[go: up one dir, main page]

CN1125390C - Heat radiator and its assembly mode - Google Patents

Heat radiator and its assembly mode Download PDF

Info

Publication number
CN1125390C
CN1125390C CN 98113400 CN98113400A CN1125390C CN 1125390 C CN1125390 C CN 1125390C CN 98113400 CN98113400 CN 98113400 CN 98113400 A CN98113400 A CN 98113400A CN 1125390 C CN1125390 C CN 1125390C
Authority
CN
China
Prior art keywords
heat dissipation
blades
sub
dissipation base
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 98113400
Other languages
Chinese (zh)
Other versions
CN1253322A (en
Inventor
李顺荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIN PRECISION INDUSTRY (SHENZHEN) CO LTD
Hon Hai Precision Industry Co Ltd
Original Assignee
FUJIN PRECISION INDUSTRY (SHENZHEN) CO LTD
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIN PRECISION INDUSTRY (SHENZHEN) CO LTD, Hon Hai Precision Industry Co Ltd filed Critical FUJIN PRECISION INDUSTRY (SHENZHEN) CO LTD
Priority to CN 98113400 priority Critical patent/CN1125390C/en
Publication of CN1253322A publication Critical patent/CN1253322A/en
Application granted granted Critical
Publication of CN1125390C publication Critical patent/CN1125390C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置及其组装方式,包括有第一成型、冲孔、第二成型、结合及截切等步骤,依靠第一成型一体制出有散热底座及成排叶片的原料条,再在各叶片间的凹槽槽底冲出数个组接孔,经第二成型制出对应于原料条组接孔的成排子叶片,靠子叶片底段宽度大于组接孔孔径的特性将各排子叶片依次过盈配合于组接孔上并适当延伸在各叶片之间,最后经截切作业制出成品,由于增加了散热面积,因而散热效能更佳。

Figure 98113400

A heat dissipation device and its assembly method, including the steps of first forming, punching, second forming, combining and cutting, relying on the first forming to integrally produce a raw material strip with a heat dissipation base and rows of blades, and then in each Several assembly holes are punched out at the bottom of the groove between the blades, and rows of sub-blades corresponding to the assembly holes of the raw material strips are produced through the second molding. The sub-blades are successively interference-fitted on the assembly holes and properly extended between the blades. Finally, the finished product is made by cutting. Because the heat dissipation area is increased, the heat dissipation performance is better.

Figure 98113400

Description

一种散热装置及其组装方式A cooling device and its assembly method

本发明涉及一种散热装置及其组装方式,特别是涉及一种直接在散热装置的各叶片间直接增设数排的子叶片,使散热表面积及散热效能倍增的散热装置组装方式。The invention relates to a cooling device and its assembly method, in particular to a cooling device assembly method in which several rows of sub-blades are directly added between the blades of the cooling device to double the cooling surface area and cooling efficiency.

随着计算机产业的快速发展,为以更快的速度处理日益庞大的资料库、图片及影像等资料,就必须不断加快电脑中央处理器芯片的运算速度。然而随着中央处理器芯片运算速度的加快,必将伴随产生相当高的热量,有些芯片甚至可产生达到四十瓦以上的热量,如此热量的产生将十分不利于电讯传输的稳定性和质量,故有必要设计传热、散热速度快的散热装置配合风扇的使用来协助中央处理器散出不必要的热量。现有有关散热装置的构造可参考美国专利第4,712,159、4,879,891号以及中国台湾第84212747、85200861、85206293号等专利。这些专利的散热装置主要设有一面积约略等同于中央处理器上表面的散热面板,并在散热面板的一侧表面上一体设有成排的叶片,因此可依靠散热面板将中央处理器的热量传出,然后再经由叶片将其热量散出至空气中。但上述设计不仅未能有效满足目前中央处理器的实际散热需要,而且在制造时常会衍生许多问题,其中最大问题来自于如何有效扩大散热装置的散热表面积,一般而言,叶片设置数目愈多愈密,而且其延伸高度与宽度的相对比例愈大(即叶片较薄较高)时,散热装置的整体散热表面积就能适当增大,但是,在挤出成型的技术限制下,叶片的宽度不可能太薄,亦即叶片数目也无法增加,因而使散热装置的散热能力受到限制。With the rapid development of the computer industry, in order to process increasingly large databases, pictures and images at a faster speed, it is necessary to continuously increase the computing speed of the computer's central processing unit chip. However, with the acceleration of the calculation speed of the central processing unit chip, it will inevitably generate quite high heat, and some chips can even generate more than 40 watts of heat. Such heat generation will be very detrimental to the stability and quality of telecommunication transmission. Therefore, it is necessary to design a cooling device with fast heat transfer and cooling speed to cooperate with the use of fans to assist the central processing unit to dissipate unnecessary heat. For the structure of the existing heat dissipation device, reference may be made to US Patent Nos. 4,712,159, 4,879,891, and Chinese Taiwan Patents No. 84212747, 85200861, and 85206293. The cooling devices of these patents are mainly provided with a cooling panel with an area approximately equal to the upper surface of the central processing unit, and are integrally provided with rows of blades on one side of the cooling panel, so that the heat dissipation of the central processing unit can be transferred to the central processing unit by means of the cooling panel. out, and then dissipate its heat into the air through the blades. However, the above design not only fails to effectively meet the actual heat dissipation needs of the current central processing unit, but also often generates many problems during manufacture. The biggest problem comes from how to effectively expand the heat dissipation surface area of the heat sink. Generally speaking, the more blades are set, the more When the relative ratio of its extension height to width is larger (that is, the blade is thinner and higher), the overall heat dissipation surface area of the heat sink can be appropriately increased. However, under the technical limitation of extrusion molding, the width of the blade is not It may be too thin, that is, the number of blades cannot be increased, thus limiting the heat dissipation capability of the heat sink.

为解决上述问题,美国第4,890,196、5,038,858号及中国台湾专利第83212791号提出将散热装置的散热面板与叶片分开制造再组装成一体的构想,如图8A及图8B所示即为美国第5,038,858号专利的构造,其主要在散热装置7的散热面板71上设有若干组接槽711,且在这些组接槽711的槽侧壁上形成有扣缘712,而叶片72则在其底侧插接边附近对应设置若干凸块721,然后在叶片72插接于组接槽711内时依靠这些凸块721配合在扣缘712上加以固定。如图9所示则是利用焊接方式,将叶片82依次接合于散热面板81以组成散热装置8。现有方法虽可在散热面板上组接较多的叶片,并使叶片的宽高比例改变以增加其表面积,但其在制造时必须将叶片逐一组接在散热面板上,而且需要适当的媒介将两者固定成一体(如用焊锡或凸块),因此制造过程复杂且须花费较多的时间及成本,不利于大量生产制造,同时所能增加的散热表面积仍相当有限。In order to solve the above problems, U.S. Nos. 4,890,196, 5,038,858 and Taiwan Patent No. 83212791 propose the concept of separately manufacturing the heat dissipation panel and the blades of the heat dissipation device and then assembling them into one body, as shown in Fig. 8A and Fig. 8B, which is U.S. No. 5,038,858 Patented structure, it is mainly provided with a number of assembly grooves 711 on the heat dissipation panel 71 of the heat dissipation device 7, and buckle edges 712 are formed on the groove side walls of these assembly grooves 711, and the blades 72 are inserted on the bottom side. A plurality of protruding blocks 721 are correspondingly provided near the connecting edge, and then when the blade 72 is inserted into the assembling groove 711 , these protruding blocks 721 are fitted on the buckle edge 712 to be fixed. As shown in FIG. 9 , the fins 82 are sequentially joined to the heat dissipation panel 81 by welding to form the heat dissipation device 8 . Although the existing method can assemble more blades on the heat dissipation panel, and change the ratio of width and height of the blades to increase its surface area, it must be assembled on the heat dissipation panel one by one during manufacture, and a suitable medium is required. Fixing the two together (such as using solder or bumps) complicates the manufacturing process and takes a lot of time and cost, which is not conducive to mass production. At the same time, the heat dissipation surface area that can be increased is still quite limited.

本发明的主要目的在于提供一种使散热面积增加为数倍的散热装置及其组装方式。The main purpose of the present invention is to provide a heat dissipation device and its assembly method which can increase the heat dissipation area several times.

另一目的在于利用低廉的成本及简化的程序来制造散热装置。Another object is to manufacture the heat sink with low cost and simplified procedures.

本发明的目的是这样实现的,即提供一种散热装置,包括:靠置于中央处理器上的散热底座;贯穿设置于散热底座上的组接孔;对应于散热底座组接孔设置的由料带冲压制成的子叶片,而且可在完全插入对应的组接孔后过盈配合在组接孔内,以延伸凸出在散热底座未靠接在中央处理器的另一侧面上并增加散热装置的整体散热表面积。组装方式包括第一成型、冲孔、第二成型、结合以及截切等步骤,其中依靠第一成型步骤一体制出具有散热底座及成排叶片的原料条,接着在各叶片间的凹槽槽底冲设数个组接孔后,可将经第二成型步骤制出的成排子叶片依序过盈配合于对应组接孔上并适当延伸在散热装置的各叶片之间,然后经截切作业制出成品。The purpose of the present invention is achieved by providing a heat dissipation device, comprising: a heat dissipation base placed on the central processing unit; an assembly hole provided through the heat dissipation base; The sub-blades stamped by the material strip can be interference-fitted in the joint hole after being fully inserted into the corresponding joint hole, so as to extend and protrude on the other side of the heat dissipation base that is not abutted against the central processing unit and increase the The overall heat dissipation surface area of a heat sink. The assembly method includes the steps of first forming, punching, second forming, bonding, and cutting. The first forming step is used to integrally produce a raw material strip with a heat dissipation base and rows of blades, and then the grooves between the blades After setting several joint holes in the bottom punch, the rows of sub-blades produced in the second molding step can be sequentially interference-fitted on the corresponding joint holes and properly extended between the blades of the heat sink, and then cut Cutting operations to produce finished products.

比较现有技术,本发明具有以下优点:1.有效提高散热装置的散热效率,并维持中央处理器的正常运作。2.适于大量制造。3.能在节省成本和减少工艺步骤的情形下改善原有散热装置的散热效能。Compared with the prior art, the present invention has the following advantages: 1. Effectively improve the heat dissipation efficiency of the heat dissipation device and maintain the normal operation of the central processing unit. 2. Suitable for mass production. 3. The heat dissipation performance of the original heat dissipation device can be improved while saving costs and reducing process steps.

下面结合实施例,参照附图对本实用新型作进一步描述:Below in conjunction with embodiment, the utility model is further described with reference to accompanying drawing:

图1A是本发明散热装置与各子叶片组合关系的立体分解图。FIG. 1A is an exploded perspective view of the combination relationship between the heat sink and sub-blades of the present invention.

图1B是本发明散热装置组装后子叶片的俯视图。FIG. 1B is a top view of the assembled sub-blades of the heat sink of the present invention.

图1C是本发明在料带上同时制出两排子叶片示意的局部俯视图。Fig. 1C is a schematic partial top view of two rows of sub-blades simultaneously produced on the tape according to the present invention.

图2是本发明散热装置制造组装时的流程图。Fig. 2 is a flow chart of manufacturing and assembling the heat sink of the present invention.

图3是本发明散热装置第二实施例的立体分解图。FIG. 3 is an exploded perspective view of the second embodiment of the heat sink of the present invention.

图4是本发明散热装置第二实施例制造组装时的流程图。图5是本发明散热装置第三实施例的立体分解图。Fig. 4 is a flow chart of manufacturing and assembling the second embodiment of the heat sink of the present invention. FIG. 5 is an exploded perspective view of a third embodiment of the heat sink of the present invention.

图6是本发明组装方式应用于现有散热装置的实施示意图。FIG. 6 is a schematic diagram of the implementation of the assembly method of the present invention applied to an existing heat dissipation device.

图7是本发明组装方式应用于另一现有散热装置的实施示意图。FIG. 7 is a schematic diagram of the implementation of the assembly method of the present invention applied to another existing heat dissipation device.

图8A是现有构造插接组接叶片示意的剖视详图。Fig. 8A is a schematic cross-sectional detailed view of a plug-in assembly blade in a conventional structure.

图8B是现有构造组接槽附近的局部剖视详图。Fig. 8B is a partial cross-sectional detailed view near the joint groove of the existing structure.

图9是现有构造依靠焊接方式组接叶片示意的剖视详图。Fig. 9 is a schematic cross-sectional detailed view of blades assembled by means of welding in an existing structure.

如图1A及图1B所示,散热装置1的主要构造包括靠置于中央处理器(未图示)上用来吸收并传导处理器所产生的热量的散热底座11,自散热底座11侧表面所一体延伸设置的成排叶片12,在叶片12之间形成凹槽13以提供空气的流通空间,因此中央处理器所产生的热量,可经由散热底座11传导至各叶片12上,并依靠叶片12的两侧表面与凹槽13内的空气接触使热量传到空气中,再利用空气对流散出。在每一凹槽13槽底的散热底座11上设置有成排的组接孔14,各排组接孔14上均可对应组接一组子叶片22。这些子叶片22是由料带2冲压制成(如图1C示),它们是均布于料带2的中央部分,且交错配置并一体连接于料带2两侧边上所同时冲出、具导引作用的导引带21上。每一子叶片22靠近导引带21的底段部分宽度均略较组接孔14的孔径为宽,因此将料带2上交错配置的两组子叶片22连同相对的导引带21折断分开并对应插接于各排组接孔14内时,可依靠其较宽的底段部分过盈配合于组接孔14内加以固定。同时在完成组接后将导引带21从子叶片22底段折断去除,如此可在散热装置1的每一凹槽13内各增设一排子叶片22以有效增加原有叶片12的散热面积,使散热装置散热效果更隹。As shown in Figures 1A and 1B, the main structure of the cooling device 1 includes a cooling base 11 placed on the central processing unit (not shown) to absorb and conduct the heat generated by the processor, from the side surface of the cooling base 11 The rows of blades 12 that are integrally extended form grooves 13 between the blades 12 to provide air circulation space, so the heat generated by the central processing unit can be conducted to each blade 12 through the heat dissipation base 11, and rely on the blades. The two side surfaces of 12 are in contact with the air in the groove 13 so that the heat is transferred to the air, and then the heat is dissipated by air convection. Rows of assembly holes 14 are provided on the heat dissipation base 11 at the bottom of each groove 13 , and each row of assembly holes 14 can be correspondingly assembled with a group of sub-blades 22 . These sub-blades 22 are made by stamping the material strip 2 (as shown in Figure 1C), they are evenly distributed on the central part of the material strip 2, and are arranged in a staggered manner and integrally connected to the both sides of the material strip 2. On the guide belt 21 with guiding effect. The width of the bottom section of each sub-blade 22 close to the guide belt 21 is slightly wider than the diameter of the assembly hole 14, so the two sets of sub-blades 22 staggered on the strip 2 together with the opposite guide belt 21 are broken and separated. And when correspondingly plugged in each row of group joint holes 14, it can be fixed in the group joint holes 14 by virtue of the interference fit of its wider bottom section. At the same time, after the assembly is completed, the guide strip 21 is broken and removed from the bottom section of the sub-blades 22, so that a row of sub-blades 22 can be added in each groove 13 of the heat sink 1 to effectively increase the heat dissipation area of the original blades 12. , so that the cooling effect of the cooling device is better.

参照图2所示,本发明制造上述散热装置的流程,包括有下列几项步骤:Referring to Fig. 2, the flow process of the present invention to manufacture the above-mentioned heat sink includes the following steps:

一.第一成型步骤30:1. The first molding step 30:

首先取用铝锭原料(或其它良好热传导的原料)依靠挤出成型的方式,直接制成包含散热底座11及成排叶片12的原料条(未图示)。Firstly, aluminum ingot raw materials (or other materials with good heat conduction) are used to form a raw material bar (not shown) including the heat dissipation base 11 and the rows of blades 12 directly by means of extrusion molding.

二.冲孔步骤31:2. Punching step 31:

制出包含散热底座11及成排叶片12的原料条后,可再依靠冲孔方式于各叶片12间的凹槽13槽底的散热底座11上分别冲出成排的组接孔14。After making the raw material strip comprising the cooling base 11 and the rows of blades 12, rows of assembly holes 14 can be punched out on the cooling base 11 at the bottom of the groove 13 between the blades 12 by means of punching.

三.第二成型步骤(Molding)32:3. The second molding step (Molding) 32:

在制造散热底座11及叶片12的同时,在长条料带2上依靠冲压成型的方式制出若干条子叶片22,为组接便利以及节省材料,可预先将各子叶片22交错配置并一体连接于前述料带2两侧边所设置的导引带21上。While manufacturing the heat dissipation base 11 and blades 12, a number of sub-blades 22 are produced on the long strip 2 by means of stamping. For the convenience of assembly and material saving, the sub-blades 22 can be staggered and connected in advance. On the guide belts 21 provided on both sides of the aforementioned material strip 2 .

四.结合步骤33:4. Combining step 33:

将连接在导引带21上的成排子叶片22分别导引并对准原料条的凹槽13槽底所冲设的成排组接孔14,然后使各子叶片22自散热底座11的底侧一一插入组接孔14并凸露于凹槽13中,依靠每一子叶片22较宽的底段部分过盈配合于组接孔14内而加以固定。The rows of sub-blades 22 connected on the guide belt 21 are respectively guided and aligned with the rows of assembly holes 14 punched at the bottom of the groove 13 of the raw material strip, and then each sub-blade 22 is separated from the heat dissipation base 11. The bottom sides are inserted into the assembly hole 14 one by one and protrude in the groove 13 , and are fixed by the interference fit of the wider bottom section of each sub-blade 22 in the assembly hole 14 .

五.截切步骤34:Five. Cutting step 34:

完成原料条与各子叶片22的结合后,可将连接于子叶片22底侧多余的导引带21折断去除,然后再依散热装置1所需的规格尺寸在原料条的适当位置处进行截切作业。After the combination of the raw material strip and each sub-blade 22 is completed, the redundant guide belt 21 connected to the bottom side of the sub-blade 22 can be broken off and removed, and then cut at the appropriate position of the raw material strip according to the specifications and sizes required by the cooling device 1. cut homework.

六.完成成品35:Six. Finished product 35:

在原料条上每隔适当长度加以截切,即可获得散热装置1的成品。The finished product of the heat sink 1 can be obtained by cutting the raw material strip at appropriate lengths.

如上述,本发明可在最节省时间、成本的情形下,有效增加散热装置1的散热表面积(即子叶片的表面积),使这些散热装置1的散热效果良好,以解决目前中央处理器的散热问题。As mentioned above, the present invention can effectively increase the heat dissipation surface area of the cooling device 1 (i.e. the surface area of the sub-blades) in the most time-saving and cost-effective situation, so that the heat dissipation effect of these cooling devices 1 is good, so as to solve the heat dissipation problem of the current central processing unit. question.

参阅图3所示,本发明依靠设置子叶片以增加散热表面积的方法,可进一步应用在具有剖沟叶片12′的散热装置1′上,其中该散热装置主要设有靠置于中央处理器上的散热底座11′与自该散热底座11′的另一侧面所凸设的成排叶片12′,叶片12′的间所形的的凹槽13′槽底同样冲设有若干个组接孔14′以与相对应的子叶片22相组接。另外在各叶片12′上剖设有若干垂直于凹槽13′走向的穿沟16′,设置穿沟16′可配合子叶片22进一步增加叶片12′原有的表面积,使散热装置1′的整体散热效果更隹。并且在各叶片12′上所设的穿沟16′中至少有一穿沟的设置宽度较其它为宽而形成固定穿沟15′,固定穿沟15′是为供组接组件(未图示)容置其中并将散热装置1′及中央处理器(未图示)组接成模组而设置。Referring to Fig. 3, the present invention relies on arranging sub-blades to increase the heat dissipation surface area, which can be further applied to a heat dissipation device 1' with split groove blades 12', wherein the heat dissipation device is mainly provided with a central processing unit. The heat dissipation base 11' and the rows of blades 12' protruding from the other side of the heat dissipation base 11', and the bottom of the groove 13' formed between the blades 12' are also punched with several assembly holes. 14' to be combined with the corresponding subblades 22. In addition, a number of grooves 16' perpendicular to the direction of the groove 13' are cut on each blade 12', and the grooves 16' are set to cooperate with the sub-blades 22 to further increase the original surface area of the blades 12', so that the cooling device 1' The overall cooling effect is better. And at least one of the grooves 16' provided on each blade 12' has a width wider than the others to form a fixed groove 15', the fixed groove 15' is for assembly (not shown) The cooling device 1' and the central processing unit (not shown) are accommodated therein and assembled into a module.

参阅图4所示,本发明制造如图3所示的散热装置时是依下列步骤进行:Referring to Fig. 4, the present invention manufactures the cooling device as shown in Fig. 3 according to the following steps:

一.第一成型步骤40:1. The first molding step 40:

首先取用铝锭原料(或其它良好热传导的原料)依靠挤出成型的方式,直接制成包含散热底座11′及成排叶片12′的原料条。Firstly, aluminum ingot raw materials (or other materials with good heat conduction) are used to form a raw material strip including the heat dissipation base 11' and the rows of blades 12' directly by means of extrusion molding.

二.剖沟步骤41:2. Trench step 41:

制出包含散热底座11′及成排叶片12′的原料条后,可依靠适当的夹持机构(未图示)配合以便在各叶片12′的适当位置上切剖若干个穿沟16′及至少一个固定穿沟15′。After the raw material strip comprising the heat dissipation base 11' and the rows of blades 12' is produced, a suitable clamping mechanism (not shown) can be used to cut several grooves 16' and At least one fastening channel 15'.

三.冲孔步骤42:3. Punching step 42:

完成剖沟后,依靠冲孔方式在叶片12′之间的凹槽13′槽底的散热底座11′上分别冲出成排的接孔14′。After the trenching is completed, rows of connection holes 14' are respectively punched out on the heat dissipation base 11' at the bottom of the groove 13' between the blades 12' by means of punching.

四.第二成型步骤43:Four. The second molding step 43:

在制造散热底座11′及叶片12′的同时,可另在长条料带2上依靠冲压成型的方式制出连接在导引带21上的子叶片22。While manufacturing the heat dissipation base 11 ′ and the vanes 12 ′, the sub-vanes 22 connected to the guide belt 21 can also be produced on the long strip 2 by stamping.

五.结合步骤44:Five. Combining step 44:

将连接在导引带21上的子叶片22分别导引并对准原料条凹槽13′槽底的成排组接孔14′,然后使子叶片22自散热底座11′的底侧一一插入组接孔14′并凸露于凹槽13′中,依靠每一子叶片22较宽的底段部分过盈配合于组接孔14′内而加以固定。The sub-blades 22 connected on the guide belt 21 are respectively guided and aligned with the rows of joint holes 14' at the bottom of the raw material strip groove 13', and then the sub-blades 22 are moved from the bottom side of the heat dissipation base 11' one by one. It is inserted into the assembly hole 14' and exposed in the groove 13', and is fixed by the interference fit of the wider bottom section of each sub-blade 22 in the assembly hole 14'.

六.截切步骤45:Six. Cutting step 45:

完成原料条与子叶片22的结合后,可将连接于子叶片22底侧多余的导引带21折断去除,然后再依散热装置1′所需的规格尺寸在原料条的适当位置处进行截切处理。After the combination of the raw material strip and the sub-blade 22 is completed, the redundant guide belt 21 connected to the bottom side of the sub-blade 22 can be broken off and removed, and then cut at the appropriate position of the raw material strip according to the required size of the cooling device 1′. cut processing.

七.完成成品46:Seven. Finished product 46:

在原料条上每隔适当长度加以截切,即可获得散热装置1′的成品。The finished product of the cooling device 1' can be obtained by cutting the raw material strip at appropriate lengths.

参阅图5所示,是本发明的第三实施例,它可先依靠挤出成型法制出平板状的散热底座11″,在散热底座11″原应设置叶片的位置以及这些位置的间隙上各冲设一排组接孔14″,依照前述组装方式在各排组接孔14″内依序插接并过盈配合上子叶片22,如此同样可制出与第二实施例相同散热效能的散热装置1″。Referring to Fig. 5, it is the third embodiment of the present invention. It can rely on the extrusion molding method to produce a flat plate heat dissipation base 11 ", and the positions where the blades should be arranged on the heat dissipation base 11 " and the gaps between these positions are respectively Punch out a row of connecting holes 14 ", according to the above-mentioned assembly method, sequentially plug in each row of connecting holes 14 " and interference fit the sub-blades 22 , so that the same heat dissipation performance as the second embodiment can also be produced Heat sink 1″.

参阅图6所示,是本发明的叶片组装方式配合使用在现有散热装置5上,该散热装置设有散热底座51及若干个叶片52,且在散热底座51一侧表面上设有若干组合槽511,各叶片52依靠其底侧边上所设的凸块521配合于组合槽511内对应设置扣缘512而与散热底座51结合成散热装置5。在该现有散热装置5上应用本发明的组装方式时,可先在两两叶片52间的散热底座51上分别冲出成排的组接孔53,再将由料带2制成的子叶片22依靠导引带21的导引而插入固定在该等组接孔上53,如此即可在各叶片52间增设数排子叶片22,以有效增加现有散热装置5的散热效能。As shown in Fig. 6, the blade assembly method of the present invention is used in conjunction with the existing heat sink 5. The heat sink is provided with a heat dissipation base 51 and several blades 52, and on the surface of one side of the heat dissipation base 51, a number of combined The groove 511 , each blade 52 relies on the projection 521 provided on the bottom side thereof to match with the buckle edge 512 correspondingly provided in the combination groove 511 to combine with the heat dissipation base 51 to form the heat dissipation device 5 . When applying the assembling method of the present invention on this existing heat dissipation device 5, the assembly holes 53 in rows can be respectively punched out on the heat dissipation base 51 between the two blades 52, and then the sub-blades made of the strip 2 can be punched out. 22 is inserted and fixed on the group connection holes 53 by being guided by the guide belt 21, so that several rows of sub-blades 22 can be added between each blade 52 to effectively increase the heat dissipation performance of the existing heat dissipation device 5.

参阅图6所示,是本发明的叶片组装方式配合使用在另一习用散热装置6上,如图示该散热装置6主要设有散热底座61,且在散热底座61一侧表面依靠适当的组接机构组接有由薄片金属折迭并挤压而成的数排叶片62,因此依靠在各排叶片的间隙位置上分别冲出组接孔63,再在组接孔63内插接由料带2制出的子叶片22,同样能在该散热装置6上增设数排子叶片22,以有效改善原来的散热效能。Referring to Fig. 6, the blade assembly method of the present invention is used in conjunction with another conventional heat sink 6. As shown in the figure, the heat sink 6 is mainly provided with a heat dissipation base 61, and on the side surface of the heat dissipation base 61, an appropriate assembly is used. The connecting mechanism is assembled with several rows of blades 62 folded and extruded by sheet metal. Therefore, the connecting holes 63 are respectively punched out at the gap positions of each row of blades, and then the materials are inserted into the connecting holes 63. With the sub-blades 22 produced by the belt 2, several rows of sub-blades 22 can be added on the cooling device 6 to effectively improve the original heat dissipation performance.

Claims (11)

1.一种散热装置,用于组接在中央处理器上,传导并散出中央处理器所产生的热量,包括:靠置于中央处理器上的散热底座,其上设有若干叶片;贯穿设置于散热底座上的组接孔;其特征在于:在散热底座的叶片间的凹槽槽底上,设有成排的组接孔,对应于散热底座的组接孔设置子叶片,子叶片过盈配合在对应的组接孔内,并延伸凸出在散热底座未靠接在中央处理器的另一侧面上。1. A cooling device, which is used to be assembled on the central processing unit to conduct and dissipate the heat generated by the central processing unit, comprising: a heat dissipation base resting on the central processing unit, on which several blades are arranged; The assembly holes arranged on the heat dissipation base; it is characterized in that: on the bottom of the groove between the blades of the heat dissipation base, there are rows of assembly holes, and sub-blades are arranged corresponding to the assembly holes of the heat dissipation base, and the sub-blades The interference fits in the corresponding assembly hole, and extends and protrudes on the other side of the heat dissipation base that is not abutted against the central processing unit. 2.如权利要求1所述的散热装置,其特征在于:其中在散热装置的散热底座未靠置于中央处理器的侧表面上可进一步一体凸设有数排叶片。2 . The heat dissipation device according to claim 1 , wherein a plurality of rows of blades can be integrally protruded on the side surface of the heat dissipation base of the heat dissipation device that is not placed against the central processing unit. 3 . 3.如权利要求1或2所述的散热装置,其特征在于:其中子叶片一端端部的宽度较组接孔孔径为宽,并能在插入组接孔内时与之呈过盈配合。3. The heat dissipation device according to claim 1 or 2, wherein the width of one end of the sub-blade is wider than the hole diameter of the assembly hole, and can form an interference fit with it when inserted into the assembly hole. 4.如权利要求3所述的散热装置,其特征在于:其中在散热装置的叶片上可进一步切剖数条穿沟。4. The heat dissipation device according to claim 3, wherein several grooves can be further cut on the blades of the heat dissipation device. 5.如权利要求4所述的散热装置,其特征在于:其中各叶片上所切剖的穿沟可进一步包括至少一个固定穿沟,且该固定穿沟具有较其他穿沟大的沟宽。5 . The heat dissipation device according to claim 4 , wherein the grooves cut on each blade further include at least one fixed groove, and the fixed groove has a larger groove width than other grooves. 6 . 6.一种散热装置的组装方式,用以制造散热装置,其特征在于:该组装方式至少包括,第一成型步骤,是取用热导材制成至少包含散热底座的原料条;冲孔步骤,是于原料条的散热底座上分别冲出成排并贯穿散热底座的组接孔;第二成型步骤,是在热导材料所形成的长条料带上冲压成型制出若干条子叶片,并使各子叶片一体连接在料带侧边的导引带上以便于导引组接;结合步骤,是导引成排的子叶片使其依次自散热底座靠接在中央处理器的侧面插接在对应设置的组接孔内,并依靠子叶片最后插入部分过盈配合在该等组接孔内,以使较早插入的部分凸出延伸于散热底座表面上;截切步骤,是在组接有子叶片的原料条适当位置上进行切断,以制出一定规格尺寸的散热装置。6. An assembly method of a heat sink, used to manufacture a heat sink, is characterized in that: the assembly method at least includes, the first forming step is to use a heat conducting material to make a raw material strip at least including a heat dissipation base; punching step , is to punch out a row of assembly holes on the heat dissipation base of the raw material strip and run through the heat dissipation base; the second forming step is to stamp and form a number of sub-blades on the long strip formed by the heat-conducting material, and The sub-blades are integrally connected to the guide belt on the side of the material belt to facilitate the guiding and assembly; the combining step is to guide the rows of sub-blades so that they are sequentially connected to the side of the central processing unit from the heat dissipation base and plugged in In the corresponding assembly holes, and relying on the interference fit of the last inserted part of the sub-blade in these assembly holes, so that the earlier inserted part protrudes and extends on the surface of the heat dissipation base; the cutting step is in the assembly The raw material strip connected with the sub-blades is cut at an appropriate position to produce a cooling device of a certain size. 7.如权利要求6所述的散热装置的组装方式,其特征在于:其中用来挤出成型以制成原料条的热导材料可为铝或其他易加工且热传导性良好的材料。7 . The assembly method of the heat sink as claimed in claim 6 , wherein the thermally conductive material used for extrusion molding to form the raw material bar is aluminum or other materials that are easy to process and have good thermal conductivity. 8 . 8.如权利要求7所述的散热装置叶片组装方式,其特征在于:其中在第一成型步骤挤出成型原料条的散热底座的同时,可进一步在散热底座未与中央处理器靠接的另一侧面上一体凸设有数排叶片。8. The method for assembling blades of a cooling device according to claim 7, wherein, while extruding the heat dissipation base of the raw material strip in the first molding step, the heat dissipation base can be further formed when the heat dissipation base is not in contact with the central processing unit. Several rows of blades are integrally protruded on one side. 9.如权利要求8所述的散热装置叶片组装方式,其特征在于:其中原料条散热底座上所冲出的组接孔是位于各叶片间所形成的凹槽槽底。9 . The method of assembling blades of a heat sink according to claim 8 , wherein the assembly holes punched out on the heat dissipation base of the raw material strips are located at the bottom of grooves formed between the blades. 10 . 10.如权利要求6或9所述的散热装置叶片组装方式,其特征在于:其中第二成型步骤在料带冲压制出子叶片时,是依靠交错配置方式使各子叶片底段一体连接于料带两侧边所连带冲压出的导引带上。10. The method for assembling blades of a heat sink according to claim 6 or 9, wherein the second forming step is to integrally connect the bottom sections of each sub-blade to the On the guide belt that is punched out on both sides of the strip. 11.如权利要求10所述的散热装置叶片组装方式,其特征在于:其中在第一成型步骤与冲孔步骤之间可进一步进行剖沟步骤,该步骤是在原料条的叶片适当位置上切剖数条穿沟。11. The method for assembling blades of a heat sink according to claim 10, wherein a step of cutting grooves can be further carried out between the first forming step and the punching step, the step is to cut the blades at the proper position of the raw material strip Cut through several grooves.
CN 98113400 1998-11-06 1998-11-06 Heat radiator and its assembly mode Expired - Fee Related CN1125390C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 98113400 CN1125390C (en) 1998-11-06 1998-11-06 Heat radiator and its assembly mode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 98113400 CN1125390C (en) 1998-11-06 1998-11-06 Heat radiator and its assembly mode

Publications (2)

Publication Number Publication Date
CN1253322A CN1253322A (en) 2000-05-17
CN1125390C true CN1125390C (en) 2003-10-22

Family

ID=5223131

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 98113400 Expired - Fee Related CN1125390C (en) 1998-11-06 1998-11-06 Heat radiator and its assembly mode

Country Status (1)

Country Link
CN (1) CN1125390C (en)

Also Published As

Publication number Publication date
CN1253322A (en) 2000-05-17

Similar Documents

Publication Publication Date Title
US6176304B1 (en) Heat sink
CN100441077C (en) heat sink
US6607023B2 (en) Structure for assembling a heat sink assembly
US20120279040A1 (en) Method of forming a heat dissipating structure
US6729384B1 (en) Cooling fin assembly
US6088917A (en) Method for making heat sink device and a heat sink made thereby
CN1125390C (en) Heat radiator and its assembly mode
CN1522811A (en) Method for manufacturing radiator and structure thereof
CN2636421Y (en) Heat sink with double-layer fins
CN2788441Y (en) Motor housing cooling structure
CN2682474Y (en) Radiating fin group
CN2466795Y (en) heat sink
CN1169213C (en) Radiator with high-density radiating fins and assembling method thereof
CN2362257Y (en) Heat sink for electronic components
CN2749230Y (en) heat sink
CN2594980Y (en) Assembled finned radiator
CN2386482Y (en) Cooling device for computer central processing unit
CN111902021A (en) Radiator for new energy automobile motor controller and manufacturing method
CN2643483Y (en) Heat radiation fin
US20090313827A1 (en) Method and a tool for manufacturing heat radiator
CN2662453Y (en) cooling fins
KR200208767Y1 (en) Heat sink
CN2588531Y (en) CPU cooler
JP2536815B2 (en) Method for manufacturing pin fin type heat sink
CN2534773Y (en) heat sink

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee