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CN1277220A - Preparation of composite conducting polymer material - Google Patents

Preparation of composite conducting polymer material Download PDF

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Publication number
CN1277220A
CN1277220A CN 00119153 CN00119153A CN1277220A CN 1277220 A CN1277220 A CN 1277220A CN 00119153 CN00119153 CN 00119153 CN 00119153 A CN00119153 A CN 00119153A CN 1277220 A CN1277220 A CN 1277220A
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composite material
preparation
conductive composite
carbon black
polymer
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CN1137184C (en
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陈欣方
赫秀娟
王丽杰
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Jilin University
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Jilin University
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Abstract

本发明属于橡胶类聚合物导电复合材料的制备技术。本发明是将导电填料填充到非晶或结晶度很低的橡胶构成中,通过辐射交联,消除了原有的负温度系数效应,使之呈现出显著的PTC效应,并且其PTC转变温度可根据需要通过配比和加工条件调整。The invention belongs to the preparation technology of rubber polymer conductive composite material. The present invention fills the conductive filler into the amorphous or very low crystallinity rubber composition, eliminates the original negative temperature coefficient effect through radiation crosslinking, and makes it present a significant PTC effect, and its PTC transition temperature can be adjusted. Adjust the ratio and processing conditions as needed.

Description

The preparation of composite conducting polymer material
The invention belongs to a kind of technology of preparing of composite conducting polymer material.
Composite conducting polymer material of the present invention has significant positive temperature coefficient effect.(positivetemperature coefficient, PTC) effect is meant the phenomenon that the resistivity of material raises and increases with temperature to positive temperature coefficient.As everyone knows, most polymers (as polyethylene, polypropylene etc.) is good isolator in its pure state.After sneaking into conductive filler material, especially after the concentration of conductive filler material surpassed a certain threshold value (being called the seepage flow threshold value), its resistivity significantly descended, and formed conduction or semiconduction matrix material.Some composite conducting material when the concentration of conductive filler material is near its threshold value, raises with temperature, and the hop of several magnitude can take place its resistivity, presents significant PTC effect.
In ptc polymer, polymer base material with the most use be high density polyethylene(HDPE) (high densitypolyethylene, HDPE), conductive filler material is the most frequently used be carbon black (carbon black, CB).At present, the ptc material that is made of high density polyethylene(HDPE) and carbon black exists the problem of two aspects: (1) is because polyethylene is the low surface energy material, poor with the interfacial interaction of carbon black, usually the required conductive filler material loading level of ptc material is bigger in addition, make the polythene/carbon black mixture exist poor mechanical property, carbon black is difficult for weakness such as dispersion.(2) when it uses as thermistors such as overcurrent protective devices, its room temperature resistivity remains further to be reduced.
The present invention adopts the base-material of the blend of high density polyethylene(HDPE) and other ethylene copolymer as ptc material, because ethylene copolymer is better than high density polyethylene(HDPE) to the affinity of carbon black, can strengthen the interfacial interaction of polymeric matrix and carbon black, improve the dispersion of carbon black in matrix, the PTC performance and the mechanical property of material are improved.
On the other hand, the present invention adopts low structure carbon black to replace high structure carbon black as conductive filler material, and not only cost reduces, and the ptc material room temperature resistance that obtains is low, PTC intensity height.The generation of carbon black-filled polymer composites PTC effect is commonly considered as because temperature when raising, polymeric matrix molecular motion aggravation causes the depolymerization of carbon black agglomerate, and conductive channel destroys and produces.And the agglomeration again of carbon black recovers conductive channel, and resistivity reduces, and the generation negative temperature coefficient (negativetemperature coefficient, NTC) effect, thus offset the part positive temperature coefficient effect, make the PTC strength degradation.Low structure carbon black, the agglomeration ability, the NTC effect is little, so adopt low structure carbon black to replace high structure carbon black as conductive filler material, helps improving PTC intensity.On the other hand, the agglomeration ability makes the carbon black-filled polymer composites of low structure more approaching between the carbon black agglomerate, under the littler condition in gap, depolymerization still can take place produce the PTC effect, the little then resistivity in gap is corresponding less, so room temperature resistivity is lower.
The used ethylene copolymer of the present invention can be terpolymer EP rubber (EPDM) or ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA) etc.The proportioning of high density polyethylene(HDPE) and ethylene copolymer can be (95~5): (5~95), preferably (75~50): (25~50).
The used conductive filler material of the present invention can be a carbon black, carbon fiber, and metal or conductivity ceramics powder etc., wherein carbon black is preferably the oven process carbon black.The DBP value of carbon black is less than 300cm 3/ 100g is preferably less than 120cm 3/ 100g.
The proportioning of polymer base material and conductive filler material is (98~20) among the present invention: (2~80), preferably (85~40): (15~60).The blend of material can be adopted Banbury mixer, also can adopt mill, or both is used in combination.Melting temperature is 100~200 ℃, and mixing time is 5~10 minutes.After at first HDPE and ethylene copolymer being mixed, again with the carbon black blend.
The effect of high-energy ray irradiation is to suppress the NTC effect among the present invention, increases PTC effect intensity and stability.The high-energy ray irradiation that is adopted can be Co 60Gamma-radiation also can be a high energy electron ray, and irradiation is at room temperature in the vacuum or carry out in the air.Absorption dose scope 10~500KGy, preferably 50~300KGy.
Resistance test among the embodiment, high resistance area (>10M Ω) adopt ZC36 type high resistant instrument, and low-resistance region (≤10M Ω) adopts digital multimeter.PTC intensity is used the electricalresistivity at resistivity and temperature relation curve upward peak place pWith room temperature resistivity ρ rThe ratio value representation.The structural parameter of used carbon black are listed in table 1.
The structural parameter of table 1 carbon black
??BP2000?????XC-72????CSF????FEF
Particle diameter (nm) surface-area (m 2/ g) DBP value (cm 3/ 100g) volatility (%) ????15?????????30?????50-70?40-48 ????1475???????254????230???41-50 ????330????????178????280???95-115 ????2.0????????1.5????1.0???-
Embodiment 1
HDPE 30.75 grams, EPDM 10.25 grams behind 150 ℃ of following premixs, add 9 gram CSF carbon blacks in Banbury mixer, continued mixing 5 minutes, use 5 fens kinds of mill mixing again, use oil press at 140-150 ℃ of compressing tablet afterwards.Irradiation at room temperature carries out in the air, and absorption dose is 150KGy.The elongation at break 31.5% of resulting matrix material, tensile strength 27.4MPa.Embodiment 2
Implementation method is identical with embodiment 1, changes EPDM into the EVA of identical weight, the elongation at break 17.5%. tensile strength 27.1MPa of resulting matrix material.Embodiment 3
Implementation method is identical with embodiment 1, changes EPDM into the EEA of identical weight, the elongation at break 18.8%. tensile strength 26.0MPa of resulting matrix material.The comparative example 1
Implementation method is identical with embodiment 1, and the HDPE with EPDM changes identical weight into promptly uses HDPE to be base-material separately.The elongation at break 7.2% of resulting matrix material, tensile strength 34.5MPa.Embodiment 4-8
Implementation method is identical with embodiment 1, changes each set of dispense ratio, the results are shown in table 2.
Table 2
Embodiment HDPE (%) EPDM (%) CB (%) PTC intensity (ρ p/ ρ r)
4????????56.0????????28.0?????????16???????????3×10 6
5????????54.7????????27.3?????????18???????????3×10 9
6????????53.3????????26.7?????????20???????????3×10 9
7????????52.0????????26.0?????????22???????????2×10 8
8 50.7 25.3 24 3 * 10 5Comparative example 2-6
Implementation method is identical with embodiment 1, uses HDPE to be base-material separately, the results are shown in table 3.
Table 3
Comparative example HDPE (%) CB (%) PTC intensity (ρ p/ ρ r)
2??????????85.5?????????14.5???????????1×10 3
3??????????85.0?????????15.0???????????2×10 9
4??????????84.0?????????16.0???????????3×10 8
5??????????82.0?????????18.0???????????1×10 4
6 80.0 20.0 1 * 10 4Embodiment 9-13
Implementation method is identical with embodiment 1, with FEF carbon black replaced C SF carbon black, and changes proportioning, and the result is as shown in table 4.
Table 4
Embodiment HDPE EPDM CB room temperature resistivity PTC intensity
(%)????(%)????(%)????(Ω·cm)???(ρ pr)
9???????56.3????18.7?????25?????2×10 7?????2×10 7
10??????52.5????17.5?????30?????2×10 4?????2×10 9
11??????48.7????16.3?????35?????2×10 3?????5×10 9
12??????45.0????15.0?????40?????2×10 3?????4×10 8
13 41.3 13.7 45 1 * 10 32 * 10 4Comparative example 7-13
Implementation method is same as embodiment 9-13, replaces the FEF carbon black with BP2000 carbon black and XC-72 carbon black respectively, the results are shown in table 5.
Table 5 embodiment HDPE EPDM BP2000 XC-72 room temperature resistivity PTC intensity
(%)????(%)?????(%)?????(%)?????(Ω·cm)????(ρ pr)
7?????????71.3????23.7??????5?????????????????3×10 13???????-
8?????????69.0????23.0??????8?????????????????2×10 8??????1×10 6
9?????????67.5????22.5??????10????????????????5×10 6??????2×10 3
10????????63.7????21.3??????15????????????????1×10 5??????1×10 2
11????????63.7????21.3??????????????15????????3×10 9??????3×10 5
12????????61.5????20.5??????????????18????????1×10 6??????2×10 8
13 60.0 20.0 20 2 * 10 45 * 10 2Embodiment 14-17
Implementation method replaces EPDM with sub-embodiment 9-13 with EEA, and changes proportioning, the results are shown in table 6.
Table 6 embodiment HDPE EEA CB room temperature resistivity PTC intensity
(%)???(%)???(%)????(Ω·cm)?????(ρ pr)
14??????56.3???18.7????25?????3×10 3???????2×10 10
15??????52.5???17.5????30?????1×10 3???????3×10 10
16??????48.7???16.3????35?????6×10 2???????3×10 6
17 45.0 15.0 40 2 * 10 23 * 10 4Comparative example 14-19
Implementation method is same as embodiment 14-17, replaces the FEF carbon black with BP2000 carbon black and XC-72 carbon black respectively, the results are shown in table 7.
Table 7 embodiment HDPE EEA BP2000 XC-72 room temperature resistivity PTC intensity
(%)????(%)????(%)??????(%)?????(Ω·cm)?????(ρ pr)
14??????69.0????23.0?????8??????????????????1×10 7??????2×10 2
15??????67.5????22.5?????10?????????????????1×10 6???????40
16??????63.7????21.3?????15?????????????????5×10 5???????4
17??????63.7????21.3??????????????15????????2×10 6??????6×10 7
18??????61.5????20.5??????????????18????????8×10 4??????6×10 3
19 58.5 19.5 22 1 * 10 45 * 10 2Embodiment 18-22
Implementation method is same as embodiment 9-13, replaces EPDM with EVA, and changes proportioning, the results are shown in table 8.
Table 8
Embodiment HDPE EVA FEF room temperature resistivity PTC intensity
(%)????(%)???(%)????(Ω·cm)????(ρ pr)
18??????56.3????18.7????25??????8×10 3?????3×10 10
19??????52.5????17.5????30??????8×10 2?????4×10 10
20??????48.7????16.3????35??????4×10 2?????3×10 10
21??????45.0????15.0????40??????3×10 2?????2×10 6
22 41.3 13.7 45 2 * 10 21 * 10 4Comparative example 20-26
Implementation method is same as embodiment 18-22, replaces the FEF carbon black with BP2000 carbon black and XC-72 carbon black respectively, the results are shown in table 9.
Table 9 embodiment HDPE EVA BP2000 XC-72 room temperature resistivity PTC intensity
(%)????(%)????(%)?????(%)?????(Ω·cm)????(ρ pr)
20??????70.5????23.5?????6?????????????????4×10 13???????4
21??????69.0????23.0?????8?????????????????4×10 6??????1×10 2
22??????67.5????22.5?????10????????????????2×10 6????????8
23??????63.7????21.3?????15????????????????2×10 5????????5
24??????63.7????21.3?????????????15????????1×10 6??????8×10 7
25??????61.5????20.5?????????????18????????4×10 4??????6×10 4
26??????58.5????19.5?????????????22????????3×10 4??????6×10 2

Claims (14)

1.一种聚合物导电复合材料的制备方法,其特征在于该材料由高密度聚乙烯、一种乙烯型共聚物和导电填料构成,物料的共混可采用密炼机,也可采用开炼机,混炼温度为100~200℃,混炼时间为5~10分钟,之后经高能射线辐照而获得。1. A preparation method for polymer conductive composite material is characterized in that the material is made of high-density polyethylene, a kind of ethylene type copolymer and conductive filler, and the blending of materials can adopt internal mixer or open refining machine, the mixing temperature is 100-200°C, the mixing time is 5-10 minutes, and then obtained by high-energy ray irradiation. 2.如权利要求1所述的聚合物导电复合材料的制备方法,其特征在于乙烯型共聚物可以是三元乙丙橡胶或乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物。2. the preparation method of polymer conductive composite material as claimed in claim 1 is characterized in that ethylene type copolymer can be EPDM rubber or ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer. 3.如权利要求1、2所述的聚合物导电复合材料的制备方法,其特征在于高密度聚乙烯与乙烯型共聚物的配比是(95~5)∶(5~95)。3. The preparation method of polymer conductive composite material as claimed in claim 1, 2, characterized in that the proportioning ratio of high-density polyethylene and ethylene-type copolymer is (95~5):(5~95). 4.如权利要求3所述的聚合物导电复合材料的制备方法,其特征在于高密度聚乙烯与乙烯型共聚物的配比是(75~50)∶(25~50)。4. The preparation method of polymer conductive composite material as claimed in claim 3, characterized in that the proportioning ratio of high-density polyethylene and ethylene-type copolymer is (75-50): (25-50). 5.如权利要求1所述的聚合物导电复合材料的制备方法,其特征在于导电填料为碳黑或碳纤维、金属粉、金属纤维、导电陶瓷粉末。5. the preparation method of polymer conductive composite material as claimed in claim 1 is characterized in that conductive filler is carbon black or carbon fiber, metal powder, metal fiber, conductive ceramic powder. 6.如权利要求5所述的聚合物导电复合材料的制备方法,其特征在于碳黑为炉法碳黑或槽法碳黑、热裂解碳黑。6. the preparation method of polymer conductive composite material as claimed in claim 5 is characterized in that carbon black is furnace carbon black or channel carbon black, thermal cracking carbon black. 7.如权利要求5、6所述的聚合物导电复合材料的制备方法,其特征在于碳黑的DBP值小于300cm3/100g。7. The preparation method of polymer conductive composite material according to claim 5, 6, characterized in that the DBP value of carbon black is less than 300cm 3 /100g. 8.如权利要求7所述的聚合物导电复合材料的制备方法,其特征在于碳黑的DBP值小于120cm3/100g。8. The preparation method of polymer conductive composite material according to claim 7, characterized in that the DBP value of the carbon black is less than 120cm 3 /100g. 9.如权利要求1中所述的导电复合材料的制备方法,其特征在于聚合物基料与导电填料的配比为(98~20)∶(2~80)。9. The preparation method of the conductive composite material as claimed in claim 1, characterized in that the ratio of the polymer base material to the conductive filler is (98-20): (2-80). 10.如权利要求9中所述的导电复合材料的制备方法,其特征在于聚合物基料与导电填料的配比为(85~40)∶(15~60)。10. The method for preparing a conductive composite material as claimed in claim 9, characterized in that the ratio of the polymer base material to the conductive filler is (85-40): (15-60). 11.如权利要求1所述的聚合物导电复合材料的制备方法,其特征在于辐照过程采用的高能射线为γ-射线或电子束射线。11. The preparation method of polymer conductive composite material as claimed in claim 1, characterized in that the high-energy rays used in the irradiation process are gamma-rays or electron beam rays. 12.如权利要求1、11所述的聚合物导电复合材料的制备方法,其特征在于导电复合材料的辐照在室温下真空或空气中进行。12. The preparation method of polymer conductive composite material as claimed in claim 1, 11, characterized in that the irradiation of conductive composite material is carried out in vacuum or air at room temperature. 13.如权利要求11、12所述的聚合物导电复合材料的制备方法,其特征在于导电复合材料辐照过程的吸收剂量为10-500KGy。13. The preparation method of polymer conductive composite material as claimed in claim 11, 12, characterized in that the absorbed dose of the conductive composite material irradiation process is 10-500KGy. 14.如权利要求13所述的聚合物导电复合材料的制备方法,其特征在于导电复合材料辐照过程的吸收剂量为50~300KGy。14. The preparation method of polymer conductive composite material as claimed in claim 13, characterized in that the absorbed dose of the conductive composite material in the irradiation process is 50-300KGy.
CNB001191535A 2000-06-23 2000-06-23 Preparation of composite conducting polymer material Expired - Fee Related CN1137184C (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100343925C (en) * 2002-03-19 2007-10-17 热力蒂思科有限公司 PTC conductive composition containing a low molecular weight polyethylene processing aid
CN101928422A (en) * 2010-04-26 2010-12-29 大连理工大学 Preparation method of a polymer-based conductive heating composite film material
CN102751530A (en) * 2011-06-02 2012-10-24 张潘毅 High capacity lithium ion battery containing metal conductive substances
CN104861273A (en) * 2015-06-11 2015-08-26 郑州轻工业学院 Composite material for thermistor and preparation method and application of composite material
CN105017608A (en) * 2015-06-25 2015-11-04 广东顺德鲁华光电新材料实业有限公司 Conductive polymer material and preparation method thereof
EP3545035A1 (en) * 2016-11-23 2019-10-02 Union Carbide Chemicals & Plastics Technology LLC Multiphase conductive polymer composite compositions
CN116462899A (en) * 2023-04-26 2023-07-21 芜湖佳宏新材料股份有限公司 A kind of low resistance PPTC material and preparation method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100343925C (en) * 2002-03-19 2007-10-17 热力蒂思科有限公司 PTC conductive composition containing a low molecular weight polyethylene processing aid
CN101928422A (en) * 2010-04-26 2010-12-29 大连理工大学 Preparation method of a polymer-based conductive heating composite film material
CN102751530A (en) * 2011-06-02 2012-10-24 张潘毅 High capacity lithium ion battery containing metal conductive substances
CN102751530B (en) * 2011-06-02 2014-12-03 张潘毅 High capacity lithium ion battery containing metal conductive substances
CN104861273A (en) * 2015-06-11 2015-08-26 郑州轻工业学院 Composite material for thermistor and preparation method and application of composite material
CN104861273B (en) * 2015-06-11 2016-05-25 郑州轻工业学院 Be used for composite of thermistor and its preparation method and application
CN105017608A (en) * 2015-06-25 2015-11-04 广东顺德鲁华光电新材料实业有限公司 Conductive polymer material and preparation method thereof
EP3545035A1 (en) * 2016-11-23 2019-10-02 Union Carbide Chemicals & Plastics Technology LLC Multiphase conductive polymer composite compositions
EP3545035B1 (en) * 2016-11-23 2025-06-25 Union Carbide Corporation Multiphase conductive polymer composite compositions
CN116462899A (en) * 2023-04-26 2023-07-21 芜湖佳宏新材料股份有限公司 A kind of low resistance PPTC material and preparation method

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