CN1311099C - Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy - Google Patents
Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy Download PDFInfo
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- CN1311099C CN1311099C CNB01135433XA CN01135433A CN1311099C CN 1311099 C CN1311099 C CN 1311099C CN B01135433X A CNB01135433X A CN B01135433XA CN 01135433 A CN01135433 A CN 01135433A CN 1311099 C CN1311099 C CN 1311099C
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 32
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 title claims description 15
- 239000002184 metal Substances 0.000 title claims description 15
- 238000005260 corrosion Methods 0.000 title description 31
- 230000007797 corrosion Effects 0.000 title description 31
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 4
- 239000007864 aqueous solution Substances 0.000 claims description 41
- 239000012530 fluid Substances 0.000 claims description 34
- 239000000243 solution Substances 0.000 claims description 17
- 230000003647 oxidation Effects 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000003518 caustics Substances 0.000 claims description 8
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 6
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 6
- 239000003153 chemical reaction reagent Substances 0.000 claims description 2
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 abstract description 9
- 239000011521 glass Substances 0.000 abstract description 4
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- 239000010808 liquid waste Substances 0.000 abstract description 2
- 239000007800 oxidant agent Substances 0.000 abstract description 2
- 230000003628 erosive effect Effects 0.000 abstract 1
- 239000010802 sludge Substances 0.000 abstract 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 23
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 16
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 4
- 241000370738 Chlorion Species 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910001432 tin ion Inorganic materials 0.000 description 3
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000004087 circulation Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000004677 hydrates Chemical class 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011707 mineral Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003011 anion exchange membrane Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 1
- SFXJSNATBHJIDS-UHFFFAOYSA-N disodium;dioxido(oxo)tin;trihydrate Chemical compound O.O.O.[Na+].[Na+].[O-][Sn]([O-])=O SFXJSNATBHJIDS-UHFFFAOYSA-N 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention provides an etching solution for etching metallic tin or a tin alloy without eroding glass and generating nitrogen oxide, as well as for producing a little sludge and enabling its liquid waste to be easily treated. Etching metallic tin or a tin alloy by contacting a material to be treated with a water-soluble solution including tin (IV). A method for continuously etching them comprises converting tin (II) generated in the water-soluble solution to tin (IV), by adding an oxidizing agent to the solution, contacting it with oxygen and air, or oxidizing it at an anode side with electrolysis, and etching them.
Description
Technical field
The present invention relates to the tinned corrosive fluid of peeling off the caustic solution of useful metallic tin or tin alloy and being used for this method that uses as the resist of copper when making printed-wiring board (PWB).
Background technology
As the corrosive fluid of metallic tin, employing was arranged in the past is the solution (Japanese Patent open the clear 59-74281 of communique number) of principal constituent with fluorine cpd, be the solution (open the flat 1-129491 of communique number of Japanese Patent) of principal constituent with the nitrobenzene-sulfonic acid, be the solution (open the flat 7-278846 of communique number of Japanese Patent) etc. of principal constituent with nitric acid.
But, when using with fluorine cpd to the solution of principal constituent, if the printed-wiring board (PWB) that possesses the insulation layer that contains glass fibre is handled, then the problem that glass is corroded can appear.In addition, when using with nitrobenzene-sulfonic acid to the solution of principal constituent, the problem of mud can appear generating easily in the corrosive fluid.When using with nitric acid, when corroding metal tin, produce oxynitride, will occur the problem that operating environment is worsened like this to the solution of principal constituent.
The content of invention
The purpose of this invention is to provide not can etching glass, can not produce nitrogen oxide just can corroding metal tin or tin alloy, and mud produces less, waste liquid easy to handle caustic solution and corrosive fluid.
The present invention relates to make the aqueous solution that contains 4 valency tin to contact method with the treated material that contains metallic tin or tin alloy with corroding metal tin or tin alloy, and the metallic tin of forming by the aqueous solution that contains 4 valency tin or the corrosive fluid of tin alloy.
Embodiment
Below, embodiments of the present invention are elaborated.
Etch of the present invention adopts the aqueous solution that contains 4 valency tin.Aforementioned 4 valency tin comprise tin compounds such as tin tetrachloride, tindioxide, tin sulphate, sodium stannate, potassium stannate.They can use separately, also can more than 2 kinds and use.In addition, 4 valency tin for example, behind the aqueous solution of modulation tindichloride, make its oxidation as long as be 4 valencys in the aqueous solution, become 4 valencys in the aqueous solution.
The concentration of 4 valency tin in the aqueous solution is preferably 1～25% (weight %, below identical) in 4 valency tin ions, and more preferably 5～20%.If aforementioned concentration less than 1%, then the corrosion meeting of tin is slack-off; If surpass 20%, then effect can't more remarkable because of the increase of addition (improve of corrosion speed etc.).
By aqueous solution is contacted with the treated material with metallic tin or tin alloy, carry out formula (1):
Shown reaction can reach the purpose of corroding tin.
Comprise as the method that aqueous solution is contacted with treated material treated material is immersed in method in the aqueous solution, and aqueous solution is injected in method on the treated material etc.
Behind aqueous solution corroding metal tin or tin alloy, shown in the formula (1), can make 4 valency tin in the aqueous solution be reduced to divalent as described above.But, because divalent tin does not possess the ability of corroding metal tin or tin alloy, so in order to corrode continuously, preferably the tin that will be reduced on one side is oxidized to 4 valency tin, Yi Bian carry out corrosion treatment.1. the method for aforementioned oxidation comprises the method for adding oxygenant in aqueous solution, and 3. the method that aqueous solution is contacted with oxygen or air makes the method etc. of tin oxidation in anode side by electrolysis.
At first, to the above-mentioned oxygenant that 1. in aqueous solution, adds, carry out corroding method when divalent tin is oxidized to 4 valency tin and describe.
Aforementioned oxygenant comprises hydrogen peroxide, chlorine, sodium chlorate, clorox, nitric acid, contain the compound (iron trichloride etc.) of 3 valency iron, contain compound (dichloride copper etc.), nitrobenzene-sulfonic acid of divalent copper etc.Aforementioned oxygenant can use separately, also can more than 2 kinds and use.Wherein, what when using hydrogen peroxide because reaction back generated is water, never can influence corrosion speed and consider, comparatively desirable.
The method of adding aforementioned additive comprises the divalent tin amount calculating corrosion and generate, adds the method that it is oxidized to the needed oxygenant of 4 valency tin in advance then, and the method etc. of adding oxygenant corresponding to the divalent tin amount that corrosion generates one by one.Have or not mensuration that divalent tin can be by redox potential etc. easily to know in the aqueous solution.In the preceding method, preceding a kind of method advantage do not need to be the oxidant concentration in the corrosion is monitored, and then a kind of method advantage oxidation capacity of being corrosive fluid is comparatively stable.
The addition of oxygenant can be adjusted according to the kind of treated material.For example, when corrosion form is formed in zinc-plated on the copper,, so just can corrode copper, but only corrode zinc-plated as base material as long as the addition of oxygenant can be oxidized to the divalent tin that generates because of corrosion 4 valency tin.In addition, not only to corrode tin, also will be simultaneously to as the copper of base material be formed at the intermediary gunmetal and carry out under the corrosive situation, can excessively add the oxidation capacity that oxygenant improves corrosive fluid.Therefore, the addition means of the oxygenant under the tinned situation on the dissolved copper only can adopt the method for progressively adding oxygenant, but it is strong excessively preferably oxidation capacity to be controlled the oxidation capacity that prevents corrosive fluid.
In order to accelerate corrosion speed, preferably there is chlorion in the aqueous solution.The source of chlorion comprises aforementioned tin tetrachloride, tindichloride, hydrochloric acid, ammonium chloride, sodium chloride, Repone K etc.Chlorine ion concentration in the aqueous solution is preferably 1～35% (weight %, below identical), and more preferably 3～30%.If chlorine ion concentration less than 1%, the effect of corrosion speed of then accelerating tin is obvious inadequately, if chlorine ion concentration surpasses 35%, then effect can be more not remarkable with the increase of addition.When being chloride-ion source, because knowing from experience, hydrogen chloride gas produces irritating stink, so can pollute operating environment with hydrochloric acid.
In addition, also other compositions can be comprised in the aqueous solution as required, for example, in order to increase the meltage of tin, mineral acids such as nitric acid and sulfuric acid can be added, organic acids such as citric acid and oxysuccinic acid etc.
Below, to above-mentioned 2. for making divalent tin be oxidized to 4 valency tin aqueous solution is described with the method that oxygen or air contact.
Aqueous solution is contacted with oxygen or air, can carry out in aqueous solution, importing oxygen or air, when aqueous solution contacts with treated material, adopt spray method, make aqueous solution pass through operations such as gas absorbing device such as packed tower or bubble column.
In order to accelerate corrosion speed, being preferably in when adopting this method has chlorion to exist in the aqueous solution.The concentration of chlorion is preferably 1～25%, and more preferably 3～20%.If chlorine ion concentration less than 1%, the effect of corrosion speed of then accelerating metallic tin or tin alloy is just abundant inadequately, if chlorine ion concentration surpasses 25%, then divalent tin can not be oxidized effectively, and corrosion speed will slow down when continuous corrosion.
Make in aqueous solution and the method that oxygen or air contact, also can contain other compositions as required.For example, in order to increase the maximum meltage of tin, also can add organic acids such as mineral acids such as nitric acid, sulfuric acid and citric acid, oxysuccinic acid.In addition, increase, when the metal beyond copper and the tin is corroded, also can add oxygenants such as hydrogen peroxide, sodium chlorate, nitrobenzene-sulfonic acid for making corrosion speed.
As long as condition such as the amount of oxygen when aqueous solution is contacted with oxygen or air and air capacity is corresponding with the divalent tin amount that generates in the aqueous solution.Because the divalent tin amount and the etching extent that generate in the aqueous solution are proportional, so according to etching extent, promptly the divalent tin amount of Sheng Chenging adopts corresponding oxidizing condition just can corrode continuously.
At last, to 3. electrolytic oxidation is aforementioned by corroding the divalent tin that generates, carry out corroding method when it is oxidized to 4 valency tin and describe.
For example, be ready to the electrolyte layers that is isolated into anion-exchange membrane between anode and negative electrode, import in anode side and be used for the corrosive fluid that corrosive contains divalent tin, import and corrosive fluid contains the hydrochloric acid of identical anionic acid, carry out electrolysis then at cathode side.So just make divalent tin be oxidized to 4 valencys in anode side, the solution regeneration of anode side is as corrosive fluid.Preferably add hydrochloric acid and water etc. in the regenerated corrosive fluid and adjust its chlorine ion concentration.
The present invention can be applicable to tinned the peeling off as the resist use of copper when the making of printed-wiring board (PWB).In this case, also must peel off the gun-metal layer that between tin and copper, generates.Therefore, in same operation, peel off, preferably improve the oxidation capacity of corrosive fluid of the present invention for making tin layer and gun-metal.Perhaps, utilize corrosive fluid of the present invention after only peeling off the tin layer, using the stripping liquid (S-651B that Mitsuku K.K. produces etc.) of gun-metal to peel off gun-metal again.
Corrosive fluid of the present invention is useful to the corrosion of metallic tin in the various parts such as the electrode of lead frame, electronic component, ornament and tin alloy.
Embodiment 1
Modulation is the corrosive fluid 1000g that 35% hydrochloric acid and 614g deionized water are formed by 280g tin tetrachloride 5 hydrates, 106g concentration, uses pure tin plate (1.0mm is thick) as treated material.
Soak treated material with aforementioned corrosive fluid (35 ℃), it is shaken vibration make the tin corrosion.In addition, be oxidized to 4 valency tin for making the divalent tin that generates because of corrosion, corrode in the importing air in corrosive fluid, corrosion speed is 8.1 μ m/ branches.
Behind dissolving 10g tin, because it is 6.5 μ m/ minutes that corrosion speed slows down, so add the dilute hydrochloric acid (concentration is 17.5%) of 92.8g, chlorine ion concentration and 4 valency tin ion concentrations are returned to and the essentially identical value of initial stage concentration, corrosion speed also can return to the level at initial stage like this.
From above-mentioned solution, take out 1000g, dissolve 10g tin again.With aforesaid operations, promptly 1. in the 1000g corrosive fluid, dissolve 10g tin, 2. replenish 92.8g dilute hydrochloric acid, 3. take out the 1000g corrosive fluid, so repeat 5 circulations, so just can keep corrosive power (corrosion speed).
The above-mentioned corrosive fluid of every 1kg can dissolve the tin of 94.8g, only just can use continuously by replenishing hydrochloric acid.
Embodiment 2
Modulation is the corrosive fluid 1000g that 35% hydrochloric acid and 468g deionized water are formed by 432g tin tetrachloride 5 hydrates, 100g concentration, uses pure tin plate (1.0mm is thick) as treated material.
Soak treated material with aforementioned corrosive fluid (35 ℃), make the tin corrosion after shaking vibration.Corrosion speed is 11.9 μ m/ minutes.In addition,,, add concentration at any time and be 35% hydrogen peroxide, make redox potential return to initial value so it is monitored owing to the divalent tin that generates of corrosion descends redox potential significantly.
Behind dissolving 10g tin, add hydrogen peroxide, though redox potential returns to original state, corrosion speed only returned to 10.3 μ m/ minutes.The total amount of the hydrogen peroxide (35%) that adds is 16.4g.So, add 42.0g hydrochloric acid (35%), the concentration of chlorine ion concentration and 4 valency tin ions is returned to and the essentially identical value of initial stage concentration, corrosion speed also can return to the initial stage level like this.
From above-mentioned solution, take out 1000g, dissolving 10g tin when adding hydrogen peroxide to keep redox potential.With aforesaid operations, promptly 1. when keeping redox potential, in the 1000g corrosive fluid, dissolve 10g tin, 2. replenish 42.0g hydrochloric acid, 3. take out the 1000g corrosive fluid, so repeat 5 circulations, so just can keep corrosive power (corrosion speed).
The above-mentioned corrosive fluid of every 1kg can dissolve the tin of 146.2g, only just can use continuously by replenishing hydrogen peroxide and hydrochloric acid.
Caustic solution of the present invention and corrosive fluid can be under the prerequisites of not using high price reagent, the corrosive nature that dissolving because of tin is descended can be restored, compare with traditional caustic solution and corrosive fluid, can corrode metallic tin or tin alloy continuously with extremely low cost.
In addition, caustic solution of the present invention and corrosive fluid can be at etching glass not, and do not produce under the situation of nitrogen oxide metallic tin or tin alloy are corroded.
Caustic solution of the present invention and corrosive fluid produce slurry hardly, and liquid waste disposal is convenient.
Claims (9)
1. the caustic solution of metallic tin or tin alloy is characterized in that, the aqueous solution that contains 4 valency tin is contacted with the treated material with metallic tin or tin alloy.
2. the method for claim 1 is characterized in that, when metallic tin or tin alloy are corroded, make the divalent tin oxidation that therefore generates in aqueous solution turn back to 4 valency tin, thereby continuously metallic tin or tin alloy is corroded.
3. method as claimed in claim 2, its feature also be, the method for adding oxygenant in aqueous solution is adopted in aforementioned oxidation, the method that aqueous solution is contacted with oxygen or air, or make the method for aqueous solution in the anode side oxidation by electrolysis.
4. as power 1 described method, it is characterized in that form tin on copper, copper surface is a gun-metal, as processed dose, after the aqueous solution that usefulness contains 4 valency tin carries out etching to metallic tin, gun-metal is carried out etching with the etching reagent of gun-metal with this.
5. as power 1,2 or 4 described methods, it is characterized in that the aqueous solution that contains 4 valency tin is the aqueous solution of chloride ion-containing.
6. as claim 1 or 2 or 4 described methods, its feature is that also aforementioned 4 valency tin are tin tetrachloride.
7. the corrosive fluid of metallic tin or tin alloy is characterized in that, is made up of the aqueous solution that contains 4 valency tin.
8 corrosive fluids as claimed in claim 7 is characterized in that, the aqueous solution that contains 4 valency tin is the aqueous solution of chloride ion-containing.
9. corrosive fluid as claimed in claim 7, wherein, aforementioned 4 valency tin are tin tetrachloride.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP327341/00 | 2000-10-26 | ||
| JP2000327341A JP4580085B2 (en) | 2000-10-26 | 2000-10-26 | Method for etching metal tin or tin alloy and metal tin or tin alloy etchant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1354280A CN1354280A (en) | 2002-06-19 |
| CN1311099C true CN1311099C (en) | 2007-04-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01135433XA Expired - Fee Related CN1311099C (en) | 2000-10-26 | 2001-09-26 | Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4580085B2 (en) |
| CN (1) | CN1311099C (en) |
| TW (1) | TWI233454B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2503029B1 (en) * | 2011-03-22 | 2013-03-20 | Atotech Deutschland GmbH | Process for etching a recessed structure filled with tin or a tin alloy |
| CN103866324B (en) * | 2013-05-20 | 2015-09-16 | 昆山市板明电子科技有限公司 | Selectivity tin etching solution |
| CN103741142B (en) * | 2014-01-10 | 2016-06-29 | 中南大学 | A kind of tin stripper based on hydrochloric acid-pink salt system and the method reclaiming stannum from waste tin stripper |
| CN106216792B (en) * | 2016-08-22 | 2018-12-21 | 中南大学 | A method of all kinds of components of clean separation and tin is recycled from discarded circuit board |
| CN110618009A (en) * | 2019-10-30 | 2019-12-27 | 无锡隆达金属材料有限公司 | Method for microcosmic metallographic corrosion of cupronickel alloy |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283248A (en) * | 1979-02-01 | 1981-08-11 | Nitto Electric Industrial Co., Ltd. | Etching solution for tin-nickel alloy and process for etching the same |
| US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
| JPH0897279A (en) * | 1993-11-16 | 1996-04-12 | Toshiba Corp | Method for manufacturing semiconductor device |
| CN1178260A (en) * | 1996-08-30 | 1998-04-08 | 美克株式会社 | Liquid for separating tin from tin alloy |
| WO2000043574A1 (en) * | 1999-01-25 | 2000-07-27 | Alpha Fry Limited | Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219475A (en) * | 1983-05-30 | 1984-12-10 | Metsuku Kk | Tin or tin alloy stripper |
| JPS6263692A (en) * | 1985-05-10 | 1987-03-20 | C Uyemura & Co Ltd | Method for removing tetravalent tin ions in surface treatment solution |
| JPH08285993A (en) * | 1995-04-17 | 1996-11-01 | Toshiba Corp | Chemical decontamination method and decontamination apparatus therefor |
| JPH09302480A (en) * | 1996-05-14 | 1997-11-25 | Nikko Metal Pureeteingu Kk | Removing solution of tin or tin alloy and peeling method |
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2000
- 2000-10-26 JP JP2000327341A patent/JP4580085B2/en not_active Expired - Fee Related
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2001
- 2001-09-26 CN CNB01135433XA patent/CN1311099C/en not_active Expired - Fee Related
- 2001-10-16 TW TW90125532A patent/TWI233454B/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283248A (en) * | 1979-02-01 | 1981-08-11 | Nitto Electric Industrial Co., Ltd. | Etching solution for tin-nickel alloy and process for etching the same |
| US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
| JPH0897279A (en) * | 1993-11-16 | 1996-04-12 | Toshiba Corp | Method for manufacturing semiconductor device |
| CN1178260A (en) * | 1996-08-30 | 1998-04-08 | 美克株式会社 | Liquid for separating tin from tin alloy |
| WO2000043574A1 (en) * | 1999-01-25 | 2000-07-27 | Alpha Fry Limited | Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1354280A (en) | 2002-06-19 |
| JP2002129359A (en) | 2002-05-09 |
| JP4580085B2 (en) | 2010-11-10 |
| TWI233454B (en) | 2005-06-01 |
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