CN1301296C - 一种环氧树脂组合物 - Google Patents
一种环氧树脂组合物 Download PDFInfo
- Publication number
- CN1301296C CN1301296C CNB2004100412953A CN200410041295A CN1301296C CN 1301296 C CN1301296 C CN 1301296C CN B2004100412953 A CNB2004100412953 A CN B2004100412953A CN 200410041295 A CN200410041295 A CN 200410041295A CN 1301296 C CN1301296 C CN 1301296C
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resins
- epoxy
- general formula
- grams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 70
- 239000003822 epoxy resin Substances 0.000 claims abstract description 105
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 105
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract 2
- 239000003063 flame retardant Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 4
- 150000004692 metal hydroxides Chemical class 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims 11
- 229920003987 resole Polymers 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000007767 bonding agent Substances 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 235000013312 flour Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 27
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 24
- 229920001568 phenolic resin Polymers 0.000 abstract description 24
- 239000005011 phenolic resin Substances 0.000 abstract description 24
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 229910052787 antimony Inorganic materials 0.000 abstract description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052736 halogen Inorganic materials 0.000 abstract description 4
- 150000002367 halogens Chemical class 0.000 abstract description 4
- 239000003086 colorant Substances 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 description 24
- 229910003475 inorganic filler Inorganic materials 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 12
- 239000006229 carbon black Substances 0.000 description 10
- 239000004203 carnauba wax Substances 0.000 description 10
- 235000013869 carnauba wax Nutrition 0.000 description 10
- 150000003512 tertiary amines Chemical class 0.000 description 10
- 229920001971 elastomer Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000002994 raw material Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000011863 silicon-based powder Substances 0.000 description 4
- 239000000383 hazardous chemical Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- -1 curing accelerator Substances 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 235000004263 Ocotea pretiosa Nutrition 0.000 description 1
- 244000009660 Sassafras variifolium Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 150000004074 biphenyls Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
| 项目 | 实施例14 | 实施例15 | 实施例16 | 实施例17 | |
| 环氧树脂 | 50 | 50 | 50 | 50 | |
| 酚醛树脂 | 43 | 47 | 51 | 60 | |
| 含磷/叔胺类固化促进剂 | 1.0/0.8 | 1.0/0.8 | 1.0/0.8 | 1.0/0.8 | |
| 复合填料 | A部分 | 561 | 582 | 604 | 653 |
| B部分 | 23 | 24 | 25 | 27 | |
| 碳黑 | 3 | 3 | 3 | 3 | |
| 巴西棕榈蜡 | 3 | 3 | 3 | 3 | |
| 偶联剂 | 5 | 5 | 5 | 5 | |
| 改性剂 | 4 | 4 | 4 | 4 | |
| 指标参数 | 阻燃性 | V-0 | V-0 | V-0 | V-0 |
| 吸水率 | 0.10 | 0.14 | 0.19 | 0.20 | |
| 黏度 | 48.9 | 50.8 | 60.5 | 57.0 | |
| 充填性 | 良好 | 良好 | 良好 | 良好 | |
| 项目 | 对照例1 | 对照例2 | 对照例3 | 对照例4 | |
| 环氧树脂 | 50 | 50 | 50 | 50 | |
| 酚醛树脂 | 37 | 41 | 44 | 52 | |
| 含磷/叔胺类固化促进剂 | 1.0/0.8 | 1.0/0.8 | 1.0/0.8 | 1.0/0.8 | |
| 复合填料 | A部分 | 528 | 549 | 565 | 610 |
| B部分 | 22 | 23 | 24 | 25 | |
| 碳黑 | 3 | 3 | 3 | 3 | |
| 巴西棕榈蜡 | 3 | 3 | 3 | 3 | |
| 偶联剂 | 5 | 5 | 5 | 5 | |
| 改性剂 | 4 | 4 | 4 | 4 | |
| 指标参数 | 阻燃性 | V-1 | V-1 | V-1 | V-0 |
| 吸水率 | 0.20 | 0.34 | 0.40 | 0.55 | |
| 黏度 | 58.7 | 140.3 | 182.0 | 163.9 | |
| 充填性 | 良好 | 良好 | 空洞 | 空洞 | |
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100412953A CN1301296C (zh) | 2004-06-14 | 2004-06-14 | 一种环氧树脂组合物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100412953A CN1301296C (zh) | 2004-06-14 | 2004-06-14 | 一种环氧树脂组合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1583876A CN1583876A (zh) | 2005-02-23 |
| CN1301296C true CN1301296C (zh) | 2007-02-21 |
Family
ID=34601602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100412953A Ceased CN1301296C (zh) | 2004-06-14 | 2004-06-14 | 一种环氧树脂组合物 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1301296C (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851386B (zh) | 2009-04-01 | 2012-09-05 | 汉高华威电子有限公司 | 一种环氧树脂组合物 |
| JP5838659B2 (ja) * | 2010-09-02 | 2016-01-06 | 住友ベークライト株式会社 | 樹脂成形体の製造方法、樹脂組成物の製造方法 |
| JP5570449B2 (ja) * | 2011-01-31 | 2014-08-13 | 新日鉄住金化学株式会社 | エポキシ樹脂組成物及び硬化物 |
| JP2012167142A (ja) * | 2011-02-10 | 2012-09-06 | Nippon Steel Chem Co Ltd | エポキシ樹脂組成物及び硬化物 |
| WO2016145654A1 (en) * | 2015-03-19 | 2016-09-22 | Henkel Huawei Electronics Co. Ltd. | Epoxy resin composition, preparation and use thereof |
| CN110642998A (zh) * | 2019-08-27 | 2020-01-03 | 中山精合电子材料有限公司 | 一种环氧树脂组合物、固化性干膜、固化物及印刷电路板 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236378A (zh) * | 1997-07-02 | 1999-11-24 | 住友电木株式会社 | 半导体密封用的环氧树脂组合物和半导体器件 |
| EP1142952A1 (en) * | 2000-04-06 | 2001-10-10 | Nitto Denko Corporation | Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
| CN1321179A (zh) * | 1999-09-06 | 2001-11-07 | 住友电木株式会社 | 环氧树脂组合物和半导体装置 |
| JP2001354754A (ja) * | 2000-04-06 | 2001-12-25 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2002128994A (ja) * | 2000-10-31 | 2002-05-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002206021A (ja) * | 2001-01-11 | 2002-07-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002293886A (ja) * | 2001-03-29 | 2002-10-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| WO2002090434A1 (en) * | 2001-04-23 | 2002-11-14 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device |
-
2004
- 2004-06-14 CN CNB2004100412953A patent/CN1301296C/zh not_active Ceased
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236378A (zh) * | 1997-07-02 | 1999-11-24 | 住友电木株式会社 | 半导体密封用的环氧树脂组合物和半导体器件 |
| CN1321179A (zh) * | 1999-09-06 | 2001-11-07 | 住友电木株式会社 | 环氧树脂组合物和半导体装置 |
| EP1142952A1 (en) * | 2000-04-06 | 2001-10-10 | Nitto Denko Corporation | Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
| CN1316447A (zh) * | 2000-04-06 | 2001-10-10 | 日东电工株式会社 | 半导体封装用环氧树脂组合物及使用这种组合物的半导体装置 |
| JP2001354754A (ja) * | 2000-04-06 | 2001-12-25 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2002128994A (ja) * | 2000-10-31 | 2002-05-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002206021A (ja) * | 2001-01-11 | 2002-07-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002293886A (ja) * | 2001-03-29 | 2002-10-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| WO2002090434A1 (en) * | 2001-04-23 | 2002-11-14 | Sumitomo Bakelite Company Limited | Epoxy resin composition and semiconductor device |
| CN1432047A (zh) * | 2001-04-23 | 2003-07-23 | 住友电木株式会社 | 环氧树脂组合物和半导体设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1583876A (zh) | 2005-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111073217B (zh) | 一种半导体封装用高导热低应力环氧塑封料 | |
| JP5599862B2 (ja) | エポキシ樹脂組成物 | |
| CN1125135C (zh) | 环氧树脂组合物 | |
| US20120302668A1 (en) | Semiconductor sealing material composition | |
| CN111187560B (zh) | 一种户外母线排用超高压阻燃绝缘粉末及其制备方法 | |
| CN1301296C (zh) | 一种环氧树脂组合物 | |
| CN102108184B (zh) | 一种环氧树脂组合物及其应用 | |
| JP3573651B2 (ja) | エポキシ樹脂組成物及び半導体装置 | |
| SG188749A1 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | |
| CN112480847A (zh) | 一种高耐热、低应力环氧塑封料及其制备方法 | |
| TW201305235A (zh) | 電子零件封裝用環氧樹脂組合物及使用其之電子零件裝置 | |
| CN100343325C (zh) | 阻燃性环氧树脂组合物、制备方法及其应用 | |
| CN116218148A (zh) | 一种适用于第三代半导体封装用热固性树脂组合物及其制备方法 | |
| CN1800290A (zh) | 阻燃低烟低毒环氧胶粘剂 | |
| CN115572461A (zh) | 一种环氧树脂成型材料及其制备方法与应用 | |
| JP3980701B2 (ja) | 半導体封止用樹脂組成物およびそれを用いた半導体装置 | |
| CN101967266A (zh) | 无卤阻燃环氧树脂组合物 | |
| CN111471278A (zh) | 一种低温高辐射热的环氧树脂组合物及其应用 | |
| CN101208386B (zh) | 一种用于封装半导体设备的环氧树脂组合物 | |
| CN1345896A (zh) | 环氧树脂组合物和半导体装置 | |
| JP2014152189A (ja) | 封止用エポキシ樹脂組成物及びそれを用いた半導体装置 | |
| KR20120110267A (ko) | 비할로겐계 반도체 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치 | |
| CN116178903A (zh) | 一种环氧塑封料及其制备方法与应用 | |
| JP3969402B2 (ja) | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 | |
| KR101190765B1 (ko) | 반도체 소자 봉지용 에폭시 수지 조성물 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HENKEL HUAWEI ELECTRONICS CO., LTD. Free format text: FORMER NAME: JIANGSU ZHONGDIAN HUAWEI ELECTRONICS CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 222006 song Jump Development Zone, Jiangsu, Lianyungang Patentee after: Henkel Huawei Electronics Co., Ltd. Address before: 222004 No. 26, new sea road, Sinpo District, Jiangsu, Lianyungang Patentee before: Jiangsu Zhongdian Huawei Electronics Co., Ltd. |
|
| C35 | Partial or whole invalidation of patent or utility model | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20130117 Decision number of declaring invalidation: 19929 Granted publication date: 20070221 |