CN1125390C - Heat radiator and its assembly mode - Google Patents
Heat radiator and its assembly mode Download PDFInfo
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- CN1125390C CN1125390C CN 98113400 CN98113400A CN1125390C CN 1125390 C CN1125390 C CN 1125390C CN 98113400 CN98113400 CN 98113400 CN 98113400 A CN98113400 A CN 98113400A CN 1125390 C CN1125390 C CN 1125390C
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Abstract
一种散热装置及其组装方式,包括有第一成型、冲孔、第二成型、结合及截切等步骤,依靠第一成型一体制出有散热底座及成排叶片的原料条,再在各叶片间的凹槽槽底冲出数个组接孔,经第二成型制出对应于原料条组接孔的成排子叶片,靠子叶片底段宽度大于组接孔孔径的特性将各排子叶片依次过盈配合于组接孔上并适当延伸在各叶片之间,最后经截切作业制出成品,由于增加了散热面积,因而散热效能更佳。
A heat dissipation device and its assembly method, including the steps of first forming, punching, second forming, combining and cutting, relying on the first forming to integrally produce a raw material strip with a heat dissipation base and rows of blades, and then in each Several assembly holes are punched out at the bottom of the groove between the blades, and rows of sub-blades corresponding to the assembly holes of the raw material strips are produced through the second molding. The sub-blades are successively interference-fitted on the assembly holes and properly extended between the blades. Finally, the finished product is made by cutting. Because the heat dissipation area is increased, the heat dissipation performance is better.
Description
本发明涉及一种散热装置及其组装方式,特别是涉及一种直接在散热装置的各叶片间直接增设数排的子叶片,使散热表面积及散热效能倍增的散热装置组装方式。The invention relates to a cooling device and its assembly method, in particular to a cooling device assembly method in which several rows of sub-blades are directly added between the blades of the cooling device to double the cooling surface area and cooling efficiency.
随着计算机产业的快速发展,为以更快的速度处理日益庞大的资料库、图片及影像等资料,就必须不断加快电脑中央处理器芯片的运算速度。然而随着中央处理器芯片运算速度的加快,必将伴随产生相当高的热量,有些芯片甚至可产生达到四十瓦以上的热量,如此热量的产生将十分不利于电讯传输的稳定性和质量,故有必要设计传热、散热速度快的散热装置配合风扇的使用来协助中央处理器散出不必要的热量。现有有关散热装置的构造可参考美国专利第4,712,159、4,879,891号以及中国台湾第84212747、85200861、85206293号等专利。这些专利的散热装置主要设有一面积约略等同于中央处理器上表面的散热面板,并在散热面板的一侧表面上一体设有成排的叶片,因此可依靠散热面板将中央处理器的热量传出,然后再经由叶片将其热量散出至空气中。但上述设计不仅未能有效满足目前中央处理器的实际散热需要,而且在制造时常会衍生许多问题,其中最大问题来自于如何有效扩大散热装置的散热表面积,一般而言,叶片设置数目愈多愈密,而且其延伸高度与宽度的相对比例愈大(即叶片较薄较高)时,散热装置的整体散热表面积就能适当增大,但是,在挤出成型的技术限制下,叶片的宽度不可能太薄,亦即叶片数目也无法增加,因而使散热装置的散热能力受到限制。With the rapid development of the computer industry, in order to process increasingly large databases, pictures and images at a faster speed, it is necessary to continuously increase the computing speed of the computer's central processing unit chip. However, with the acceleration of the calculation speed of the central processing unit chip, it will inevitably generate quite high heat, and some chips can even generate more than 40 watts of heat. Such heat generation will be very detrimental to the stability and quality of telecommunication transmission. Therefore, it is necessary to design a cooling device with fast heat transfer and cooling speed to cooperate with the use of fans to assist the central processing unit to dissipate unnecessary heat. For the structure of the existing heat dissipation device, reference may be made to US Patent Nos. 4,712,159, 4,879,891, and Chinese Taiwan Patents No. 84212747, 85200861, and 85206293. The cooling devices of these patents are mainly provided with a cooling panel with an area approximately equal to the upper surface of the central processing unit, and are integrally provided with rows of blades on one side of the cooling panel, so that the heat dissipation of the central processing unit can be transferred to the central processing unit by means of the cooling panel. out, and then dissipate its heat into the air through the blades. However, the above design not only fails to effectively meet the actual heat dissipation needs of the current central processing unit, but also often generates many problems during manufacture. The biggest problem comes from how to effectively expand the heat dissipation surface area of the heat sink. Generally speaking, the more blades are set, the more When the relative ratio of its extension height to width is larger (that is, the blade is thinner and higher), the overall heat dissipation surface area of the heat sink can be appropriately increased. However, under the technical limitation of extrusion molding, the width of the blade is not It may be too thin, that is, the number of blades cannot be increased, thus limiting the heat dissipation capability of the heat sink.
为解决上述问题,美国第4,890,196、5,038,858号及中国台湾专利第83212791号提出将散热装置的散热面板与叶片分开制造再组装成一体的构想,如图8A及图8B所示即为美国第5,038,858号专利的构造,其主要在散热装置7的散热面板71上设有若干组接槽711,且在这些组接槽711的槽侧壁上形成有扣缘712,而叶片72则在其底侧插接边附近对应设置若干凸块721,然后在叶片72插接于组接槽711内时依靠这些凸块721配合在扣缘712上加以固定。如图9所示则是利用焊接方式,将叶片82依次接合于散热面板81以组成散热装置8。现有方法虽可在散热面板上组接较多的叶片,并使叶片的宽高比例改变以增加其表面积,但其在制造时必须将叶片逐一组接在散热面板上,而且需要适当的媒介将两者固定成一体(如用焊锡或凸块),因此制造过程复杂且须花费较多的时间及成本,不利于大量生产制造,同时所能增加的散热表面积仍相当有限。In order to solve the above problems, U.S. Nos. 4,890,196, 5,038,858 and Taiwan Patent No. 83212791 propose the concept of separately manufacturing the heat dissipation panel and the blades of the heat dissipation device and then assembling them into one body, as shown in Fig. 8A and Fig. 8B, which is U.S. No. 5,038,858 Patented structure, it is mainly provided with a number of assembly grooves 711 on the heat dissipation panel 71 of the heat dissipation device 7, and buckle edges 712 are formed on the groove side walls of these assembly grooves 711, and the blades 72 are inserted on the bottom side. A plurality of protruding blocks 721 are correspondingly provided near the connecting edge, and then when the blade 72 is inserted into the assembling groove 711 , these protruding blocks 721 are fitted on the buckle edge 712 to be fixed. As shown in FIG. 9 , the fins 82 are sequentially joined to the heat dissipation panel 81 by welding to form the heat dissipation device 8 . Although the existing method can assemble more blades on the heat dissipation panel, and change the ratio of width and height of the blades to increase its surface area, it must be assembled on the heat dissipation panel one by one during manufacture, and a suitable medium is required. Fixing the two together (such as using solder or bumps) complicates the manufacturing process and takes a lot of time and cost, which is not conducive to mass production. At the same time, the heat dissipation surface area that can be increased is still quite limited.
本发明的主要目的在于提供一种使散热面积增加为数倍的散热装置及其组装方式。The main purpose of the present invention is to provide a heat dissipation device and its assembly method which can increase the heat dissipation area several times.
另一目的在于利用低廉的成本及简化的程序来制造散热装置。Another object is to manufacture the heat sink with low cost and simplified procedures.
本发明的目的是这样实现的,即提供一种散热装置,包括:靠置于中央处理器上的散热底座;贯穿设置于散热底座上的组接孔;对应于散热底座组接孔设置的由料带冲压制成的子叶片,而且可在完全插入对应的组接孔后过盈配合在组接孔内,以延伸凸出在散热底座未靠接在中央处理器的另一侧面上并增加散热装置的整体散热表面积。组装方式包括第一成型、冲孔、第二成型、结合以及截切等步骤,其中依靠第一成型步骤一体制出具有散热底座及成排叶片的原料条,接着在各叶片间的凹槽槽底冲设数个组接孔后,可将经第二成型步骤制出的成排子叶片依序过盈配合于对应组接孔上并适当延伸在散热装置的各叶片之间,然后经截切作业制出成品。The purpose of the present invention is achieved by providing a heat dissipation device, comprising: a heat dissipation base placed on the central processing unit; an assembly hole provided through the heat dissipation base; The sub-blades stamped by the material strip can be interference-fitted in the joint hole after being fully inserted into the corresponding joint hole, so as to extend and protrude on the other side of the heat dissipation base that is not abutted against the central processing unit and increase the The overall heat dissipation surface area of a heat sink. The assembly method includes the steps of first forming, punching, second forming, bonding, and cutting. The first forming step is used to integrally produce a raw material strip with a heat dissipation base and rows of blades, and then the grooves between the blades After setting several joint holes in the bottom punch, the rows of sub-blades produced in the second molding step can be sequentially interference-fitted on the corresponding joint holes and properly extended between the blades of the heat sink, and then cut Cutting operations to produce finished products.
比较现有技术,本发明具有以下优点:1.有效提高散热装置的散热效率,并维持中央处理器的正常运作。2.适于大量制造。3.能在节省成本和减少工艺步骤的情形下改善原有散热装置的散热效能。Compared with the prior art, the present invention has the following advantages: 1. Effectively improve the heat dissipation efficiency of the heat dissipation device and maintain the normal operation of the central processing unit. 2. Suitable for mass production. 3. The heat dissipation performance of the original heat dissipation device can be improved while saving costs and reducing process steps.
下面结合实施例,参照附图对本实用新型作进一步描述:Below in conjunction with embodiment, the utility model is further described with reference to accompanying drawing:
图1A是本发明散热装置与各子叶片组合关系的立体分解图。FIG. 1A is an exploded perspective view of the combination relationship between the heat sink and sub-blades of the present invention.
图1B是本发明散热装置组装后子叶片的俯视图。FIG. 1B is a top view of the assembled sub-blades of the heat sink of the present invention.
图1C是本发明在料带上同时制出两排子叶片示意的局部俯视图。Fig. 1C is a schematic partial top view of two rows of sub-blades simultaneously produced on the tape according to the present invention.
图2是本发明散热装置制造组装时的流程图。Fig. 2 is a flow chart of manufacturing and assembling the heat sink of the present invention.
图3是本发明散热装置第二实施例的立体分解图。FIG. 3 is an exploded perspective view of the second embodiment of the heat sink of the present invention.
图4是本发明散热装置第二实施例制造组装时的流程图。图5是本发明散热装置第三实施例的立体分解图。Fig. 4 is a flow chart of manufacturing and assembling the second embodiment of the heat sink of the present invention. FIG. 5 is an exploded perspective view of a third embodiment of the heat sink of the present invention.
图6是本发明组装方式应用于现有散热装置的实施示意图。FIG. 6 is a schematic diagram of the implementation of the assembly method of the present invention applied to an existing heat dissipation device.
图7是本发明组装方式应用于另一现有散热装置的实施示意图。FIG. 7 is a schematic diagram of the implementation of the assembly method of the present invention applied to another existing heat dissipation device.
图8A是现有构造插接组接叶片示意的剖视详图。Fig. 8A is a schematic cross-sectional detailed view of a plug-in assembly blade in a conventional structure.
图8B是现有构造组接槽附近的局部剖视详图。Fig. 8B is a partial cross-sectional detailed view near the joint groove of the existing structure.
图9是现有构造依靠焊接方式组接叶片示意的剖视详图。Fig. 9 is a schematic cross-sectional detailed view of blades assembled by means of welding in an existing structure.
如图1A及图1B所示,散热装置1的主要构造包括靠置于中央处理器(未图示)上用来吸收并传导处理器所产生的热量的散热底座11,自散热底座11侧表面所一体延伸设置的成排叶片12,在叶片12之间形成凹槽13以提供空气的流通空间,因此中央处理器所产生的热量,可经由散热底座11传导至各叶片12上,并依靠叶片12的两侧表面与凹槽13内的空气接触使热量传到空气中,再利用空气对流散出。在每一凹槽13槽底的散热底座11上设置有成排的组接孔14,各排组接孔14上均可对应组接一组子叶片22。这些子叶片22是由料带2冲压制成(如图1C示),它们是均布于料带2的中央部分,且交错配置并一体连接于料带2两侧边上所同时冲出、具导引作用的导引带21上。每一子叶片22靠近导引带21的底段部分宽度均略较组接孔14的孔径为宽,因此将料带2上交错配置的两组子叶片22连同相对的导引带21折断分开并对应插接于各排组接孔14内时,可依靠其较宽的底段部分过盈配合于组接孔14内加以固定。同时在完成组接后将导引带21从子叶片22底段折断去除,如此可在散热装置1的每一凹槽13内各增设一排子叶片22以有效增加原有叶片12的散热面积,使散热装置散热效果更隹。As shown in Figures 1A and 1B, the main structure of the
参照图2所示,本发明制造上述散热装置的流程,包括有下列几项步骤:Referring to Fig. 2, the flow process of the present invention to manufacture the above-mentioned heat sink includes the following steps:
一.第一成型步骤30:1. The first molding step 30:
首先取用铝锭原料(或其它良好热传导的原料)依靠挤出成型的方式,直接制成包含散热底座11及成排叶片12的原料条(未图示)。Firstly, aluminum ingot raw materials (or other materials with good heat conduction) are used to form a raw material bar (not shown) including the
二.冲孔步骤31:2. Punching step 31:
制出包含散热底座11及成排叶片12的原料条后,可再依靠冲孔方式于各叶片12间的凹槽13槽底的散热底座11上分别冲出成排的组接孔14。After making the raw material strip comprising the
三.第二成型步骤(Molding)32:3. The second molding step (Molding) 32:
在制造散热底座11及叶片12的同时,在长条料带2上依靠冲压成型的方式制出若干条子叶片22,为组接便利以及节省材料,可预先将各子叶片22交错配置并一体连接于前述料带2两侧边所设置的导引带21上。While manufacturing the
四.结合步骤33:4. Combining step 33:
将连接在导引带21上的成排子叶片22分别导引并对准原料条的凹槽13槽底所冲设的成排组接孔14,然后使各子叶片22自散热底座11的底侧一一插入组接孔14并凸露于凹槽13中,依靠每一子叶片22较宽的底段部分过盈配合于组接孔14内而加以固定。The rows of
五.截切步骤34:Five. Cutting step 34:
完成原料条与各子叶片22的结合后,可将连接于子叶片22底侧多余的导引带21折断去除,然后再依散热装置1所需的规格尺寸在原料条的适当位置处进行截切作业。After the combination of the raw material strip and each sub-blade 22 is completed, the
六.完成成品35:Six. Finished product 35:
在原料条上每隔适当长度加以截切,即可获得散热装置1的成品。The finished product of the
如上述,本发明可在最节省时间、成本的情形下,有效增加散热装置1的散热表面积(即子叶片的表面积),使这些散热装置1的散热效果良好,以解决目前中央处理器的散热问题。As mentioned above, the present invention can effectively increase the heat dissipation surface area of the cooling device 1 (i.e. the surface area of the sub-blades) in the most time-saving and cost-effective situation, so that the heat dissipation effect of these
参阅图3所示,本发明依靠设置子叶片以增加散热表面积的方法,可进一步应用在具有剖沟叶片12′的散热装置1′上,其中该散热装置主要设有靠置于中央处理器上的散热底座11′与自该散热底座11′的另一侧面所凸设的成排叶片12′,叶片12′的间所形的的凹槽13′槽底同样冲设有若干个组接孔14′以与相对应的子叶片22相组接。另外在各叶片12′上剖设有若干垂直于凹槽13′走向的穿沟16′,设置穿沟16′可配合子叶片22进一步增加叶片12′原有的表面积,使散热装置1′的整体散热效果更隹。并且在各叶片12′上所设的穿沟16′中至少有一穿沟的设置宽度较其它为宽而形成固定穿沟15′,固定穿沟15′是为供组接组件(未图示)容置其中并将散热装置1′及中央处理器(未图示)组接成模组而设置。Referring to Fig. 3, the present invention relies on arranging sub-blades to increase the heat dissipation surface area, which can be further applied to a heat dissipation device 1' with split groove blades 12', wherein the heat dissipation device is mainly provided with a central processing unit. The heat dissipation base 11' and the rows of blades 12' protruding from the other side of the heat dissipation base 11', and the bottom of the groove 13' formed between the blades 12' are also punched with several assembly holes. 14' to be combined with the corresponding
参阅图4所示,本发明制造如图3所示的散热装置时是依下列步骤进行:Referring to Fig. 4, the present invention manufactures the cooling device as shown in Fig. 3 according to the following steps:
一.第一成型步骤40:1. The first molding step 40:
首先取用铝锭原料(或其它良好热传导的原料)依靠挤出成型的方式,直接制成包含散热底座11′及成排叶片12′的原料条。Firstly, aluminum ingot raw materials (or other materials with good heat conduction) are used to form a raw material strip including the heat dissipation base 11' and the rows of blades 12' directly by means of extrusion molding.
二.剖沟步骤41:2. Trench step 41:
制出包含散热底座11′及成排叶片12′的原料条后,可依靠适当的夹持机构(未图示)配合以便在各叶片12′的适当位置上切剖若干个穿沟16′及至少一个固定穿沟15′。After the raw material strip comprising the heat dissipation base 11' and the rows of blades 12' is produced, a suitable clamping mechanism (not shown) can be used to cut several grooves 16' and At least one fastening channel 15'.
三.冲孔步骤42:3. Punching step 42:
完成剖沟后,依靠冲孔方式在叶片12′之间的凹槽13′槽底的散热底座11′上分别冲出成排的接孔14′。After the trenching is completed, rows of connection holes 14' are respectively punched out on the heat dissipation base 11' at the bottom of the groove 13' between the blades 12' by means of punching.
四.第二成型步骤43:Four. The second molding step 43:
在制造散热底座11′及叶片12′的同时,可另在长条料带2上依靠冲压成型的方式制出连接在导引带21上的子叶片22。While manufacturing the
五.结合步骤44:Five. Combining step 44:
将连接在导引带21上的子叶片22分别导引并对准原料条凹槽13′槽底的成排组接孔14′,然后使子叶片22自散热底座11′的底侧一一插入组接孔14′并凸露于凹槽13′中,依靠每一子叶片22较宽的底段部分过盈配合于组接孔14′内而加以固定。The sub-blades 22 connected on the
六.截切步骤45:Six. Cutting step 45:
完成原料条与子叶片22的结合后,可将连接于子叶片22底侧多余的导引带21折断去除,然后再依散热装置1′所需的规格尺寸在原料条的适当位置处进行截切处理。After the combination of the raw material strip and the sub-blade 22 is completed, the
七.完成成品46:Seven. Finished product 46:
在原料条上每隔适当长度加以截切,即可获得散热装置1′的成品。The finished product of the cooling device 1' can be obtained by cutting the raw material strip at appropriate lengths.
参阅图5所示,是本发明的第三实施例,它可先依靠挤出成型法制出平板状的散热底座11″,在散热底座11″原应设置叶片的位置以及这些位置的间隙上各冲设一排组接孔14″,依照前述组装方式在各排组接孔14″内依序插接并过盈配合上子叶片22,如此同样可制出与第二实施例相同散热效能的散热装置1″。Referring to Fig. 5, it is the third embodiment of the present invention. It can rely on the extrusion molding method to produce a flat plate
参阅图6所示,是本发明的叶片组装方式配合使用在现有散热装置5上,该散热装置设有散热底座51及若干个叶片52,且在散热底座51一侧表面上设有若干组合槽511,各叶片52依靠其底侧边上所设的凸块521配合于组合槽511内对应设置扣缘512而与散热底座51结合成散热装置5。在该现有散热装置5上应用本发明的组装方式时,可先在两两叶片52间的散热底座51上分别冲出成排的组接孔53,再将由料带2制成的子叶片22依靠导引带21的导引而插入固定在该等组接孔上53,如此即可在各叶片52间增设数排子叶片22,以有效增加现有散热装置5的散热效能。As shown in Fig. 6, the blade assembly method of the present invention is used in conjunction with the existing heat sink 5. The heat sink is provided with a heat dissipation base 51 and several blades 52, and on the surface of one side of the heat dissipation base 51, a number of combined The groove 511 , each blade 52 relies on the projection 521 provided on the bottom side thereof to match with the buckle edge 512 correspondingly provided in the combination groove 511 to combine with the heat dissipation base 51 to form the heat dissipation device 5 . When applying the assembling method of the present invention on this existing heat dissipation device 5, the assembly holes 53 in rows can be respectively punched out on the heat dissipation base 51 between the two blades 52, and then the sub-blades made of the
参阅图6所示,是本发明的叶片组装方式配合使用在另一习用散热装置6上,如图示该散热装置6主要设有散热底座61,且在散热底座61一侧表面依靠适当的组接机构组接有由薄片金属折迭并挤压而成的数排叶片62,因此依靠在各排叶片的间隙位置上分别冲出组接孔63,再在组接孔63内插接由料带2制出的子叶片22,同样能在该散热装置6上增设数排子叶片22,以有效改善原来的散热效能。Referring to Fig. 6, the blade assembly method of the present invention is used in conjunction with another conventional heat sink 6. As shown in the figure, the heat sink 6 is mainly provided with a
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98113400 CN1125390C (en) | 1998-11-06 | 1998-11-06 | Heat radiator and its assembly mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98113400 CN1125390C (en) | 1998-11-06 | 1998-11-06 | Heat radiator and its assembly mode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1253322A CN1253322A (en) | 2000-05-17 |
| CN1125390C true CN1125390C (en) | 2003-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98113400 Expired - Fee Related CN1125390C (en) | 1998-11-06 | 1998-11-06 | Heat radiator and its assembly mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1125390C (en) |
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1998
- 1998-11-06 CN CN 98113400 patent/CN1125390C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1253322A (en) | 2000-05-17 |
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