CN112133815A - LED brackets, lamp beads, conductive bases, light-emitting unit modules and devices - Google Patents

Abstract

The invention provides an LED bracket, a lamp bead, a conductive base, a light-emitting unit module and a device, wherein the conductive base comprises at least two metal sheets which are arranged in an insulating and isolating way, the metal sheets are combined with a colloid for forming a bracket shell to form the LED bracket, the upper surface of at least one metal sheet is used for bearing an LED chip, and heat generated by the LED chip during working can be directly transferred to the metal sheets and quickly dissipated outwards through the metal sheets; because the lower surface and the first side of sheetmetal all have to expose, and be provided with first concave part and second concave part respectively, the two can all regard as the pad of external electricity connection to use, consequently applicable in various application scenarios, and the welding is convenient, and the welding area can be promoted in the setting of first concave part and second concave part, and then promotes welding strength, and can all hold unnecessary solder in this concave part with welding process, guarantee welded planarization and reliability.

Description

LED brackets, lamp beads, conductive bases, light-emitting unit modules and devices

technical field

The invention relates to the field of LED (Light Emitting Diode, light-emitting diode), and in particular, to an LED bracket, a lamp bead, a conductive base, a light-emitting unit module and a device.

Background technique

At present, the color gamut and brightness required by various display devices are getting higher and thinner, and the color gamut and brightness are negatively correlated. The higher the color gamut requirement, the lower the brightness. The brightness cannot meet the requirements, and it is necessary to propose ultra-thin side-emitting diodes with higher brightness in high color gamut. To this end, the prior art provides a light-emitting diode with higher brightness in a high color gamut, as shown in FIG. 1 , which includes a plastic substrate 001, and a circuit electrically connected to the LED chip is formed on the top surface of the plastic substrate 001, and the pads 004 provided on the bottom surface of the plastic substrate 001, and the circuit on the top surface of the plastic substrate 001 is electrically connected to the pads 004 through the conductive material in the through holes penetrating the bottom surface. A casing 002 is formed on the plastic substrate 001 , a cavity for placing the LED chip 003 is formed in the casing 002 , and the cavity is filled with fluorescent glue 005 . Although the light-emitting diode of this structure can improve the brightness, its structure is relatively complex and the cost is high; in addition, due to the placement of two LED chips, the heat generated during operation of the light-emitting diode with a single LED chip is multiplied, and The heat generated by the LED chip in the light emitting diode is mainly transferred to the pad 004 through the conductive material in the through hole of the plastic substrate 001 for heat dissipation. The heat dissipation path is long and the heat dissipation area is small, resulting in poor heat dissipation effect.

SUMMARY OF THE INVENTION

The LED bracket, lamp bead, conductive base, light-emitting unit module and device provided by the present invention solve the problems of complex structure, high cost and poor heat dissipation of the existing light-emitting diode.

In order to solve the above technical problems, an embodiment of the present invention provides a conductive base for an LED bracket, the conductive base includes at least two metal sheets that are insulated and isolated, and the metal sheets are combined with a colloid used to form a bracket shell. An LED bracket is formed, and the upper surface of the metal sheet is located at the bottom of the bracket shell for placing the LED chip cup, and is at least partially exposed; the upper surface of at least one of the metal sheets is used for carrying the LED chip, and the exposed area on the upper surface of each of the metal sheets is used for electrical connection with the corresponding electrode of the LED chip;

At least part of the lower surface of the metal sheet is exposed outside the bracket shell, the lower surface is the surface opposite to the upper surface, and at least one of the metal sheets is located between the upper surface and the lower surface. At least part of one side surface is exposed outside the bracket shell, at least one second side surface of the metal sheet between the upper surface and the lower surface is not exposed outside the bracket shell, the first side surface and the second side surface are not exposed outside the bracket shell. The sides are two opposite sides, the area of the lower surface exposed outside the bracket shell is provided with a first recess for accommodating solder, and the area of the first side exposed outside the bracket shell is provided with a solder accommodating of the second recess.

Optionally, the first recess communicates with the second recess.

Optionally, the first concave portion is a first groove or a first hole, and the second concave portion is a second groove or a second hole.

Optionally, the area on the upper surface of the metal sheet that is combined with the bracket shell is provided with a rough surface with a concave-convex structure for enhancing the bonding force with the bracket shell, and/or is provided with A bonding hole into which the colloid forming the stent shell flows.

Optionally, the coupling hole communicates with the first recess.

Optionally, an end of the coupling hole close to the upper surface is an upper end, an end close to the lower surface is a lower end, and the diameter of the upper end of the coupling hole is larger than that of the lower end of the coupling hole.

Optionally, the conductive base includes three metal sheets arranged in sequence, and the exposed areas on the upper surface of the middle metal sheet are respectively electrically connected to the electrodes corresponding to the two LED chips.

Optionally, the lateral width of the upper end of at least one of the metal sheets close to the upper surface is greater than the lateral width of the first side surface, and a part of the upper end of the metal sheet is embedded in the bracket shell;

or,

At least one of the metal sheets is provided with an outwardly extending protrusion between the upper surface and the lower surface, and at least a part of the protrusion is embedded in the bracket shell.

Optionally, the metal sheet is a copper substrate, and a reflective layer is provided on the upper surface at least in the exposed area.

In order to solve the above technical problem, an embodiment of the present invention further provides an LED bracket, which includes the above-mentioned conductive base, and further includes a colloid combined with the conductive base to form the bracket shell.

Optionally, the colloid is white glue.

Optionally, the conductive base includes three metal sheets arranged in sequence, and the bracket housing further includes a partition wall arranged on the upper surface of the middle metal sheet, so as to be on the upper surface of the three metal sheets. Two separate said bowls are formed on the surface.

In order to solve the above technical problems, an embodiment of the present invention also provides an LED lamp bead, which includes the above-mentioned LED bracket, and also includes an LED chip arranged in the bowl, and an LED chip arranged in the bowl to connect the The encapsulation layer covered by the LED chip, the electrode of the LED chip is electrically connected to the corresponding exposed area on the upper surface of the metal sheet.

In order to solve the above technical problem, an embodiment of the present invention further provides a light-emitting unit module, which includes a substrate and a plurality of LED lamp beads as described above, and the plurality of LED lamp beads are electrically connected to the substrate.

In order to solve the above technical problem, an embodiment of the present invention further provides a display device including the above-mentioned light emitting unit module.

beneficial effect

The present invention provides an LED bracket, a lamp bead, its conductive base, a light-emitting unit module and a device, wherein the conductive base comprises at least two insulating and isolated metal sheets, the metal sheets and the colloid used to form the bracket shell Combined to form an LED bracket, the upper surface of the metal sheet is located at the bottom of the bowl and cup for placing the LED chips formed by the bracket shell, and is at least partially exposed; the upper surface of at least one metal sheet is used to carry the LED chips, and each The exposed area of the upper surface of the metal sheet is used for electrical connection with the electrodes of the corresponding LED chip; at least part of the lower surface of the metal sheet is exposed outside the bracket shell, so that the heat generated by the LED chip during operation can be directly transferred to the metal sheet, And quickly radiate out through the metal sheet, which greatly shortens the heat dissipation path and greatly increases the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the LED lamp beads;

In addition, at least a part of the first side surface of the at least one metal sheet located between the upper surface and the lower surface is exposed outside the bracket shell, and the second side surface of the at least one metal sheet located between the upper surface and the lower surface is not exposed outside the bracket shell, The area of the lower surface exposed to the outside of the bracket shell is provided with a first concave portion for accommodating solder, and the area of the first side exposed to the outside of the bracket shell is provided with a second concave portion for accommodating solder; There are exposed, both of which can be used as pads for external electrical connection. In the application scenario of side light emission, the first side and the outside can be welded, or the first side and the lower surface can be welded at the same time; in the application scene of positive light emission, The lower surface can be welded, or the lower surface and the first side can be welded at the same time, so it can be applied to various application scenarios, and the welding is convenient. It can also be welded on both surfaces according to requirements, which can improve the firmness of welding , thereby improving the reliability of the product;

In addition, since the area where the lower surface of the metal sheet is exposed outside the bracket shell is provided with a first concave portion for accommodating solder, and the area where the first side surface is exposed outside the bracket shell is provided with a second concave portion for accommodating solder, the arrangement of the concave portion can be The welding area is increased, thereby increasing the welding strength; and the setting of the first recess and the second recess can accommodate the excess solder in the welding process in the recess to ensure the flatness and reliability of the welding;

The LED bracket is composed of a conductive base and a bracket shell that covers the conductive base. The LED lamp bead is composed of an LED chip placed in a bowl inside the LED bracket and an encapsulation layer covering the LED chip. The structure of the bracket and the LED lamp bead is simpler than the structure of the existing bracket and the lamp bead, the manufacture is easier, and the cost is lower.

Description of drawings

FIG. 1 is a schematic structural diagram of an existing light-emitting diode;

2 is a schematic diagram of a conductive base in an example provided by an embodiment of the present invention;

FIG. 3-1 is a perspective schematic diagram 1 of an LED bracket in an example provided by an embodiment of the present invention;

3-2 is a second perspective schematic diagram of an LED bracket in an example provided by an embodiment of the present invention;

3-3 is a schematic diagram of another conductive base in an example provided by an embodiment of the present invention;

4 is a schematic diagram of a conductive base in another example provided by an embodiment of the present invention;

FIG. 5 is a schematic diagram 1 of an LED lamp bead in another example provided by an embodiment of the present invention;

6 is a schematic diagram of a conductive base in another example provided by an embodiment of the present invention;

FIG. 7 is a schematic diagram of an LED lamp bead in another example provided by an embodiment of the present invention;

8 is a schematic diagram of a conductive base in another example provided by an embodiment of the present invention;

FIG. 9 is a schematic diagram of an LED lamp bead in another example provided by an embodiment of the present invention;

10 is a schematic diagram 1 of a conductive base in another example provided by an embodiment of the present invention;

11 is a second schematic diagram of a conductive base in yet another example provided by an embodiment of the present invention;

FIG. 12 is a schematic diagram 3 of a conductive base in another example provided by an embodiment of the present invention;

13 is a schematic diagram 1 of an LED lamp bead in another example provided by an embodiment of the present invention;

14 is a second schematic diagram of an LED lamp bead in another example provided by an embodiment of the present invention;

FIG. 15 is a schematic diagram 3 of an LED lamp bead in another example provided by an embodiment of the present invention;

16 is a schematic diagram of a light-emitting unit module in another example provided by an embodiment of the present invention;

FIG. 17 is a schematic diagram of a display device in yet another example provided by an embodiment of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

This embodiment provides a conductive base applied to an LED bracket and an LED lamp bead, so that the LED bracket and the lamp bead have a simple structure, low cost, good heat dissipation performance, and simple and reliable welding. The conductive base includes at least two metal sheets that are insulated and isolated. The metal sheets are combined with the glue used to form the bracket shell to form an LED bracket. The bottom of the bowl is at least partially exposed; the upper surface of at least one metal sheet is used to carry the LED chip, and the exposed area of the upper surface of each metal sheet is used for electrical connection with the electrode of the corresponding LED chip; the lower part of the metal sheet At least part of the surface is exposed outside the bracket shell, the lower surface is the surface opposite to the upper surface, at least a part of the first side surface between the upper surface and the lower surface at least one metal sheet is exposed outside the bracket shell, and at least one metal sheet is located in the bracket shell. The second side surface between the upper surface and the lower surface is not exposed outside the bracket shell, and the first side surface and the second side surface are opposite side surfaces. That is to say, in this embodiment, the upper surface, the lower surface and the first side surface of the metal sheet can be set at least partially exposed to the outside of the bracket shell, and the other surfaces are covered by the bracket shell, thereby increasing the distance between the bracket shell and the metal sheet. The combined area can improve the combined strength of the two, thereby improving the reliability of the LED bracket, and at the same time, it can also make the LED bracket have better air tightness, thereby improving the safety and reliability of the LED product.

Since the LED chip can be directly arranged on the upper surface of the metal sheet, and the lower surface and the first side of the metal sheet are exposed outside the bracket shell, the heat generated by the LED chip during operation can be directly transferred to the metal sheet, and the heat generated by the LED chip can be directly transferred to the metal sheet through the metal sheet. The chip quickly radiates out, which greatly shortens the heat dissipation path and increases the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the LED lamp beads.

In this embodiment, the area of the lower surface of the metal sheet exposed outside the bracket shell is provided with a first concave portion for accommodating solder, and the area of the first side surface exposed outside the bracket shell is provided with a second concave portion for accommodating solder. The arrangement of the first concave portion and the second concave portion can increase the welding area, thereby enhancing the welding strength; and the arrangement of the first concave portion and the second concave portion can accommodate the excess solder in the concave portion during the welding process to ensure the welding performance. Flatness and reliability.

Optionally, in this embodiment, in order to further improve the reliability of welding, the metal sheet may be exposed outside the bracket shell, and a welding flux layer for improving welding force may be provided on the area to be welded. The metal layer, such as a metal coating, can also be other layer structures that can improve the soldering force. For example, in some examples, at least one sidewall of the first groove and the second groove in the above examples may be provided with a metal plating layer for improving the welding force, and the metal plating layer may be but not limited to silver plating Floor.

In this embodiment, the LED bracket can be directly composed of at least two insulating and isolated metal sheets, and the metal sheets are combined with the colloid used to form the bracket shell. Compared with the existing LED bracket, the structure is greatly simplified, so it can be simplified. The production process improves production efficiency and yield, while reducing costs.

It should be understood that, in this embodiment, the number of metal sheets included in an LED bracket can be flexibly set according to specific application scenarios. For example, only two insulating and isolated metal sheets may be provided, the bracket shell may only enclose a bowl body, and at least a part of the upper surface of the two insulating and isolated metal sheets may be exposed at the bottom of the bowl and cup body for carrying The LED chips are electrically connected to the electrodes of the LED chips, and the number of LED chips arranged in the bowl body and the luminous color of the LED chips can be flexibly set according to requirements. For example, it can be set to one, or it can be set to two or three, etc.

The LED chip in this embodiment can be a flip-chip LED chip, and the two electrodes of the flip-chip LED chip can directly straddle the exposed upper surfaces of the two adjacent metal sheets, so as to realize the carrying of the LED chip and complete the electrical connection; The LED chip in this embodiment can also be a positive LED chip. A positive LED chip can be arranged on the upper surface of any one of the metal sheets, and can also be arranged across the upper surfaces of multiple metal sheets at the same time. The two electrodes of the chip are respectively electrically connected to the exposed upper surfaces of the corresponding two metal sheets through leads.

In some application examples of this embodiment, the conductive base may include three metal sheets arranged in sequence, and the exposed areas on the upper surface of the middle metal sheet are respectively electrically connected to the electrodes corresponding to the two LED chips; The exposed areas on the upper surface of the metal sheet are respectively electrically connected to the remaining electrodes corresponding to the two LED chips, thereby realizing the series connection of the two LED chips. In this example, the three metal pieces could also be at the bottom of the same bowl. In other application scenarios of this example, the bracket housing may further include a partition wall disposed on the upper surface of the metal sheet in the middle, so as to form two isolated bowls (also The partition wall can be omitted and a large bowl can be formed on the three metal sheets), so that the metal sheet in the middle spans the bottoms of the two mutually isolated bowls, and the two metal sheets of the two are located in two separate bowls. Bottom of bowl. Which structure is adopted can be flexibly set according to requirements. And in this application example, the number and color of LED chips set in a bowl, and whether to use a front-mounted LED chip or a flip-chip LED chip, etc., can be flexibly set according to requirements. In some application scenarios of this application example, the first side surface and/or the lower surface of the metal sheet located in the middle may not be exposed outside the bracket housing as required. When the first side and/or the lower surface of the middle metal sheet can also be exposed outside the bracket shell as required, during welding, the first side and/or the lower surface of the middle metal sheet can be selectively welded , it is also optional not to weld the first side and/or the lower surface of the middle metal sheet, which can be flexibly selected according to application scenarios.

In this embodiment, the shape of the first recess provided in the area where the lower surface of the metal sheet is exposed outside the bracket shell can be set flexibly, for example, but not limited to, the first recess or the first hole, the first side exposed in The shape of the second recess for accommodating the solder provided in the area outside the bracket housing can also be flexibly set, for example, but not limited to, the second recess may be a second groove or a second hole. For example, the first recess may be configured as a first groove and the second recess may be configured as a second groove or a second hole, or the first recess may be configured as a first hole and the second recess may be configured as a second groove or a second hole , which can be flexibly set according to your needs.

In this embodiment, the first concave portion provided on the lower surface of the metal sheet and the second concave portion provided on the first side surface may not communicate with each other. For example, in the application scenario of side light emission, when the first side is used as the main mounting surface and placed on the soldering surface with solder, the first side will squeeze the solder on the soldering surface, and a part of the solder will follow the first side. When heating and welding, the solder will gather to the metal sheet due to the heat, so that the overflowing solder can be preferentially gathered into the first concave part set on the lower surface to complete the bonding with the lower surface. The solder is bonded to the first surface, so as to realize the welding of the first side and the lower surface, and improve the reliability of the welding; at the same time, the arrangement of the first recess and the second recess can increase the welding area compared with the planar arrangement, and can The excess solder is stored in the recess, which can further improve the stability of the soldering and improve the flatness of the soldering. In the application scenario of positive light emission, the welding process when the lower surface of the metal sheet is placed as the main mounting surface on the soldering surface with solder is similar to the welding process in the application scenario of side light emission above, and will not be repeated here. .

In this embodiment, the first concave part provided on the lower surface of the metal sheet and the second concave part provided on the first side surface can be set to communicate with each other. This communicating structure can form better drainage for the liquid solder and can be more reliable. of ensuring that excess solder is contained within the recess. In this embodiment, when the first concave portion and the second concave portion communicate with each other, the communication can be formed inside the metal sheet, or the lower surface of the metal sheet and the outer surface of the first side surface can be communicated with each other, and the communication portion between the two can be formed. The structure can be a slot, or a hole or other structure. For example, in the application scenario of side light emission, when the first side is placed on the soldering surface provided with solder, the first side is pressed against the solder on the soldering surface. Since the first recess and the second recess are connected, they are squeezed Part of the solder to the second concave part can flow directly into the first concave part along the position where the two communicate with each other, so it can be ensured that there is solder in the first concave part and the second concave part as much as possible, so as to ensure that the lower surface and the first side surface are covered. Soldering; when there is a part of the solder that will overflow along the first side, during the heating process, the solder will gather to the metal sheet due to the heat, and the overflowing solder can also be preferentially gathered into the first recess provided on the lower surface. It can be seen that the arrangement of the first concave portion and the second concave portion in communication can better realize the welding of the first side surface and the lower surface, and improve the reliability of the welding. In the application scene of positive light emission, the welding process when the lower surface of the metal sheet is placed on the welding surface provided with solder is similar to the welding process in the application scene of side light emission, and will not be repeated here.

It should be understood that, in this embodiment, when the first concave portion is set as a first groove or a first hole, and the second concave portion is set as a second groove or a second hole, the specific shapes of the first groove and the second groove are , size, the specific shape and size of the second hole and the first hole can be flexibly set according to requirements. For ease of understanding, this example is described below with reference to several specific setting examples in the accompanying drawings.

Please refer to a conductive base 1 and an LED bracket shown in FIG. 2 to FIG. 3-2. The conductive base 1 includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partly exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side c is a surface located between the upper surface a and the lower surface b. Referring to FIG. 2 and FIG. 3-2 , in this example, the first side c of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 is exposed on the first side surface 22 of the bracket housing 2 . The area is provided with a second concave portion c1 in the shape of a horseshoe-shaped groove. The regions of the two recesses are flush with the first side surface 22 of the bracket housing 2 . The area where the lower surfaces b of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket shell 2 is provided with a first recess b1 in the shape of a square hole. The concave portion b1 does not communicate with the second concave portion c1. Optionally, in this embodiment, the lower surfaces b of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket housing 2 , and the area where the second recess is not provided can also be connected to the bracket. The lower surface 23 of the housing 2 is flush. 21 in FIG. 3-1 is the upper surface of the bracket shell, which may be parallel to but not limited to the upper surface a of the metal sheet.

For example, still referring to FIG. 2-FIG. 3-2, in this example, the left and right sides of the first metal sheet 11 and the third metal sheet 13 are provided with outwardly protruding protrusions 3 between the upper surface and the lower surface. , the shape and size of the protrusion 3 can be flexibly set. And in some examples, the protrusions 3 may also be provided only on one of the left and right sides of the first metal sheet 11 and the third metal sheet 13 , or in front of the first metal sheet 11 and the third metal sheet 13 . At least one of the middle, rear, left and right sides can be flexibly set with protrusions 3 according to requirements; the specific configuration can be flexibly set according to requirements. Referring to Fig. 3-1 and Fig. 3-2, after the LED bracket is formed in this embodiment, the protrusions 3 provided on the metal sheet are embedded in the bracket shell, and at the bottom of the bowl, the colloid 20 constituting the bracket shell is embedded in the metal plate The upper surface a is flush. 3-2, there is a colloid 20 between the upper surface a of the metal sheet and the side wall of the bracket shell, and the colloid 20 is flush with the upper surface a. In this setting example, for the bracket shell The setting of the thickness of the side wall of the LED is not limited, and under the requirement of the strength of the LED bracket, the side wall can be set thinner, thereby reducing the size of the LED bracket as a whole, which is more conducive to its miniaturization. It should be understood that the second metal sheet 12 may be provided with the protrusions 3 in the manner of referring to the first metal sheet 11 or the third metal sheet 13 , or may not be provided with the protrusions 3 , which may be flexibly provided according to requirements.

In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the bracket housing, the side surface of the protrusion 3 of at least one metal sheet can also be set as an inclined surface, and the inclined angle of the inclined surface can be Flexible setting according to needs. For example, as shown in FIG. 3-3 , the side surfaces 31 of the upper protrusions 3 of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces. The structure can have a larger contact area with the bracket shell, and can better withstand the pressure of the bracket shell on the metal sheet, so that the bonding force between the metal sheet and the bracket shell can be better improved. Of course, the second metal sheet 12 can also be provided with structures similar to the protrusions 3 on the first metal sheet 11 and the third metal sheet 13 as required.

Please refer to another conductive base 1 and LED bracket shown in FIG. 4 to FIG. 5. The conductive base 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partly exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side c is a surface located between the upper surface a and the lower surface b. Referring to FIG. 4 and FIG. 5 , in this example, the first side c of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed in the area of the first side surface 22 of the bracket shell 2 . There is a second recess c1 in the shape of a horseshoe-shaped groove. Optionally, the first side c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the bracket housing 2 and the second recess is not provided The area is flush with the first side 22 of the bracket housing 2 . The area where the lower surfaces b of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket shell 2 is provided with a first recess b1 in the shape of a square hole. The concave portion b1 communicates with the second concave portion c1. Optionally, in this embodiment, the lower surfaces b of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket housing 2 , and the area where the second recess is not provided can also be connected to the bracket. The lower surface 23 of the housing 2 is flush.

Please refer to another conductive base 1 and LED bracket shown in FIG. 6 to FIG. 7 . The conductive base 1 also includes a first metal sheet 11 , a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partly exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side c is a surface located between the upper surface a and the lower surface b. Referring to FIG. 6 and FIG. 7 , in this example, the first side c of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed in the area of the first side surface 22 of the bracket shell 2 . There is a second recess c1 in the shape of a circular hole, optionally, the first side c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the bracket housing 2 and the second recess is not provided The area of c1 is flush with the first side 22 of the bracket housing 2 . The area where the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket shell 2 is provided with a first recess b1 in the shape of a square hole. In the embodiment, the lower surfaces b of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket shell 2 . The region where the second recess is not provided can also be connected to the lower surface of the bracket shell 2 . Surface 23 is flush. In this example, the first concave portion b1 and the second concave portion c1 communicate with each other inside the metal sheet.

Please refer to another conductive base 1 and LED bracket shown in FIG. 8 to FIG. 9 . The conductive base 1 also includes a first metal sheet 11 , a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a part of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partly exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side c is a surface located between the upper surface a and the lower surface b. Referring to FIG. 8 and FIG. 9 , in this example, the first side c of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed in the region of the first side surface 22 of the bracket shell 2 . There is a second recess c1 in the shape of a square groove. Optionally, the first side c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the bracket housing 2 and the second recess is not provided The area of c1 is flush with the first side 22 of the bracket housing 2 . The area where the lower surfaces b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket shell 2 is provided with a first recess b1 in the shape of a square groove. In the embodiment, the lower surfaces b of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket shell 2 . The region where the second recess is not provided can also be connected to the lower surface of the bracket shell 2 . Surface 23 is flush. In this example, the first concave portion b1 communicates with the second concave portion c1 on the outer surface of the metal sheet.

It should be understood that the shapes of the first concave portion and/or the second concave portion provided on each metal sheet in this embodiment may be the same or at least partially different, and may be flexibly set according to application scenarios. For example, a conductive base is shown in FIG. 10 . The first side c of the first metal sheet 11 is exposed to the area of the bracket shell 2. The second recess c1 is a circular hole. The second metal sheet 12 and the third metal sheet The second recess c1 provided in the region where the first side c of 13 is exposed to the bracket housing 2 is a square groove. Likewise, the arrangement of the first concave portion b1 can also be flexibly arranged according to requirements.

Optionally, in an example of this example, the lateral width of the upper end of the at least one metal sheet close to the upper surface may be greater than the lateral width of the upper end close to the first side surface, so that when the LED bracket is formed, a part of the upper end of the conductive metal substrate is formed. The glue embedded in the bracket shell can improve the stability of the combination between the metal sheet and the bracket shell. For example, referring to the conductive base shown in FIG. 6 , the lateral width W1 of the upper end of the third metal sheet 13 is greater than the lateral width W2 of the first side surface. Likewise, the lateral width W1 of the upper ends of the first metal sheet 11 and the second metal sheet 12 may also be greater than the lateral width W2 of the first side surface.

In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the bracket housing, the side surface of the upper end of at least one metal sheet can also be set as an inclined surface, and the inclined angle of the inclined surface can be adjusted according to requirements. Flexible settings. For example, the side surfaces of the upper ends of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces. After being combined with the bracket shell, the inclined surface can have a larger contact area with the bracket shell than the structure of the non-inclined surface. , and can better withstand the pressure of the bracket shell on the metal sheet, so that the bonding force between the metal sheet and the bracket shell can be better improved. Of course, the side surface of the upper end of the second metal sheet 12 can also be set as an inclined surface according to requirements.

Of course, in some application examples, the lateral width of the upper end of the metal sheet close to the upper surface and the lateral width of the lower end close to the lower surface may also be the same or substantially the same. Relay realizes the combination of the two. It can be set flexibly according to needs.

Optionally, in order to further improve the firmness of the combination between the metal sheet and the bracket housing. In the area on the upper surface of the metal sheet that is combined with the bracket shell, a rough surface of the concave-convex structure for enhancing the bonding force with the bracket shell can be provided (of course, other parts of the metal sheet that are in contact with the bracket shell can also be provided. The region is also provided on the rough surface of the concave-convex structure that enhances the bonding force with the stent shell), and/or is provided with a bonding hole through which the colloid forming the stent shell flows.

Optionally, in this embodiment, the coupling hole provided on the upper surface of the metal sheet may communicate with the first concave portion provided on the lower surface of the metal sheet, and may also communicate with the second concave portion provided on the first side surface.

Optionally, in this embodiment, one end of the coupling hole close to the upper surface is the upper end, and one end close to the lower surface is the lower end. There are at least one level of convex surfaces between them, so that the contact area between the bonding hole and the colloid used to form the bracket shell can be further improved, and the bonding strength of the two can be further improved.

For example, please refer to FIG. 11 for an example of setting. On the upper surface a of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 , the area for contacting the bracket shell is provided with a concave-convex structure the rough surface a1. For another example, as shown in FIG. 12 , on the upper surface a of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 , the area for contacting with the bracket shell is provided with a combination with a raised structure hole a2. Of course, in some other setting examples, the area on the upper surface a of at least one of the first metal sheet 11 , the second metal sheet 12 and the third metal sheet 13 for contact with the bracket shell can also be simultaneously provided Rough surface a1 with concave-convex structure and bonding hole a2 with convex structure.

This embodiment also provides an LED lamp bead, which includes the LED bracket shown above, and also includes an LED chip disposed in the bowl. The LED chip can be a front-mounted LED chip or a flip-chip LED chip, and the An encapsulation layer covering the LED chip in the bowl, and the electrode of the LED chip is electrically connected to the exposed area on the upper surface of the corresponding metal sheet. The encapsulation layer in this embodiment can be a fluorescent adhesive layer, or a combination of a fluorescent adhesive layer and a transparent adhesive layer, a quantum dot QD film, a combination of a QD film and a transparent adhesive layer, or a fluorescent adhesive layer, A combination of at least two of the QD film and the clear subbing layer.

The LED lamp beads provided in this embodiment are manufactured by using the above-mentioned LED bracket. For ease of understanding, the following description is given in conjunction with several lamp bead structure examples.

Please refer to FIG. 13 , which is a cross-sectional view of an LED lamp bead made by using the LED brackets in the above examples. It can be seen from this figure that the gaps between the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are all filled with the colloid forming the bracket shell, and the first metal sheet 11, the second metal sheet 11, the second metal sheet Two isolated cups are formed on the sheet 12 and the third metal sheet 13, each cup is provided with an LED chip 4, the LED chip is a flip-chip LED chip, and each flip-chip LED chip is arranged across the adjacent ones. On the two metal sheets, the bowl is filled with the encapsulation layer 3 .

Please refer to FIG. 14 , which is a transverse cross-sectional view of another LED lamp bead made by using the LED brackets in the above examples. The difference from the lamp bead shown in FIG. 13 is that in the cup The LED chips 4 provided inside are front mounted LED chips, and both of the two front mounted LED chips are arranged on the upper surface of the second metal sheet 12 . Of course, it can also be adjusted that two positive LED chips are arranged on the upper surfaces of the first metal sheet 11 and the third metal sheet 13, respectively, or one of the positive LED chips is arranged on the upper surface of the first metal sheet 11, and the other is arranged on the upper surface of the first metal sheet 11. On the upper surface of the second metal sheet 12 , or one of the LED chips is mounted on the upper surface of the third metal sheet 13 , and the other is arranged on the upper surface of the second metal sheet 12 .

Please refer to FIG. 15. The difference between the LED lamp bead shown in this figure and the LED lamp bead shown in FIG. 13 is that the second metal sheet 12 is reduced. Of course, it should be understood that when more than three LED chips are required When connecting in series, the fourth metal sheet, the fourth and fifth metal sheets, etc. can also be added in sequence on the basis shown in Figure 11, and the settings can be flexibly selected according to the needs, but it should be understood that these setting ideas are based on this implementation. Equivalent alternative arrangements made by the structures provided in the examples are all within the scope of this embodiment.

The LED lamp beads shown in the above examples are composed of a conductive base and a bracket housing that coats the conductive base. Compared with the existing light-emitting diodes, the structure of the LED lamp beads is greatly simplified and the cost is low.

The metal sheet can realize the bearing of the LED chip and the electrical connection with the LED chip at the same time, and as a pad to realize the electrical connection with the outside, with high integration and simple structure;

Since the LED chip is directly placed on the upper surface of the metal sheet, and the lower surface and the first side of the metal sheet are exposed, the heat generated by the LED chip can be directly transferred to the metal sheet during operation and quickly dissipated through the metal sheet. , to improve the performance of LED lamp beads.

Since both the lower surface and the first side of the metal sheet are exposed, both of them can be used as pads for external electrical connection. The surface is welded; in the positive light emitting application scenario, the lower surface can be welded, or the lower surface and the first side can be welded at the same time, and the setting of the first recess and the second recess can further improve the reliability and convenience of welding . Therefore, it can be applied to various application scenarios, and the welding is convenient. It can also be welded on two surfaces according to the requirements, which can improve the firmness of the welding, thereby improving the reliability of the product.

Optionally, in some examples of this embodiment, only the upper surface, the lower surface, and the first side surface of the metal sheet may be exposed to the outside of the enclosure, and the other surfaces are covered by the bracket shell, so as to improve the gap between the conductive metal plate and the enclosure. Combined reliability.

In an application scenario of this embodiment, the metal sheet may be, but is not limited to, a copper substrate, and the copper substrate has the advantages of low cost, easy processing, and good electrical and thermal conductivity.

Optionally, in other application examples of this embodiment, a reflective layer for improving light extraction efficiency may also be provided on the upper surface of the metal sheet at least in the exposed area, so as to improve the efficiency of the LED lamp bead. In this embodiment, the reflective layer can be, but not limited to, a silver layer, and the silver layer can be formed on the copper substrate by, but not limited to, electroplating, electroless silver plating, and the like.

It should be understood that the overall shape of the LED bracket in this embodiment may be a long strip, a square, a hexagon, etc., and the overall shape of the LED bracket is not limited in this embodiment.

It should be understood that the metal sheet in this embodiment can be any metal plate that can achieve reliable conductive connection and meet the requirements of the LED bracket. Since the heat dissipation performance of the metal plate is better, the heat dissipation performance of the LED bracket can be improved. , of course, it can also be replaced with other boards of other materials with electrical conductivity that can meet the above requirements. In this embodiment, the specific shape and size of the metal sheet can be flexibly set according to application requirements, which are not limited in this embodiment.

In this embodiment, the colloidal material for forming the bracket shell can also be flexibly selected according to requirements, for example, but not limited to, thermosetting glue or hot-pressing glue, and white glue with better reflection performance can be selected but not limited to. For example, in an example, the colloid can be made of, but not limited to, epoxy or resin (eg, epoxy glue, silica gel, resin, etc.).

This embodiment also provides a light-emitting unit module, which can be used in but not limited to various lighting scenarios and/or display scenarios, including a substrate and a plurality of the above-mentioned LED lamp beads, the plurality of LED lamp beads. The LED lamp beads are electrically connected to the substrate. The LED lamp beads in this embodiment can be positive light-emitting LED light beads, and can also be side light-emitting LED light beads. An example of a light-emitting unit module is shown in FIG. 16 . The light-emitting unit module 5 shown in the figure includes a substrate 52 and a plurality of the above-mentioned side-emitting LED lamp beads 51 disposed on the substrate 52 .

This embodiment also provides a display device including the above-mentioned light-emitting unit module. The display device can be used for, but not limited to, various displays, mobile phones, PCs, advertising equipment, and the like. An exemplary display device is shown in FIG. 17, which includes an outer frame 6, a film 701 assembled in the outer frame 6, a light guide plate 702, a reflector 703 and a metal back plate 704, and a film 701 assembled in the outer frame 6. 701 , the light guide plate 702 , the reflective sheet 703 and the metal back plate 704 are correspondingly provided with the light emitting unit module 5 . It should be understood that, what is shown in FIG. 17 is only an exemplary display device, and the specific structure of the display device can be set flexibly, which will not be repeated here.

The above content is a further detailed description of the embodiments of the present invention in combination with specific embodiments, and it cannot be considered that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deductions or substitutions can be made, which should be regarded as belonging to the protection scope of the present invention.

Claims (14)

1. A conductive base for an LED bracket, characterized in that the conductive base comprises at least two metal sheets that are insulated and isolated, and the metal sheets are combined with a colloid used to form a bracket shell to form an LED bracket, so the LED bracket is formed. The upper surface of the metal sheet is located at the bottom of the bowl enclosed by the bracket shell for placing the LED chips, and is at least partially exposed; the upper surface of at least one of the metal sheets is used to carry the LED chips, and the exposed area on the upper surface of each of the metal sheets is used for electrical connection with the electrodes of the corresponding LED chips; At least part of the lower surface of the metal sheet is exposed outside the bracket shell, the lower surface is the surface opposite to the upper surface, and at least one of the metal sheets is located between the upper surface and the lower surface. At least part of one side surface is exposed outside the bracket shell, at least one second side surface of the metal sheet between the upper surface and the lower surface is not exposed outside the bracket shell, the first side surface and the second side surface are not exposed outside the bracket shell. The sides are two opposite sides, the area of the lower surface exposed outside the bracket shell is provided with a first recess for accommodating solder, and the area of the first side exposed outside the bracket shell is provided with a solder accommodating of the second recess. 2 . The conductive base of the LED bracket according to claim 1 , wherein the first concave portion communicates with the second concave portion. 3 . 3. The LED bracket according to claim 1 or 2, characterized in that, an area on the upper surface of the metal sheet that is combined with the bracket shell is provided with an area for enhancing the combination with the bracket shell The rough surface of the concave-convex structure of force, and/or, is provided with a bonding hole into which the colloid forming the bracket shell flows. 4 . The conductive base of the LED bracket according to claim 3 , wherein the coupling hole communicates with the first concave portion. 5 . 5 . The conductive base of the LED bracket according to claim 3 , wherein the end of the coupling hole close to the upper surface is the upper end, the end close to the lower surface is the lower end, and the upper end of the coupling hole is the upper end. 6 . The pore size is larger than the pore size of the lower end of the binding hole. 6 . The conductive base of the LED bracket according to claim 1 or 2 , wherein the conductive base comprises three metal sheets arranged in sequence, and the exposed area on the upper surface of the middle metal sheet is respectively connected with the two metal sheets. 7 . The electrodes corresponding to the LED chips are electrically connected. 7. The conductive base of the LED bracket according to claim 1 or 2, wherein the lateral width of the upper end of at least one of the metal sheets close to the upper surface is greater than the lateral width of the first side surface, and the A part of the upper end of the metal sheet is embedded in the bracket shell; and / or, At least one of the metal sheets is provided with an outwardly extending protrusion between the upper surface and the lower surface, and at least a part of the protrusion is embedded in the bracket shell. 8 . The conductive base of the LED bracket according to claim 1 or 2 , wherein the metal sheet is a copper substrate, and a reflective layer is provided on the upper surface at least in the exposed area. 9 . 9 . An LED bracket, characterized in that it comprises the conductive base according to any one of claims 1 to 8 , and further comprising a glue combined with the conductive base to form the bracket shell. 10 . 10 . The LED bracket according to claim 9 , wherein the conductive base comprises three metal sheets arranged in sequence, and the bracket housing further comprises a spacer provided on the upper surface of the middle metal sheet. 11 . wall to form two separate cups on the upper surfaces of the three metal sheets. 11. An LED lamp bead, characterized by comprising the LED bracket according to claim 9 or 10, further comprising an LED chip arranged in the bowl, and an LED chip arranged in the bowl to connect the LED In the packaging layer covered by the chip, the electrodes of the LED chip are electrically connected to the corresponding exposed areas on the upper surface of the metal sheet. 12 . The LED lamp bead according to claim 11 , wherein the LED lamp bead is a side-emitting LED lamp bead, and the first side is a main mounting surface; 12 . Or, the LED lamp beads are positive light-emitting LED lamp beads, and the lower surface is the main installation surface. 13. A light-emitting unit module, comprising a substrate and a plurality of LED lamp beads according to any one of claims 11 or 12, wherein the plurality of LED lamp beads are electrically connected to the substrate. 14. A display device, comprising the light-emitting unit module according to claim 13.

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