CN1128038C - Thermal radiator and its manufacture technology - Google Patents
Thermal radiator and its manufacture technology Download PDFInfo
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- CN1128038C CN1128038C CN98122202A CN98122202A CN1128038C CN 1128038 C CN1128038 C CN 1128038C CN 98122202 A CN98122202 A CN 98122202A CN 98122202 A CN98122202 A CN 98122202A CN 1128038 C CN1128038 C CN 1128038C
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Abstract
Description
本发明是有关一种散热装置及其制造方法,尤其是指一种在薄板面上冲孔以供叶片插入,并借冲击出的变形槽孔来嵌组各薄板面形成底座的散热装置及其制造方法。The present invention relates to a heat dissipation device and its manufacturing method, in particular to a heat dissipation device which punches holes on the surface of a thin plate for inserting blades, and uses the punched out deformation slots to embed each thin plate surface to form a base and the heat dissipation device. Manufacturing method.
目前,随着电脑资讯产业的快速发展以及各种产业应用电脑的范围愈来愈广,使用者对电脑中央处理单元(CPU)处理资料的速度要求也愈来愈快,而且目前中央处理单元的电路设计有简单化、集中化的趋势,因此中央处理器不再只包含单纯的晶片而已,还有许多小型化的电子元件逐渐纳入中央处理单元中,于是,象这样电子元件愈来愈快的运算速度,将伴随产生相当高的整体热量,如此高温的热量十分不利于中央处理单元的电讯传输的稳定性和品质,故需要通过散热速度快的散热媒介来协助散出热量。现有技术中有关散热装置的构造可参考美国专利第4,712,159、4,879,891号等专利。这些专利的散热装置是利用挤制成型的方式,在散热面板的同侧表面上一体凸设有若干个大面积的散热叶片,因此借散热面板靠置于中央处理单元旁将其热量导出,再经由叶片与空气接触而对流散出。但是上述构造的散热效率不高,不能有效满足目前中央处理单元的实际散热需要,而且在制造时容易衍生许多问题,其中最大问题来自于如何有效扩大散热装置的散热表面积。一般而言,叶片设置数目愈多愈密,而且其延伸高度与宽度的相对比例愈大(即叶片较薄较高)时,散热装置的整体散热表面积就能适当增大,但是,在现有挤出成型的制造技术下,叶片的宽度与高度比达1∶8已很不容易,因此,叶片的宽度不可能太薄,相对地数目则无法增加,因而使散热的能力受到限制。At present, with the rapid development of the computer information industry and the widening range of computer applications in various industries, the user's requirements for the computer central processing unit (CPU) to process data are also getting faster and faster, and the current central processing unit The circuit design tends to be simplified and centralized, so the central processing unit no longer only includes a simple chip, and many miniaturized electronic components are gradually incorporated into the central processing unit, so electronic components like this are getting faster and faster The calculation speed will be accompanied by a relatively high overall heat generation. Such high temperature heat is very detrimental to the stability and quality of the telecommunications transmission of the central processing unit. Therefore, it is necessary to use a heat dissipation medium with a fast heat dissipation speed to assist in dissipating heat. For the structure of the heat dissipation device in the prior art, reference may be made to US Patent Nos. 4,712,159, 4,879,891 and other patents. The heat dissipation devices of these patents utilize extrusion molding, and a plurality of large-area heat dissipation fins are integrally protruded on the same side surface of the heat dissipation panel, so that the heat is exported by placing the heat dissipation panel next to the central processing unit Then through the contact with the air through the blades, it is dissipated by convection. However, the heat dissipation efficiency of the above-mentioned structure is not high, and cannot effectively meet the actual heat dissipation needs of the current central processing unit, and it is easy to cause many problems during manufacture, and the biggest problem comes from how to effectively expand the heat dissipation surface area of the heat dissipation device. Generally speaking, when the number of blades is set more and denser, and the relative ratio of the extension height to width is larger (that is, the blades are thinner and higher), the overall heat dissipation surface area of the heat sink can be appropriately increased. However, in the existing Under the manufacturing technology of extrusion molding, it is not easy for the blade width to height ratio to be 1:8. Therefore, the width of the blades cannot be too thin, and the number of blades cannot be increased relatively, thus limiting the heat dissipation capability.
为解决上述问题,美国第4,884,331、5,208,731、5,464,054、5,486,980号等专利做了一些改进,在上述的大面积散热叶片上剖沟,即将各叶片剖成长条状的多个散热片,进而增加散热装置的散热表面积。但是,如此设计只能增加部分散热表面积,并不能有效增加叶片数目或改变其宽度与高度比,而且制造上太过薄窄的叶片在剖沟时,容易发生折弯或断裂的情形,因此加工剖沟的速度不能太快,进而将使生产率大为降低。In order to solve the above problems, some improvements have been made in U.S. patents such as Nos. 4,884,331, 5,208,731, 5,464,054, and 5,486,980. Grooves are cut on the above-mentioned large-area heat dissipation blades, that is, each blade is cut into a plurality of strip-shaped heat sinks, and then heat dissipation devices are added. heat dissipation surface area. However, such a design can only increase part of the heat dissipation surface area, and cannot effectively increase the number of blades or change their width-to-height ratio, and the blades that are too thin and narrow are prone to bending or breaking when they are grooved, so processing The speed of trenching should not be too fast, which will greatly reduce the productivity.
本发明的主要目的在于提供一种使散热装置的散热表面积增加为数倍的散热装置及其制造方法,它可在相同面积的散热装置底座上设置数目较多较密的叶片,而有效提高散热装置的整体散热效率。另外,利用薄板冲孔加工较为容易的特性,使散热装置能迅速冲制插孔供叶片组接使用,进而能缩短加工时程,有效提高产能。The main purpose of the present invention is to provide a heat sink that increases the heat dissipation surface area of the heat sink several times and its manufacturing method. It can arrange a larger number of denser blades on the base of the heat sink with the same area, and effectively improve the heat dissipation. The overall cooling efficiency of the device. In addition, by utilizing the relatively easy punching process of thin plates, the heat sink can quickly punch holes for blade assembly, thereby shortening the processing time and effectively increasing production capacity.
本发明的技术特征在于:它包括有冲孔、冲剪、结合、冲击、磨铣以及截切等步骤,它是借冲孔及冲剪步骤分别制出具插孔的板面及成排的叶片条,接着将各板面组成底座并使成排的叶片依次紧配合于对应的插孔上而适当延伸在底座的同侧面,然后在各叶片间的底座适当位置上冲击变形槽孔,以使各板面彼此嵌固成一体并加强叶片的结合,再施以适当长度的截切即可得到成品。The technical feature of the present invention is that it includes the steps of punching, punching and shearing, combining, impacting, milling and cutting. strips, and then form the base of each plate surface and make the rows of blades tightly fit on the corresponding sockets in turn and properly extend on the same side of the base, and then impact the deformation slots on the appropriate positions of the base between the blades, so that The boards are embedded and fixed into one body to strengthen the combination of the blades, and then cut to an appropriate length to obtain the finished product.
与现有技术相比,本发明具有以下优点:因本散热装置在底座的侧面增设较多的叶片数,并使叶片高度不受挤出成型生产工艺的限制,而得以有效增大散热面积,使散热效率更好且更能维持中央处理器正常工作。Compared with the prior art, the present invention has the following advantages: because the cooling device adds more blades on the side of the base, and the height of the blades is not limited by the extrusion molding production process, the heat dissipation area can be effectively increased, The heat dissipation efficiency is better and the CPU can be maintained to work normally.
下面结合附图及实施例对本发明做进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
图1是本发明散热装置纵向配置叶片的成品局部立体图。Fig. 1 is a partial perspective view of the finished product of the cooling device of the present invention with vertically arranged blades.
图2是本发明散热装置的制造流程图。Fig. 2 is a manufacturing flow chart of the heat sink of the present invention.
图3是本发明散热装置底板结合叶片的立体图。Fig. 3 is a perspective view of the bottom plate of the heat dissipation device combined with the blades of the present invention.
图4是本发明散热装置冲击并组装底板的立体图。Fig. 4 is a perspective view of the heat sink of the present invention impacting and assembling the bottom plate.
图5是图4沿V-V线方向的剖视图。Fig. 5 is a sectional view along the line V-V of Fig. 4 .
图6是图1沿VI-VI线方向的剖视图。Fig. 6 is a sectional view along line VI-VI of Fig. 1 .
图7是本发明散热装置横向配置叶片的成品立体图。Fig. 7 is a perspective view of the finished product of the cooling device of the present invention with blades arranged laterally.
如图1所示,散热装置1包括有靠置于中央处理器(未图示)上借以吸收并传导中央处理器所产生的热量的底座10,以及由底座表面向一侧延伸设置的成排叶片2,其中底座10是由第一板面11、第二板面12及第三板面13所叠合而成,它亦可视实际加工的需要设置较多或较少数量的板面,在这些板面上按一定的间距对应冲设有数排插孔111、121、131(图3所示),且在这些板面彼此叠合成底座10时,各板面上的插孔恰能上下对齐。叶片2呈长条板片状,它是在料带上直接冲剪出两条交错的连续叶片条20(图3示)后,再分别与底座10组合并折去导引带21而成,各叶片2均具有较插孔孔径略为宽的底部22及较为尖窄的顶部23,因此利用叶片2尖窄的顶部23使各叶片2能经由相对设置的插孔自底座10的一侧迅速插向另一侧,再借其较宽大的底部22加以塞止固定,这样,便可在底座10表面上组接数排向一侧延伸设置的叶片2。在这些叶片2间形成有间隙14可作为空气流通的通道,因此,中央处理器所产生的热量,可经由底座10传导至各叶片2上,并借每一叶片2的侧表面与间隙14内的空气接触,使热量传到空气中,再借空气对流散出热量。另外,在每四个相邻叶片2间的底座10表面上加工冲设有变形槽孔15,这些变形槽孔15在底座的各板面叠合起来并依次插入成排叶片2后,再在叶片2间隙上冲设而成,因此可配合各叶片2的底部22塞止于插孔内的特性,使各板面紧密结合成完整的底座10而不致分离,而且在冲出变形槽孔15后,将连带拉动旁侧的底座10板面,使靠近变形槽孔15的插孔孔缘随之变形,这样亦有助于叶片2紧固在底座10上而不易脱出。As shown in Figure 1, the
请参阅图2所示,它是本发明制造上述散热装置1的流程,它包括有下列几项步骤:一、冲孔步骤(Stamping)30:Please refer to shown in Fig. 2, it is the flow process that the present invention manufactures above-mentioned
首先取用热传导性良好的原料所制成、具适当厚度的薄板(通常为铝薄板)作为底座10的板面11、12、13,并直接在这些板面上冲制出成排的插孔111、121、131。二、冲剪步骤(Stamping)31:Firstly, thin plates (usually aluminum thin plates) made of materials with good thermal conductivity are used as the
在对各板面进行冲孔作业的同时,可另于长条料带上借冲剪成型的方式制出两交叉配置的叶片条20(图3所示),其中交错冲剪叶片条20是为了节省材料,而预先将叶片2一体组接于一导引带21上则有助于叶片2与底座10的板面迅速组接。三、结合步骤(Assembling)32:While carrying out the punching operation on each plate surface, two intersecting blade strips 20 (shown in FIG. 3 ) can be produced on the long strip of material by punching and shearing, wherein the interleaved punching and shearing blade strips 20 are In order to save material, pre-integrating the
如图3所示,将完成冲孔的板面彼此叠合成底座10,并使连接在导引带21上的成排叶片2分别导引并对准底座10各插孔,然后使各叶片2自底座10底侧一一插入插孔并由另一侧凸伸出来,再借每一叶片2较宽的底部22紧配合于对应板面的插孔内而加以固定,完成底座10与各叶片2的结合后,可将连接于叶片2底侧多余的导引带21折断去除。四、冲击步骤(Punching)33:As shown in Figure 3, the plate surfaces that have been punched are superimposed on each other to form a
如图4所示,将组合有成排叶片2的底座10移至模具4下方,该模具是由固定板40及自固定板40向下延伸的成排冲击臂41所组成,其中固定板40组接于机台(未图示)上而可受机台的推引上下移动,而在各排冲击臂41的底缘凸设有若干个相隔一定间距的方形顶块42。由于各排冲击臂41与散热装置1的叶片2走向相平行的纵向配置,而且其设置位置恰位于各排叶片2的间隙14上,因此当机台带动固定板40上下移动时,将可使各冲击臂41分别插置于各排叶片2的间隙内活动,而且,冲击臂41向下延伸的长度较叶片2的高度为大,故冲击臂41向下运动将使其底部的方形顶块42直接撞击在相邻四个叶片2的间隙上,而造成适当深度、梯形孔状的变形槽孔15,机台推引模具4的速度愈快,变形槽孔15的深度愈深,则其嵌固底座10的板面及各叶片2的能力愈强,如图5所示。五、磨铣步骤(Milling)34:As shown in Figure 4, the
请对照图5及图6所示,完成底座10板面与叶片2的组接后,可进一步对底座10未凸设有叶片2的另一侧面进行磨铣作业,以除去因冲制变形槽孔15而凸出的隆起部16,使该侧面恢复平整而利于贴靠在中央处理器上。六、截切步骤(Cutting)35:Please refer to Figure 5 and Figure 6, after the assembly of the
按散热装置1所需的规格尺寸在上述完成磨铣的半成品上进行截切作业。七、完成成品36。Cutting operations are carried out on the above-mentioned finished milling semi-finished product according to the required specifications of the
因此,借上述本发明各步骤所制成的散热装置1,可在节省时间、成本的情形下,在底座10上增设较多数量的叶片2,以有效增加整个散热装置1的散热表面积,使散热装置1的整体散热效果良好,以解决目前中央处理器的散热问题。而且,将底座10分成数个板面的构造,将有助于冲孔加工的迅速完成,而冲击变形槽孔15以组固底座10板面及叶片2的作法亦具有便于加工、节省时间的效用。Therefore, the
另外,如图7所示,散热装置1′的叶片2亦可在底座10′上依相对于底座10′的横方向排列设置,以便于在底座10′上设置更多的叶片2,有效增加散热装置1′的散热能力。In addition, as shown in Figure 7, the
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| Application Number | Priority Date | Filing Date | Title |
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| CN98122202A CN1128038C (en) | 1998-11-06 | 1998-11-06 | Thermal radiator and its manufacture technology |
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| CN98122202A CN1128038C (en) | 1998-11-06 | 1998-11-06 | Thermal radiator and its manufacture technology |
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| CN1128038C true CN1128038C (en) | 2003-11-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW349194B (en) * | 1997-12-26 | 1999-01-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and process for producing the same |
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| TW349194B (en) * | 1997-12-26 | 1999-01-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and process for producing the same |
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