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CN1386037A - 电容式送话器及制造电容式送话器的方法 - Google Patents

电容式送话器及制造电容式送话器的方法 Download PDF

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CN1386037A
CN1386037A CN02119994A CN02119994A CN1386037A CN 1386037 A CN1386037 A CN 1386037A CN 02119994 A CN02119994 A CN 02119994A CN 02119994 A CN02119994 A CN 02119994A CN 1386037 A CN1386037 A CN 1386037A
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CN1201633C (zh
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田辺阳久
堀内惠
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49792—Dividing through modified portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

一具有固定后电极的后板固定于基体。一隔膜电极安装在后板上,其间插入一间隔件。一具有声音接收孔的框架安装在隔膜电极上。

Description

电容式送话器及制造电容式送话器的方法
(1)技术领域
本发明涉及一种电容式送话器和制造用于移动电话、摄像机及其它装置的电容式送话器的方法。
(2)背景技术
图5示出一传统电容式送话器的剖视图。该电容式送话器包括一基体2、一安装在基体2上的场效应晶体管(FET)3、一安装在基体2之上的在两者之间有一间隔件4的后板5以及一安装在后板5之上的在两者之间有一间隔件6的框架8。一作为可动电极的隔膜7固定于框架的下侧，一固定电极(未示出)固定于后板5的表面。
在组装送话器时，壳体1的底部1a是未被弯曲的。具有一声音收集孔1b的壳体1被倒置，上述的元件安装在壳体1中。然后将底部1a如图5所示弯曲。
在传统的电热器中，各构成元件必需封装在每一送话器的壳体中，底部1a必需弯曲。
因此，电容式送话器的生产率是低的，制造成本是高的。
(3)发明内容
本发明的目的是提供一种电容式送话器，它可被低成本地简单地制成。
本发明的另一个目的是提供一种方法，可用该方法低成本地制造多个电容式送话器。
根据本发明，提供一电容式送话器，它包括一基体、一具有固定后电极并固定于基体的后板、一安装在后板上的间隔件、一在间隔件上的隔膜电极以及一具有声音接收孔并安装在隔膜电极上的框架。
在送话器的一侧设置一凹部，在该凹部中具有连接固定后电极、隔膜电极的线路和在基体上的电路。
本发明还提供一种制造电容式送话器的方法，该方法包括如下步骤：制备一具有多个分割块的基体集合体，每一分割块提供一个基体，制备一后板集合体，在每一分割块上有一个固定后电极，制各一间隔件集合体，在每一分割块上有一个孔，制备一框架集合体，在每一分割块上有一个声音接收孔，在框架集合体的下侧围绕声音接收孔有一隔膜电极，叠堆所述集合体，并将这些集合体彼此粘结在一起以形成一集合体的组件，切割集合体的组件，以在每一分割块分离出一电容式送话器。
基体集合体、后板集合体和框架集合体由陶瓷制成。
印刷一金属糊以形成固定后电极。
真空淀积金属以形成隔膜电极。
从结合附图的如下的详细说明中将可更清楚地知道本发明的这些和其它目的以及特征。
(4)附图说明
图1a至1d是组装电容式送话器的各材料的立体图；
图2是组合后的材料的立体图；
图3是本发明的电容式送话器的剖视图；
图4是电容式送话器的一个分解的立体图；以及
图5是一传统电容式送话器的剖视图。
(5)具体实施方式
参阅图3和4，本发明的电容式送话器的特征在于，各构成元件组合在一起，但不装在盒子里。电容式送话器包括一具有印刷线路的基体12、一固定地安装在基体12上的场效应晶体管(FET)13、一具有用于FET13的凹部14和通风孔15b的固定于基体12的后板15、一固定地安装在后板15的表面上的固定后电极16和一安装在后板15上的两者之间插入一具有孔19a的间隔件19的框架18。基体12、后板15、框架18由陶瓷制成。一作为可动电极的隔膜电极17固定于框架18的下侧。固定后电极16和隔膜电极17形成一电容器。
如图4所示，半圆形凹部20设置在送话器的四个角上，其中印刷有连接电极16、17的线路、在基体12上的电路及其它。
下面描述本发明的制造方法。
参阅图1a-1d，各个原材料板具有相同尺寸，该尺寸也是12个送话器的集合的尺寸。因此，每一板被分成12分割块。每一分割块都是正方形。
图1d的基体集合体22在每一分割块中有一个基体。FET13固定在每一分割块的中心位置并通过布线结合连接于每一基体上的电路。此外，FET涂覆有塑料保护膜。在后板集合体25的每一分割块中，形成图3所示的凹部14和通风孔15b。一金属糊(metal paste)印刷在后板集合体25的表面上，以在每一分割块中形成固定的后电极16。
由金属片制成的间隔件集合体29的每一分割块中有一孔29a。
框架集合体28在每一分割块中有一声音收集孔28a。在框架集合体28的下侧，通过金属的真空淀积，在声音收集孔的周围形成隔膜电极膜并使其形状做成隔膜电极17。
在每一集合体，为了凹部20，在每一分割块的四个角上形成四个小孔23。
所有集合体22、25、29和28按图1a-1d的顺序重叠，用粘结剂将它们粘结在一起，以提供如图2所示的集合体的组件。沿格子线21切割组合的集合体板，以形成12块电容式送话器。
每一小孔23被分成四个半圆形凹部20。
根据本发明，电容式送话器的构成元件的组装不用壳体(casing)。送话器是以低成本方便地制成的。
尽管结合本发明的较佳特定的实施例描述了本发明，但要理解的是，这种说明只是为了举例说明，而不是用来限制本发明的范围，本发明的范围由下面的权利要求书所限定。

Claims (7)

1.一种电容式送话器，它包括：
一基体；
一具有固定后电极并固定于基体的后板；
一安装在后板上的间隔件；
一在间隔件上的隔膜电极；以及
一具有声音接收孔并安装在隔膜电极上的框架。
2.如权利要求1所述的电容式送话器，其特征在于，在送话器的一侧设置至少一个凹部，在该凹部中具有连接固定后电极、隔膜电极和在基体上的电路的布线。
3.一种制造电容式送话器的方法，该方法包括如下步骤：
制备一具有多个分割块的基体集合体，每一分割块提供一个基体；
制备一后板集合体，在每一分割块上有一个固定后电极；
制备一间隔件集合体，在每一分割块上有一个孔；
准备一框架集合体，在每一分割块上有一个声音接收孔，在框架集合体的下侧围绕声音接收孔有一隔膜电极；
叠堆所述集合体，并将这些集合体彼此粘结在一起以形成一集合体的组件；
切割集合体的组件，以在每一分割块分离出一电容式送话器。
4.如权利要求3所述的方法，其特征在于，基体集合体、后板集合体和框架集合体由陶瓷制成。
5.如权利要求3所述的方法，其特征在于，印刷一金属糊以形成固定后电极。
6.如权利要求3所述的方法，其特征在于，真空淀积金属以形成隔膜电极。
7.如权利要求3所述的方法，其特征在于，每一分割块是正方形的，在每一分割块的四个角上形成孔，提供布线以连接在送话器中的各元件。
CNB021199949A 2001-05-15 2002-05-15 电容式送话器及制造电容式送话器的方法 Expired - Fee Related CN1201633C (zh)

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JP2001145694A JP2002345092A (ja) 2001-05-15 2001-05-15 コンデンサマイクロホンの製造方法

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EP (1) EP1261234A3 (zh)
JP (1) JP2002345092A (zh)
KR (1) KR100518134B1 (zh)
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TW (1) TW546981B (zh)

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US20040057595A1 (en) 2004-03-25
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US6708387B2 (en) 2004-03-23
EP1261234A3 (en) 2007-11-07
US20020172383A1 (en) 2002-11-21
EP1261234A2 (en) 2002-11-27
JP2002345092A (ja) 2002-11-29
KR20020087358A (ko) 2002-11-22
KR100518134B1 (ko) 2005-10-04
US6947568B2 (en) 2005-09-20

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