickness of the wafer 72, so that when the lifting plate 46 is attached to The ball pool 3800 is enough to allow the wafer 72 on the wafer carrier 80 to fully fit below the perforated plate 32, and to allow the ball planter to conveniently remove the wafer 7 2 from the wafer holder 8 2 after the entire ball planting process is completed. Take out quickly. The four corners of the wafer holder 8 2 are provided respectively, so that the ball planter can remove the wafer 7 2 from the wafer holder after the entire ball implantation process is completed.

Page 9 M240765 IV. Creative Instructions (6) The carrier 80 is a leak. The first week on 80 is one of the sides parallel and long, and the positioner can be easily made this way. Please refer to the figure again. Place it on the wafer carrier. Positioner 3 6 is packaged with a plurality of bumps 9 0 into the positioner 3 6 3 6. In the plural and plural bumpers 36, the distance between the plurals (concave hole size) can be quickly taken out from the wafer to take out the opening 8 4 according to the actual 82. Bucket-shaped square pyramid, that is, each side of the wafer carrier 86 corresponds to the second periphery 88, and the circumference of the first periphery 86 is smaller than the circumference of the second periphery 88. The shape inside 6 corresponds to the outer shape of the wafer carrier 80, and the wafer carrier 80 is embedded into the positioner 3 accurately. The wafer carrier 80 also includes a plurality of bumps 90, and a seat 48 is provided. The periphery of the upper surface which is in contact with the positioner 36 and includes a plurality of recessed holes 37 corresponding to a plurality of bumps 90 and a plurality of recessed holes 37 are provided to the wafer carrier 8 When the wafer carrier 80 is accurately positioned at the positioner bump 90, the wafer carrier 80 can also be set at the wafer carrier 80. Of course, the plurality of recesses 37 corresponding to 90 must be set at the positioning bumps. The number of 90 (the number of recessed holes 37), the distance between the 90 points of the bumps 37, and the size of the bumps 90 (the size of the recessed holes 3 to 7 are subject to change. Inspection staff can use this creation The ball-implanting device 30 quickly adheres a plurality of solder balls to a wafer. First, the wafer is placed on a load of a lifting plate 46 In the wafer holder 82 in the wafer carrier 80 on the seat f8, one side of the wafer coated with the helper leans upward. Then, the end of the lifting plate 46 that is not connected to the connection seat 44 is lifted upward from the position of the base 54 After the surface of the wafer can be porous, and the height below 3 2 is completely fit, insert the spring 50 on the ball pool 3 8 into the spring hole 5 2 on the lifting plate 4 6 to make the lifting plate 4 6 Fixed on

Page 10 M240765 IV. Creation Instructions (7) Below the ball pool 38. Then open the dust cover 40, inject two to three thousand solder balls into the ball pool 38, and then close the dust cover 40 to ensure that during the process of adhering a plurality of solder balls to the wafer, dust and other impurities will not affect the solder balls. Yield of adhesion.俟 After all the objects are in place or properly placed, shake the ball pool 38 or lift one end of the ball planting device 30 so that the plurality of solder balls in the ball pool 38 cover the plurality of porous plates 3 2 After each cloth bead hole 34 is filled with a solder ball, you can stop shaking the ball planting device 30, or put one end of the ball planting device 30 previously raised, and lower it. The spring piece 50 is pulled out from the spring hole 52 of the spring piece, and the end of the lifting plate 46 which is not connected to the connection seat 4 4 is placed on the base 54. The wafer is taken out from the wafer holder 82 of the wafer carrier 80. At that time, all positions on the wafer that should be covered with solder balls have been filled with solder balls. The whole process of planting balls using this creation ball planting device 30 takes only 10 to 15 seconds, and anyone with only a little training can use the ball planting device 30 to engage in ball planting. Please refer to FIG. 5 and FIG. 6. FIG. 5 is a schematic diagram of another hand-held ball planting device 60 in the creation, and FIG. 6 is a diagram of the ball planting device 60 in FIG. Schematic diagram after joining. The ball planting device 60 includes a perforated plate 62, which is provided with a plurality of bead holes 64. Each of the bead holes 6 4 is used to receive a tin ball. The positions correspond to the positions where the plurality of solder balls should be implanted in a wafer 74. The ball planting device 60 also includes a positioner 6 6 arranged above the perforated plate 6 2 for fixing the wafer 7 4 above the perforated plate 62 to ensure that a plurality of bead holes 6 4 are formed on the perforated plate 6 2. The positions exactly correspond to the positions where the plurality of solder balls should be implanted on the wafer 74. The ball planting device 60 further includes a container interface 68 disposed below the perforated plate 62 for engaging

Page 11 M240765

A container 70 (shown in Fig. 6) which can hold a plurality of solder balls. When the maintenance personnel wants to use the ball implantation device 60 to adhere a plurality of solder balls to the surface of the wafer 74, the maintenance personnel can place the wafer 74 in the positioner 66 of the ball implantation device 60, wherein the wafer 74 is coated with an adhesive One side is facing inward, while the other side without adhesive is facing outwards. With a simple tool, or just with your fingers, move the wafer? 4 abut 'to prevent the wafer 7 4 from moving or sliding off from the ball planting device 60. Then, the maintenance personnel can join the opening of the container 70 with a plurality of solder balls to the ball planting device 60 and the valley connector interface 68, and then place the bottom of the container 70 upward and gently shake the container 70. After the solder balls in the container 70 are covered on the perforated plate 62, and each of the bead holes 64 in the perforated plate 62 contains a tin ball, the bottom of the container 70 may face down. Remove the wafer 7 4 from the positioner 66. At this time, all the positions on the wafer 7 4 that should be covered with solder balls are covered with solder balls. The above-mentioned ball planting process using the ball planting device 60 does not exceed 5 seconds. . Please note that the depth of the positioner 66 is preferably not more than the thickness of the wafer 74, so as to facilitate the completion of the entire ball-planting process. The film 7 4 is quickly removed from the positioner 66. The number and arrangement of the bead holes in the perforated plate in this creative ball planting device, and the distance between the bead holes and the bead holes can be changed differently according to different bulb array packaging. The positioner in the ball device can also be changed accordingly. In addition, the ball planting device of this creation is mainly used to adhere a plurality of solder balls to a repaired wafer, that is, the wafer is not new. Of course, users can also use the ball planting device of this creation to put a plurality of balls Tin balls are planted on brand new wafers. Finally, one end of the lifting plate 46 in the embodiment of FIG. 2 is rotatably connected to the connecting seat 4 4.

M240765 4. Creation instructions (9) The design of the plate 46 is not limited to this, as long as it can be used to carry the wafer to the positioner 36 so that a plurality of solder balls can be accurately grounded I. The lift on the wafer The design of Ban 4 6 belongs to the mouth of this creation. In terms of the advantages of phased array sealing, it is easy to learn how to put it on, so as to ensure that the advantages of planting in the ball, and the cost is more expensive than the conventional technique of wearing a surface. How to use this creator does not Need to pay attention to fatigue, so in this creative planting solder balls can be accurately packaged with the planting grid array of this creative. The use of this creative time is only about 10 to 15 minutes. 'Anyone can only do it. Second, because the ball array is sealed, the holes in each ball planting device do not need to be planted in the ball grid array device, which can cover the surface. Fourth, the ball planting device will cover 10 to 15 Seconds, short 0-ball device to be called to add to the use of this device, so the solder balls packaged by the board and the positioning column for a period of time are also the number of solder balls far less training than using the ground plant, creating It is necessary to use the surface of the device to be accurate and to create the most implanted knowledge. Below the ball grid, you can lightly plant the eyes of the person who wears the ball. Need to be described above only for this creation Preferred embodiment, where the creation under this patent range of modifications and alterations made, also belong to the creation of the present patent culvert cover range. Page 13 M240765 Brief Description of Drawings Brief Description of Drawings Figure 1 is a schematic cross-sectional view of a conventional ball grid array package. Figure 2 is a schematic diagram of the ball planting device. FIG. 3 is a schematic diagram of a positioner and a wafer carrier of the ball planting device of FIG. 2. FIG. 4 is a side perspective view of the positioner and the wafer carrier of the ball planting device of FIG. 2. Figure 5 is a schematic diagram of another ball planting device. Fig. 6 is a schematic diagram of the ball planting device in Fig. 4 after being combined with a container containing a plurality of solder balls.

Schematic symbol description

10 Ball grid array package 12 Substrate 14 Solder ball solder pad 16 Copper wire layer 18 Solder paint 20 Solder ball 22 Printed circuit board 32 6 2 Multi-hole board 3 [6 4 Bead holes 36, 6 6 Positioner 38 Ball pool 40 Dustproof Cover 42 Support frame 44 Connection base 46 Lifting plate 48 Load base 50 Spring piece 52 Spring piece card hole 30 ^ 6 0 Ball planting device 68 Container interface 70 Container 72, 7 4 Wafer

Page 14 M240765 Brief description of the diagram 80 Wafer carrier 82 Wafer holder 84 Wafer removal opening 86 First perimeter 88 Second perimeter 90 Multiple bumps 37 Concave holes

Claims (1)

M240765 5. Scope of patent application 1 A ball planting device used to adhere a plurality of solder balls to a wafer 'the wafer is coated with a layer of adhesive' The ball planting device includes a perforated plate on which A plurality of cloth bead holes are provided. Each cloth bead hole is used to receive a solder ball. This layer of adhesive can adhere the solder balls in each cloth bead hole to the wafer, and a positioner is used for the wafer. Fixed under the perforated plate, a ball pool for loading the plurality of solder balls 'wherein the perforated plate is set at one end of the ball pool' is used for accommodating the plurality of cloth bead holes when the ball pool shakes A solder ball sliding over the ball pool, a support frame for fixing the ball pool, a connection seat fixed to one end of the support frame, and a lifting plate, one end of which is rotatably connected to the connection seat A lifting base is provided on the lifting plate for carrying the wafer and preliminary positioning of the wafer, so that when the end of the lifting plate which is not connected to the connecting base is lifted to the lifting plate and attached to The height of the ball pool can Sheet accurately positioned within the bottom of the retainer of the porous plate. 2 The ball planting device as described in item 1 of the scope of the patent application, wherein the height of the ball pool is slightly lower than that of the perforated plate. 3 The ball-planting device according to item 1 of the scope of the patent application, further comprising a dust-proof cover, which is provided at the upper end of the ball pool in an openable manner. 4 The ball planting set according to item 1 of the scope of patent application, wherein the ball pool M240765 5. The scope of the patent application is provided with an elastic plate, and the lifting plate is provided with an elastic plate hole. When the lifting plate is attached to the ball pool, the elastic plate can be elastically inserted into the elastic plate hole to fix the lifting plate to The ball is below the pool. 5 The ball planting device according to item 1 of the scope of patent application, further comprising a base, and the support frame is fixed on the base. 6. The ball planting device according to item 1 of the scope of the patent application, further comprising a funnel-shaped quadrangular wafer carrier, and the shape in the positioner corresponds to the wafer carrier. 7 The ball-implanting device according to item 6 of the scope of the patent application, wherein the wafer carrier is provided with a wafer holder 'for placing a wafer to be implanted with a solder ball. 8 The ball planting device according to item 7 of the scope of the patent application, wherein the shape and size of the wafer holder are the same as the shape and size of the wafer. 9 The ball-planting device according to item 7 of the scope of patent application, wherein the depth of the wafer holder is slightly smaller than the thickness of the wafer. 10. The ball-planting device according to item 7 of the scope of the patent application, wherein four corners of the wafer holder are provided with wafer removal openings for facilitating the removal of the wafer from the wafer holder. Page 17 M240765 V. Patent application scope 11 The device according to item} of the patent application scope further includes a container interface provided on the perforated plate. 'The plurality of cloth bead holes are all within the scope of the container interface. The trough connector is used for engaging a container, and the container can be used for loading the plurality of solder balls. 12 The device according to item 1 of the scope of patent application, wherein the adhesive is a flux. 13 — A ball-planting device for adhering a plurality of solder balls to a wafer, which includes a perforated plate with a plurality of bead holes, each of which is used to receive a solder ball. A positioner for fixing the wafer below the perforated plate, and a rotary lifting plate, which is provided with a carrier 'for carrying the wafer and preliminary positioning of the wafer' to the lifting plate When attached to the ball pool, the wafer can be accurately positioned in a locator under the perforated plate, wherein the wafer is coated with a layer of adhesive 'for adhering the solder balls in each cloth bead hole to the wafer. 14 The ball planting device according to item 13 of the scope of the patent application, further comprising a wafer carrier of a funnel-shaped pyramid, and the shape in the positioner corresponds to the wafer carrier. 15 The ball planting device according to item 13 of the scope of patent application, wherein the wafer M240765 Page 19