CN118095308A - A thin RFID tag and a manufacturing method thereof - Google Patents
A thin RFID tag and a manufacturing method thereof Download PDFInfo
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- CN118095308A CN118095308A CN202410243897.4A CN202410243897A CN118095308A CN 118095308 A CN118095308 A CN 118095308A CN 202410243897 A CN202410243897 A CN 202410243897A CN 118095308 A CN118095308 A CN 118095308A
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10297—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves arrangements for handling protocols designed for non-contact record carriers such as RFIDs NFCs, e.g. ISO/IEC 14443 and 18092
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
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Abstract
本发明属于标签技术领域，具体涉及一种薄的RFID标签及其制作方法；其中，所述薄的RFID标签的制作方法包括：S1、制作并检测加工柔性基板，以作RFID标签的基板；其中，所述柔性基板为纸张基板；S2、在所述柔性基板上制作柔性电路板；S3、制作曲线分形结构的RFID标签天线；S4、将所述RFID标签天线以及RFID标签芯片装配至绝缘膜上，以形成软性标签；S5、将所述软性标签装配至所述柔性电路板，以形成RFID标签产品。本发明可以实现在检测确定各个部分的使用的合格性再进行组装生产，进而可以确定生产的合格率，降低生产成本，并且可以有效地缩短RFID标签的厚度，还可以保障其运行的正常性以及提高生产效率。
The present invention belongs to the field of label technology, and specifically relates to a thin RFID label and a method for making the same; wherein, the method for making the thin RFID label includes: S1, making and testing a flexible substrate to serve as a substrate for the RFID label; wherein, the flexible substrate is a paper substrate; S2, making a flexible circuit board on the flexible substrate; S3, making an RFID label antenna with a curved fractal structure; S4, assembling the RFID label antenna and the RFID label chip onto an insulating film to form a soft label; S5, assembling the soft label onto the flexible circuit board to form an RFID label product. The present invention can realize assembly and production after testing and determining the eligibility of each part, and then determine the qualified rate of production, reduce production costs, and effectively shorten the thickness of the RFID label, and can also ensure the normal operation and improve production efficiency.
Description
Technical Field
The invention belongs to the technical field of labels, and particularly relates to a thin RFID label and a manufacturing method thereof.
Background
RFID is a technology that uses radio frequency signals to achieve contactless information transfer through spatial coupling (alternating magnetic or electromagnetic fields) and to achieve identification through the transferred information. Has been developed for many years and is widely applied to the fields of logistics, assembly lines, ETC, electronic ticket, animal management, commodity anti-counterfeiting (label) and the like.
However, most of the existing electronic tags with metal interference resistance and liquid environment are made of ceramic, ABS (acrylonitrile butadiene styrene) and other materials, and the thickness is generally thicker, so that the tags are not easy to print in a roll mode through a printer, and the electronic tags are limited in application and low in production efficiency.
Disclosure of Invention
The invention aims at: aiming at the defects of the prior art, a thin RFID label and a manufacturing method thereof are provided to solve the problems that the existing label is not easy to print in a roll through a printer, the application is limited and the production efficiency is low.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
A method of making a thin RFID tag, comprising:
S1, manufacturing and detecting a processed flexible substrate to be used as a substrate of an RFID tag; wherein the flexible substrate is a paper substrate;
s2, manufacturing a flexible circuit board on the flexible substrate;
s3, manufacturing an RFID tag antenna with a curve fractal structure;
s4, assembling the RFID tag antenna and the RFID tag chip on an insulating film to form a flexible tag;
s5, assembling the flexible tag to the flexible circuit board to form an RFID tag product.
Preferably: the step of manufacturing and detecting the flexible substrate to be used as the substrate of the RFID tag comprises the following steps:
Acquiring at least one A4 printing paper;
Cutting at least one corresponding flexible substrate according to the size of the RFID tag;
and detecting the relative dielectric constant of the flexible substrate in a preset environment.
Preferably: the step of manufacturing the RFID tag antenna with the curve fractal structure comprises the following steps:
Obtaining a metal foil;
Manufacturing a resonance antenna model of a deformed Koch curve fractal structure on a metal foil to form an RFID tag antenna with the curve fractal structure;
Preferably: the step of assembling the RFID tag antenna and the RFID tag chip onto the insulating film to form the flexible tag includes the steps of:
bonding a connection point of an RFID tag chip to a pin of the RFID tag antenna by using a conductive bonding part;
the assembly point of the RFID tag chip is welded to the mounting point of the RFID tag antenna;
And adhering the RFID tag chip and the RFID tag antenna integrally to the insulating film by using a conductive adhesive part to form a flexible tag.
Preferably: the step of assembling the RFID tag antenna and the RFID tag chip onto the insulating film to form a flexible tag further includes the steps of:
Placing the soft label on a metal backboard or a nonmetal backboard;
Positioning and clamping the soft label by using a clamping frame;
adjusting the center frequency of the 1/2 open circuit line to 915MHz; wherein the 1/2 open line is electrically connected with the feeding portion;
And detecting the S parameter of the RFID tag antenna in the soft tag.
Preferably: the step of assembling the flexible label to the flexible circuit board to form an RFID label product includes the steps of:
assembling the flexible tag to the flexible circuit board through a conductive adhesive member;
And a matching circuit corresponding to the RFID tag antenna and the RFID tag chip is additionally arranged between the RFID tag antenna and the RFID tag chip so as to form an RFID tag product.
The invention also discloses a thin RFID label, which is produced based on the steps of the manufacturing method of the thin RFID label; the flexible printed circuit board comprises a flexible substrate, a flexible circuit board, a flexible label and release paper which are sequentially arranged from bottom to top; the soft tag comprises an RFID tag antenna, an RFID tag chip and an insulating film; the RFID tag antenna and the RFID tag chip are arranged side by side and connected into a whole; and the RFID tag antenna and the RFID tag chip are attached to the insulating film; the RFID tag antenna is electrically connected with the RFID tag chip; the insulating film is connected to the release paper; the bottom of the RFID tag chip is connected to the flexible circuit board.
Preferably: the RFID tag antenna comprises a metal foil and a curve fractal structure; the curve fractal structure is connected to the metal foil; the metal foil is welded to the RFID tag chip.
Preferably: the flexible circuit board is a polyimide substrate circuit board or a polyester film substrate circuit board;
And/or, the flexible substrate is made of paper;
And/or the release paper comprises silicone oil, a coating film and base paper which are sequentially arranged from top to bottom; and the base paper is attached to the insulating film.
Preferably: the RFID tag body also comprises a waterproof film and a conductive adhesive component; the waterproof film is arranged on the flexible substrate and surrounds the periphery of the RFID tag chip; the conductive adhesive member is connected between the RFID tag antenna and the RFID tag chip.
The manufacturing method has the beneficial effects that the flexible substrate is manufactured and detected and processed to obtain the substrate which can accord with the RFID tag, so that the manufacturing smoothness and the manufacturing order can be improved; a flexible circuit board is manufactured on the flexible substrate, so that the smoothness of the subsequent use of the RFID tag antenna and the RFID tag chip is ensured; then, manufacturing the RFID tag antenna with the curve fractal structure, so that the generation of the qualified RFID tag antenna can be further ensured; then the RFID tag antenna and the RFID tag chip are assembled on the insulating film to form a soft tag, so that the assembling accuracy and the using stability of the operation part of the RFID tag can be determined; finally, assembling the flexible tag to the flexible circuit board to form an RFID tag product; therefore, assembly production can be carried out after the qualification of the use of each part is detected and determined, the qualification rate of production can be determined, the production cost is reduced, the thickness of the RFID label can be effectively shortened, the operation normality of the RFID label can be ensured, and the production efficiency is improved.
Drawings
Features, advantages, and technical effects of exemplary embodiments of the present invention will be described below with reference to fig. 1 to 10.
FIG. 1 is a flow chart of a method of fabricating a thin RFID tag according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of a thin RFID tag according to one embodiment of the present invention;
FIG. 3 is a schematic view of the structure of a release paper layer of a thin RFID tag according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an RFID tag antenna of a thin RFID tag in accordance with an embodiment of the present invention;
FIG. 5 is a schematic structural view of a test fixture for a thin RFID tag according to an embodiment of the present invention;
FIG. 6 is a graph of antenna input impedance for a method of making a thin RFID tag according to one embodiment of the present invention;
FIG. 7 is a diagram showing the radiation pattern of an antenna when an RFID tag of a method of manufacturing a thin RFID tag according to an embodiment of the present invention is attached to a metal object;
FIG. 8 is a diagram showing the radiation pattern of an antenna when an RFID tag of a method of manufacturing a thin RFID tag according to an embodiment of the present invention is attached to a nonmetallic object;
FIG. 9 is a three-dimensional gain map of a thin RFID tag according to one embodiment of the present invention when the RFID tag is attached to a metal object;
Fig. 10 is a graph S11 after debugging of the method of manufacturing a thin RFID tag according to an embodiment of the present invention.
In the figure: 100-RFID tag body; 1-a flexible substrate; 2-a flexible circuit board; 3-a waterproof film; a 4-RFID tag antenna; a 5-RFID tag chip; 6-insulating film; 7-release paper; 71-silicone oil; 72-laminating; 73-backing paper; 8-a conductive adhesive member; 200-a metal backplate; 300-1/2 open line; 400-feeding section; 500-clamping frame.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.
In the description of embodiments of the present application, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In the description of the embodiments of the present application, the term "and/or" is merely a thin RFID tag and its manufacturing method describing association relation of association objects, and indicates that three relations may exist, for example, a and/or B may indicate that: a alone, both a and B, and a plurality of cases alone. In addition, the character "/" herein generally indicates that the front-rear related object is a thin RFID tag and a method of manufacturing the same.
In the description of the embodiments of the present application, the term "plurality" means two or more (including two), and similarly, "plural sets" means two or more (including two), and "plural sheets" means two or more (including two).
In the description of the embodiments of the present application, the orientation or positional relationship indicated by the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present application.
In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like should be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.
The present invention will be described in further detail with reference to fig. 1 to 10, but the present invention is not limited thereto.
As shown in fig. 1, in one embodiment of the present invention, the method of manufacturing the thin RFID tag; comprising the following steps:
S1, manufacturing and detecting a processed flexible substrate to be used as a substrate of an RFID tag; wherein the flexible substrate is a paper substrate;
s2, manufacturing a flexible circuit board on the flexible substrate;
s3, manufacturing an RFID tag antenna with a curve fractal structure;
s4, assembling the RFID tag antenna and the RFID tag chip on an insulating film to form a flexible tag;
s5, assembling the flexible tag to the flexible circuit board to form an RFID tag product.
According to the technical scheme, the flexible substrate is manufactured and detected to obtain the substrate which can accord with the RFID tag, so that the manufacturing smoothness and the manufacturing order can be improved; a flexible circuit board is manufactured on the flexible substrate, so that the smoothness of the subsequent use of the RFID tag antenna and the RFID tag chip is ensured; then, manufacturing the RFID tag antenna with the curve fractal structure, so that the generation of the qualified RFID tag antenna can be further ensured; then the RFID tag antenna and the RFID tag chip are assembled on the insulating film to form a soft tag, so that the assembling accuracy and the using stability of the operation part of the RFID tag can be determined; finally, assembling the flexible tag to the flexible circuit board to form an RFID tag product; therefore, assembly production can be carried out after the qualification of the use of each part is detected and determined, the qualification rate of production can be determined, the production cost is reduced, the thickness of the RFID label can be effectively shortened, the operation normality of the RFID label can be ensured, and the production efficiency is improved.
Specifically, in some embodiments, in S1, the step of manufacturing and inspecting the flexible substrate to be used as the substrate of the RFID tag includes the following steps:
Acquiring at least one A4 printing paper;
Cutting at least one corresponding flexible substrate according to the size of the RFID tag;
and detecting the relative dielectric constant of the flexible substrate in a preset environment.
Further, the step of detecting the relative dielectric constant of the flexible substrate in a preset environment includes the following steps:
Establishing a model with the same size as the real object of the flexible substrate by using HFSS software;
Determining relative dielectric constant as parameter to make simulation model until resonance frequency and actual measurement are close to resonance frequency f 0;
the relative permittivity at this time is an approximate relative permittivity of the flexible substrate;
judging whether the approximate relative dielectric constant is a preset relative dielectric constant. The relative dielectric constant of the flexible substrate of the paper obtained by the method is 2.9 under the UHF frequency band.
The paper with the relative dielectric constant of 2.9 can ensure the stability and smoothness of the use of the label on the premise of ensuring the thickness of the label.
Specifically, in some embodiments, in the step S2, the step of fabricating a flexible circuit board on the flexible substrate includes:
And manufacturing a circuit board with a polyimide substrate or a polyester film substrate on the flexible substrate. The paper is a circuit board of a flexible substrate and a polyimide substrate or a polyester film substrate, so that the label with high wiring density, small quality and thin thickness is realized, the production cost is effectively reduced, and the use stability is improved.
Specifically, in some embodiments, in the step S3, the step of manufacturing the RFID tag antenna with the fractal curve structure includes the following steps:
Obtaining a metal foil;
And manufacturing a resonant antenna model of the deformed Koch curve fractal structure on the metal foil to form the RFID tag antenna with the curve fractal structure. Wherein the metal foil is copper foil. The structure can determine the resonance frequency of the tag through deforming the RFID tag antenna of the Koch curve fractal structure; guaranteeing the stability of the use.
Specifically, in some embodiments, in the step S4, the step of assembling the RFID tag antenna and the RFID tag chip onto an insulating film to form a flexible tag includes the following steps:
bonding the connection point of the RFID tag chip to the pin of the RFID tag antenna by using a conductive bonding part 8;
the assembly point of the RFID tag chip is welded to the mounting point of the RFID tag antenna;
The RFID tag chip and the RFID tag antenna are integrally bonded to the insulating film using a conductive adhesive member 8 to form a flexible tag. The conductive adhesive member 8 is conductive adhesive. That is, the RFID chip is bonded to the pin of the RFID tag antenna by adopting conductive adhesive; thereby, the stability of assembly can be improved and the stability of operation can be ensured.
Specifically, in some embodiments, in the step S4, the step of assembling the RFID tag antenna and the RFID tag chip onto an insulating film to form a flexible tag further includes the following steps:
Placing the flexible label on a metal backplate 200 or a non-metal backplate;
positioning and clamping the soft label by using a clamping frame 500;
Adjusting the center frequency of the 1/2 open line 300 to 915MHz; wherein the 1/2 open line 300 is electrically connected with the feeding portion 400;
And detecting the S parameter of the RFID tag antenna in the soft tag.
That is, the flexible tag is placed on the metal backplate 200 or the nonmetal plate to simulate the working environment of the metal backplate or the nonmetal backplate; total reflection occurs when the length of the 1/2 open line 300 is lambda/2 wavelength. When the RFID tag antenna approaches the transmission line, resonance is generated, so that the resonance frequency of the RFID tag antenna can be tested, and whether the RFID tag antenna is qualified can be judged.
And besides, matching, slotting, parameter optimization and the like are performed on the RFID tag antenna according to the S parameter of the RFID tag antenna, so that an input impedance curve of the RFID tag antenna is obtained as shown in fig. 6. As can be seen from fig. 6: the impedance of the RFID tag antenna at 915MHz is: (27+j196.5) Ω, and an impedance of the RFID chip at 915MHz (27-J201) Ω; i.e., a close conjugate match.
Specifically, in some embodiments, in S5, the step of assembling the flexible tag to the flexible circuit board to form an RFID tag product includes the steps of:
assembling the flexible tag to the flexible circuit board through a conductive adhesive member;
And a matching circuit corresponding to the RFID tag antenna and the RFID tag chip is additionally arranged between the RFID tag antenna and the RFID tag chip so as to form an RFID tag product.
Wherein the conductive adhesive member 8 is a conductive adhesive. Namely, the RFID tag chip 5 is bonded to the pin in the RFID tag antenna 4 by the conductive adhesive, and the adhesive is coated on the back of the surface material and is compounded with the other surface of the RFID tag chip. The embedded design is attractive and elegant, and the anti-counterfeiting trademark effect is achieved; and the space utilization can be effectively improved. Wherein the paper substrate is an A4 printing paper substrate.
That is, since the A4 printing paper substrate is relatively thin, the bandwidth of the RFID tag is small. The bandwidth of the RFID tag can be reasonably increased through the additionally arranged matching circuit, and the running stability and fluency of the RFID tag are ensured.
Specifically, in some embodiments, after the step S5, the step of assembling the flexible tag to the flexible circuit board to form an RFID tag product includes:
Detecting an RFID tag antenna and an RFID tag chip in an RFID tag product;
As shown in fig. 5, the step of detecting the RFID tag antenna and the RFID tag chip in the RFID tag product includes:
placing the product of the RFID tag 100 on a metal backplate 200 or a non-metal backplate;
Positioning and clamping the product of the RFID tag 100 by using a clamping frame 500;
Adjusting the center frequency of the 1/2 open line 300 to 915MHz; wherein the 1/2 open line 300 is electrically connected with the feeding portion 400;
An S parameter of the RFID tag antenna in the product of the RFID tag 100 is detected. That is, the RFID tag antenna of the product of the RFID tag 100 after the production is completed may be detected again; the method comprises the following steps: placing the product of the RFID tag 100 on the metal backplate 200 or the nonmetal plate to simulate the working environment of the metal backplate or the nonmetal backplate; total reflection occurs when the length of the 1/2 open line 300 is lambda/2 wavelength. When the RFID tag antenna approaches the transmission line, resonance is generated, so that the resonance frequency of the RFID tag antenna can be tested, and whether the RFID tag antenna is qualified can be judged.
The model of fig. 4 was parameter optimized using HFSS software modeling, with resonance at 915MHz. And a metal plate or nonmetal plate with the size of 150mm multiplied by 10mm is added on the back surface of the RFID tag antenna so as to simulate a metal object or a nonmetal object. And the radiating surface and the ground are short-circuited through the via holes at both ends of the RFID tag antenna. The radiation pattern of the final RFID tag antenna is shown in fig. 7-9.
By comparing the tag with the surface of a non-metal object, the RFID electronic tag can be used for the surface of the metal object and the surface of the non-metal object. The theoretical reading distance of the RFID tag antenna can be obtained according to the Friis formula as follows:
Wherein: lambda is the working wavelength; p t is the reader transmit power; g t is the reader antenna gain; g T is the tag antenna gain; p th is the minimum power threshold required by the tag chip;
τ is the power transfer coefficient between the RFID tag antenna and the RFID tag chip, where
Thus, using a reader to test the read distance of an RFID tag antenna, the results indicate that: the RFID tag antenna has a working distance of about 3m on the metal surface, and meets the application requirements.
To reduce the resonant frequency of the RFID tag antenna, portions of the antenna on either side are plated through Kong Huadiao (as shown in fig. 4) to increase the resonant loop length of the antenna to reduce the frequency. The actual measurement curve of the debugged S 11 parameters is shown in figure 10. Therefore, the RFID tag antenna at 900-930 MHz is better in matching, and can better meet the actual application and meet the design requirement.
The invention also provides a thin RFID label which is produced based on the steps of the manufacturing method of the thin RFID label, and the specific structure of the manufacturing method of the thin RFID label refers to the embodiment, and as the thin RFID label adopts all the technical schemes of all the embodiments, at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
Wherein, as shown in fig. 2 and 5, the thin RFID tag includes an RFID tag body 100; the RFID tag body 100 comprises a flexible substrate 1, a flexible circuit board 2, a flexible tag and release paper 7 which are sequentially arranged from bottom to top; the flexible tag comprises an RFID tag antenna 4, an RFID tag chip 5 and an insulating film 6; the RFID tag antenna 4 and the RFID tag chip 5 are arranged side by side and connected into a whole; and the RFID tag antenna 4 and the RFID tag chip 5 are attached to an insulating film 6; the RFID tag antenna 4 is electrically connected with the RFID tag chip 5; an insulating film 6 is connected to the release paper 7; the bottom of the RFID tag chip 5 is connected to the flexible circuit board 2. Wherein the insulating film 6 is a KAPTON insulating film.
In particular, in some embodiments, as shown in fig. 4, the RFID tag antenna 4 includes a metal foil and a curved fractal structure; the curve fractal structure is connected to the metal foil; the metal foil is welded to the RFID tag chip 5. Wherein the metal foil is copper foil; the RFID tag chip 5 is a silicon wafer; the curve fractal structure is a deformed Koch curve fractal radiator. That is, a section of matching circuit is added between the RFID tag antenna 4 and the RFID tag chip 5, and the RFID tag antenna 4 and the RFID tag chip 5 are welded by using a low-cost laser technology, so that the production cost is effectively reduced, and the light and thin properties of the silicon wafer and the copper foil are also utilized, so that the RFID tag antenna can be effectively prevented from being visually detected, and can bear a greater degree of bending, so that the use stability is improved. Wherein, the RFID tag chip 5 selects Higgs3, the equivalent resistance of the chip is 1500Ω, and the equivalent capacitance is 0.85pF.
Specifically, in some embodiments, the flexible circuit board 2 is a polyimide-based circuit board or a mylar-based circuit board. The flexible printed circuit board is made of polyimide or polyester film as a base material, so that the label has the characteristics of high wiring density, small quality and thin thickness.
Wherein, the flexible substrate 1 is made of paper; further, the paper is A4 printing paper; still further, the thickness of the A4 printing paper was 0.1mm. Since the relative dielectric constant of the printing paper in the UHF band is 2.9, the RFID tag body 100 can have conductivity and signal transmission smoothness. The structure adopts common A4 paper with the thickness of 0.1 millimeter as a substrate of the tag antenna, and the flexible circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a substrate and has the characteristics of high reliability, small quality and thin thickness, so as to realize the characteristics of high wiring density.
Specifically, in some embodiments, as shown in fig. 2 and 3, the release paper 7 includes a silicone oil 71, a coating film 72, and a base paper 73 sequentially disposed from top to bottom; and the base paper 73 is attached to the insulating film 6.
Specifically, in some embodiments, as shown in fig. 2, the RFID tag body 100 further includes a waterproof film 3 and a conductive adhesive member 8; the waterproof film 3 is arranged on the flexible substrate 1 and surrounds the periphery of the RFID tag chip; the conductive adhesive member 8 is connected between the RFID tag antenna 4 and the RFID tag chip 5. Wherein the conductive adhesive member 8 is a conductive adhesive. Namely, the RFID tag chip 5 is bonded to the pin in the RFID tag antenna 4 by the conductive adhesive, and the adhesive is coated on the back of the surface material and is compounded with the other surface of the RFID tag chip. The embedded design is attractive and elegant, and the anti-counterfeiting trademark effect is achieved; and the space utilization can be effectively improved.
Wherein, the waterproof film 3 is an expanded PTFE film or an expanded polytetrafluoroethylene film; and the thickness of the waterproof film 3 is 1 to 3mm. The waterproof and isolating effects of the RFID tag body 100 can be effectively guaranteed through the waterproof film 3 with the thickness of 1-3 mm, and the assembly stability of the RFID tag antenna 4 and the RFID tag chip 5 can also be guaranteed, so that the optimal thin effect of the flexible tag is guaranteed as much as possible, the whole thickness of the RFID tag body 100 is reduced, and the installation space of the RFID tag body is reduced.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the embodiments of the disclosure may be suitably combined to form other embodiments as will be understood by those skilled in the art.
Variations and modifications of the above embodiments will occur to those skilled in the art to which the invention pertains from the foregoing disclosure and teachings. Therefore, the present invention is not limited to the above-described embodiments, but is intended to be capable of modification, substitution or variation in light thereof, which will be apparent to those skilled in the art in light of the present teachings. In addition, although specific terms are used in the present specification, these terms are for convenience of description only and do not limit the present invention in any way.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410243897.4A CN118095308A (en) | 2024-03-04 | 2024-03-04 | A thin RFID tag and a manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410243897.4A CN118095308A (en) | 2024-03-04 | 2024-03-04 | A thin RFID tag and a manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN118095308A true CN118095308A (en) | 2024-05-28 |
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| CN202410243897.4A Pending CN118095308A (en) | 2024-03-04 | 2024-03-04 | A thin RFID tag and a manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119748974A (en) * | 2024-12-25 | 2025-04-04 | 浙江卡游科技有限公司 | Paper RFID card manufacturing method and paper RFID card |
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| US20060181716A1 (en) * | 2005-01-28 | 2006-08-17 | Seiko Epson Corporation | RFID tag, printing paper, printer, and RFID system |
| CN109314307A (en) * | 2016-05-06 | 2019-02-05 | 唯景公司 | window antenna |
| CN111105003A (en) * | 2019-12-26 | 2020-05-05 | 江苏孚登物联网技术有限公司 | Electronic tag and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060181716A1 (en) * | 2005-01-28 | 2006-08-17 | Seiko Epson Corporation | RFID tag, printing paper, printer, and RFID system |
| CN109314307A (en) * | 2016-05-06 | 2019-02-05 | 唯景公司 | window antenna |
| CN111105003A (en) * | 2019-12-26 | 2020-05-05 | 江苏孚登物联网技术有限公司 | Electronic tag and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119748974A (en) * | 2024-12-25 | 2025-04-04 | 浙江卡游科技有限公司 | Paper RFID card manufacturing method and paper RFID card |
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