CN111276332A - Guide pin type capacitor and production method thereof, integrated circuit board and electronic product - Google Patents

Abstract

The invention discloses a production method of a lead-pin capacitor. The production method comprises the following steps: step 1: electrically connecting a positive foil with a positive lead stud through a positive conductor, and electrically connecting a negative foil with the negative lead stud through a negative conductor , the positive conductor and the negative conductor are respectively wound by the electrolytic paper; Step 2, the positive conductor and the negative conductor after the electrolytic paper of the step one is wound up are rolled up with adhesive tape to form the element; Step 3, the above element is put into the aluminum After the electrolyte is soaked, cover the soaked element with a rubber stopper and seal it to the aluminum shell. After the package, the positive lead and the negative lead are exposed outside the same end of the aluminum shell; step 4, when there is a positive lead The aluminum shell ends of the nails and the negative guide nails are mounted on the base plate, and the positive guide nails and the negative guide nails are bent on the same end surface of the mounting base plate. After the capacitor produced by the production method is installed on the integrated circuit board, the problems of two high temperature damages and high cost caused by the horizontally mounted capacitor on the integrated circuit board are reduced.

Description

A guide pin capacitor and its production method, integrated circuit board and electronic product

technical field

The invention belongs to the technical field of capacitor production, and in particular relates to a guide-pin capacitor and a production method thereof, an integrated circuit board and an electronic product.

Background technique

In the process of industrial production, especially in the production of electronic products, an important electronic component lead-type capacitor is often used. With the development of science and technology, the PCB integrated circuit board in electronic products is required to be thinner and thinner. The existing technology realizes the thinning of the integrated circuit by designing the capacitor to be installed horizontally. However, the labor cost brought by the horizontal installation of capacitors It is relatively high, and the installation process is completed by reflow soldering and wave soldering. Such installation often causes damage to the components themselves due to high temperature baking on both sides, and wastes energy and costs due to the need for two types of soldering. added questions.

SUMMARY OF THE INVENTION

The present invention aims to solve at least one of the technical problems existing in the prior art.

The purpose of the present invention is to provide a production method of a pin-lead capacitor, the production method comprising:

Step 1, the positive foil is electrically connected to the positive conductive nail through the positive conductor, the negative foil is electrically connected to the negative conductive nail through the negative conductor, and the positive conductor and the negative conductor are respectively wound through electrolytic paper;

Step 2, the positive conductor and the negative conductor after the electrolytic paper of step one is wound up are rolled up with adhesive tape to form the element;

Step 3: Put the above-mentioned elements into the aluminum electrolyte for impregnation, cover the impregnated elements with rubber plugs and encapsulate them into the aluminum case. After encapsulation, the positive and negative guide pins are exposed outside the same end of the aluminum case. ;

Step 4: Install the seat plate on the aluminum shell end with the positive guide pin and the negative guide pin, and bend the positive guide pin and the negative guide pin on the same end surface of the mounting seat plate.

Further, it also includes covering the outer surface of the aluminum case with a layer of rubber after the step 3 is packaged into the aluminum case.

Further, after being packaged into an aluminum case in step 3, the element is aged and charged.

Further, in the fourth step, the positive guide pins and the negative guide pins are respectively bent on the same end surface of the mounting base plate in opposite directions.

Further, the seat plate is made of insulating material of the seat plate.

Another object of the present invention is to provide a pin-lead capacitor, which is a pin-lead capacitor produced by the above-mentioned method for producing a pin-lead capacitor.

The present invention also provides an integrated circuit board, the integrated circuit board includes the above-mentioned lead-pin capacitor.

The present invention also provides an electronic product, and the electronic product includes the above-mentioned integrated circuit board.

The beneficial effect of the present invention is that in step 4, a mounting seat plate is arranged at the outer end of the aluminum shell, and the positive and negative lead pins are bent on the same end surface of the mounting seat plate, and the capacitor installed by the above method is installed. On the integrated circuit board, the height along the direction perpendicular to the integrated circuit board is low, and the space is small, so that the integrated circuit board is thinner, realizes the characteristics of miniaturization, and reduces the twice caused by the horizontal installation of capacitors. High temperature damage and higher cost problems. The electronic product with the pin-lead capacitor of the present invention has the advantages of small size and low cost.

The present invention also provides an electronic product comprising the above-mentioned integrated circuit board.

The specific principles and other advantages that the present invention can achieve the above effects can be found in the descriptions in the embodiments, which will not be repeated here.

Additional aspects and advantages of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or may be learned by practice of the invention.

Detailed ways

The embodiments of the present invention are described in detail below, which are only used to explain the present invention, and should not be construed as a limitation of the present invention.

Unless otherwise specified, if there are words in this application that describe directions such as "up, down, bottom, top, vertical, vertical, top view, horizontal, top, bottom", it should not be construed as a limitation on the technical solutions of the present invention.

An embodiment of the present invention relates to a method for producing a pin-lead capacitor, wherein the pin-lead capacitor is generally a pin-lead aluminum electrolytic capacitor. Usually used on integrated circuit boards.

The production method includes: step 1, electrically connecting the positive foil to the positive conducting stud through the positive conductor, electrically connecting the negative foil to the negative conducting stud through the negative conductor, and passing the positive conductor and the negative conductor through an electrolytic paper roll respectively. around.

Step 2: Roll the positive conductor and the negative conductor after the electrolytic paper of step 1 is wound up with tape to form an element. Elements are commonly known as capacitor cells.

Step 3: Put the above-mentioned elements into the aluminum electrolyte for impregnation, cover the impregnated elements with rubber plugs and encapsulate them into the aluminum case. After encapsulation, the positive and negative guide pins are exposed outside the same end of the aluminum case. . By arranging the positive guide pins and the negative guide pins exposed outside the aluminum shell, the external guide connection is realized.

Step 4: Install the seat plate on the aluminum shell end with the positive guide pin and the negative guide pin, and bend the positive guide pin and the negative guide pin on the same end surface of the mounting seat plate. By bending, after the capacitor is installed on the integrated circuit board, the installation space is reduced.

The lead-type capacitor produced by the above method has low cost after being mounted on the integrated circuit board, and because it does not need to be welded twice, the damage to the performance of the capacitor itself caused by high temperature welding is reduced.

Preferably, it also includes covering the outer surface of the aluminum case with a layer of rubber after the step 3 is encapsulated in the aluminum case. Therefore, the lead-type capacitor is insulated from the outside world.

Preferably, the element is aged and charged after being packaged into an aluminum case in step 3. The purpose of aging and charging is to remove bad products, and repair the oxide film where the positive foil and negative foil are damaged during the production process, so as to obtain better quality products.

Preferably, in the fourth step, the positive guide pins and the negative guide pins are respectively bent on the same end surface of the mounting base plate in opposite directions. Bend the positive guide pin and the negative guide pin in opposite directions to facilitate installation on the integrated circuit board later. The positive guide pins and the negative guide pins are usually made of materials with good bending properties.

Preferably, the seat plate is made of insulating material for the seat plate. After the base plate made of insulating material is installed on the integrated circuit board, the insulation isolation effect from the integrated circuit board is realized.

An embodiment of the present invention provides a pin-lead capacitor, and the pin-lead capacitor is a pin-lead capacitor produced by the method for producing a pin-lead capacitor described in the above embodiment. The capacitor has low production cost and does not require high temperature welding on both sides, thereby reducing damage during installation.

An embodiment of the present invention further provides an integrated circuit board, wherein the integrated circuit board includes the above-mentioned lead-pin capacitor. The integrated circuit board with the above-mentioned capacitor can achieve the purpose of thinner and lower cost installation.

An embodiment of the present invention further provides an electronic product, where the electronic product includes the integrated circuit board described in the embodiment. The electronic product having the above-mentioned integrated circuit board can realize the advantages of smaller volume and lower production cost.

To sum up, in the method for producing a pin-lead capacitor of the present invention, a mounting seat plate is arranged at the outer end of the aluminum shell through step 4, and the positive lead pin and the negative lead pin are bent on the mounting seat On the same end face of the board, the capacitor prepared by the above method is installed on the integrated circuit board, the height along the direction perpendicular to the integrated circuit board is low, and the occupied space is small, thereby making the integrated circuit board thinner and realizing the characteristics of miniaturization , reducing the two high-temperature damage and high cost problems caused by the horizontal installation of capacitors. The electronic product with the pin-lead capacitor of the present invention has the advantages of small size and low cost.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, The scope of the invention is defined by the claims and their equivalents.

Claims (8)

1. A method of manufacturing a pin-type capacitor, the method comprising:

electrically connecting a positive foil with a positive conductive nail through a positive conductor, electrically connecting a negative foil with a negative conductive nail through a negative conductor, and respectively winding the positive conductor and the negative conductor through electrolytic paper;

step two, winding the positive conductor and the negative conductor which are wound by the electrolytic paper in the step one, and gluing tapes on the positive conductor and the negative conductor to form elements;

step three, putting the element into an aluminum electrolyte to be soaked completely, sleeving a rubber plug on the soaked element, packaging the element into an aluminum shell, and exposing the positive conductive connecting nail and the negative conductive connecting nail out of the same end of the aluminum shell after packaging;

and step four, mounting a base plate at the end of the aluminum shell with the positive conductive connecting nail and the negative conductive connecting nail, and bending the positive conductive connecting nail and the negative conductive connecting nail on the same end face of the mounting base plate.

2. The method of claim 1 further comprising sleeving a rubber layer over the outer surface of the aluminum shell after step three of encapsulating the aluminum shell.

3. The method of manufacturing a lead-type capacitor of any of claims 1 or 2, wherein said element is aged and charged after being packaged into an aluminum case in step three.

4. The method for manufacturing a lead-type capacitor as claimed in claim 1, wherein in the fourth step, the positive lead pin and the negative lead pin are respectively bent in opposite directions on the same end face of the mounting plate.

5. A method of manufacturing a lead-type capacitor as claimed in claim 1 wherein said base plate is made of insulating material.

6. A guide pin type capacitor, characterized in that the guide pin type capacitor is produced by the method for producing a guide pin type capacitor of any one of claims 1 to 5.

7. An integrated circuit board, characterized in that it comprises a pin-type capacitor according to claim 6.

8. An electronic product, characterized in that the electronic product comprises the integrated circuit board of claim 7.