CN1239275C - Regulator cleaning device and cleaning method for chemical mechanical grinding machine table - Google Patents
Regulator cleaning device and cleaning method for chemical mechanical grinding machine table Download PDFInfo
- Publication number
- CN1239275C CN1239275C CN 02159578 CN02159578A CN1239275C CN 1239275 C CN1239275 C CN 1239275C CN 02159578 CN02159578 CN 02159578 CN 02159578 A CN02159578 A CN 02159578A CN 1239275 C CN1239275 C CN 1239275C
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- China
- Prior art keywords
- cleaning
- adjuster
- regulator
- overflow tank
- pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004140 cleaning Methods 0.000 title claims abstract description 108
- 239000000126 substance Substances 0.000 title claims abstract description 18
- 238000000227 grinding Methods 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 11
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000005498 polishing Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 8
- 239000012535 impurity Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 28
- 239000012530 fluid Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 230000009711 regulatory function Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A cleaning device for a conditioner of a chemical mechanical polishing machine comprises an overflow trough; a cleaning liquid supply device; and a cleaning unit installed in the overflow tank. The cleaning unit comprises a cleaning gasket arranged in the overflow groove and a motor arranged at the bottom of the overflow groove, the motor is connected with the cleaning gasket, and the motor rotates the cleaning gasket. The cleaning liquid supply device is communicated with the overflow groove and is used for continuously supplying the cleaning liquid to the overflow groove, and the cleaning liquid can overflow the top of the overflow groove and take away impurities washed from the regulator.
Description
Technical field
The invention relates to a kind of regulator in chemical and mechanical grinder bench cleaning device, and particularly relevant for a kind of regulator in chemical and mechanical grinder bench cleaning device.
Background technology
Chemical mechanical milling method is unique now a kind of technology that comprehensive planarization can be provided.And the principle of its planarization is to utilize this mechanical principle of similar sharpening, cooperates suitable chemical assistant (Reagent), and the profile that crystal column surface just rises and falls is polished.
Shown in Figure 1, it illustrates is the schematic diagram of a work-table of chemicomechanical grinding mill and known adjuster cleaning device.
Please refer to Fig. 1, a work-table of chemicomechanical grinding mill comprises a grinding table 100 (PolishingTable), a grinding pad (Polishing Pad) 102, one wafer carrier (Wafer Carrier) 104, one lapping liquid conveying pipe fitting (Slurry Tube) 108 and one adjuster (Conditioner) 110.
Wherein, grinding pad 102 is layered on the grinding table 100.Wafer carrier 104 is configured in the top of grinding pad 102, and it is used for catching polished wafer 106, so that wafer 106 can grind on grinding pad 102.Lapping liquid carries pipe fitting 108 to be configured in the top of grinding pad 102, and it is used for carrying lapping liquid to grinding pad 102.And adjuster 110 is configured in the top of grinding pad 102, and adjuster 110 has adjusting range 111 and is embedded with many hard particles with the surface that contacts grinding pad 102, for example be diamond grains (Diamond Grits) or ceramic particle, in order to regulate the surface of grinding pad 102.
When carrying out cmp, grinding table 100 rotates along certain direction respectively with wafer carrier 104.And wafer carrier 104 is caught the back side of wafer 106, and the front of wafer 106 is pressed on the grinding pad 102.It is that lapping liquid is fed on the grinding pad 102 continuously that lapping liquid is carried 108 of pipe fittings.So, the cmp program is exactly when the part of the protrusion in wafer 106 fronts contacts with grinding pad 102, just can utilize the chemical assistant in the lapping liquid, produce chemical reaction with front at wafer 106, and grind with Aided Machine by the abrasive grains (Abrasive Particles) in the lapping liquid, and the part of the protrusion in removal wafer 106 fronts.After above-mentioned repeatedly chemical reaction and mechanical lapping, just can make the positive planarization of wafer 106.
Usually have many concaveconvex structures that help grind on the surface of grinding pad 102, so the surface of grinding pad 102 presents 1 micron to 2 microns degree of roughness.And generally work-table of chemicomechanical grinding mill is after grinding several pieces wafers, and original grinding pad 102 rough surfaces will become smooth, so that the grainding capacity of grinding pad 102 reduces.And after grinding, the material that is ground away from the wafer 106 also may remain on the grinding pad 102, will make that so abrasive characteristic changes to some extent, and then the influence effect of grinding.Therefore, after grinding several pieces wafers, all can utilize adjuster 110 to regulate grinding pad 102 usually,, and strike off the residue of plug in grinding pad 102 simultaneously so that the surface recovery of grinding pad 102 becomes rough surface.When drawing together when removing the residue of plug in grinding pad 102, the adjusting range 111 of adjuster 110 can attach some materials that ground away, and reduces the function of adjuster 110, so after a period of time, promptly need clean adjuster 110.
And the mode of known cleaning adjuster is adjuster 110 to be immersed contain in the tank 112 of cleaning fluid 114, and adjuster 110 is bobbed and woven clean.But because of the cleaning fluid in the tank 112 114 is not had a flowability, therefore known cleaning method can't be fully clean with adjuster 110.
Summary of the invention
Therefore purpose of the present invention is exactly in that a kind of regulator in chemical and mechanical grinder bench cleaning device is provided, and can fully clean adjuster, recovers the function of adjuster.
A kind of regulator in chemical and mechanical grinder bench cleaning device proposed by the invention, this device comprises an overflow launder, a cleaning fluid feeding mechanism and a cleaning unit, this cleaning unit is installed in and comprises in the overflow launder that being configured in one in this overflow launder cleans a pad and a motor that is installed in the bottom of this overflow launder, and this motor is connected with this cleaning pad, and this motor rotates this cleaning pad.Wherein the cleaning fluid feeding mechanism is communicated with overflow launder, in order to continuing the supply cleaning fluid to overflow launder, and can the overfill top of overflow launder of cleaning fluid, takes advantage of a situation and takes away and will wash the impurity that gets off from adjuster.
A kind of regulator in chemical and mechanical grinder bench cleaning method proposed by the invention, the method at first provides an overflow launder, this overflow launder is communicated with a cleaning fluid feeding mechanism, and is provided with a motor that cleans pad and the bottom that is installed in overflow launder and be connected with the cleaning pad in the overflow launder.When adjuster after grinding pad work a period of time, adjuster is placed overflow launder, make lasting supply one cleaning fluid of cleaning fluid feeding mechanism to overflow launder, and an adjusting range that makes adjuster with clean that pad contact and with motor rotation cleaning pad, remain in the material on the adjusting range of adjuster with removal.
The present invention is because of the cleaning structure of employing overflow-type, and the device cleaning unit can be brushed in the overflow launder
The present invention is because of the cleaning structure of employing overflow-type, and the device cleaning unit can be scrubbed adjuster in the overflow launder, therefore can adjuster is fully clean, recover the function of adjuster.
Description of drawings
Fig. 1 is the schematic diagram of a kind of work-table of chemicomechanical grinding mill and known adjuster cleaning device;
Fig. 2 is the schematic diagram of a kind of adjuster at work-table of chemicomechanical grinding mill running and adjuster cleaning device of the present invention; And
Fig. 3 is the schematic diagram that a kind of work-table of chemicomechanical grinding mill and adjuster clean at cleaning device of the present invention.
100: grinding table
102: grinding pad
104: wafer carrier
106: wafer
108: lapping liquid is carried pipe fitting
110: adjuster
111: adjusting range
112: tank
114: cleaning fluid
200: overflow launder
202: clean pad
204: pipe fitting
206: liquid pump
207: the cleaning fluid feeding mechanism
208: motor
210: cleaning unit
The specific embodiment
Please refer to Fig. 2, it illustrates the schematic diagram of a kind of adjuster at work-table of chemicomechanical grinding mill running and adjuster cleaning device of the present invention.Regulator in chemical and mechanical grinder bench cleaning device of the present invention comprises an overflow launder 200, a cleaning fluid feeding mechanism 207 and a cleaning unit 210.Wherein, cleaning fluid feeding mechanism 207 comprises pipe fitting 204 and liquid pump 206, and cleaning unit 210 comprises cleaning pad 202 and motor 208.
Above-mentioned overflow launder 200 is used for the splendid attire cleaning fluid, its material is can being not good with cleaning fluid chemically reactive person, because of its top, groove top opening needs to hold to put into adjuster and impurity is gone out with the cleaning fluid overflow, the groove top opening is answered vast plane of tool and groove top edge can not hinder fine impurity and is overflowed outflow in the design again.
Wherein, cleaning fluid feeding mechanism 207 is to be communicated with overflow launder 200 with pipe fitting 204, and supplies cleaning fluids 114 to overflow launder 200 with liquid pump 206.
In addition, cleaning unit 210 is installed in the overflow launder 200, and this cleaning unit 210 for example is to clean pad 202, and in order to the adjusting range 111 of scrubbing adjuster 110, its kind for example is dishcloth or brush, and its shape for example is circle or rectangle.
In a preferred embodiment, cleaning unit 210 more comprises motor 208, and it is arranged on the bottom of overflow launder 200, and is connected with cleaning pad 202, motor 208 can driven rotary cleans pad 202 in order to scrubbing adjuster 110, and the impurity on the adjuster 110 is removed fully.
Illustrate that then the present invention cleans the method for regulator in chemical and mechanical grinder bench, please refer to Fig. 2 and Fig. 3, Fig. 2 illustrate is the schematic diagram of a kind of adjuster at work-table of chemicomechanical grinding mill running and adjuster cleaning device of the present invention, and Fig. 3 illustrate is a kind of work-table of chemicomechanical grinding mill and the adjuster schematic diagram in cleaning device cleaning of the present invention.
Please refer to Fig. 2, when carrying out cmp, grinding table 100 rotates along certain direction respectively with wafer carrier 104.And wafer carrier 104 is caught the back side of wafer 106, and the front of wafer 104 is pressed on the grinding pad 102.It is that lapping liquid is fed on the grinding pad 102 continuously that lapping liquid is carried 108 of pipe fittings.So, the cmp program is exactly when the part of the protrusion in wafer 106 fronts contacts with grinding pad 102, just can utilize the chemical assistant in the lapping liquid, produce chemical reaction with front at wafer 106, and grind with Aided Machine by the abrasive grains in the lapping liquid, and the part of the protrusion in removal wafer 106 fronts.After above-mentioned repeatedly chemical reaction and mechanical lapping, just can make the positive planarization of wafer 106.
Usually have many concaveconvex structures that help grind on the surface of grinding pad 102, so the surface of grinding pad 102 presents 1 micron to 2 microns degree of roughness.And generally work-table of chemicomechanical grinding mill is after grinding several pieces wafers, and original grinding pad 102 rough surfaces will become smooth, so that the grainding capacity of grinding pad 102 reduces.And after grinding, the material that is ground away from the wafer 106 also may remain on the grinding pad 102, will make that so abrasive characteristic changes to some extent, and then the influence effect of grinding.Therefore, after grinding several pieces wafers, all can utilize adjuster 110 to regulate grinding pad 102 usually,, and strike off the residue of plug in grinding pad 102 simultaneously so that the surface recovery of grinding pad 102 becomes rough surface.
Then please refer to Fig. 3, when adjuster 110 at grinding pad 102 after work a period of times, need adjuster 110 is shifted out grinding pad 102, immerse the adjusting range 111 contact cleaning units 210 that make adjuster 110 in the overflow launder 200 then, cleaning fluid feeding mechanism 207 continues supply cleaning fluid 114 to overflow launder 200 at the same time, cleaning fluid 114 is gone out from the top overflow of overflow launder 200, and the impurity that will wash down of taking advantage of a situation is taken out of outside the overflow launder 200 in the lump.
Because the cleaning way of adjuster of the present invention is placed on adjuster 110 in the overflow launder 200 and cleans, and what cleaning fluid 114 can continue is fed in the overflow launder 200, and go out from the top overflow of overflow launder 200, therefore, compared to known cleaning fluid is stagnant water and immobilising state, and the present invention more can be fully cleans up the material that remains on the adjusting range 111 of adjuster 110.
In addition, comprise more in the overflow launder 200 of the present invention being provided with cleaning unit 210 that wherein cleaning unit 210 for example is rotary cleaning pad 202, it comes driven rotary to clean pad 202 by motor 208.And the adjusting range 111 of adjuster 110 contacts with cleaning pad 202, removes with the material on the adjusting range 111 that will remain in adjuster 110.
Cleaning device of the present invention is except the design of overflow launder 200, more device cleans pad 202 in overflow launder 200, therefore adjuster 110 is in the process of cleaning, and the cleaning fluid by constant supply cleans it, but also scrubs its adjusting range 111 by cleaning unit 210.Therefore, cleaning device of the present invention and cleaning method can make adjuster 110 be cleaned fully totally.
Comprehensive the above, the present invention has following advantages:
1. the adjuster cleaning device of work-table of chemicomechanical grinding mill of the present invention adopts the clear of overflow-type Wash structure, and the device cleaning unit can be scrubbed adjuster in the overflow launder, therefore adjuster can be filled Divide and clean, recover its regulatory function.
2. the present invention cleans the method for the adjuster of work-table of chemicomechanical grinding mill, and adjuster is placed In the overflow launder, make cleaning fluid continue to be supplied in the overflow launder, and the cleaning pad of rotation is scrubbed The adjusting range of adjuster, the residue of removal adjusting range can be rapidly fully clean with adjuster, Recover the function that it regulates grinding pad.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02159578 CN1239275C (en) | 2002-12-27 | 2002-12-27 | Regulator cleaning device and cleaning method for chemical mechanical grinding machine table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02159578 CN1239275C (en) | 2002-12-27 | 2002-12-27 | Regulator cleaning device and cleaning method for chemical mechanical grinding machine table |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1511652A CN1511652A (en) | 2004-07-14 |
| CN1239275C true CN1239275C (en) | 2006-02-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02159578 Expired - Fee Related CN1239275C (en) | 2002-12-27 | 2002-12-27 | Regulator cleaning device and cleaning method for chemical mechanical grinding machine table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1239275C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384127B (en) * | 2014-10-11 | 2017-03-29 | 清华大学 | For cleaning the cleaning device of dresser |
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2002
- 2002-12-27 CN CN 02159578 patent/CN1239275C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1511652A (en) | 2004-07-14 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060201 Termination date: 20191227 |
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| CF01 | Termination of patent right due to non-payment of annual fee |