CN113858603A - Preparation method of polymer flexible copper clad laminate - Google Patents
Preparation method of polymer flexible copper clad laminate Download PDFInfo
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- CN113858603A CN113858603A CN202111068549.0A CN202111068549A CN113858603A CN 113858603 A CN113858603 A CN 113858603A CN 202111068549 A CN202111068549 A CN 202111068549A CN 113858603 A CN113858603 A CN 113858603A
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- clad laminate
- copper clad
- flexible copper
- copper foil
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 191
- 229920000642 polymer Polymers 0.000 title claims abstract description 112
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 109
- 239000010949 copper Substances 0.000 title claims abstract description 109
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims abstract description 26
- 229920006254 polymer film Polymers 0.000 claims abstract description 26
- 238000004070 electrodeposition Methods 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 239000012467 final product Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 23
- 229920000106 Liquid crystal polymer Polymers 0.000 description 16
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 16
- 238000001723 curing Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007603 infrared drying Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a preparation method of a polymer flexible copper clad laminate, which comprises the steps of preparing a base material and depositing copper on the base material in an electrodeposition mode to form a copper foil; coating the polymer solution on a copper foil and drying to form a polymer flexible copper clad laminate; separating the base material from the polymer flexible copper clad laminate to obtain the polymer flexible copper clad laminate; forming a copper foil with a second preset thickness on a base material with a first preset thickness in an electro-deposition mode, then coating a polymer solution on the copper foil with a third preset thickness, and generating a polymer film in a drying mode, so that the polymer film and the copper foil generate a polymer flexible copper clad laminate, and finally separating the generated polymer flexible copper clad laminate from the base material to obtain a final product of the polymer flexible copper clad laminate; the manufacturing process of the polymer flexible copper clad laminate is simplified, the thickness of the generated polymer flexible copper clad laminate is smaller than the preset thickness value, and the preparation of the low-thickness polymer flexible copper clad laminate is realized.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a preparation method of a polymer flexible copper clad laminate.
Background
LCP (Liquid Crystal Polymer) film is a novel thermoplastic organic material, and can realize high-frequency high-speed transmission on the premise of ensuring higher reliability. LCP films have excellent performance characteristics: 1. the constant dielectric constant can be almost kept in the whole radio frequency range up to 110GHz, and the stability is good; 2. the loss tangent Df value is very small, is only 0.002 at 10GHz and is only increased to 0.0045 even at 110GHz, so that the method is very suitable for millimeter wave application; 3. the low hygroscopicity (the moisture absorption rate is about 0.01-0.02%, only 1/10 of a common PI base material) enables the material to have good base plate high reliability, and can be used as an ideal high-frequency FCCL (Flexible Copper Clad Laminate) material.
With the development of IT technology, miniaturization of devices, and acceleration of thin film formation, the market demand for LCP thin film formation is increasing. However, the thickness of the LCP commonly available on the market is usually > 25 μm. Further, as FPC (Flexible Printed Circuit) products are developed toward fine circuits, it is required to satisfy the requirements of a fine line width (50 μm or less) and a fine pitch (50 μm or less). However, the LCP-FCCL with a copper layer of 12 μm thickness on the market at present cannot meet the manufacturing requirement of fine circuits.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provides a preparation method of the polymer flexible copper clad laminate, which can generate the polymer flexible copper clad laminate with low thickness.
In order to solve the technical problems, the invention adopts the technical scheme that:
a preparation method of a polymer flexible copper clad laminate comprises the following steps:
preparing a base material with a first preset thickness;
depositing copper on the base material in an electrodeposition mode to form a copper foil with a second preset thickness;
coating a polymer solution on the copper foil by a third preset thickness and drying to form a polymer film;
the copper foil is attached to the polymer film to form a polymer flexible copper clad laminate;
the sum of the second preset thickness and the third preset thickness is less than a preset thickness value;
and separating the base material from the polymer flexible copper clad laminate to obtain the single polymer flexible copper clad laminate.
As can be seen from the above description, the beneficial effects of the present invention are: forming a copper foil with a second preset thickness on a base material with a first preset thickness in an electro-deposition mode, then coating a polymer solution on the copper foil with a third preset thickness, and generating a polymer film in a drying mode, so that the polymer film and the copper foil generate a polymer flexible copper clad laminate, and finally separating the generated polymer flexible copper clad laminate from the base material to obtain a final product of the polymer flexible copper clad laminate; the manufacturing process of the polymer flexible copper clad laminate is simplified, the thickness of the generated polymer flexible copper clad laminate is smaller than the preset thickness value, and the preparation of the low-thickness polymer flexible copper clad laminate is realized.
Drawings
FIG. 1 is a flow chart of the steps of a method for manufacturing a polymer flexible copper clad laminate according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a polymer flexible copper clad laminate according to an embodiment of the present invention;
description of reference numerals:
1. a substrate layer; 2. a release agent layer; 3. a copper foil layer; 4. an LCP layer.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a method for preparing a polymer flexible copper clad laminate comprises the steps of:
preparing a base material with a first preset thickness;
depositing copper on the base material in an electrodeposition mode to form a copper foil with a second preset thickness;
coating a polymer solution on the copper foil by a third preset thickness and drying to form a polymer film;
the copper foil is attached to the polymer film to form a polymer flexible copper clad laminate;
the sum of the second preset thickness and the third preset thickness is less than a preset thickness value;
and separating the base material from the polymer flexible copper clad laminate to obtain the single polymer flexible copper clad laminate.
As can be seen from the above description, the beneficial effects of the present invention are: forming a copper foil with a second preset thickness on a base material with a first preset thickness in an electro-deposition mode, then coating a polymer solution on the copper foil with a third preset thickness, and generating a polymer film in a drying mode, so that the polymer film and the copper foil generate a polymer flexible copper clad laminate, and finally separating the generated polymer flexible copper clad laminate from the base material to obtain a final product of the polymer flexible copper clad laminate; the manufacturing process of the polymer flexible copper clad laminate is simplified, the thickness of the generated polymer flexible copper clad laminate is smaller than the preset thickness value, and the preparation of the low-thickness polymer flexible copper clad laminate is realized.
Further, the depositing copper on the substrate by electrodeposition comprises:
depositing copper on the substrate with a current density of 0.5-6ASD for a plating time of 1-30 min.
As is apparent from the above description, by performing electrodeposition of copper on a substrate at a current density of 0.5 to 6ASD and an electroplating time of 1 to 30min, a copper foil having a thickness of 1.5 μm can be prepared, reducing the thickness of the copper foil.
Further, the method comprises the following steps of coating the polymer solution on the copper foil with a third preset thickness and drying the copper foil to form the polymer flexible copper clad laminate:
and manufacturing the base material coated with the copper foil into a continuous roll.
According to the description, the base material coated with the copper foil is made into a continuous roll, so that the continuous roll polymer flexible copper clad laminate can be made subsequently, and the preparation efficiency of the polymer flexible copper clad laminate is greatly improved.
Further, the step of coating the polymer solution on the copper foil with a third preset thickness and drying the copper foil to form the polymer flexible copper clad laminate comprises the following steps:
coating the polymer solution on the copper foil on the base material in a continuous roll shape at a third preset thickness;
heating and drying the polymer solution by continuous infrared heating to generate a polymer film;
the polymer film and the copper foil are attached to form the continuous roll-shaped polymer flexible copper clad laminate.
From the above description, it can be seen that the polymer solution is coated on the copper foil by the third preset thickness, and the polymer solution is dried by continuous infrared heating, so that the polymer film and the copper foil can be produced in a continuous roll form, and compared with the prior art that the polymer flexible copper clad laminate with the length of only tens of meters or less than one hundred meters can be produced by drying through an oven device, the production is simplified, and the production efficiency is greatly improved.
Further, the heating and drying the polymer solution by continuous infrared to generate a polymer film comprises:
the polymer solution was heated and dried by continuous infrared at a temperature of 250 ℃ and 400 ℃ for a period of 1 to 5 hours.
As is apparent from the above description, the residual amount of the polymer solvent can be reduced to 1ppm by drying and solidifying the polymer solution at a temperature of 250-400 ℃ for 1-5 hours.
Further, before depositing copper on the substrate by means of electrodeposition, the method further comprises the following steps:
coating a release agent on the base material;
depositing copper on the substrate in an electrodeposition manner to form a second predetermined thickness of copper foil comprises:
and electrodepositing copper on the release agent to form a copper foil with a second preset thickness.
From the above description, it can be known that the preparation of the copper foil on the release agent can be realized by coating the release agent on the substrate and performing electrodeposition on copper on the release agent, and further the polymer flexible copper clad laminate can be generated, so that the polymer flexible copper clad laminate can be easily separated from the polymer flexible copper clad laminate.
Further, the release agent is an organic material.
As can be seen from the above description, the use of organic materials as release agents allows for easier release between the substrate and the polymeric flexible copper clad laminate.
Further, the third predetermined thickness is less than 7 μm.
Further, the second predetermined thickness is less than 1.5 μm.
Further, the first preset thickness is 12-18 μm;
the base material is continuous roll-shaped bearing copper.
As can be seen from the above description, the single-sided polymer flexible copper clad laminate can be prepared by one step by adopting the copper layer of 12-18 μm as the bearing substrate; if the base material such as polytetrafluoroethylene is adopted as the coating base material, the single-sided polymer flexible copper clad laminate can be prepared only by preparing the polymer film and then pressing the copper foil on the polymer film or sputtering the copper foil.
The preparation method of the polymer flexible copper clad laminate can be suitable for preparing various types of polymer flexible copper clad laminates, such as LCP-FCCL single-panel, and is explained by the specific implementation mode as follows:
example one
Referring to fig. 1, a method for preparing a polymer flexible copper clad laminate comprises the steps of:
s1, preparing a base material with a first preset thickness;
s2, depositing copper on the base material in an electrodeposition mode to form a copper foil with a second preset thickness; specifically, copper is deposited on the base material in a mode of current density of 0.5-6ASD and electroplating time of 1-30 min;
in an optional embodiment, step S2 is preceded by the step of: coating a release agent on the base material; and electrodepositing copper on the release agent to form a copper foil with a second preset thickness; wherein the release agent is an organic material; the first preset thickness is 12-18 mu m; the base material is continuous rolled bearing copper glass; the second preset thickness is less than 1.5 mu m;
s3, making the base material coated with the copper foil into a continuous roll;
s4, coating the polymer solution on the copper foil with a third preset thickness and drying to form a polymer film;
specifically, the method comprises the following steps: coating the polymer solution on the copper foil on the base material in a continuous roll shape at a third preset thickness; heating and drying the polymer solution by continuous infrared heating, wherein the drying temperature is 250-400 ℃ and the drying time is 1-5 hours, so as to generate a polymer film; the temperature is increased for drying and curing, the residual quantity of the polymer solvent can be reduced to 1ppm, while the residual quantity of the polymer solvent is 3ppm for drying and curing without increasing the temperature; the polymer film and the copper foil are attached to form a continuous roll-shaped polymer flexible copper clad laminate; the copper foil is attached to the polymer film to form a polymer flexible copper clad laminate; the sum of the second preset thickness and the third preset thickness is less than a preset thickness value; the third preset thickness is less than 7 mu m; the coating thickness can adjust the coating gap according to the actual requirement to realize different thicknesses of the coated wet film; if a polymer wet film with the thickness of 15 μm needs to be coated, the gap of the coating equipment is set to be 18 μm; if a 7.5 μm thick wet film of polymer is to be applied, the application gap is set to 9 μm;
s5, separating the base material from the polymer flexible copper clad laminate to obtain a single polymer flexible copper clad laminate;
referring to fig. 2, before peeling, the substrate layer 1, the release agent layer 2, the copper foil layer 3 and the LCP layer 4 are sequentially stacked; and stripping to obtain the continuous roll-shaped polymer flexible copper clad laminate containing the copper foil layer 3 and the LCP layer 4.
Example two
The embodiment is different from the first embodiment in that a specific example for preparing the polymer flexible copper clad laminate is provided;
s1, coating a layer of organic mold release agent on coiled bearing copper with the thickness of 12 mu m or 18 mu m, wherein the bearing copper is carrier copper foil;
s2, electroplating copper foil on the organic film remover; the current density was: 0.8ASD, the plating time is: 9 min; preparing a copper foil with the thickness of 1.5 mu m in a roll shape, and bonding the copper foil and the bearing copper foil;
s3, loading the carrier copper foil coated with the copper foil into a coating machine device in a continuous roll mode;
s4, coating a wet film with the thickness of 7 mu m on the copper foil in a continuous roll shape by using the solvent-type LCP solution;
s5, placing the continuous roll-type single-sided polymer (in a wet film state) flexible copper-clad plate prepared in the step S4 in a far infrared drying furnace for heating, drying and curing, wherein the temperature is as follows: at 220 ℃ for the following time: 2.5 hours; curing to form a dry film, generating an LCP film with the thickness of 5 mu m, and attaching the LCP film to the continuous rolled copper foil and the bearing copper foil;
s6, placing the LCP-FCCL prepared in the step S5 into a film stripping device, stripping the bearing copper, and finally obtaining a single-sided LCP-FCCL finished product with the total thickness of 6.5 microns.
EXAMPLE III
The embodiment is different from the first embodiment in that a specific example of preparing another polymer flexible copper clad laminate is provided;
s1, coating a layer of organic film remover on a carrier copper foil which is rolled and has the thickness of 12 mu m or 18 mu m;
s2, electroplating copper foil on the organic film remover; the current density was: 0.5ASD, the plating time is: 15 min; preparing a copper foil with the thickness of 1.5 mu m in a roll shape, and bonding the copper foil and the bearing copper foil;
s3, loading the copper foil and the bearing copper foil attached with the copper foil into coating machine equipment in a continuous roll mode;
s4, coating a wet film with the thickness of 7 mu m on the copper foil in a continuous roll shape by using the solvent-type LCP solution;
s5, placing the continuous roll-type single-sided polymer (in a wet film state) flexible copper-clad plate prepared in the step S4 in a far infrared drying furnace for heating, drying and curing, wherein the temperature is as follows: at 220 ℃ for the following time: 2.5 hours; curing to form a dry film, generating an LCP film with the thickness of 5 mu m, and attaching the LCP film to the continuous rolled copper foil and the bearing copper foil;
s6, placing the LCP-FCCL prepared in the step S5 into a film stripping device, stripping the bearing copper, and finally obtaining a single-side LCP-FCCL finished product with the total thickness of 6.5 microns;
preferably, the current density ranges from: 0.5-2 ASD; adjusting the electroplating time according to the current density to keep the product of the current density and the electroplating time relatively unchanged; so that a copper foil having a thickness of 1.5 μm can be prepared; meanwhile, the peeling strength between the copper foil and the LCP film is increased by reducing the thickness of the copper foil, compared with the prior art that the peeling degree between the copper foil and the LCP film is improved by an activation mode, the manufacturing process of the polymer flexible copper clad laminate is simplified;
please refer to table 1, which shows the performance test results of the materials in the second embodiment and the first embodiment;
TABLE 1
The peel strength of the LCP-FCCL prepared by the method is higher than that of the LCP-FCCL prepared by the prior art; the peel strength of LCP-FCCL prepared by the prior art is only 0.7N/mm, while the peel strength of LCP-FCCL prepared by the invention is 0.9N/mm; the higher the peel strength of the product, the better the reliability of the product processing.
In conclusion, the preparation method of the polymer flexible copper clad laminate provided by the invention can be used for preparing a polymer film with the thickness of 5 microns and a copper foil with the thickness of 1.5 microns, and finally generating the single-sided ultra-thin polymer flexible copper clad laminate with the total thickness of 6.5 microns; the ultra-thin flexible copper clad laminate manufactured by the method not only meets the development requirements of miniaturization and thinning of devices, but also realizes the processing and manufacturing feasibility of fine circuits (the line width is 10 mu m/the line distance is 10 mu m) by a board factory through a semi-additive process. The polymer solution is coated on the thin copper, and then the polymer wet film is solidified through a preparation method of continuous far-infrared furnace heating and drying, so that the continuous rolled ultrathin polymer flexible copper clad laminate single-sided board can be prepared through a one-step method, the manufacturing process is saved, the efficiency is higher, and the company is more competitive in the market.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A preparation method of a polymer flexible copper clad laminate is characterized by comprising the following steps:
preparing a base material with a first preset thickness;
depositing copper on the base material in an electrodeposition mode to form a copper foil with a second preset thickness;
coating a polymer solution on the copper foil by a third preset thickness and drying to form a polymer film;
the copper foil is attached to the polymer film to form a polymer flexible copper clad laminate;
the sum of the second preset thickness and the third preset thickness is less than a preset thickness value;
and separating the base material from the polymer flexible copper clad laminate to obtain the single polymer flexible copper clad laminate.
2. The method for preparing the polymer flexible copper clad laminate according to claim 1, wherein the depositing copper on the substrate by electrodeposition comprises:
depositing copper on the substrate with a current density of 0.5-6ASD for a plating time of 1-30 min.
3. The method for preparing the polymer flexible copper clad laminate according to claim 1, wherein the step of coating the polymer solution on the copper foil with a third preset thickness and drying the coated copper foil to form the polymer flexible copper clad laminate comprises the following steps:
and manufacturing the base material coated with the copper foil into a continuous roll.
4. The method for preparing the polymer flexible copper clad laminate according to claim 3, wherein the step of coating the polymer solution on the copper foil with a third preset thickness and drying the copper foil to form the polymer flexible copper clad laminate comprises the following steps:
coating the polymer solution on the copper foil on the base material in a continuous roll shape at a third preset thickness;
heating and drying the polymer solution by continuous infrared heating to generate a polymer film;
the polymer film and the copper foil are attached to form the continuous roll-shaped polymer flexible copper clad laminate.
5. The method for preparing the polymer flexible copper clad laminate according to claim 4, wherein the step of heating and drying the polymer solution by continuous infrared to form the polymer film comprises:
the polymer solution was heated and dried by continuous infrared at a temperature of 250 ℃ and 400 ℃ for a period of 1 to 5 hours.
6. The method for preparing the polymer flexible copper clad laminate according to claim 1, wherein the method further comprises the following steps before depositing copper on the substrate by electrodeposition:
coating a release agent on the base material;
depositing copper on the substrate in an electrodeposition manner to form a second predetermined thickness of copper foil comprises:
and electrodepositing copper on the release agent to form a copper foil with a second preset thickness.
7. The method for preparing the polymer flexible copper-clad plate according to claim 6, wherein the release agent is an organic material.
8. The method for preparing the polymer flexible copper clad laminate according to claim 1, wherein the third predetermined thickness is less than 7 μm.
9. The method for preparing the polymer flexible copper clad laminate according to claim 1, wherein the second predetermined thickness is less than 1.5 μm.
10. The method for preparing the polymer flexible copper clad laminate according to claim 1, wherein the first preset thickness is 12 μm to 18 μm;
the base material is continuous roll-shaped bearing copper.
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