CN1299169C - 光刻装置和器件的制造方法 - Google Patents

光刻装置和器件的制造方法 Download PDF

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Publication number: CN1299169C
Authority: CN; China
Prior art keywords: vacuum chamber; sealing element; groove; extended; substrate
Prior art date: 2002-06-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CNB031438598A

Other languages

English (en)

Chinese (zh)

Other versions

CN1475864A (zh

Inventor

P·M·H·沃斯特斯

H·雅各布斯

H·K·范德肖特

P·鲁特格尔斯

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ASML Netherlands BV

Original Assignee

ASML Netherlands BV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-06-13

Filing date

2003-06-11

Publication date

2007-02-07

2003-06-11 Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV

2004-02-18 Publication of CN1475864A publication Critical patent/CN1475864A/zh

2007-02-07 Application granted granted Critical

2007-02-07 Publication of CN1299169C publication Critical patent/CN1299169C/zh

2023-06-11 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title claims description 8
238000001259 photo etching Methods 0.000 title 1
238000007789 sealing Methods 0.000 claims abstract description 91
239000000758 substrate Substances 0.000 claims description 62
230000005855 radiation Effects 0.000 claims description 38
238000000059 patterning Methods 0.000 claims description 22
239000000463 material Substances 0.000 claims description 13
238000001459 lithography Methods 0.000 claims description 7
238000000034 method Methods 0.000 claims description 5
238000005096 rolling process Methods 0.000 claims description 3
239000000696 magnetic material Substances 0.000 claims description 2
239000007769 metal material Substances 0.000 claims description 2
239000010410 layer Substances 0.000 description 9
239000007789 gas Substances 0.000 description 7
239000011159 matrix material Substances 0.000 description 6
230000003287 optical effect Effects 0.000 description 5
238000003491 array Methods 0.000 description 3
238000005452 bending Methods 0.000 description 3
238000010894 electron beam technology Methods 0.000 description 3
238000010943 off-gassing Methods 0.000 description 3
238000012546 transfer Methods 0.000 description 3
238000011282 treatment Methods 0.000 description 3
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
238000013461 design Methods 0.000 description 2
238000009826 distribution Methods 0.000 description 2
238000010884 ion-beam technique Methods 0.000 description 2
238000005259 measurement Methods 0.000 description 2
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
229910052753 mercury Inorganic materials 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
239000002245 particle Substances 0.000 description 2
230000010363 phase shift Effects 0.000 description 2
229910052710 silicon Inorganic materials 0.000 description 2
239000010703 silicon Substances 0.000 description 2
239000002356 single layer Substances 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
AETVBWZVKDOWHH-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-(1-ethylazetidin-3-yl)oxypyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)OC1CN(C1)CC AETVBWZVKDOWHH-UHFFFAOYSA-N 0.000 description 1
VPSXHKGJZJCWLV-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-(1-ethylpiperidin-4-yl)oxypyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)OC1CCN(CC1)CC VPSXHKGJZJCWLV-UHFFFAOYSA-N 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
239000004215 Carbon black (E152) Substances 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
230000002238 attenuated effect Effects 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000000969 carrier Substances 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
238000001514 detection method Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
230000005684 electric field Effects 0.000 description 1
230000005611 electricity Effects 0.000 description 1
230000005670 electromagnetic radiation Effects 0.000 description 1
238000005530 etching Methods 0.000 description 1
239000012530 fluid Substances 0.000 description 1
229930195733 hydrocarbon Natural products 0.000 description 1
150000002430 hydrocarbons Chemical class 0.000 description 1
238000005286 illumination Methods 0.000 description 1
238000003384 imaging method Methods 0.000 description 1
239000012535 impurity Substances 0.000 description 1
238000003780 insertion Methods 0.000 description 1
230000037431 insertion Effects 0.000 description 1
238000007689 inspection Methods 0.000 description 1
238000005468 ion implantation Methods 0.000 description 1
239000002346 layers by function Substances 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
230000005381 magnetic domain Effects 0.000 description 1
230000015654 memory Effects 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
239000004033 plastic Substances 0.000 description 1
238000009428 plumbing Methods 0.000 description 1
238000005498 polishing Methods 0.000 description 1
230000037452 priming Effects 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000007493 shaping process Methods 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1
238000013022 venting Methods 0.000 description 1

Images

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
Engineering & Computer Science (AREA)
Environmental & Geological Engineering (AREA)
Epidemiology (AREA)
Public Health (AREA)
Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

CNB031438598A 2002-06-13 2003-06-11 光刻装置和器件的制造方法 Expired - Fee Related CN1299169C (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
EP02254139		2002-06-13
EP02254139.5		2002-06-13

Publications (2)

Publication Number	Publication Date
CN1475864A CN1475864A (zh)	2004-02-18
CN1299169C true CN1299169C (zh)	2007-02-07

Family

ID=31197951

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CNB031438598A Expired - Fee Related CN1299169C (zh)	2002-06-13	2003-06-11	光刻装置和器件的制造方法

Country Status (7)

Country	Link
US (1)	US6970230B2 (de)
JP (1)	JP3972202B2 (de)
KR (1)	KR100523823B1 (de)
CN (1)	CN1299169C (de)
DE (1)	DE60317407T2 (de)
SG (1)	SG107661A1 (de)
TW (1)	TWI223838B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7675201B2 (en) *	2006-07-25	2010-03-09	Asml Netherlands B.V.	Lithographic apparatus with planar motor driven support
CN111168995B (zh) *	2020-01-03	2022-09-02	深圳摩方新材科技有限公司	一种膜涂层多材料光固化3d打印设备及其使用方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5844719A (ja) *	1981-09-11	1983-03-15	Nippon Telegr & Teleph Corp <Ntt>	電子ビ−ム露光装置
JP2001085291A (ja) *	1999-09-09	2001-03-30	Matsushita Electric Ind Co Ltd	電子ビーム露光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3641973A (en) *	1970-11-25	1972-02-15	Air Reduction	Vacuum coating apparatus
US4430571A (en) *	1981-04-16	1984-02-07	Control Data Corporation	Method and apparatus for exposing multi-level registered patterns interchangeably between stations of a multi-station electron-beam array lithography (EBAL) system
JPH05283509A (ja) *	1992-03-31	1993-10-29	Nippon Seiko Kk	ダスト吸引装置
TWI233535B (en) *	1999-04-19	2005-06-01	Asml Netherlands Bv	Motion feed-through into a vacuum chamber and its application in lithographic projection apparatuses
EP1500983A3 (de)	1999-04-19	2005-02-09	ASML Netherlands B.V.	Isolierende Stützvorrichtungen zur Verwendung mit Vakuumkammern und deren Anwendung in lithographischen Projektionsapparaten
US6279490B1 (en) *	1999-10-08	2001-08-28	Etec Systems, Inc.	Epicyclic stage
TW591342B (en) *	2000-11-30	2004-06-11	Asml Netherlands Bv	Lithographic projection apparatus and integrated circuit manufacturing method using a lithographic projection apparatus

2003
- 2003-06-11 JP JP2003197462A patent/JP3972202B2/ja not_active Expired - Fee Related
- 2003-06-11 SG SG200303394A patent/SG107661A1/en unknown
- 2003-06-11 US US10/458,727 patent/US6970230B2/en not_active Expired - Fee Related
- 2003-06-11 TW TW092115834A patent/TWI223838B/zh not_active IP Right Cessation
- 2003-06-11 DE DE60317407T patent/DE60317407T2/de not_active Expired - Lifetime
- 2003-06-11 KR KR10-2003-0037651A patent/KR100523823B1/ko not_active Expired - Fee Related
- 2003-06-11 CN CNB031438598A patent/CN1299169C/zh not_active Expired - Fee Related

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5844719A (ja) *	1981-09-11	1983-03-15	Nippon Telegr & Teleph Corp <Ntt>	電子ビ−ム露光装置
JP2001085291A (ja) *	1999-09-09	2001-03-30	Matsushita Electric Ind Co Ltd	電子ビーム露光装置

Also Published As

Publication number	Publication date
TW200403718A (en)	2004-03-01
SG107661A1 (en)	2004-12-29
US20040061844A1 (en)	2004-04-01
KR20040026100A (ko)	2004-03-27
JP3972202B2 (ja)	2007-09-05
KR100523823B1 (ko)	2005-10-25
DE60317407D1 (de)	2007-12-27
CN1475864A (zh)	2004-02-18
JP2004040105A (ja)	2004-02-05
US6970230B2 (en)	2005-11-29
TWI223838B (en)	2004-11-11
DE60317407T2 (de)	2008-09-18

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Legal Events

Date	Code	Title	Description
2004-02-18	C06	Publication
2004-02-18	PB01	Publication
2005-08-24	C10	Entry into substantive examination
2005-08-24	SE01	Entry into force of request for substantive examination
2007-02-07	C14	Grant of patent or utility model
2007-02-07	GR01	Patent grant
2013-07-31	C17	Cessation of patent right
2013-07-31	CF01	Termination of patent right due to non-payment of annual fee	Granted publication date: 20070207 Termination date: 20120611