CN1208187C - 用于生产陶瓷生坯片料的铸膜 - Google Patents
用于生产陶瓷生坯片料的铸膜 Download PDFInfo
- Publication number
- CN1208187C CN1208187C CNB011217448A CN01121744A CN1208187C CN 1208187 C CN1208187 C CN 1208187C CN B011217448 A CNB011217448 A CN B011217448A CN 01121744 A CN01121744 A CN 01121744A CN 1208187 C CN1208187 C CN 1208187C
- Authority
- CN
- China
- Prior art keywords
- resin
- pressing sheet
- ceramic green
- casting film
- stearic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 63
- 238000005266 casting Methods 0.000 title claims abstract description 55
- 238000003825 pressing Methods 0.000 title claims description 53
- 229920000180 alkyd Polymers 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 25
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 25
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 20
- 239000004640 Melamine resin Substances 0.000 claims abstract description 19
- 229920003180 amino resin Polymers 0.000 claims abstract description 17
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920001807 Urea-formaldehyde Polymers 0.000 claims abstract description 8
- 235000021355 Stearic acid Nutrition 0.000 claims description 34
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 34
- 239000008117 stearic acid Substances 0.000 claims description 34
- 239000007787 solid Substances 0.000 claims description 21
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 20
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 9
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 239000003377 acid catalyst Substances 0.000 claims description 4
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 claims description 2
- CUTDUKARYBNWSH-UHFFFAOYSA-N C=O.C(C)=NC(=O)N Chemical compound C=O.C(C)=NC(=O)N CUTDUKARYBNWSH-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229920006267 polyester film Polymers 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- NGFUWANGZFFYHK-UHFFFAOYSA-N 1,3,3a,4,6,6a-hexahydroimidazo[4,5-d]imidazole-2,5-dione;formaldehyde Chemical compound O=C.N1C(=O)NC2NC(=O)NC21 NGFUWANGZFFYHK-UHFFFAOYSA-N 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 28
- 239000011248 coating agent Substances 0.000 abstract description 26
- 239000002002 slurry Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003985 ceramic capacitor Substances 0.000 abstract description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 1
- 230000001846 repelling effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 18
- 239000000243 solution Substances 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
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- 238000001723 curing Methods 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
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- 239000003607 modifier Substances 0.000 description 5
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 229920006397 acrylic thermoplastic Polymers 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N n-propyl alcohol Natural products CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- MEBONNVPKOBPEA-UHFFFAOYSA-N 1,1,2-trimethylcyclohexane Chemical compound CC1CCCCC1(C)C MEBONNVPKOBPEA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 210000002469 basement membrane Anatomy 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- AWMNXQXKGOSXDN-GORDUTHDSA-N (e)-ethylideneurea Chemical compound C\C=N\C(N)=O AWMNXQXKGOSXDN-GORDUTHDSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- GBURUDXSBYGPBL-UHFFFAOYSA-N 2,2,3-trimethylhexanedioic acid Chemical compound OC(=O)C(C)(C)C(C)CCC(O)=O GBURUDXSBYGPBL-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BIDIHFPLDRSAMB-UHFFFAOYSA-N 4,4-dimethylpent-2-ene Chemical compound CC=CC(C)(C)C BIDIHFPLDRSAMB-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- CZORBZCFAPGTNL-UHFFFAOYSA-N butane-1,1,4,4-tetracarboxylic acid Chemical compound OC(=O)C(C(O)=O)CCC(C(O)=O)C(O)=O CZORBZCFAPGTNL-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- SNCZNSNPXMPCGN-UHFFFAOYSA-N butanediamide Chemical compound NC(=O)CCC(N)=O SNCZNSNPXMPCGN-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 239000003054 catalyst Substances 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011928 denatured alcohol Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- GFMIDCCZJUXASS-UHFFFAOYSA-N hexane-1,1,6-triol Chemical compound OCCCCCC(O)O GFMIDCCZJUXASS-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229960005137 succinic acid Drugs 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 150000003504 terephthalic acids Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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Abstract
本发明公开了一种用于生产陶瓷生坯片料的铸膜,该铸膜包括底膜(例如聚对苯二甲酸乙二醇酯薄膜)和在其上形成的脱模层,该脱模层包括来自(A)硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂和(B)氨基树脂(例如各自被低级醇醚化的蜜胺树脂、尿素树脂和尿素-蜜胺树脂)的固化树脂。上述铸膜具有极好的陶瓷料浆可湿性和适中的对陶瓷生坯片料的脱模性,而在涂覆涂层时不产生排斥,且非常适用于生产陶瓷电容器、层合的感应器元件等所用的陶瓷生坯片料。
Description
技术领域
本发明涉及用于生产陶瓷生坯片料(ceramic green sheet)的铸膜。更具体而言,本发明涉及在生产陶瓷电子零器件中用于陶瓷生坯片料生产过程的铸膜,该铸膜具有极好的陶瓷料浆可湿性和适中的对陶瓷生坯片料的脱模性。
背景技术
陶瓷电子零器件例如电容器、层合的感应器元件、压电零件、热敏电阻和压敏电阻是通过包括以下步骤的方法生产的:通过用陶瓷料浆涂覆铸膜而形成生坯片料,该陶瓷料浆非常适于在高介电常数、磁性等情况下使用的上述电子零器件,它是由陶瓷粉、有机粘合剂、增塑剂、溶剂(有机溶剂或水)等组成的(步骤①);采用丝网印刷法使所得的生坯片料配备由钯、银、镍等制成的电极(步骤②);然后将生坯片料从铸膜上剥离并将该生坯片料层合为多层(步骤③);通过压制和切割步骤形成陶瓷生坯片(步骤④);将这样得到的生坯片进行烘焙(步骤⑤);并使烘焙后的生坯片配备由银、银钯、镍、铜等制成的端电极(步骤⑥)。除此之外,近来已有人提出一种新的生产方法,其中将上述步骤①和②重复多次,接着进行步骤③{参见日本专利申请公开号130150/1996(Heisei-8)}。
迄今已经常采用涂覆了基于硅氧烷的脱模剂的聚酯薄膜作为用于陶瓷电子零器件生产过程的铸膜。
此外,提出了一种用于铸制生坯片料的载体膜,该载体膜中的脱模层由醇酸树脂、蜜胺树脂和聚二甲基硅氧烷组成{参见日本专利申请公开号137218/1995(Heisei-7)}。
此外,还提出了一种用于生产陶瓷片的可脱模的基膜,该基膜中的脱模层由基于氨基的共聚物树脂组成{参见日本实用新型公开号38884/1993(Heisei-5)}。
近年来随着陶瓷电子零件的微型化、重量减轻和性能的改进,薄膜生坯片料处于快速发展之中,对水基陶瓷生坯片料而言,要求薄膜的厚度为10微米或更小,而对溶剂基的陶瓷生坯片料而言其薄膜厚度为4微米或更小。然而,对所有常规的铸膜而言难以同时满足包括可湿性和适中的对生坯片料的脱模性两方面的要求:可湿性要求是在涂覆陶瓷料浆时即使对薄的涂层厚度也能形成均匀涂层而不产生排斥,适中的对生坯片料的脱模性要求是在将上述步骤①和②重复多次以构成多层涂层的方法中能顺利进行多层涂覆而不产生过度的脱模性且在重复涂覆陶瓷料浆时和第二次以后不致使最初形成的生坯片料从铸膜上解脱/或剥离。
发明内容
在上述情况下,本发明的目的是提供一种用于生产陶瓷电子零器件中使用的陶瓷生坯片料的铸膜,该铸膜具有极好的陶瓷料浆可湿性和适中的对陶瓷生坯片料的脱模性,而在涂覆陶瓷料浆时可抑制排斥的发生。
本发明的其他目的可从本说明书所公开的下文中明显看出。
为了开发具有上述必要性能的用于生产陶瓷生坯片料的铸膜,通过本发明人积累的广泛而深入的调查研究结果,已发现通过采用来自硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂和氨基树脂的固化树脂作为构成脱模层的脱模剂,可获得适合于本发明目的的铸膜。根据上述发现和资料实现了本发明。
也就是说,本发明提供了:
(1)一种用于生产陶瓷生坯片料的铸膜,该铸膜包括底膜和在其至少任一面上形成的脱模层,其中所述脱模层包括来自(A)硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂和(B)氨基树脂的固化树脂;
(2)在前面第(1)项中所述的用于生产陶瓷生坯片料的铸膜,其中硬脂酸改性的醇酸树脂的硬脂酰基含量为40-60重量%,和/或硬脂酸改性的丙烯酸类树脂的硬脂酰基含量为20-40重量%;
(3)在前面第(1)项中所述的用于生产陶瓷生坯片料的铸膜,其中(B)氨基树脂是至少一种选自各自被低级醇醚化的蜜胺树脂、尿素树脂和尿素-蜜胺树脂;
(4)在前面第(1)、(2)和(3)中的任一项所述的用于生产陶瓷生坯片料的铸膜,其中组分(B)的含量为组分(A)和(B)固含量总和的5-40重量%;
(5)在前面第(1)项中所述的用于生产陶瓷生坯片料的铸膜,其中底膜包括聚对苯二甲酸乙二醇酯;
(6)在前面第(1)项中所述的用于生产陶瓷生坯片料的铸膜,其中组分(A)由硬脂酸改性的醇酸树脂和硬脂酸改性的丙烯酸类树脂的混合物组成;和
(7)在前面第(1)项中所述的用于生产陶瓷生坯片料的铸膜,其中固化树脂是在酸催化剂存在下形成的。
具体实施方式
根据本发明的用于生产陶瓷生坯片料的铸膜(下文简称为“铸膜”)包括底膜和在其至少任一面上形成的脱模层。构成该脱模层的脱模剂包括来自(A)硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂和(B)氨基树脂的固化树脂,且可再根据需要将其与脱模改性剂、粘结增进剂等混合。
作为组分(A)的醇酸树脂和丙烯酸类树脂各自都是用硬脂酸改性了的,而所有未用硬脂酸改性的醇酸树脂和丙烯酸类树脂不能保证对生坯片料的良好脱模性能而且也不能达到本发明的目的。
上述树脂的改性程度没有特别的限制,但考虑到良好的陶瓷料浆可湿性和生坯片料的脱模性之间的平衡,适宜将所述程度选择在使硬脂酸改性的醇酸树脂的硬脂酰基含量约为40-60重量%,而硬脂酸改性的丙烯酸类树脂的硬脂酰基含量约为20-40重量%。
迄今通常已分别用作醇酸树脂漆和热固性丙烯酸类树脂漆的树脂组份的醇酸树脂和丙烯酸类树脂可用作上述的醇酸树脂和丙烯酸类树脂。
醇酸树脂是通过众所周知的多元醇、多元酸或其酸酐以及所有各种根据需要使用的改性剂的组合组分的酯化反应制得。
上述多元醇的实例包括乙二醇;丙二醇;二甘醇;丁二醇;新戊二醇;己二醇;2,2-二甲基戊二醇-1,3;氢化双酚A;己二醇;甘油;三羟甲基乙烷;三羟甲基丙烷;1,2,6-己三醇;三甲基环己烷;季戊四醇;山梨醇;双甘油和二季戊四醇。除以上这些以外,也可用三羟乙基异氰脲酸酯;2,2-二甲基-3-羟基丙醇等。所有以上举例的多元醇组分都可单独使用或可至少与其它一种联合使用。
上述多元酸和其酸酐的实例是邻苯二甲酸酐、间苯二酸、对苯二酸、四氢化邻苯二甲酸酐、马来酸酐、富马酸、琥珀酸、戊二酸、己二酸、三甲基己二酸、癸二酸、偏苯三酸酐和丁烷四甲酸等。所有上述的多元酸和其酸酐都可单独使用或可至少与其它一种联合使用。
改性剂的实例是脂肪酸、苯酚、松香、苯乙烯和丙烯酸类化合物,其中用于本发明的是脂肪酸之一的硬脂酸。
另一方面,热固性丙烯酸类树脂是其分子中具有反应基且通过采用交联剂例如氨基树脂、环氧树脂或酚类树脂等可将其热固化的丙烯酸类树脂。例如已知热固性丙烯酸类树脂可通过将起始原料例如丙烯酸酯、苯乙烯和丙烯酰胺反应然后再与甲醛水反应使醛与该聚合物中的酰胺结合的方法制得。在此过程中,通过采用各种不同的改性剂可使该丙烯酸类树脂改性。在本发明中,改性剂是硬脂酸。
用以构成本发明铸膜的脱模层的组分(A)可以是任一种硬脂酸改性的醇酸树脂、硬脂酸改性的丙烯酸类树脂、及其混合物。其中为了保证获得良好的陶瓷料浆可湿性和对生坯片料的脱模性,优选的是其混合物。
另一方面,众所周知作为用于醇酸树脂漆、热固性丙烯酸类树脂漆等的固化剂的常规氨基树脂可用作组分(B)的氨基树脂。前述氨基树脂的具体实例包括蜜胺树脂、尿素树脂、尿素-蜜胺树脂、胍胺树脂、甘脲(glycoluryl)-甲醛树脂、琥珀酰胺-甲醛树脂、亚乙基脲醛树脂,其中的每一种都具有羟基或烷氧基。所有以上举例的树脂可通过将蜜胺、尿素、胍胺、甘脲、琥珀酰胺、亚乙基脲等在沸水中与甲醛水反应进行羟甲基化并根据具体情况将该反应产物再与甲醇、乙醇、丙醇、丁醇等反应进行醚化的方法容易地制得。
从促进该树脂固化方面考虑,在本发明中优选采用至少一种选自各自被低级醇醚化、甲基醚化、乙基醚化或丁基醚化的蜜胺树脂、尿素树脂和尿素-蜜胺树脂。
在本发明中,组分(B)氨基树脂的用量优选为树脂组分(A)和(B)固含量总和的5-40重量%。当其用量小于树脂组分(A)和(B)固含量总和的5重量%时,会造成固化不足从而使其难以形成具有理想物理性能的脱模层,而当其用量大于树脂组分(A)和(B)固含量总和的40重量%时,会使对陶瓷生坯片料的脱模性降低。考虑到树脂的固化性、对陶瓷生坯片料的脱模性等因素,作为组分(B)的氨基树脂的用量特别优选为树脂组分(A)和(B)固含量总和的10-30重量%。
为了促进用氨基树脂固化的固化反应,可根据需要采用酸催化剂例如对甲苯磺酸,按100重量份的组分(A)和(B)树脂总固含量计,其用量至多为20重量份。
用于本发明的底膜没有特别的限制,但是可以适当地从熟知的薄膜中任意选用,这些薄膜迄今已作为底膜用于生产陶瓷生坯片料的铸膜。这类薄膜的实例包括由聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯等制成的聚脂薄膜,由聚丙烯、聚甲基戊烯等制成的聚烯烃薄膜,聚碳酸酯薄膜以及聚乙酸乙烯酯薄膜。在这些薄膜中,聚脂薄膜是优选的,而从平滑性、耐热性和成本方面考虑,双轴取向的聚对苯二甲酸乙二醇酯是特别优选的。通常采用具有厚度为12-125微米的底膜。
为了获得本发明的铸膜,首先制备用于形成脱模层的涂覆溶液。通过添加上述作为组分(A)的硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂以及作为组分(B)的氨基树脂,且在需要时,可将酸催化剂等添加到适宜的有机溶剂例如甲苯、乙酸乙酯、甲基乙基酮、变性酒精和己烷中以制备前述的涂覆溶液,所形成的涂覆溶液具有能进行涂覆作业的粘度。
必要时,可以将该涂覆溶液与各自用除硬脂酸以外的脂肪酸改性的醇酸树脂和/或丙烯酸类树脂、填料、抗静电剂、染料、颜料、其它添加剂等混合。
采用例如凹版涂覆法、棒涂法、多辊涂布法、喷涂法、旋涂法等方法,将这样制得的涂覆溶液涂覆在前述底膜的任一面或两面上。
以固体含量表示的涂覆量适宜为0.04-2.00克/平方米、特别优选为0.07-1.00克/平方米。当涂覆量小于0.04克/平方米时,导致陶瓷生坯片料的脱模性差,而当涂覆量大于2.00克/平方米时,在涂覆陶瓷料浆时可能产生排斥作用。
为了使这样涂覆上的涂覆溶液固化,可将其在涂覆机的烘炉中进行热处理。在热处理的情况下,如果在100-160℃的温度下保证足够的固化时间,则其操作条件没有特别的限制,通常,在该温度下进行热处理5-120秒是适宜的。
为了进一步增强底膜与脱膜层之间的粘合性,可预先将底膜进行粘合性增强处理,例如电晕放电处理、臭氧处理、火焰处理、增粘剂涂覆等。此外,为了抗静电起见,可将抗静电剂预先混合在涂覆溶液中。另一方面,也可以采用涂覆了静电剂的底膜。
此外,可将脱模剂涂覆在底膜的整个表面上或其一部分表面上,例如,可将图案涂层中没有涂覆的部分放置在两端,以便控制脱模性和粘合性。
这样根据本发明制得的铸膜可用于生产陶瓷生坯片料。优选该陶瓷生坯片料具有的厚度为20微米或更小,对水基体系而言,更优选该陶瓷生坯片料具有的厚度为10微米或更小,而对溶剂体系则为4微米或更小。
概述一下本发明的铸膜的操作效果,这种具有极好的陶瓷料浆可湿性和适中的对陶瓷生坯片料的脱模性的铸膜可以容易地通过在底膜上形成由固化树脂组成的脱模剂层而制得,该固化树脂来自硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂以及氨基树脂。
本发明的铸膜非常适用于生产陶瓷电容器、层合的感应器元件等所用的陶瓷生坯片料。
在下文中,将参照对比例和操作实施例对本发明作更详细的叙述,然而,这些实例对本发明绝无限制。
根据以下所述的评价方法对通过操作实施例和对比例得到的每种铸膜的不同特性作出评价。
(1)陶瓷料浆的可湿性
按重量计,制备100份钛酸钡粉、10份水溶性丙烯酸类树脂和10份聚乙二醇的混合物,在罐中通过利用直径为10毫米的氧化锆珠将其混合24小时以生产水基陶瓷料浆。将所得的陶瓷料浆涂覆在铸膜的脱模表面层上,使该涂层的厚度在干燥后达到6微米,继而进行干燥处理以制备生坯片料。在生产过程中,目视观察该陶瓷料浆的可湿性(是否存在涂层的排斥和不均匀性),然后根据以下标准评价所得结果。
◎:既未观察到涂层的排斥也未发现不均匀性,显示出极好的涂层表面(未产生实际问题)
○:未观察到排斥(未产生实际问题)
×:观察到排斥(产生实际问题)
××:不能形成薄膜
(2)生坯片料的脱模性
<采用手工剥离方法进行评价>
通过手工剥离测试对按上述方法(1)制备的生坯片料的脱模性进行了评价。
◎:脱模性适中(未产生实际问题)
○:脱模性稍差(未产生实际问题)
×:难以脱模(产生实际问题)
××:不能脱模(产生实际问题)
<生坯片料的剥离力>
用压敏胶粘带(Nitto Denko Corporation生产,商品名为″31BTape″)将按上述方法(1)制备的生坯片料层合以制备试样。将所得试样在23℃和相对湿度为65%的条件下放置24小时,随后,将其切割成各为宽20毫米的小片以制备测试样片。接着,采用张力试验机以100米/分钟的速率、按180度的角度将该铸膜剥离以测定剥离所需的力(剥离力)。
实施例1
将硬脂酸改性的醇酸树脂(硬脂酰基含量以重量计为50%)、硬脂酸改性的丙烯酸类树脂(硬脂酰基含量以重量计为33%)和已进行甲基醚化的蜜胺树脂,分别以重量计、以固体含量表示为40%、40%和20%的量进行混合以制备树脂混合物。将所得的树脂混合物用主要由甲苯组成的有机溶剂稀释,然后,将该树脂混合物以其固体含量100重量份为基准再与5重量份的对甲苯磺酸混合,以制备按重量计固体含量为3%的涂覆溶液。
通过凹版涂覆法将该涂覆溶液均匀地涂覆在双轴取向的厚度为38微米的聚对苯二甲酸乙二醇酯(PET)薄膜上,以便产生以固体含量表示为0.2克/平方米的涂覆量。随后,将该涂覆了的PET薄膜在热空气循环型的干燥器中于130℃下热处理30秒钟以使该涂覆溶液固化从而制得铸膜。这样制得的铸膜的各种特性列于表1中。
实施例2
除了将分别以重量计、以固体含量表示为20%、60%和20%的硬脂酸改性的醇酸树脂、硬脂酸改性的丙烯酸类树脂和已进行甲基醚化的蜜胺树脂代替40%、40%和20%的上述醇酸树脂、丙烯酸类树脂和蜜胺树脂之外,重复实施例1的方法以制备铸膜。这样制得的铸膜的各种特性列于表1中。
实施例3
除了将分别以重量计、以固体含量表示为70%和30%的硬脂酸改性的醇酸树脂(硬脂酰基含量以重量计为50%)和已进行甲基醚化的蜜胺树脂代替40%和20%的上述醇酸树脂和蜜胺树脂之外,重复实施例2的方法以制备铸膜。这样制得的铸膜的各种特性列于表1中。
对比例1
采用主要由甲苯组成的有机溶剂将溶剂型加成反应型的基于硅氧烷的脱模剂(以重量计固体含量为30%,Toray Dow corning SiliconeCorporation生产,商品名为″SRX-211″)稀释,该脱模剂包括具有作为官能团的乙烯基的聚二甲基硅氧烷和交联剂(聚甲基氢硅氧烷)作为主要成分。按重量计,以100份基于硅氧烷的脱模剂为基准将1份铂基催化剂(以重量计固体含量为100%,Toray Dow corning SiliconeCorporation生产,商品名为″SRX-212″)添加到稀释后的脱模剂中以制备按重量计固体含量为2%的涂覆溶液。
通过凹版涂覆法将这样制备的涂覆溶液均匀地涂覆在双轴取向的厚度为38微米的PET薄膜上,以便产生以固体含量表示为0.1克/平方米的涂覆量。随后,将该涂覆了的PET薄膜在热空气循环型的干燥器中于130℃下热处理30秒钟以使该涂覆溶液固化从而制得铸膜。这样制得的铸膜的各种特性列于表1中。
对比例2
重复实施例1的方法制备铸膜,不同之处在于:将由以重量计固体含量为11%的羟基甲基丙烯酸类树脂和已进行丁基醚化的以重量计固体含量为89%的蜜胺树脂组成的树脂混合物用主要由甲苯组成的有机溶剂稀释,然后,将该树脂混合物按其固体含量100重量份为基准再与1重量份的对甲苯磺酸混合,在170℃和30秒钟的条件下进行热处理。这样制得的铸膜的各种特性列于表1中。
表1
| 陶瓷料浆的涂布性能 | 生坯片料的脱模性 | ||
| 采用手工剥离进行评价 | 剥离力(mN/25mm) | ||
| 实施例1 | ○ | ◎ | 5.98 |
| 实施例2 | ◎ | ◎ | 4.12 |
| 实施例3 | ○ | ○ | 7.50 |
| 对比例1 | ×× | - | - |
| 对比例2 | ◎ | ×× | - |
Claims (8)
1.一种用于生产陶瓷生坯片料的铸膜,该铸膜包括底膜和在其至少任一面上形成的脱模层,其中所述脱模层包括来自(A)硬脂酸改性的醇酸树脂和/或硬脂酸改性的丙烯酸类树脂和(B)氨基树脂的固化树脂,其中所述底膜选自聚酯膜、聚烯烃膜、聚碳酸酯膜和聚醋酸乙烯酯膜;且所述氨基树脂选自蜜胺树脂、尿素树脂、尿素-蜜胺树脂、胍胺树脂、甘脲-甲醛树脂、琥珀酰胺-甲醛树脂、亚乙基脲醛树脂,其中的每一种都具有羟基或烷氧基。
2.根据权利要求1的用于生产陶瓷生坯片料的铸膜,其中该硬脂酸改性的醇酸树脂的硬脂酰基含量为40-60重量%。
3.根据权利要求1的用于生产陶瓷生坯片料的铸膜,其中硬脂酸改性的丙烯酸类树脂的硬脂酰基含量为20-40重量%。
4.根据权利要求1-3中任一项的用于生产陶瓷生坯片料的铸膜,其中该(B)氨基树脂是至少一种选自各自被低级醇醚化的蜜胺树脂、尿素树脂和尿素-蜜胺树脂。
5.根据权利要求1-3中任一项的用于生产陶瓷生坯片料的铸膜,其中该组分(B)的含量为组分(A)和(B)的固含量总和的5-40重量%。
6.根据权利要求1-3中任一项的用于生产陶瓷生坯片料的铸膜,其中该底膜包括聚对苯二甲酸乙二醇酯。
7.根据权利要求1-3中任一项的用于生产陶瓷生坯片料的铸膜,其中该组分(A)由硬脂酸改性的醇酸树脂和硬脂酸改性的丙烯酸类树脂的混合物组成。
8.根据权利要求1-3中任一项的用于生产陶瓷生坯片料的铸膜,其中该固化树脂是在酸催化剂存在下形成的。
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- 2001-06-18 SG SG200103656A patent/SG89405A1/en unknown
- 2001-06-19 US US09/883,257 patent/US6410157B1/en not_active Expired - Lifetime
- 2001-07-03 MY MYPI20013162A patent/MY117447A/en unknown
- 2001-07-05 MX MXPA01006887A patent/MXPA01006887A/es active IP Right Grant
- 2001-07-05 KR KR1020010040067A patent/KR100766669B1/ko not_active Expired - Lifetime
- 2001-07-06 CN CNB011217448A patent/CN1208187C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| SG89405A1 (en) | 2002-06-18 |
| MXPA01006887A (es) | 2003-08-20 |
| TWI233394B (en) | 2005-06-01 |
| US6410157B1 (en) | 2002-06-25 |
| JP2002019037A (ja) | 2002-01-22 |
| JP3760085B2 (ja) | 2006-03-29 |
| MY117447A (en) | 2004-06-30 |
| KR20020003524A (ko) | 2002-01-12 |
| US20020022141A1 (en) | 2002-02-21 |
| CN1332083A (zh) | 2002-01-23 |
| KR100766669B1 (ko) | 2007-10-11 |
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