CN1258189A - Method for attaching electrical conductors to a substrate - Google Patents
Method for attaching electrical conductors to a substrate Download PDFInfo
- Publication number
- CN1258189A CN1258189A CN 98126051 CN98126051A CN1258189A CN 1258189 A CN1258189 A CN 1258189A CN 98126051 CN98126051 CN 98126051 CN 98126051 A CN98126051 A CN 98126051A CN 1258189 A CN1258189 A CN 1258189A
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- China
- Prior art keywords
- substrate
- conductor
- attaching
- conductive liquid
- regularly arranged
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- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 239000004020 conductor Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000008595 infiltration Effects 0.000 claims 1
- 238000001764 infiltration Methods 0.000 claims 1
- 230000010354 integration Effects 0.000 claims 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010408 sweeping Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000012466 permeate Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本发明涉及一种集成电路封装方法，具体为一种导电体附接于一基板上的方法，尤指附接球状接点于球状点阵列(BGA，BallGridArray)集成电路基板的方法。The invention relates to an integrated circuit packaging method, specifically a method for attaching a conductor to a substrate, especially a method for attaching ball joints to a ball grid array (BGA, BallGridArray) integrated circuit substrate.
早期该球状点阵列基板上的接点(脚)的形成系将已完成的锡球通过机器逐一摆放于该球状点阵列基板的复数个规则排列的接点上，使其形成一完整的球状形阵列基板。In the early days, the formation of the joints (feet) on the spherical dot array substrate was to place the completed solder balls one by one on the plurality of regularly arranged joints of the spherical dot array substrate to form a complete spherical array. substrate.
以上作法极为费时，必须先行一一完成球状形导电体，再将该导电体附接于该基板上；而且此作法也极为消耗人力，所需成本也较高，是故极为不经济。The above method is very time-consuming, and it is necessary to complete the spherical conductors one by one before attaching the conductors to the substrate; moreover, this method consumes a lot of manpower, and the required cost is also high, so it is extremely uneconomical.
本发明目的在于克服现有技术的不足，提供一种完善的方法，使锡球的形成可以不用一一摆置，以一次上模的方式，使锡球的形成更为快速，且成本更为低廉，商业价值更高。The purpose of the present invention is to overcome the deficiencies of the prior art and provide a perfect method, so that the formation of solder balls can be formed more quickly and at a lower cost by one-time upper mold. Cheaper, higher commercial value.
本发明的目的是通过下述技术方案实现的：The purpose of the present invention is achieved through the following technical solutions:
一种使导电体附接于一基板上的方法，该基板系具复数个规则排列的接点，系将一导电液体印制于该复数个规则排列的接点上，使该导电液体冷却后，以一定形状紧附于该复数个规则排列之接点上，其包含下列步骤：A method for attaching a conductor to a substrate, the substrate has a plurality of regularly arranged contacts, printing a conductive liquid on the plurality of regularly arranged contacts, cooling the conductive liquid, and A certain shape is attached to the plurality of regularly arranged contacts, which includes the following steps:
将该印模置于该复数个规则排列之接点上；将该导电液体倒至该印模上，再利用刮板在该印模上扫刮，使导电液体从该印模均衡渗透至相对于该复数个规则排列的接点上；以及加热该基板，使该导电液体冷却后，以该形状紧附于该复数个规则排列的接点上。Place the stamp on the plurality of regularly arranged contacts; pour the conductive liquid onto the stamp, and then use a scraper to sweep the stamp, so that the conductive liquid can penetrate from the stamp to the relative on the plurality of regularly arranged contacts; and heating the substrate so that the conductive liquid is cooled and tightly attached to the plurality of regularly arranged contacts in the shape.
较佳者，该基板系指复数个规则排列接点之基板。而复数个规则排列接点的基板系为球状点阵列(BGA)的集成电路(IC)基板。其中复数个规则排列的接点系指球状点阵列。Preferably, the substrate refers to a substrate with a plurality of regularly arranged contacts. The substrate with a plurality of regularly arranged contacts is an integrated circuit (IC) substrate of a ball point array (BGA). The plurality of regularly arranged joints refers to the spherical dot array.
较佳者，该导电液体包含锡，还包含铅，锡铅之比为63/37。Preferably, the conductive liquid contains tin and lead, and the ratio of tin to lead is 63/37.
较佳者，该印模则系指相对于球状点阵列之基板的印模。该相对于球状点阵列之基板的印模包含复数个规则排列的球状形洞口。Preferably, the stamp refers to the stamp corresponding to the substrate of the spherical dot array. The stamp corresponding to the substrate of the spherical dot array includes a plurality of regularly arranged spherical holes.
较佳者，其中该刮板系用于刮动该印模上的导电液体，使该导电液体得以从该印模上的洞口均衡流至相对应的该基板上。Preferably, the scraper is used to scrape the conductive liquid on the stamp, so that the conductive liquid can evenly flow from the hole on the stamp to the corresponding substrate.
较佳者，所谓渗透系指将该导电液体倒置该印模上，使该导电液体经由该印模上的复数个规则排列的球状形洞口流至相对于之该基板上。Preferably, the so-called permeation refers to inverting the conductive liquid onto the stamp, so that the conductive liquid flows to the opposite substrate through a plurality of regularly arranged spherical holes on the stamp.
较佳者，加热系指该基板须经由加热回焊，使该形状得于紧附于该复数个规则排列的接点上。Preferably, heating means that the substrate must be heated and reflowed so that the shape can be tightly attached to the plurality of regularly arranged contacts.
较佳者，该形状系柱状形；其中该柱状形系为初步形成并附接于该基板上的导电体。此初步形成并附接于基板上的柱状形导电体须经由加热使其柱状形变成为球状形。Preferably, the shape is a columnar shape; wherein the columnar shape is an electrical conductor initially formed and attached to the substrate. The columnar conductors initially formed and attached to the substrate must be heated to make the columnar shape into a spherical shape.
本发明采用上述技术方案，使锡球的形成可以不用一一摆置，以一次上模的方式，不需分由几个步骤，一次完成，因而使锡球的形成更为快速，所需成本低，也较省时省力。The present invention adopts the above-mentioned technical scheme, so that the formation of solder balls can be completed at one time without placing them one by one, without dividing into several steps, so that the formation of solder balls is faster and the required cost Low and save time and effort.
以下结合附图及附图给出的实施例对本发明作进一步详细说明：Below in conjunction with accompanying drawing and the embodiment that accompanying drawing provides, the present invention is described in further detail:
图1为本发明较佳实施例的导电体制造示意图。FIG. 1 is a schematic diagram of the fabrication of a conductor in a preferred embodiment of the present invention.
图2为本发明较佳实施例的导电体形状图。Fig. 2 is a shape diagram of a conductor in a preferred embodiment of the present invention.
请参见图1，本发明为一种使导电液体附接于一基板1的方法，系将一印模2放置于相对于该球状点阵列基板1的接点51上，再将一导电液体3倒置该印模2上，且利用刮板4在该印模上扫刮，使导电液体得于从该印模2上的复数个规则的球状形洞口5均衡流至相对的球状点阵列基板1上。形成柱状形导电体6，并依附接于该球状点阵列的基板1上。Please refer to FIG. 1 , the present invention is a method for attaching a conductive liquid to a substrate 1. A
请参见图2，初步形成且附接于该基板上的柱状形导电体6，须经由加热回焊使其变成为一球状形导电体7。Please refer to FIG. 2 , the
上述基板系指复数个规则排列之接点的基板，而此一复数个规则排列之接点系为球状形，较佳者，复数个规则排列接点的基板系为球状形阵列(BGA)的集成电路基板。The above-mentioned substrate refers to a substrate with a plurality of regularly arranged contacts, and the plurality of regularly arranged contacts is a spherical shape. Preferably, the substrate with a plurality of regularly arranged contacts is an integrated circuit substrate of a spherical array (BGA) .
由上述图解及说明，我们可以得出以下结论：From the illustrations and descriptions above, we can draw the following conclusions:
一、本发明所实施的方法其所需成本低；One, its required cost of the method implemented by the present invention is low;
二、本发明所实施的方法也较省时省力；Two, the method implemented by the present invention is also more time-saving and labor-saving;
三、本发明所施实的方法一次既完成，不需分由几个步骤方使完成。Three, the method that the present invention implements once finished, needn't divide by several steps and just finish.
Claims (16)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98126051 CN1258189A (en) | 1998-12-22 | 1998-12-22 | Method for attaching electrical conductors to a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98126051 CN1258189A (en) | 1998-12-22 | 1998-12-22 | Method for attaching electrical conductors to a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1258189A true CN1258189A (en) | 2000-06-28 |
Family
ID=5229455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98126051 Pending CN1258189A (en) | 1998-12-22 | 1998-12-22 | Method for attaching electrical conductors to a substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1258189A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6784598B2 (en) | 2001-04-25 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
| CN104733887A (en) * | 2013-12-20 | 2015-06-24 | 爱信精机株式会社 | Electric connection structure of electronic component |
-
1998
- 1998-12-22 CN CN 98126051 patent/CN1258189A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6784598B2 (en) | 2001-04-25 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
| CN104733887A (en) * | 2013-12-20 | 2015-06-24 | 爱信精机株式会社 | Electric connection structure of electronic component |
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| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |