CN1354280A - Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy - Google Patents
Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy Download PDFInfo
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- CN1354280A CN1354280A CN 01135433 CN01135433A CN1354280A CN 1354280 A CN1354280 A CN 1354280A CN 01135433 CN01135433 CN 01135433 CN 01135433 A CN01135433 A CN 01135433A CN 1354280 A CN1354280 A CN 1354280A
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- tin
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- alloy
- corrosion
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 34
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 24
- 230000007797 corrosion Effects 0.000 title description 25
- 238000005260 corrosion Methods 0.000 title description 25
- 229910052751 metal Inorganic materials 0.000 title description 5
- 239000002184 metal Substances 0.000 title description 5
- 238000005530 etching Methods 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000007800 oxidant agent Substances 0.000 claims abstract description 14
- 230000001590 oxidative effect Effects 0.000 claims abstract description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 4
- 239000007864 aqueous solution Substances 0.000 claims description 37
- 239000000243 solution Substances 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 9
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 5
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 abstract description 12
- 239000011521 glass Substances 0.000 abstract description 4
- 239000010802 sludge Substances 0.000 abstract description 3
- 230000003628 erosive effect Effects 0.000 abstract 1
- 239000010808 liquid waste Substances 0.000 abstract 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 23
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- 230000033116 oxidation-reduction process Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910001432 tin ion Inorganic materials 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003011 anion exchange membrane Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention provides an etching solution for etching metallic tin or a tin alloy without eroding glass and generating nitrogen oxide, as well as for producing a little sludge and enabling its liquid waste to be easily treated. Etching metallic tin or a tin alloy by contacting a material to be treated with a water-soluble solution including tin (IV). A method for continuously etching them comprises converting tin (II) generated in the water-soluble solution to tin (IV), by adding an oxidizing agent to the solution, contacting it with oxygen and air, or oxidizing it at an anode side with electrolysis, and etching them.
Description
Technical Field
The present invention relates to a method for etching metallic tin or a tin alloy, which is useful for stripping tin plating used as a copper resist in the production of printed wiring boards, and an etching solution used for the method.
Background
As the etching liquid for metallic tin, conventionally, there have been used a solution containing a fluorine compound as a main component (Japanese patent laid-open publication No. Sho 59-74281), a solution containing nitrobenzenesulfonic acid as a main component (Japanese patent laid-open publication No. Hei 1-129491), a solution containing nitric acid as a main component (Japanese patent laid-open publication No. Hei 7-278846), and the like.
However, when a solution containing a fluorine compound as a main component is used, if a printed wiring board having an insulating layer containing glass fibers is treated, there is a problem that glass is corroded. Further, when a solution containing nitrobenzenesulfonic acid as a main component is used, there is a problem that sludge is easily generated in the etching solution. When a solution containing nitric acid as a main component is used, nitrogen oxide is generated when metal tin is corroded, which causes a problem of deterioration of working environment.
Disclosure of the invention
The invention aims to provide a corrosion method and a corrosion liquid which can corrode metal tin or tin alloy without corroding glass and generating nitrogen oxide, and has the advantages of less sludge generation and easy waste liquid treatment.
The present invention relates to a method for etching metallic tin or a tin alloy by bringing an aqueous solution containing tin having a valence of 4 into contact with a material to be treated containing metallic tin or a tin alloy, and an etching solution for metallic tin or a tin alloy composed of an aqueous solution containing tin having a valence of 4.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
The etching method of the present invention uses an aqueous solution containing tin having a valence of 4. The above-mentioned 4-valent tin includes tin compounds such as tin tetrachloride, tin dioxide, tin sulfate, sodium stannate, potassium stannate, etc. These may be used alone or in combination of 2 or more. The 4-valent tin may be in the form of a 4-valent tin in an aqueous solution, and for example, an aqueous solution of tin dichloride is prepared and then oxidized to have a 4-valent tin in an aqueous solution.
The concentration of the 4-valent tin in the aqueous solution is preferably 1 to 25% (by weight, the same applies hereinafter) in terms of 4-valent tin ions, more preferably 5 to 20%. If the concentration is less than 1%, the corrosion of tin is slowed down; if it exceeds 20%, the effect is not more pronounced by an increase in the amount added (e.g., an increase in the corrosion rate).
By bringing the aqueous solution into contact with a material to be treated having metallic tin or a tin alloy, the following formula (1):
As a method of bringing the aqueous solution into contact with the material to be treated, there are a method of immersing the material to be treated in the aqueous solution, a method of spraying the aqueous solution on the material to be treated, and the like.
However, since 2-valent tin does not have the ability to corrode metallic tin or tin alloy, it is preferable to perform corrosion treatment while oxidizing the reduced tin to 4-valent tin in order to continuously perform corrosion, and the oxidation method includes a method of ① adding an oxidizing agent to the aqueous solution, a method of ② contacting the aqueous solution with oxygen or air, a method of ③ oxidizing tin on the anode side by electrolysis, and the like.
First, a method of ① in which an oxidizing agent is added to the aqueous solution to oxidize 2-valent tin to 4-valent tin and simultaneously perform etching will be described.
The oxidizing agent includes hydrogen peroxide, chlorine gas, sodium chlorate, sodium hypochlorite, nitric acid, a compound containing iron (3) in valence (e.g., ferric trichloride), a compound containing copper (2) in valence (e.g., cupric dichloride), and nitrobenzenesulfonic acid. The oxidizing agents may be used alone or in combination of 2 or more. Among them, hydrogen peroxide is preferably used because water is generated after the reaction, and the corrosion rate is not affected.
The method of adding the additive includes a method of calculating the amount of 2-valent tin generated by etching and then adding an oxidizing agent necessary for oxidizing the tin to 4-valent tin in advance, a method of sequentially adding an oxidizing agent in accordance with the amount of 2-valent tin generated by etching, and the like. The presence or absence of tin having a valence of 2 in the aqueous solution can be easily determined by measurement of an oxidation-reduction potential or the like. Of the foregoing methods, the first 1 method has an advantage in that the concentration of the oxidizing agent in the etching does not need to be monitored, and the latter 1 method has an advantage in that the oxidizing ability of the etching solution is relatively stable.
The amount of the oxidizing agent to be added can be adjusted depending on the kind of the material to be treated. For example, in the case of etching tin plating formed on copper, the amount of the oxidizing agent added is only required to be capable of oxidizing 2-valent tin generated by the etching to 4-valent tin, so that only tin plating is etched without etching copper as a base material. In addition, when not only tin is to be etched but also copper as a base material and a copper-tin alloy formed in the middle are to be etched at the same time,an oxidizing agent may be added in an excessive amount to improve the oxidizing ability of the etching solution. Therefore, although the oxidizing agent can be added in a stepwise manner in the case of dissolving only tin plating on copper, it is preferable to control the oxidizing ability to prevent the oxidizing ability of the etching solution from becoming too strong.
In order to accelerate the etching rate, it is preferable that chlorine ions are present in the aqueous solution. Sources of chloride ions include the aforementioned tin tetrachloride, tin dichloride, hydrochloric acid, ammonium chloride, sodium chloride, potassium chloride, and the like. The concentration of the chloride ion in the aqueous solution is preferably 1 to 35% (by weight, the same applies hereinafter), more preferably 3 to 30%. If the chloride ion concentration is less than 1%, the effect of accelerating the corrosion rate of tin is not sufficiently significant, and if the chloride ion concentration exceeds 35%, the effect is not more significant with an increase in the amount of addition. When hydrochloric acid is used as a chloride ion source, hydrogen chloride gas generates an offensive odor, which causes a pollution to the working environment.
The aqueous solution may contain other components as necessary, and for example, inorganic acids such as nitric acid and sulfuric acid, organic acids such as citric acid and malic acid, and the like may be added to increase the amount of dissolved tin.
Next, a method of ② in which the aqueous solution is brought into contact with oxygen or air to oxidize tin having a valence of 2 to tin having a valence of 4 will be described.
The aqueous solution may be brought into contact with oxygen or air by introducing oxygen or air into the aqueous solution, spraying the aqueous solution into the aqueous solution while the aqueous solution is brought into contact with the material to be treated, passing the aqueous solution through a gas absorption apparatus such as a packed column or a bubble column, or the like.
In order to accelerate the etching rate, it is preferable to use this method in which chloride ions are present in the aqueous solution. The concentration of the chloride ion is preferably 1 to 25%, more preferably 3 to 20%. If the chloride ion concentration is less than 1%, the action of accelerating the corrosion rate of metallic tin or tin alloy is insufficient, and if the chloride ion concentration exceeds 25%, the 2-valent tin cannot be effectively oxidized, and the corrosion rate will be reduced during continuous corrosion.
The method of contacting the aqueous solution with oxygen or air may further contain other components as necessary. For example, inorganic acids such as nitric acid and sulfuric acid, and organic acids such as citric acid and malic acid may be added to increase the maximum amount of tin dissolved. In addition, in order to increase the etching rate, an oxidizing agent such as hydrogen peroxide, sodium chlorate, or nitrobenzene sulfonic acid may be added to the copper or tin during etching.
The amount of oxygen and the amount of air used for contacting the aqueous solution with oxygen or air may be set so as to correspond to the amount of tin (2) valent formed in the aqueous solution. Since the amount of the 2 nd valent tin formed in the aqueous solution is proportional to the amount of corrosion, the corrosion can be continuously performed by using oxidation conditions according to the amount of corrosion, that is, the amount of the 2 nd valent tin formed.
Finally, a method of ③ electrolytically oxidizing the 2 nd valent tin generated by the etching to oxidize the tin to 4 th valent tin and simultaneously etching the tin will be described.
For example, an electrolytic layer is prepared, which is partitioned between an anode and a cathode by an anion exchange membrane, and an etchant containing tin having a valence of 2 for etching is introduced on the anode side, and hydrochloric acid containing the same anionic acid as the etchant is introduced on the cathode side, followed by electrolysis. This oxidizes the tin having a valence of 2 to tin having a valence of 4 on the anode side, and the solution on the anode side is regenerated as an etching solution. Hydrochloric acid, water and the like are preferably added to the regenerated etching solution to adjust the chloride ion concentration.
The present invention is applicable to stripping of tin plating used as a copper resist in the production of printed wiring boards. In this case, the tin-copper alloy layer formed between tin and copper must be peeled off. Therefore, in order to peel off the tin layer and the tin-copper alloy in the same step, it is preferable to improve the oxidizing ability of the etching solution of the present invention. Alternatively, after only the tin layer is peeled off by the etching solution of the present invention, the tin-copper alloy is peeled off by a stripping solution for tin-copper alloy (S-651B manufactured by Meige corporation, etc.).
The etching solution of the present invention is useful for etching metallic tin and tin alloys in various members such as lead frames, electrodes of electronic components, and accessories.
Example 1
1000g of an etching solution composed of 280g of stannic chloride 5 hydrate, 106g of 35% hydrochloric acid and 614g of deionized water was prepared, and a pure tin plate (1.0mm thick) was used as a material to be treated.
The material to be treated was immersed in the etching solution (35 ℃ C.), and the tin was etched by shaking and shaking. Further, in order to oxidize the2-valent tin generated by the etching to 4-valent tin, the etching was performed while introducing air into the etching solution, and the etching rate was 8.1 μm/min.
After 10g of tin was dissolved, the etching rate was reduced to 6.5 μm/min, and 92.8g of dilute hydrochloric acid (17.5% concentration) was added to return the chloride ion concentration and the 4-valent tin ion concentration to substantially the same values as the initial concentrations, so that the etching rate was also returned to the initial levels.
The operation described above, i.e., ① dissolving 10g of tin in 1000g of etching solution, ② supplementing 92.8g of dilute hydrochloric acid, ③ taking out 1000g of etching solution, was repeated for 5 cycles, whereby the etching ability (etching rate) was maintained.
94.8g of tin was dissolved in 1kg of the etching solution, and the etching solution was continuously used by merely adding hydrochloric acid.
Example 2
1000g of an etching solution composed of 432g of stannic chloride-5 hydrate, 100g of 35% hydrochloric acid and 468g of deionized water was prepared, and a pure tin plate (1.0mm thick) was used as a material to be treated.
The material to be treated was immersed in the etching solution (35 ℃ C.), shaken and oscillated to etch the tin. The etching rate was 11.9 μm/min. Further, since the oxidation-reduction potential is greatly lowered by the 2-valent tin generated by the corrosion, the oxidation-reduction potential is monitored and the oxidation-reduction potential is returned to the initial value by adding hydrogen peroxide at a concentration of 35% as needed.
After 10g of tin was dissolved, hydrogen peroxide was added to restore the oxidation-reduction potential to the original state, but the corrosion rate was restored to 10.3 μm/min. The total amount of hydrogen peroxide (35%) added was 16.4 g. Then, by adding 42.0g of hydrochloric acid (35%), the chlorine ion concentration and the concentration of the 4-valent tin ion can be returned to substantially the same values as the initial concentrations, and the etching rate can be returned to the initial level.
The above operation, ①, was carried out to dissolve 10g of tin in 1000g of etching solution while maintaining the redox potential, ② was supplemented with 42.0g of hydrochloric acid, ③ was carried out to take out 1000g of etching solution, and this was repeated for 5 cycles, whereby the etching capacity (etching rate) was maintained.
146.2g of tin can be dissolved in 1kg of the etching solution, and the etching solution can be continuously used only by supplementing hydrogen peroxide and hydrochloric acid.
The corrosion method and the corrosion liquid of the present invention can recover the corrosion performance decreased by the dissolution of tin without using an expensive reagent, and can continuously corrode metallic tin or tin alloy at an extremely low cost as compared with the conventional corrosion method and the corrosion liquid.
In addition, the etching method and the etching solution of the invention can etch metal tin or tin alloy without etching glass and generating nitrogen oxide.
The corrosion method and the corrosion liquid of the invention hardly produce slurry, and the waste liquid is convenient to treat.
Claims (6)
1. A method for etching metallic tin or a tin alloy, characterized by bringing an aqueous solution containing tin having a valence of 4 into contact with a material to be treated having metallic tin or a tin alloy.
2. A method for etching metallic tin or tin alloy, characterized in that an aqueous solution containing tin having a valence of 4 is brought into contact with a material to be treated having metallic tin or tin alloy, and the metallic tin or tin alloy is etched while oxidizing tin having a valence of 2 generated in the aqueous solution to tin having a valence of 4, thereby continuously etching the metallic tin or tin alloy.
3. The method according to claim 2, wherein the oxidation is performed by adding an oxidizing agent to the aqueous solution, by bringing the aqueous solution into contact with oxygen or air, or by oxidizing the aqueous solution on the anode side by electrolysis.
4. The method according to claim 1 or 2, wherein the tin having a valence of 4 is tin tetrachloride.
5. The corrosive liquid of metallic tin or tin alloy is characterized by comprising an aqueous solution containing tin having a valence of 4.
6. The etching solution according to claim 5, wherein the tin having a valence of 4 is tin tetrachloride.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP327341/00 | 2000-10-26 | ||
| JP2000327341A JP4580085B2 (en) | 2000-10-26 | 2000-10-26 | Method for etching metal tin or tin alloy and metal tin or tin alloy etchant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1354280A true CN1354280A (en) | 2002-06-19 |
| CN1311099C CN1311099C (en) | 2007-04-18 |
Family
ID=18804378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01135433XA Expired - Fee Related CN1311099C (en) | 2000-10-26 | 2001-09-26 | Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4580085B2 (en) |
| CN (1) | CN1311099C (en) |
| TW (1) | TWI233454B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103741142A (en) * | 2014-01-10 | 2014-04-23 | 中南大学 | Method for recycling tin from waste tin-stripping solution based on tin-stripping solution of hydrochloric acid-tin salt system |
| CN103866324A (en) * | 2013-05-20 | 2014-06-18 | 昆山市板明电子科技有限公司 | Selective tin etching solution |
| CN106216792A (en) * | 2016-08-22 | 2016-12-14 | 中南大学 | A kind of all kinds of components and parts of clean separation reclaim the method and device of stannum from discarded circuit board |
| CN110618009A (en) * | 2019-10-30 | 2019-12-27 | 无锡隆达金属材料有限公司 | Method for microcosmic metallographic corrosion of cupronickel alloy |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2503029B1 (en) * | 2011-03-22 | 2013-03-20 | Atotech Deutschland GmbH | Process for etching a recessed structure filled with tin or a tin alloy |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283248A (en) * | 1979-02-01 | 1981-08-11 | Nitto Electric Industrial Co., Ltd. | Etching solution for tin-nickel alloy and process for etching the same |
| JPS59219475A (en) * | 1983-05-30 | 1984-12-10 | Metsuku Kk | Tin or tin alloy stripper |
| JPS6263692A (en) * | 1985-05-10 | 1987-03-20 | C Uyemura & Co Ltd | Method for removing tetravalent tin ions in surface treatment solution |
| US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
| JP3382031B2 (en) * | 1993-11-16 | 2003-03-04 | 株式会社東芝 | Method for manufacturing semiconductor device |
| JPH08285993A (en) * | 1995-04-17 | 1996-11-01 | Toshiba Corp | Chemical decontamination method and decontamination apparatus therefor |
| JPH09302480A (en) * | 1996-05-14 | 1997-11-25 | Nikko Metal Pureeteingu Kk | Removing solution of tin or tin alloy and peeling method |
| CN1178260A (en) * | 1996-08-30 | 1998-04-08 | 美克株式会社 | Liquid for separating tin from tin alloy |
| GB9901586D0 (en) * | 1999-01-25 | 1999-03-17 | Alpha Fry Ltd | Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces |
-
2000
- 2000-10-26 JP JP2000327341A patent/JP4580085B2/en not_active Expired - Fee Related
-
2001
- 2001-09-26 CN CNB01135433XA patent/CN1311099C/en not_active Expired - Fee Related
- 2001-10-16 TW TW90125532A patent/TWI233454B/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103866324A (en) * | 2013-05-20 | 2014-06-18 | 昆山市板明电子科技有限公司 | Selective tin etching solution |
| CN103866324B (en) * | 2013-05-20 | 2015-09-16 | 昆山市板明电子科技有限公司 | Selectivity tin etching solution |
| CN103741142A (en) * | 2014-01-10 | 2014-04-23 | 中南大学 | Method for recycling tin from waste tin-stripping solution based on tin-stripping solution of hydrochloric acid-tin salt system |
| CN103741142B (en) * | 2014-01-10 | 2016-06-29 | 中南大学 | A kind of tin stripper based on hydrochloric acid-pink salt system and the method reclaiming stannum from waste tin stripper |
| CN106216792A (en) * | 2016-08-22 | 2016-12-14 | 中南大学 | A kind of all kinds of components and parts of clean separation reclaim the method and device of stannum from discarded circuit board |
| CN106216792B (en) * | 2016-08-22 | 2018-12-21 | 中南大学 | A method of all kinds of components of clean separation and tin is recycled from discarded circuit board |
| CN110618009A (en) * | 2019-10-30 | 2019-12-27 | 无锡隆达金属材料有限公司 | Method for microcosmic metallographic corrosion of cupronickel alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1311099C (en) | 2007-04-18 |
| JP2002129359A (en) | 2002-05-09 |
| JP4580085B2 (en) | 2010-11-10 |
| TWI233454B (en) | 2005-06-01 |
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