CN111105003A - Electronic tag and manufacturing method thereof - Google Patents

Abstract

The invention provides an electronic tag which comprises a release paper layer, a first adhesive layer, a metal resisting material layer, a chip layer, a second adhesive layer and a fragile paper layer which are sequentially arranged, wherein a plurality of grooves are formed in one side, opposite to the chip layer, of the metal resisting material layer, a silicon oil layer is arranged between the groove surface and the chip layer, the chip layer is a flexible circuit board, and a processor, a patch sensor, a radio frequency circuit and a communication unit are arranged on the flexible circuit board and are respectively connected with the processor. The invention has certain expanded function, strong metal resistance and difficult damage.

Description

Electronic tag and manufacturing method thereof

Technical Field

The invention belongs to the technical field of electronic tags, and particularly relates to an electronic tag and a manufacturing method thereof.

Background

At present, RFID radio frequency identification is a technology which utilizes radio frequency signals to realize contactless information transmission through space coupling (alternating magnetic field or electromagnetic field) and achieves the identification purpose through transmitted information, compared with the traditional identification technology (two-dimensional code, bar code and the like), the RFID technology has the characteristics of unique mark, large information capacity, quick and convenient reading, multi-label reading and data encryption, the radio signals are used for transmitting data from labels attached to articles through adjusting the electromagnetic field with radio frequency so as to automatically identify and track the articles, however, the existing electronic label has single function, in many applications, the RFID labels need to be attached to the surfaces of metal objects, but when the common passive ultrahigh frequency RFID label with dipole-like antenna is applied to the metal surfaces, the impedance matching is realized, the radiation efficiency and the radiation direction are changed, thereby lead to the performance variation of label, the reading and writing distance shortens, can not effectively read even, and at present all make anti metal electronic tags on the market mostly use PVC, materials such as ABS are moulded plastics and are formed, and this kind of label pastes in the gas cylinder very easily with electronic tags's chip crushing, causes the label unable to use.

Disclosure of Invention

The invention aims to provide an electronic tag and a manufacturing method thereof, which have certain expansion function, strong metal resistance and difficult damage.

The invention provides the following technical scheme:

the utility model provides an electronic tag, is including the release paper layer, first adhesive layer, anti metallic material layer, chip layer, second adhesive layer and the breakable paper layer that sets gradually, anti metallic material layer is relative one side of chip layer is equipped with a plurality of recesses, the recess face with be equipped with the silicon oil layer between the chip layer, chip layer adopts flexible circuit board, be equipped with the treater on the flexible circuit board and respectively with paster sensor, radio frequency circuit and the communication unit that the treater is connected.

Preferably, a converter is arranged between the patch sensor and the processor, and the processor is further connected with a memory.

Preferably, the communication unit uses bluetooth.

Preferably, the metal-resistant material layer is made of PET polyethylene terephthalate or PI polyimide.

Preferably, the radio frequency circuit is etched on the flexible circuit board using a printed circuit.

Preferably, the first adhesive layer and the second adhesive layer are pressure-sensitive hot melt adhesives or pressure-sensitive adhesives.

A method of manufacturing an electronic tag, comprising the steps of:

manufacturing an electronic tag chip layer on a flexible circuit board, wherein the flexible circuit board is provided with a processor, and a patch sensor, a radio frequency circuit and a communication unit which are respectively connected with the processor;

the chip layer is packaged, a silicon oil layer is used for isolation protection and filling one surface of the flexible circuit board, which is provided with devices, and a metal-resistant material layer is packaged on the silicon oil layer, and the silicon oil layer and the metal-resistant material layer are arranged in a concave-convex embedded mode;

and respectively adding adhesive on the other surfaces of the anti-metal material layer and the flexible circuit board, and sticking release paper and the fragile paper layer.

The invention has the beneficial effects that: the electronic tag chip adopts a flexible circuit board and is not easy to break; a chip layer is internally provided with a patch sensor, so that the sensing detection function can be designed according to the use function, and the chip layer has certain function expansibility; the whole anti-metal layer design is adopted, the anti-metal property of the electronic tag is improved, and the paper layers on two sides are designed to prevent the tag from being transferred for use.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of a chip structure according to the present invention;

labeled as: 1. a chip layer; 2. a silicon oil layer; 3. a metal-resistant material layer; 31. a groove; 4. a first adhesive layer; 5. a release paper layer; 6. a second adhesive layer; 7. a frangible paper layer.

Detailed Description

As shown in fig. 1 and 2, the electronic tag includes a release paper layer 5, a second adhesive layer 6, a metal-resistant material layer 3, a chip layer 1, a second adhesive layer 6, and a brittle paper layer 7, which are sequentially disposed, wherein the metal-resistant material layer 3 is made of PET polyethylene terephthalate or PI polyimide. The first adhesive layer and the second adhesive layer are pressure-sensitive hot melt adhesives or pressure-sensitive adhesives. One side of the anti-metal material layer 3, which is opposite to the chip layer 1, is provided with a plurality of grooves 31, a silicon oil layer 2 is arranged between the groove surface 31 and the chip layer 1, the chip layer 1 adopts a flexible circuit board, the flexible circuit board is provided with a processor, a patch sensor, a radio frequency circuit and a communication unit, the patch sensor, the radio frequency circuit and the communication unit are respectively connected with the processor, and the radio frequency circuit adopts a printed circuit to be etched on the flexible circuit board. Be equipped with the converter between paster sensor and the treater, the treater still is connected with the memory for more data content of storage, communication unit adopts the bluetooth, and the bluetooth has transmission distance far away, more does benefit to electronic tags's discernment.

As shown in fig. 1 and 2, a method for manufacturing an electronic tag includes the following steps:

manufacturing an electronic tag chip layer 1 on a flexible circuit board, wherein the flexible circuit board is provided with a processor, and a patch sensor, a radio frequency circuit and a communication unit which are respectively connected with the processor;

the chip layer 1 is packaged, a silicon oil layer 2 is adopted for isolation protection, one surface of the flexible circuit board, which is provided with devices, is filled, a metal resisting material layer 3 is packaged on the silicon oil layer 2, and the silicon oil layer 2 and the metal resisting material layer 3 are arranged in a concave-convex embedded mode;

and respectively adding adhesive on the other surfaces of the metal resisting material layer 3 and the flexible circuit board, and sticking the release paper 5 and the fragile paper layer 7.

As shown in fig. 1 and 2, in the using process of an electronic tag, a designed electronic tag chip layer 1 can design a processor and a radio frequency circuit according to the specific application scene function and the required data of the tag, and extend a patch sensor, so that some sensing data of the electronic tag, such as temperature, pressure and the like, can be further measured, more using data are provided for an identifier, and the overall use value of the electronic tag is improved; the silicon oil layer 2 is adopted to isolate, protect and fill up one surface of the flexible circuit board, which is provided with a device, and the metal-resistant material layer 3 is packaged on the silicon oil layer 2, so that the silicon oil layer 2 effectively protects the surface of the device of the chip layer 1, the oxygen resistance of the electronic device is improved, and the silicon oil layer 2 and the metal-resistant material layer 3 are arranged in a concave-convex embedded mode, so that the mutual adhesion is firmer; in addition, the two sides are designed with paper which is easy to tear, when the electronic tag is torn down, the anti-metal material layer 3 and the chip layer 2 are also completely torn down, and the data inside cannot be read, so that the anti-tear purpose is achieved.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The electronic tag is characterized by comprising a release paper layer, a first adhesive layer, a metal resisting material layer, a chip layer, a second adhesive layer and a fragile paper layer which are sequentially arranged, wherein the metal resisting material layer is opposite to one side of the chip layer, a plurality of grooves are formed in one side of the chip layer, a silicon oil layer is arranged between the groove face and the chip layer, the chip layer is made of a flexible circuit board, and a processor, a patch sensor, a radio frequency circuit and a communication unit are arranged on the flexible circuit board and are respectively connected with the processor.

2. An electronic label according to claim 1, characterized in that a converter is provided between the patch sensor and the processor, and a memory is connected to the processor.

3. An electronic label according to claim 1, characterized in that the communication unit is bluetooth.

4. An electronic label according to claim 1, characterized in that the metal-resistant material layer is made of PET polyethylene terephthalate or PI polyimide.

5. An electronic tag as claimed in claim 1, wherein said radio frequency circuitry is etched on said flexible circuit board using printed circuitry.

6. The electronic tag according to claim 1, wherein the first adhesive layer and the second adhesive layer are pressure-sensitive hot melt adhesive or pressure-sensitive adhesive.

7. A method of manufacturing an electronic label according to claim 1, characterized by comprising the steps of:

manufacturing an electronic tag chip layer on a flexible circuit board, wherein the flexible circuit board is provided with a processor, and a patch sensor, a radio frequency circuit and a communication unit which are respectively connected with the processor;

the chip layer is packaged, a silicon oil layer is used for isolation protection and filling one surface of the flexible circuit board, which is provided with devices, and a metal-resistant material layer is packaged on the silicon oil layer, and the silicon oil layer and the metal-resistant material layer are arranged in a concave-convex embedded mode;

and respectively adding adhesive on the other surfaces of the anti-metal material layer and the flexible circuit board, and sticking release paper and the fragile paper layer.

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