CN111019298A - 树脂组合物和高耐热金属基覆铜板 - Google Patents
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Abstract
本发明提供一种树脂组合物和高耐热金属基覆铜板，其中树脂组合物，按照重量份数计，包括5至35份的多官能团酚醛环氧树脂、20至40份的酚醛清漆型氰酸酯以及20至60份的无机填料。高耐热金属基覆铜板包括上述的树脂组合物。该树脂组合物具有高导热和高电绝缘性。
Description
技术领域
本发明涉及金属基覆铜板技术领域，具体地说，是涉及一种高导热的树脂组合物和高耐热金属基覆铜板。
背景技术
随着电子产品向轻、薄、小、高密度、多功能化发展，印制板上元件组装密度和集成度越来越高，功率消耗越来越大，对基板的散热性要求越来越迫切，如果基板的散热性不好，就会导致印制电路板上元器件过热，从而使整机可靠性下降，在此背景下诞生了高散热的金属基覆铜板。
金属基覆铜板具有优异的散热性、电绝缘性、耐热性、粘结性等特性，为了尽可能提高金属基覆铜板的散热性，往往需要添加大量导热填料，但随着散热性的提高，介质层的粘附性、导热性和电绝缘性会急剧下降。
发明内容
本发明的第一目的是提供一种具有高导热和高电绝缘性的树脂组合物。
本发明的第二目的是提供一种具有上述树脂组合物的金属基覆铜板。
为实现上述目的，本发明提供一种树脂组合物，按照重量份数计，树脂组合物包括5至35份的多官能团酚醛环氧树脂、20至40份的酚醛清漆型氰酸酯以及20至60份的无机填料。
一个优选的方案是，树脂组合物还包括胺类固化剂，胺类固化剂为二氨基二苯砜。
进一步的方案是，胺类固化剂的含量在5.6份至10.4份范围内。
一个优选的方案是，树脂组合物还包括固化催化剂，固化催化剂为1-氰乙基-2-乙基-4-甲基咪唑，固化催化剂的含量在0.07份至0.13份范围内。
一个优选的方案是，多官能团酚醛环氧树脂为双酚A型环氧树脂、邻甲酚醛环氧树脂中的至少一种。
一个优选的方案是，多官能团酚醛环氧树脂为20至30份，酚醛清漆型氰酸酯为20至30份。
一个优选的方案是，无机填料为氧化铝、二氧化硅、氮化硼、氮化铝中的至少一种。
一个优选的方案是，无机填料采用偶联剂对其进行表面处理，偶联剂为硅烷偶联剂，偶联剂的质量是无机填料质量的0.5％至5％。
为实现上述第二目的，本发明提供一种高耐热金属基覆铜板，包括至少一层绝缘层，绝缘层由上述的树脂组合物制成。
一个优选的方案是，绝缘层厚度在50微米至150微米范围内。
本发明的有益效果是，氰酸酯酚醛清漆型树脂能够提高树脂组合物的耐热性，多官能团酚醛环氧树脂能够提高树脂基体和诸如铜箔等的导体基底表面之间的粘结力。使用高耐热和耐高温抗老化性能好的高Tg的氰酸酯酚醛清漆型树脂保证绝缘层的耐高温抗老化性能。满足绝缘层在温度200℃条件处理1000H以后，各项性能指标仍然保持在一个很高的水准。
多官能团酚醛环氧树脂与酚醛清漆型氰酸酯的含量比值在适当范围时，可避免铝基板在长时间高温的环境中出现绝缘层脱落,加速老化。使用偶联剂对无机填料进行表面处理，以改善无机填料与树脂之间的结合界面，提升材料整体的高耐热和高散热性能。
为了进一步改善绝缘层的散热性，通过高度填充导热填料，可以减少绝缘层的厚度并降低热阻。从导热性的观点出发，氮化物填料的材料优选为氮化硼和氮化铝中的至少一种，从绝缘性的观点来看，更优选为氮化硼。
具体实施方式
下述各实施例中的多官能团酚醛环氧树脂选用邻甲酚醛环氧树脂，胺类固化剂选用二氨基二苯砜，固化催化剂选用1－氰乙基－2－乙基－4－甲基咪唑，无机填料选用氮化硼或氧化铝。
树脂组合物实施例1
邻甲酚醛环氧树脂30份(以重量份数计，下同)，酚醛清漆型氰酸酯20份，二氨基二苯砜8份，1－氰乙基－2－乙基－4－甲基咪唑0.1份，氮化硼20份。
树脂组合物实施例2
邻甲酚醛环氧树脂25份，酚醛清漆型氰酸酯25份，二氨基二苯砜8份，1－氰乙基－2－乙基－4－甲基咪唑0.1份，氧化铝60份。
树脂组合物实施例3
邻甲酚醛环氧树脂5份，酚醛清漆型氰酸酯40份，二氨基二苯砜8份，1－氰乙基－2－乙基－4－甲基咪唑0.1份，氮化硼20份。
树脂组合物比较例1
邻甲酚醛环氧树脂35份，二氨基二苯砜8份，1－氰乙基－2－乙基－4－甲基咪唑0.1份，氮化硼20份。
树脂组合物比较例2
邻甲酚醛环氧树脂25份，酚醛清漆型氰酸酯25份，二氨基二苯砜8份，1－氰乙基－2－乙基－4－甲基咪唑0.1份，氮化硼20份。
使用球磨机、罐磨机、砂磨机等类似设备，并配合使用高剪切搅拌分散设备，可以将上述各组分混合在一起。
性能测试的测定方法
1、玻璃化温度：采用差示扫描量热仪，以一个略高于室温但远低于试样预计玻璃化温度的初始温度(如30℃)开始扫描，升温速度为(20±2)℃/min。观察到热变形后，继续升温至热变形区以上30℃，停止扫描。根据玻璃化温度DSC测试曲线图，获得玻璃化温度Tg。
2、吸水率：金属基覆铜板的吸水率按GB/T4722中的吸水率进行测试。试样采用压制成约0.25毫米厚的绝缘基材。
3、耐电压测试：从室温的水中取出预处理的试样，用无绒毛纸巾或面擦干，用涂层测厚仪测量并记录每个边距边缘25mm中点处的绝缘粘结层厚度。将试样插入夹具中心，浸没于油槽中，以防止飞弧。启动测试仪，以500V/s的速度升压，观察击穿时测试仪指示的电压值。
4、耐热性：金属基覆铜板的热应力按GB/T4722中热应力进行检验，测试温度为288℃，时间为60秒。
各实施例、比较例的树脂组合物的配比及性能测试结果如下表所示。
表1
由上表可见，当树脂组合物中添加酚醛清漆型氰酸酯时，玻璃化温度可达到210℃，耐压值达到4.5KV以上，使用酚醛清漆型氰酸酯能够提高树脂组合物的耐热性，多官能团酚醛环氧树脂能够提高树脂基体和诸如铜箔等的导体基底表面之间的粘结力。使用高耐热型树脂体系和耐高温抗老化性能好的高Tg的氰酸酯酚醛清漆型树脂保证绝缘层的耐高温抗老化性能。满足绝缘层在温度200℃条件处理1000H以后，各项性能指标仍然保持在一个很高的水准。
其中，无机填料可以采用偶联剂对其进行表面处理，偶联剂无特殊要求，可选用硅烷偶联剂，偶联剂的质量是无机填料质量的0.5％至5％，更优选为无机填料质量的1.0％至2.0％。偶联剂能够改善填料与树脂之间的结合界面，提升材料整体的高耐热和高散热性能。
此外，优选地，胺类固化剂的含量在5.6份至10.4份范围内，固化催化剂的含量在0.07至0.13份。多官能团酚醛环氧树脂也可以选用双酚A型环氧树脂、邻甲酚醛环氧树脂中的至少一种。无机填料也可以选用氧化铝、二氧化硅、氮化硼、氮化铝中的一种或多种，其中，氮化硼能够使得树脂组合物具有更好的绝缘性。上述改变也能实现本发明的目的。
高耐热金属基覆铜板实施例
本实施例的高耐热金属基覆铜板包括至少一层绝缘层，绝缘层由上述各树脂组合物实施例中的树脂组合物制成。
另外，制作过程中，可使用景深高分辨率电子显微镜对绝缘层中的无机填料进行观测，调整不同粒径形状颗粒在绝缘层中的分布形态，以达到最优的填充效果。
对金属基板表面覆胶进行处理，提高金属基板与绝缘层之间的结合力，防止加工过程中金属基板与绝缘层脱离。优选地，绝缘层厚度在50微米至150微米范围内。
最后需要强调的是，以上仅为本发明的优选实施例，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种变化和更改，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (10)
1.树脂组合物，其特征在于：
按照重量份数计，所述树脂组合物包括5至35份的多官能团酚醛环氧树脂、20至40份的酚醛清漆型氰酸酯和20至60份的无机填料。
2.根据权利要求1所述的树脂组合物，其特征在于：
所述树脂组合物还包括胺类固化剂，所述胺类固化剂为二氨基二苯砜。
3.根据权利要求2所述的树脂组合物，其特征在于：
所述胺类固化剂的含量在5.6份至10.4份范围内。
4.根据权利要求1所述的树脂组合物，其特征在于：
所述树脂组合物还包括固化催化剂，所述固化催化剂为1-氰乙基-2-乙基-4-甲基咪唑，所述固化催化剂的含量在0.07份至0.13份范围内。
5.根据权利要求1至4任一项所述的树脂组合物，其特征在于：
所述多官能团酚醛环氧树脂为双酚A型环氧树脂、邻甲酚醛环氧树脂中的至少一种。
6.根据权利要求1至4任一项所述的树脂组合物，其特征在于：
所述多官能团酚醛环氧树脂为20至30份，所述酚醛清漆型氰酸酯为20至30份。
7.根据权利要求1至4任一项所述的树脂组合物，其特征在于：
所述无机填料为氧化铝、二氧化硅、氮化硼、氮化铝中的至少一种。
8.根据权利要求1至4任一项所述的树脂组合物，其特征在于：
所述无机填料采用偶联剂对其进行表面处理，所述偶联剂为硅烷偶联剂，所述偶联剂的质量是无机填料质量的0.5％至5％。
9.高耐热金属基覆铜板，包括至少一层绝缘层，其特征在于，所述绝缘层由如权利要求1至8任一项所述的树脂组合物制成。
10.根据权利要求9所述的高耐热金属基覆铜板，其特征在于：
所述绝缘层厚度在50微米至150微米范围内。
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101652425A (zh) * | 2007-04-10 | 2010-02-17 | 住友电木株式会社 | 树脂组合物、预成型料、层叠板、多层印刷布线板和半导体装置 |
| CN103724999A (zh) * | 2013-05-30 | 2014-04-16 | 广东生益科技股份有限公司 | 一种氰酸酯树脂组合物及其用途 |
| CN103724998A (zh) * | 2013-05-30 | 2014-04-16 | 广东生益科技股份有限公司 | 一种氰酸酯树脂组合物及其用途 |
| CN109851997A (zh) * | 2018-12-25 | 2019-06-07 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652425A (zh) * | 2007-04-10 | 2010-02-17 | 住友电木株式会社 | 树脂组合物、预成型料、层叠板、多层印刷布线板和半导体装置 |
| CN103724999A (zh) * | 2013-05-30 | 2014-04-16 | 广东生益科技股份有限公司 | 一种氰酸酯树脂组合物及其用途 |
| CN103724998A (zh) * | 2013-05-30 | 2014-04-16 | 广东生益科技股份有限公司 | 一种氰酸酯树脂组合物及其用途 |
| CN109851997A (zh) * | 2018-12-25 | 2019-06-07 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板 |
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