CN1233035C - A working method for rework and salvage of integrated circuit components - Google Patents
A working method for rework and salvage of integrated circuit components Download PDFInfo
- Publication number
- CN1233035C CN1233035C CN 02127079 CN02127079A CN1233035C CN 1233035 C CN1233035 C CN 1233035C CN 02127079 CN02127079 CN 02127079 CN 02127079 A CN02127079 A CN 02127079A CN 1233035 C CN1233035 C CN 1233035C
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- China
- Prior art keywords
- integrated circuit
- target integrated
- circuit package
- circuit component
- solder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract 10
- 238000007689 inspection Methods 0.000 claims abstract 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 72
- 238000012360 testing method Methods 0.000 claims description 25
- 238000012795 verification Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 230000002950 deficient Effects 0.000 description 40
- 238000004458 analytical method Methods 0.000 description 13
- 230000006378 damage Effects 0.000 description 6
- 230000000007 visual effect Effects 0.000 description 5
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 4
- 241000482268 Zea mays subsp. mays Species 0.000 description 3
- 238000012812 general test Methods 0.000 description 3
- 240000007711 Peperomia pellucida Species 0.000 description 2
- 235000012364 Peperomia pellucida Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 235000013578 rice krispies Nutrition 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to an operation method for returning (rework) and saving an integrated circuit assembly, wherein the integrated circuit assembly is packaged in a Ball Grid Array (BGA) mode, and the operation method comprises the following steps: (a) the method comprises the steps of firstly, checking by a preliminary inspection step to screen out damaged and failed integrated circuit components, (b) baking target integrated circuit components at a preset temperature within a preset time, (c) removing at least one solder ball of the integrated circuit components, and (d) re-soldering the solder on the solder-removed parts of the integrated circuit components.
Description
Technical field
The present invention relates to a kind of doing over again and rescue back the operational method of integrated circuit package, especially finger is a kind of to selecting whether to burn-on again scolding tin with ball pin trellis array way packaged integrated circuits assembly, can rescue back the operational method of this integrated circuit package to carry out next step test.
Background technology
In general, when client terminal to discover has defective integrated circuit package, those integrated circuit packages can be returned goods to manufacturer, hope can give attributional analysis or replacing.At this moment, manufacturer can attempt to determine that it is to belong to defective integrated circuit package just like the client is said that these visitors move back integrated circuit package actually, and as truly belonging to defective integrated circuit package, the pin position that can understand its fault is the defective analysis of which and occurrence cause thereof, so will help the reference of integrated circuit package manufacturer when the next group integrated circuit package is made, to avoid the generation of failure condition of the same race.Certainly, the integrated circuit package that part client returns may be through after the defective analysis, but finds still to belong to the integrated circuit package of operate as normal, thus, this part client returns integrated circuit package and just can be kept, and verifies again or re-uses to return to the client.
(Ball Grid Array, BGA) formula method for packing are widely used in the encapsulation of integrated circuit package to ball pin trellis array already.When returning goods when the integrated circuit package that uses ball pin trellis array package mode because being judged to be defective item by client, integrated circuit package manufacturer can move back defective item at these visitors and carry out accident analysis.The defective analytical method of common technique, earlier these so-called fault integrated circuit packages are given removal on circuit support plate (motherboard) exactly, and remove scolding tin all on it, afterwards again to its scolding tin of burn-oning again, so that carry out next step defective analysis.
Before waiting for the scolding tin of burn-oning again, because these defective integrated circuit packages may be exposed to a period of time in the air, the airborne moisture that made its absorbed inside.Thus, the moment high temperature of following when rewelding scolding tin and coming (for example similarly be 180 degree Celsius to about 260 degree), can make the moisture of integrated circuit package inside destroy (popcorn failure) owing to thermal shock causes volume to expand rice krispies fancy such as causing explosion or delamination rapidly, the defective analysis that will cause being about to after a while carry out is difficult to obtain correct result, has also wasted these for the scolding tin of burn-oning again required material and time simultaneously.
In addition, from the scolding tin of rewelding, whether the scolding tin of rewelding to inspecting is finished, until whole integrated circuit package is cleaned whole process, will consume five to six minutes time.When the needs scolding tin of rewelding carries out integrated circuit package quantity that integrated circuit package pin bit function detects when very huge, still can spend the considerable time on the whole.And must know as early as possible under the situation of analysis result as some client how to quicken the carrying out verifying, analyze, for urgently holding the problem of separating rhymed formula.
Summary of the invention
Main purpose of the present invention is to provide a kind of doing over again to rescue back the operational method of integrated circuit package.This operational method is before scolding tin again, earlier with a predetermined temperature target integrated circuit package being toasted a scheduled time can absorbent ambient moisture to remove the inner institute of this target integrated circuit package, make when carrying out again the scolding tin action, not can because of moment the high thermal conductance volume that causes these water (wetting) gas expand rapidly, cause the integrated circuit package bottom that the protuberance of resembling popcorn or the destruction of internal structure are arranged, and then make the defective analysis of carrying out after a while can't obtain correct result.
In addition, operational method of the present invention can be applicable on the integrated circuit package of the ball pin trellis array package of using POGO Pin test trough seat, it is after removing all scolding tin of so-called defective integrated circuit package, not earlier to this target integrated circuit package action of scolding tin again, make the target integrated circuit package do electrical the contact with conductive pad with POGO Pin test trough seat fully, judge whether to be qualified product earlier, if lost efficacy the then action of scolding tin no longer again of product, and only for the just action of scolding tin again of the partly integrated circuit unit that is judged as qualified product and has an opportunity to rescue back, reweld the required time of scolding tin with saving.It should be noted that the action that this does not reweld scolding tin fully, only be applied to the test trough seat of POGO Pin, for the integrated circuit package of the ball pin trellis array package of using other general test trough seat, this action of scolding tin of rewelding is still necessary.
In order to reach above-mentioned purpose, the operational method that the integrated circuit package of ball pin trellis array package of the present invention is done over again includes inspects bottom that step is used for inspecting this target integrated circuit package with one and whether protuberance is arranged or opens after short circuit lost efficacy, in a scheduled time, toast this target integrated circuit package with a predetermined temperature, remove at least one scolding tin of this target integrated circuit package, and this target integrated circuit package removed the scolding tin position scolding tin of rewelding.Wherein, at general test groove seat and POGO Pin test trough seat, whether operational method of the present invention can be selected after removing scolding tin the target integrated circuit package scolding tin of burn-oning, after the correct bad analysis result that can obtain target integrated circuit package pin position, save the time consumption of the scolding tin of rewelding.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the flow chart of first preferred embodiment of operational method of the present invention;
Fig. 2 is the flow chart of another preferred embodiment of operational method of the present invention.
Embodiment
See also Fig. 1, Fig. 1 is the flow chart of the operational method 100 of first preferred embodiment of the present invention.Operational method 100 of the present invention includes the following step:
Step 101: beginning;
Step 102: unload defective integrated circuit package on motherboard, this is will inspected target integrated circuit package;
Step 103: carry out initial survey step test-target integrated circuit package, as defective then past step 104, if qualified then toward step 105;
Step 104, this integrated circuit package is judged as defective item and abandons;
Step 105: this one scheduled time of target integrated circuit package of baking under a predetermined temperature;
Step 106: remove scolding tin;
Step 107: clean this integrated circuit package;
Step 108: again to this integrated circuit package scolding tin of burn-oning;
Step 109: whether the scolding tin that execution reinspection step is inspected this target integrated circuit package is qualified, if qualified then toward step 110, the defective step 108 of then getting back to;
Step 110: clean this integrated circuit package once again;
Step 111: this integrated circuit package to test trough seat is installed is carried out functional verification test, as defective then past step 112, if qualified then toward step 113;
Step 112: this integrated circuit package is judged as defective item and abandons;
Step 113: be judged as qualified product and rescue back; And
Step 114: finish.
When receiving the visitor, integrated circuit package manufacturer produces visitor that end sends here when moving back defective integrated circuit package, must earlier these defective integrated circuit packages be gone up removal (shown in step 102) from circuit support plate (or motherboard), and this removal action nature can partial destruction be positioned at these scolding tin with ball pin trellis array encapsulation method packaged integrated circuits assembly bottom.This is just why after a while before carrying out defective analysis, must be to these integrated circuit packages scolding tin of burn-oning again, could learn really that these so-called defective integrated circuit packages are that the very out of order facts takes place actually, or in a single day really defining fault takes place, and is to break down in which leg position actually.
Initial survey step shown in the step 103, be behind these integrated circuit packages of removal on circuit support plate or the motherboard, whether the bottom of (1) these integrated circuit packages of visual examination has protuberance emersion or the uneven phenomenon (so-called Popcorn Failure) of depression earlier, and further (2) check the situation that whether has had abnormal open circuit and/or short circuit to lose efficacy between the power supply of these integrated circuit packages and grounding leg again, this open circuit/short circuit failure conditions available digital voltmeter (Digital Voltage Meier) detection and learning.In case meet above-mentioned two kinds of situations one of them, proceed to just that step 104 directly judges that these integrated circuit packages lost efficacy and be defective item, the value rescued back of further not doing over again is also abandoned it.
Qualified integrated circuit package after process initial survey step then carry out step 105.Owing to having exposed a period of time in air, these integrated circuit packages absorbed airborne part moisture, may be in the removal scolding tin that carries out after a while or the process of rewelding because of moment high heat the and therefore destruction that causes the integrated circuit package internal structure need a milder mode to remove and be present in its inner moisture.Step 105 of the present invention promptly is to toast a scheduled time (as 8 to 12 hours) down to reach this purpose at a predetermined temperature (as 125 degree Celsius).Though in the present embodiment, be with as 125 degree Celsius carry out 8 to 12 hours baking, this temperature height and time length are when visual actual state is adjusted it.
After the baking action of completing steps 105, just can carry out step 106, begin to remove the integrated circuit package bottom because of the scolding tin that when circuit support plate removal, sustains damage, till all scolding tin all is removed.Because scolding tin is the relative position that is arranged at the conductive pad below of integrated circuit package bottom in man-to-man mode, be with after removing scolding tin, if when finding that the conductive pad of integrated circuit package has the phenomenon of oxidation, then need to use in addition the tin silk to these conductive pads tin sticky again.
After finishing removal scolding tin, a cleaning step 107 being arranged in addition, is integrated circuit package to be soaked also to handle in 2 minutes with cleaning solution dry.The action (step 108) of scolding tin afterwards just begins to burn-on again.In the process that present embodiment is rewelded, the temperature that sets is 240 degree Celsius, and be 3 minutes heating time, and be 1 minute cooling time.This temperature is dried the temperature that gas sets (125 degree Celsius) by comparison with baking before, belong to high temperature relatively, if do not include moisture with removal so earlier integrated circuit package is not walked unhurriedly to toast, just directly reweld, probably can cause the infringement of integrated circuit package internal structure, and the situation that has so-called quick-fried corn to destroy takes place.
After rewelding, whether operational method 100 of the present invention includes in addition rechecks step 109, comes the visual integrated circuit package that these have finished again the scolding tin action of inspecting, have scolding tin leakage weldering or the molten tin of scolding tin bad.If the generation of above-mentioned situation is arranged, then come back to step 108 pair defective integrated circuit package part and reweld once again.
After rechecking step 109 end, if the scolding tin of rewelding of integrated circuit package is qualified, then clean (shown in step 110) once more, then integrated circuit package is installed to test trough seat (socket) afterwards in step 111, carry out functional verification test, then abandon this integrated circuit package as defective toward step 112, or used for carrying out further defective analysis in addition; Quilt is rescued back if qualified then past step 113 is judged as qualified product.The whole operational method 100 of doing over again arrives this, just can finish (shown in step 114) at last.If think that more detail knowledge is to break down in that integrated circuit package pin position actually, the integrated circuit package that step 112 can be abandoned sees through more accurate tester table in addition to reach this purpose, and emphasis of the present invention then is the steps flow chart of doing over again and rescuing back.
See also Fig. 2, Fig. 2 is the flow chart of another preferred embodiment of the present invention.The doing over again of the disclosed pin of this embodiment position trellis array package integrated circuit package rescued back operational method 200 and included the following step.
Step 201: beginning;
Step 202: unload defective integrated circuit package on motherboard, this is will inspected target integrated circuit package;
Step 203: carry out initial survey step test-target integrated circuit package, as defective then past step 204, if qualified then toward step 205;
Step 204: this integrated circuit package is judged as defective item and abandons;
Step 205: this one scheduled time of target integrated circuit package of baking under a predetermined temperature;
Step 206: remove scolding tin;
Step 207: clean this integrated circuit package;
Step 208: this integrated circuit package to POGO Pin test trough seat is installed is carried out functional verification test, as defective then past step 209, if qualified then toward step 210;
Step 209: this integrated circuit package is judged as defective item and abandons;
Step 210: again to this integrated circuit package scolding tin of burn-oning;
Step 211: whether the soldered ball that execution reinspection step is inspected this target integrated circuit package is qualified, if qualified then toward step 212, the defective step 210 of then getting back to;
Step 212: clean this integrated circuit package once again;
Step 213: be judged as qualified product and rescue back; And
Step 214: finish.
Shown in step 202,, must earlier these defective integrated circuit packages be gone up removal from circuit support plate (or motherboard) when integrated circuit package manufacturer receives visitor that client sends here when moving back defective integrated circuit package.This removal action nature can part even whole scolding tin that is positioned at pin position trellis array package integrated circuit package bottom that destroys.
Inspect step shown in the step 203, be behind these integrated circuit packages of removal on circuit support plate or the motherboard, whether the bottom of elder generation's visual examination these integrated circuit packages has protuberance emersion or the uneven phenomenon of depression, further checks the situation that open circuit/short circuit inefficacy whether has been arranged between the power supply of these integrated circuit packages and grounding leg again.In case meet above-mentioned two kinds of situations one of them, lost efficacy and do not have and further do over again the value rescued back and it is abandoned (shown in step 204) just directly judge these integrated circuit packages.
When belonging to qualified integrated circuit package after step 203 is inspected,, toast a scheduled time (as 8 to 12 hours) down at a predetermined temperature (as 125 degree Celsius) just carry out step 205 through inspecting.This practice is to remove in a milder mode and is present in its inner moisture, so as not to integrated circuit package in the removal scolding tin that carries out after a while or again in the process of scolding tin because moment high heat and the destruction that causes the integrated circuit package internal structure.
After the baking action of completing steps 205, just can carry out step 206 and begin to remove the integrated circuit package bottom because of the scolding tin that when circuit support plate removal, sustains damage, till all scolding tin all is removed.Because scolding tin is the relative position that is arranged at the conductive pad below of integrated circuit package bottom in man-to-man mode, be with after removing scolding tin, if when finding that the conductive pad of integrated circuit package has the phenomenon of oxidation, then need to use in addition the tin silk to these conductive pads tin sticky again.
After finishing removal scolding tin, a cleaning step 207 is arranged in addition, so that the bottom of integrated circuit package keeps clean and dry.Next in the present embodiment, be to use a POGO Pin test trough seat to come these target integrated circuit packages are carried out functional verification test (step 208).Because due to the architectural feature of POGO Pin test trough seat itself, make the operational method flow process 200 of present embodiment not need this action of scolding tin of to reweld earlier as previous embodiment.Also just because of POGO Pin groove seat with respect to the particularity of general test groove seat, the scolding tin of just not rewelding at last, the contact impedance (contact resistance) between testing integrated circuits assembly and POGO Pin test trough seat can remain on very a stationary value near zero impedance equally.Desire to reach above-mentioned purpose, as long as can keep the conductive pad of integrated circuit package bottom and the cleaning of POGO Pin test trough seat.Carry out the result of functional verification test, then abandon this integrated circuit package toward step 209 as defective, or used for carrying out further defective analysis in addition; If qualifiedly then transfer again this integrated circuit package scolding tin of burn-oning toward step 210.
Behind scolding tin again, operational method 200 of the present invention includes in addition rechecks step 211, comes the visual integrated circuit package that these have finished again the soldered ball action of inspecting, whether have scolding tin to leak weldering or the molten tin of scolding tin defective.If the generation of above-mentioned defective situation is arranged, the integrated circuit package part that then comes back to step 210 and pair the have disappearance scolding tin of rewelding once again, otherwise if the scolding tin of rewelding of integrated circuit package is qualified, promptly enter step 212 and clean integrated circuit package once again, in step 212, be judged as qualified product again and by being rescued back.The whole operational method 200 of doing over again arrives this, just can finish (shown in step 214) at last.
Compared to common technique, back method is rescued in doing over again of ball pin trellis array package integrated circuit package of the present invention, be can be especially at when using elastic probe (POGO Pin) test trough seat, the scolding tin of selecting not reweld is earlier promptly tested, and then only to the integrated circuit package that the is judged as qualified product scolding tin of rewelding, and defective item is directly abandoned and the scolding tin of needn't rewelding, to save scolding tin reweld spent time, manpower and material cost.
The employed probe of elastic probe test trough seat (pin), its characteristics are that probe itself has elasticity, can stretch in response to suffered strength size, so can be when the contact error that partly (as soldering tin) is in height bigger of sphere grid array type integrated circuit package, still has preferable electrical contact effect, thereby improved itself and the electrical effect that contacts of the scolding tin joining zone of scolding tin, to reach the purpose of correct test.Just because of this, some may also have the integrated circuit package that continues to use chance because of the client erroneous judgement, can not scrap because of erroneous judgement, and even cause the loss of client manufacturer itself.
Though be that act one motherboard is an example in the operational method 100,200 of each preferred embodiment of the present invention, but on other circuit board, for example similarly be additional card (add-on card) etc., do over again and rescue return of serve lattice array integrated circuit package and also do not break away from category of the present invention.
The above only is preferred embodiment of the present invention, changes according to any equivalence of the present invention, should belong to the protection range of patent of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02127079 CN1233035C (en) | 2002-07-30 | 2002-07-30 | A working method for rework and salvage of integrated circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02127079 CN1233035C (en) | 2002-07-30 | 2002-07-30 | A working method for rework and salvage of integrated circuit components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1472800A CN1472800A (en) | 2004-02-04 |
| CN1233035C true CN1233035C (en) | 2005-12-21 |
Family
ID=34143459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02127079 Expired - Lifetime CN1233035C (en) | 2002-07-30 | 2002-07-30 | A working method for rework and salvage of integrated circuit components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1233035C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070050007A (en) * | 2004-06-18 | 2007-05-14 | 인테그레이티드 디바이스 테크놀로지, 인코포레이티드 | Automated Ball Mounting Method and System with Solder Ball Testing |
| CN102169809B (en) * | 2010-11-22 | 2013-04-10 | 苏剑锋 | BGA component repairing method and fixture |
| CN108106745A (en) * | 2017-05-24 | 2018-06-01 | 郑州云海信息技术有限公司 | It is a kind of to bury point methods for BGA repair thermometric plates |
| CN113155842A (en) * | 2021-03-01 | 2021-07-23 | 唐芮 | System and method for detecting defects of assembly line |
-
2002
- 2002-07-30 CN CN 02127079 patent/CN1233035C/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| CN1472800A (en) | 2004-02-04 |
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Granted publication date: 20051221 |