CN118812766A - Resist material, resist composition, pattern forming method, and monomer - Google Patents
Resist material, resist composition, pattern forming method, and monomer Download PDFInfo
- Publication number
- CN118812766A CN118812766A CN202410467831.3A CN202410467831A CN118812766A CN 118812766 A CN118812766 A CN 118812766A CN 202410467831 A CN202410467831 A CN 202410467831A CN 118812766 A CN118812766 A CN 118812766A
- Authority
- CN
- China
- Prior art keywords
- group
- carbon atoms
- bond
- atom
- ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 107
- 239000000178 monomer Substances 0.000 title claims abstract description 96
- 239000000203 mixture Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 22
- 229920000642 polymer Polymers 0.000 claims abstract description 103
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims abstract description 26
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims abstract description 26
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical group OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 244
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 65
- 239000002253 acid Substances 0.000 claims description 64
- 125000005843 halogen group Chemical group 0.000 claims description 64
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 62
- 125000004122 cyclic group Chemical group 0.000 claims description 61
- 125000001153 fluoro group Chemical group F* 0.000 claims description 55
- 229910052731 fluorine Inorganic materials 0.000 claims description 51
- 125000005842 heteroatom Chemical group 0.000 claims description 49
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 49
- 125000004185 ester group Chemical group 0.000 claims description 46
- 125000002947 alkylene group Chemical group 0.000 claims description 45
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 44
- 125000001033 ether group Chemical group 0.000 claims description 38
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 36
- 125000000217 alkyl group Chemical group 0.000 claims description 34
- 125000004434 sulfur atom Chemical group 0.000 claims description 33
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 29
- 125000003545 alkoxy group Chemical group 0.000 claims description 29
- 229910052740 iodine Inorganic materials 0.000 claims description 29
- 125000004423 acyloxy group Chemical group 0.000 claims description 27
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 26
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 25
- 229910052717 sulfur Inorganic materials 0.000 claims description 25
- 125000003368 amide group Chemical group 0.000 claims description 24
- 125000005647 linker group Chemical group 0.000 claims description 24
- 150000008053 sultones Chemical group 0.000 claims description 24
- 125000004957 naphthylene group Chemical group 0.000 claims description 22
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 22
- 239000003960 organic solvent Substances 0.000 claims description 18
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 17
- 239000011630 iodine Substances 0.000 claims description 16
- 125000000686 lactone group Chemical group 0.000 claims description 12
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 12
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 11
- 238000010894 electron beam technology Methods 0.000 claims description 11
- 239000004094 surface-active agent Substances 0.000 claims description 11
- 150000002500 ions Chemical class 0.000 claims description 10
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 125000005587 carbonate group Chemical group 0.000 claims description 8
- 230000000269 nucleophilic effect Effects 0.000 claims description 7
- 125000004036 acetal group Chemical group 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 5
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 230000035945 sensitivity Effects 0.000 abstract description 16
- 239000002994 raw material Substances 0.000 abstract description 4
- -1 methylene, ethylene, phenylene Chemical group 0.000 description 140
- 150000002430 hydrocarbons Chemical group 0.000 description 88
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 72
- 230000015572 biosynthetic process Effects 0.000 description 69
- 238000003786 synthesis reaction Methods 0.000 description 66
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 46
- 238000006243 chemical reaction Methods 0.000 description 45
- 229930195734 saturated hydrocarbon Natural products 0.000 description 45
- 230000002829 reductive effect Effects 0.000 description 40
- 239000007787 solid Substances 0.000 description 40
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 38
- 229910052757 nitrogen Inorganic materials 0.000 description 38
- 238000005160 1H NMR spectroscopy Methods 0.000 description 31
- 150000002596 lactones Chemical group 0.000 description 29
- 230000000052 comparative effect Effects 0.000 description 28
- 239000002904 solvent Substances 0.000 description 28
- 238000005227 gel permeation chromatography Methods 0.000 description 26
- 238000009792 diffusion process Methods 0.000 description 24
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 23
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 23
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 22
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 21
- 239000010408 film Substances 0.000 description 20
- 239000000243 solution Substances 0.000 description 20
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 19
- 239000003505 polymerization initiator Substances 0.000 description 19
- 238000007664 blowing Methods 0.000 description 18
- 238000007872 degassing Methods 0.000 description 18
- 238000010792 warming Methods 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 150000001450 anions Chemical class 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 15
- 125000004430 oxygen atom Chemical group O* 0.000 description 14
- 229920006395 saturated elastomer Polymers 0.000 description 14
- 238000004090 dissolution Methods 0.000 description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 12
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 10
- 125000004433 nitrogen atom Chemical group N* 0.000 description 10
- VSYDNHCEDWYFBX-UHFFFAOYSA-N (1-methylcyclopentyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)CCCC1 VSYDNHCEDWYFBX-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 238000001228 spectrum Methods 0.000 description 8
- YNGIFMKMDRDNBQ-UHFFFAOYSA-N 3-ethenylphenol Chemical compound OC1=CC=CC(C=C)=C1 YNGIFMKMDRDNBQ-UHFFFAOYSA-N 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000011161 development Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- 239000003112 inhibitor Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 150000003460 sulfonic acids Chemical class 0.000 description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- FRDAATYAJDYRNW-UHFFFAOYSA-N 3-methyl-3-pentanol Chemical compound CCC(C)(O)CC FRDAATYAJDYRNW-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 101150068794 RFC2 gene Proteins 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 4
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 125000001309 chloro group Chemical group Cl* 0.000 description 4
- 229940125782 compound 2 Drugs 0.000 description 4
- 229940126214 compound 3 Drugs 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 4
- HNBDRPTVWVGKBR-UHFFFAOYSA-N n-pentanoic acid methyl ester Natural products CCCCC(=O)OC HNBDRPTVWVGKBR-UHFFFAOYSA-N 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- XMDHFACJUDGSLF-UHFFFAOYSA-N 2-naphthalen-1-ylethenol Chemical compound C1=CC=C2C(C=CO)=CC=CC2=C1 XMDHFACJUDGSLF-UHFFFAOYSA-N 0.000 description 3
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000002252 acyl group Chemical group 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 238000005904 alkaline hydrolysis reaction Methods 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 3
- 229920005601 base polymer Polymers 0.000 description 3
- 150000007514 bases Chemical class 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- 125000001188 haloalkyl group Chemical group 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 230000005469 synchrotron radiation Effects 0.000 description 3
- JDKDXMANZJAPFX-UHFFFAOYSA-N (1-ethynylcyclopentyl) 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OC1(CCCC1)C#C JDKDXMANZJAPFX-UHFFFAOYSA-N 0.000 description 2
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical group FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 2
- QEGNUYASOUJEHD-UHFFFAOYSA-N 1,1-dimethylcyclohexane Chemical compound CC1(C)CCCCC1 QEGNUYASOUJEHD-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 2
- CTMHWPIWNRWQEG-UHFFFAOYSA-N 1-methylcyclohexene Chemical compound CC1=CCCCC1 CTMHWPIWNRWQEG-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- ZSDQQJHSRVEGTJ-UHFFFAOYSA-N 2-(6-amino-1h-indol-3-yl)acetonitrile Chemical compound NC1=CC=C2C(CC#N)=CNC2=C1 ZSDQQJHSRVEGTJ-UHFFFAOYSA-N 0.000 description 2
- AVMSWPWPYJVYKY-UHFFFAOYSA-N 2-Methylpropyl formate Chemical compound CC(C)COC=O AVMSWPWPYJVYKY-UHFFFAOYSA-N 0.000 description 2
- SZNYYWIUQFZLLT-UHFFFAOYSA-N 2-methyl-1-(2-methylpropoxy)propane Chemical compound CC(C)COCC(C)C SZNYYWIUQFZLLT-UHFFFAOYSA-N 0.000 description 2
- PFNHSEQQEPMLNI-UHFFFAOYSA-N 2-methyl-1-pentanol Chemical compound CCCC(C)CO PFNHSEQQEPMLNI-UHFFFAOYSA-N 0.000 description 2
- WFRBDWRZVBPBDO-UHFFFAOYSA-N 2-methyl-2-pentanol Chemical compound CCCC(C)(C)O WFRBDWRZVBPBDO-UHFFFAOYSA-N 0.000 description 2
- ISTJMQSHILQAEC-UHFFFAOYSA-N 2-methyl-3-pentanol Chemical compound CCC(O)C(C)C ISTJMQSHILQAEC-UHFFFAOYSA-N 0.000 description 2
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 2
- IKDIJXDZEYHZSD-UHFFFAOYSA-N 2-phenylethyl formate Chemical compound O=COCCC1=CC=CC=C1 IKDIJXDZEYHZSD-UHFFFAOYSA-N 0.000 description 2
- IWTBVKIGCDZRPL-UHFFFAOYSA-N 3-methylpentanol Chemical compound CCC(C)CCO IWTBVKIGCDZRPL-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- UYWQUFXKFGHYNT-UHFFFAOYSA-N Benzylformate Chemical compound O=COCC1=CC=CC=C1 UYWQUFXKFGHYNT-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- CRZQGDNQQAALAY-UHFFFAOYSA-N Methyl benzeneacetate Chemical compound COC(=O)CC1=CC=CC=C1 CRZQGDNQQAALAY-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 150000001345 alkine derivatives Chemical class 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229940043232 butyl acetate Drugs 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- DMEGYFMYUHOHGS-UHFFFAOYSA-N cycloheptane Chemical compound C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010511 deprotection reaction Methods 0.000 description 2
- QWHNJUXXYKPLQM-UHFFFAOYSA-N dimethyl cyclopentane Natural products CC1(C)CCCC1 QWHNJUXXYKPLQM-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical group C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 125000001634 furandiyl group Chemical group O1C(=C(C=C1)*)* 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 2
- ZOCHHNOQQHDWHG-UHFFFAOYSA-N hexan-3-ol Chemical compound CCCC(O)CC ZOCHHNOQQHDWHG-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- XKYICAQFSCFURC-UHFFFAOYSA-N isoamyl formate Chemical compound CC(C)CCOC=O XKYICAQFSCFURC-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- RPUSRLKKXPQSGP-UHFFFAOYSA-N methyl 3-phenylpropanoate Chemical compound COC(=O)CCC1=CC=CC=C1 RPUSRLKKXPQSGP-UHFFFAOYSA-N 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- MBAHGFJTIVZLFB-UHFFFAOYSA-N methyl pent-2-enoate Chemical compound CCC=CC(=O)OC MBAHGFJTIVZLFB-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methylcyclopentane Chemical compound CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 2
- 238000012705 nitroxide-mediated radical polymerization Methods 0.000 description 2
- VKCYHJWLYTUGCC-UHFFFAOYSA-N nonan-2-one Chemical compound CCCCCCCC(C)=O VKCYHJWLYTUGCC-UHFFFAOYSA-N 0.000 description 2
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 2
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- MDHYEMXUFSJLGV-UHFFFAOYSA-N phenethyl acetate Chemical compound CC(=O)OCCC1=CC=CC=C1 MDHYEMXUFSJLGV-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002522 swelling effect Effects 0.000 description 2
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 2
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- 238000010626 work up procedure Methods 0.000 description 2
- BTFCIGNUXIUMNF-UHFFFAOYSA-N (1-ethenylcyclopentyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C=C)CCCC1 BTFCIGNUXIUMNF-UHFFFAOYSA-N 0.000 description 1
- LBHPSYROQDMVBS-UHFFFAOYSA-N (1-methylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)CCCCC1 LBHPSYROQDMVBS-UHFFFAOYSA-N 0.000 description 1
- HSINOMROUCMIEA-FGVHQWLLSA-N (2s,4r)-4-[(3r,5s,6r,7r,8s,9s,10s,13r,14s,17r)-6-ethyl-3,7-dihydroxy-10,13-dimethyl-2,3,4,5,6,7,8,9,11,12,14,15,16,17-tetradecahydro-1h-cyclopenta[a]phenanthren-17-yl]-2-methylpentanoic acid Chemical compound C([C@@]12C)C[C@@H](O)C[C@H]1[C@@H](CC)[C@@H](O)[C@@H]1[C@@H]2CC[C@]2(C)[C@@H]([C@H](C)C[C@H](C)C(O)=O)CC[C@H]21 HSINOMROUCMIEA-FGVHQWLLSA-N 0.000 description 1
- 239000001618 (3R)-3-methylpentan-1-ol Substances 0.000 description 1
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- JLIDRDJNLAWIKT-UHFFFAOYSA-N 1,2-dimethyl-3h-benzo[e]indole Chemical compound C1=CC=CC2=C(C(=C(C)N3)C)C3=CC=C21 JLIDRDJNLAWIKT-UHFFFAOYSA-N 0.000 description 1
- TXNWMICHNKMOBR-UHFFFAOYSA-N 1,2-dimethylcyclohexene Chemical compound CC1=C(C)CCCC1 TXNWMICHNKMOBR-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JEIHSRORUWXJGF-UHFFFAOYSA-N 1-[(2-methylpropan-2-yl)oxy]propan-2-yl acetate Chemical compound CC(=O)OC(C)COC(C)(C)C JEIHSRORUWXJGF-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- CGHIBGNXEGJPQZ-UHFFFAOYSA-N 1-hexyne Chemical compound CCCCC#C CGHIBGNXEGJPQZ-UHFFFAOYSA-N 0.000 description 1
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- AOPDRZXCEAKHHW-UHFFFAOYSA-N 1-pentoxypentane Chemical compound CCCCCOCCCCC AOPDRZXCEAKHHW-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- YQTCQNIPQMJNTI-UHFFFAOYSA-N 2,2-dimethylpropan-1-one Chemical group CC(C)(C)[C]=O YQTCQNIPQMJNTI-UHFFFAOYSA-N 0.000 description 1
- IKECULIHBUCAKR-UHFFFAOYSA-N 2,3-dimethylbutan-2-ol Chemical compound CC(C)C(C)(C)O IKECULIHBUCAKR-UHFFFAOYSA-N 0.000 description 1
- QNVRIHYSUZMSGM-LURJTMIESA-N 2-Hexanol Natural products CCCC[C@H](C)O QNVRIHYSUZMSGM-LURJTMIESA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- HHBZZTKMMLDNDN-UHFFFAOYSA-N 2-butan-2-yloxybutane Chemical compound CCC(C)OC(C)CC HHBZZTKMMLDNDN-UHFFFAOYSA-N 0.000 description 1
- QGLVWTFUWVTDEQ-UHFFFAOYSA-N 2-chloro-3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1Cl QGLVWTFUWVTDEQ-UHFFFAOYSA-N 0.000 description 1
- SZIFAVKTNFCBPC-UHFFFAOYSA-N 2-chloroethanol Chemical compound OCCCl SZIFAVKTNFCBPC-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- TZYRSLHNPKPEFV-UHFFFAOYSA-N 2-ethyl-1-butanol Chemical compound CCC(CC)CO TZYRSLHNPKPEFV-UHFFFAOYSA-N 0.000 description 1
- BUWXUSLQPDDDSD-UHFFFAOYSA-N 2-methyl-2-(2-methylbutan-2-yloxy)butane Chemical compound CCC(C)(C)OC(C)(C)CC BUWXUSLQPDDDSD-UHFFFAOYSA-N 0.000 description 1
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WBPAQKQBUKYCJS-UHFFFAOYSA-N 2-methylpropyl 2-hydroxypropanoate Chemical compound CC(C)COC(=O)C(C)O WBPAQKQBUKYCJS-UHFFFAOYSA-N 0.000 description 1
- UZVICGKNLLBYRV-UHFFFAOYSA-N 2-naphthalen-1-ylethenyl acetate Chemical compound C1=CC=C2C(C=COC(=O)C)=CC=CC2=C1 UZVICGKNLLBYRV-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- UVEFRWMGQRNNDB-UHFFFAOYSA-N 2-pentan-2-yloxypentane Chemical compound CCCC(C)OC(C)CCC UVEFRWMGQRNNDB-UHFFFAOYSA-N 0.000 description 1
- FMFHUEMLVAIBFI-UHFFFAOYSA-N 2-phenylethenyl acetate Chemical compound CC(=O)OC=CC1=CC=CC=C1 FMFHUEMLVAIBFI-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DUXCSEISVMREAX-UHFFFAOYSA-N 3,3-dimethylbutan-1-ol Chemical compound CC(C)(C)CCO DUXCSEISVMREAX-UHFFFAOYSA-N 0.000 description 1
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- ZXNBBWHRUSXUFZ-UHFFFAOYSA-N 3-methyl-2-pentanol Chemical compound CCC(C)C(C)O ZXNBBWHRUSXUFZ-UHFFFAOYSA-N 0.000 description 1
- CRORGGSWAKIXSA-UHFFFAOYSA-N 3-methylbutyl 2-hydroxypropanoate Chemical compound CC(C)CCOC(=O)C(C)O CRORGGSWAKIXSA-UHFFFAOYSA-N 0.000 description 1
- GYWYASONLSQZBB-UHFFFAOYSA-N 3-methylhexan-2-one Chemical compound CCCC(C)C(C)=O GYWYASONLSQZBB-UHFFFAOYSA-N 0.000 description 1
- BWGRDBSNKQABCB-UHFFFAOYSA-N 4,4-difluoro-N-[3-[3-(3-methyl-5-propan-2-yl-1,2,4-triazol-4-yl)-8-azabicyclo[3.2.1]octan-8-yl]-1-thiophen-2-ylpropyl]cyclohexane-1-carboxamide Chemical compound CC(C)C1=NN=C(C)N1C1CC2CCC(C1)N2CCC(NC(=O)C1CCC(F)(F)CC1)C1=CC=CS1 BWGRDBSNKQABCB-UHFFFAOYSA-N 0.000 description 1
- JVVRCYWZTJLJSG-UHFFFAOYSA-N 4-dimethylaminophenol Chemical compound CN(C)C1=CC=C(O)C=C1 JVVRCYWZTJLJSG-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-dimethylaminopyridine Substances CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 1
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- PCWGTDULNUVNBN-UHFFFAOYSA-N 4-methylpentan-1-ol Chemical compound CC(C)CCCO PCWGTDULNUVNBN-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 102100031854 60S ribosomal protein L14 Human genes 0.000 description 1
- 101710187795 60S ribosomal protein L15 Proteins 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 101710141544 Allatotropin-related peptide Proteins 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241001448862 Croton Species 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- AQZGPSLYZOOYQP-UHFFFAOYSA-N Diisoamyl ether Chemical compound CC(C)CCOCCC(C)C AQZGPSLYZOOYQP-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- 101000704267 Homo sapiens 60S ribosomal protein L14 Proteins 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 1
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 1
- 229910020968 MoSi2 Inorganic materials 0.000 description 1
- LFZAGIJXANFPFN-UHFFFAOYSA-N N-[3-[4-(3-methyl-5-propan-2-yl-1,2,4-triazol-4-yl)piperidin-1-yl]-1-thiophen-2-ylpropyl]acetamide Chemical compound C(C)(C)C1=NN=C(N1C1CCN(CC1)CCC(C=1SC=CC=1)NC(C)=O)C LFZAGIJXANFPFN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910008812 WSi Inorganic materials 0.000 description 1
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical compound C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- 229940022663 acetate Drugs 0.000 description 1
- IPBVNPXQWQGGJP-UHFFFAOYSA-N acetic acid phenyl ester Natural products CC(=O)OC1=CC=CC=C1 IPBVNPXQWQGGJP-UHFFFAOYSA-N 0.000 description 1
- 125000001539 acetonyl group Chemical group [H]C([H])([H])C(=O)C([H])([H])* 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 125000003670 adamantan-2-yl group Chemical group [H]C1([H])C(C2([H])[H])([H])C([H])([H])C3([H])C([*])([H])C1([H])C([H])([H])C2([H])C3([H])[H] 0.000 description 1
- JIMXXGFJRDUSRO-UHFFFAOYSA-N adamantane-1-carboxylic acid Chemical compound C1C(C2)CC3CC2CC1(C(=O)O)C3 JIMXXGFJRDUSRO-UHFFFAOYSA-N 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- DULCUDSUACXJJC-UHFFFAOYSA-N benzeneacetic acid ethyl ester Natural products CCOC(=O)CC1=CC=CC=C1 DULCUDSUACXJJC-UHFFFAOYSA-N 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000003613 bile acid Substances 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004657 carbamic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- GPTJTTCOVDDHER-UHFFFAOYSA-N cyclononane Chemical compound C1CCCCCCCC1 GPTJTTCOVDDHER-UHFFFAOYSA-N 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 125000004851 cyclopentylmethyl group Chemical group C1(CCCC1)C* 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- CSYSRRCOBYEGPI-UHFFFAOYSA-N diazo(sulfonyl)methane Chemical compound [N-]=[N+]=C=S(=O)=O CSYSRRCOBYEGPI-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 125000005982 diphenylmethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- YVXHZKKCZYLQOP-UHFFFAOYSA-N hept-1-yne Chemical compound CCCCCC#C YVXHZKKCZYLQOP-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000671 immersion lithography Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 description 1
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical class [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- MCVVUJPXSBQTRZ-ONEGZZNKSA-N methyl (e)-but-2-enoate Chemical compound COC(=O)\C=C\C MCVVUJPXSBQTRZ-ONEGZZNKSA-N 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 125000004092 methylthiomethyl group Chemical group [H]C([H])([H])SC([H])([H])* 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000004043 oxo group Chemical group O=* 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GXOHBWLPQHTYPF-UHFFFAOYSA-N pentyl 2-hydroxypropanoate Chemical compound CCCCCOC(=O)C(C)O GXOHBWLPQHTYPF-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- WLJVXDMOQOGPHL-UHFFFAOYSA-M phenylacetate Chemical compound [O-]C(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-M 0.000 description 1
- 229940049953 phenylacetate Drugs 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- DFOXKPDFWGNLJU-UHFFFAOYSA-N pinacolyl alcohol Chemical compound CC(O)C(C)(C)C DFOXKPDFWGNLJU-UHFFFAOYSA-N 0.000 description 1
- 108010001861 pregnancy-associated glycoprotein 1 Proteins 0.000 description 1
- 150000003139 primary aliphatic amines Chemical class 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 150000005619 secondary aliphatic amines Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- XHFLOLLMZOTPSM-UHFFFAOYSA-M sodium;hydrogen carbonate;hydrate Chemical compound [OH-].[Na+].OC(O)=O XHFLOLLMZOTPSM-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- SSTZGACKDAVIGZ-UHFFFAOYSA-N sulfanium;bromide Chemical compound [SH3+].[Br-] SSTZGACKDAVIGZ-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- WMOVHXAZOJBABW-UHFFFAOYSA-N tert-butyl acetate Chemical compound CC(=O)OC(C)(C)C WMOVHXAZOJBABW-UHFFFAOYSA-N 0.000 description 1
- JAELLLITIZHOGQ-UHFFFAOYSA-N tert-butyl propanoate Chemical compound CCC(=O)OC(C)(C)C JAELLLITIZHOGQ-UHFFFAOYSA-N 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003510 tertiary aliphatic amines Chemical class 0.000 description 1
- 125000004192 tetrahydrofuran-2-yl group Chemical group [H]C1([H])OC([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 1
- 125000004187 tetrahydropyran-2-yl group Chemical group [H]C1([H])OC([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004205 trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C25/00—Compounds containing at least one halogen atom bound to a six-membered aromatic ring
- C07C25/18—Polycyclic aromatic halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/63—Esters of sulfonic acids
- C07C309/72—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
- C07C309/73—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton to carbon atoms of non-condensed six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
- C07C69/84—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
- C07C69/84—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring
- C07C69/90—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring with esterified hydroxyl and carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
- C07C69/84—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring
- C07C69/92—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring with etherified hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
- C07D333/50—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
- C07D333/76—Dibenzothiophenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1806—C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
技术领域Technical Field
本发明关于抗蚀剂材料、抗蚀剂组成物、图案形成方法、及单体。The present invention relates to a resist material, a resist composition, a pattern forming method, and a monomer.
背景技术Background Art
伴随LSI的高集成化与高速化,图案规则的微细化也在急速进展。其原因是5G的高速通信和人工智能(artificial intelligence,AI)的普及,必须要有用以处理它们的高性能器件。就最先进的微细化技术而言,波长13.5nm的极紫外线(EUV)光刻所为的5nm节点的器件的量产已在进行。此外,在下一代的3nm节点、下下一代的2nm节点器件亦使用EUV光刻的探讨正在进行。With the high integration and high speed of LSI, the miniaturization of pattern rules is also progressing rapidly. The reason is that with the popularization of 5G high-speed communication and artificial intelligence (AI), high-performance devices are required to handle them. As for the most advanced miniaturization technology, mass production of 5nm node devices using extreme ultraviolet (EUV) lithography with a wavelength of 13.5nm is already underway. In addition, discussions are underway to use EUV lithography in the next-generation 3nm node and the next-generation 2nm node devices.
随着微细化的进行,酸的扩散所导致像的模糊会成为问题。为了确保尺寸大小45nm以下的微细图案的分辨度,有人提出不仅以往主张的溶解对比度的改善,酸扩散的控制亦为重要(非专利文献1)。但是,化学增幅抗蚀剂材料由于是利用酸的扩散来提升感度及对比度,若将曝光后烘烤(PEB)温度下降、或将时间缩短来将酸扩散抑制到极限的话,感度及对比度也会显著降低。As the miniaturization progresses, the blurring of the image caused by the diffusion of acid will become a problem. In order to ensure the resolution of fine patterns with a size of less than 45nm, it has been proposed that it is not only important to improve the dissolution contrast as previously advocated, but also to control the diffusion of acid (Non-Patent Document 1). However, since chemically amplified resist materials use the diffusion of acid to improve sensitivity and contrast, if the post-exposure baking (PEB) temperature is lowered or the time is shortened to suppress the diffusion of acid to the limit, the sensitivity and contrast will also be significantly reduced.
显示了感度、分辨度及边缘粗糙度的三角权衡关系。为了使分辨度改善需要抑制酸扩散,但酸扩散距离缩短的话,感度则会降低。The triangle trade-off relationship between sensitivity, resolution, and edge roughness is shown. In order to improve resolution, acid diffusion must be suppressed, but if the acid diffusion distance is shortened, the sensitivity will decrease.
添加会产生体积庞大的酸的酸产生剂来抑制酸扩散为有效的。于是有人提出在聚合物中含有来自具有聚合性不饱和键的鎓盐的重复单元。此时,聚合物亦可作为酸产生剂而发挥功能(聚合物键结型酸产生剂)。专利文献1已有人提出会产生特定的磺酸的具有聚合性不饱和键的锍盐、錪盐。专利文献2已有人提出磺酸直接键结于主链的锍盐。It is effective to add an acid generator that generates a bulky acid to inhibit acid diffusion. Therefore, it has been proposed that a repeating unit from an onium salt having a polymerizable unsaturated bond be contained in the polymer. In this case, the polymer can also function as an acid generator (polymer-bonded acid generator). Patent Document 1 has proposed sulfonium salts and iodonium salts having a polymerizable unsaturated bond that generate specific sulfonic acids. Patent Document 2 has proposed sulfonium salts in which sulfonic acid is directly bonded to the main chain.
有人提出为了抑制酸扩散而使用具有聚合性基团的pKa为-0.8以上的弱酸的锍盐作为基础聚合物的聚合物键结型淬灭剂的抗蚀剂材料(专利文献3~5)。专利文献3中就弱酸而言,列举了羧酸、磺酰胺、苯酚、六氟醇等。In order to suppress acid diffusion, resist materials using a polymer-bound quencher of a sulfonium salt having a polymerizable group with a pKa of -0.8 or higher as a base polymer have been proposed (Patent Documents 3 to 5). Patent Document 3 lists carboxylic acid, sulfonamide, phenol, hexafluoroalcohol, and the like as weak acids.
现有技术文献Prior art literature
专利文献Patent Literature
[专利文献1]日本特开2006-045311号公报[Patent Document 1] Japanese Patent Application Publication No. 2006-045311
[专利文献2]日本特开2006-178317号公报[Patent Document 2] Japanese Patent Application Publication No. 2006-178317
[专利文献3]国际公开第2019/167737号[Patent Document 3] International Publication No. 2019/167737
[专利文献4]国际公开第2022/264845号[Patent Document 4] International Publication No. 2022/264845
[专利文献5]日本特开2022-115072号公报[Patent Document 5] Japanese Patent Application Publication No. 2022-115072
非专利文献Non-patent literature
[非专利文献1]SPIE Vol.6520 65203L-1(2007)[Non-patent document 1] SPIE Vol.6520 65203L-1 (2007)
发明内容Summary of the invention
[发明所欲解决的课题][Problems to be solved by the invention]
本发明是鉴于前述情况而成的,目的为提供超过已知的正型抗蚀剂材料的高感度、高分辨度,且边缘粗糙度、尺寸变异小,曝光后的图案形状良好的抗蚀剂材料,以及提供含有前述抗蚀剂材料的抗蚀剂组成物、图案形成方法、及为前述抗蚀剂材料的原料的单体。The present invention is made in view of the above situation, and its purpose is to provide a resist material with higher sensitivity and higher resolution than the known positive resist materials, with small edge roughness and dimensional variation, and good pattern shape after exposure, as well as to provide a resist composition containing the above-mentioned resist material, a pattern forming method, and a monomer which is the raw material of the above-mentioned resist material.
[解决课题的手段][Methods to solve the problem]
为了解决上述课题,本发明提供一种抗蚀剂材料,含有含自聚合物主链间隔酯键而键结的有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐的重复单元a。In order to solve the above problems, the present invention provides a resist material comprising a repeating unit a containing a sulfonium salt or iodonium salt of a substituted or unsubstituted iodinated monovalent aromatic carboxylic acid bonded to a polymer main chain via an ester bond.
若为如此的抗蚀剂材料,则会成为超过已知的正型抗蚀剂材料的高感度、高分辨度,且边缘粗糙度、尺寸变异小,曝光后的图案形状良好的抗蚀剂材料。Such a resist material has high sensitivity and high resolution exceeding those of known positive resist materials, has small edge roughness and dimensional variation, and has a good pattern shape after exposure.
又,本发明中,前述重复单元a宜包含下述通式(a)-1或(a)-2表示的重复单元。In the present invention, the repeating unit a preferably includes a repeating unit represented by the following general formula (a)-1 or (a)-2.
[化1][Chemistry 1]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为单键或碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a single bond or a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
重复单元a宜为如此的结构。The repeating unit a preferably has such a structure.
此时,前述通式(a)-1及(a)-2中,前述X2宜为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。In this case, in the aforementioned general formulae (a)-1 and (a)-2, the aforementioned X2 is preferably a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom.
重复单元a为如此的结构更佳。The repeating unit a is more preferably of such a structure.
又,本发明中,宜更含有羧基及酚性羟基中的任一者或其两者的氢原子被酸不稳定基团取代的重复单元b。Furthermore, in the present invention, it is preferred to further contain a repeating unit b in which the hydrogen atom of either or both of a carboxyl group and a phenolic hydroxyl group is substituted with an acid-labile group.
若为如此的抗蚀剂材料,则会成为更高感度且尺寸变异小的抗蚀剂材料。Such a resist material can have higher sensitivity and less dimensional variation.
此时,前述复单元b宜为选自下述通式(b1)及(b2)表示的重复单元中的至少1种。In this case, the complex unit b is preferably at least one selected from the repeating units represented by the following general formulae (b1) and (b2).
[化2][Chemistry 2]
式中,RA分别独立地为氢原子或甲基。Y1为单键、亚苯基、亚萘基、或具有酯键、醚键或内酯环的碳数1~12的连接基团。Y2为单键、酯键或酰胺键。R11及R12为酸不稳定基团。R13为氟原子、三氟甲基、氰基、或碳数1~6的烷基。R14为单键或直链状或分支状的碳数1~6的烷二基,且其碳原子的一部分也可被醚键或酯键取代。a为1或2。b为0~4的整数。In the formula, RA is independently a hydrogen atom or a methyl group. Y1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms and having an ester bond, an ether bond, or a lactone ring. Y2 is a single bond, an ester bond, or an amide bond. R11 and R12 are acid-labile groups. R13 is a fluorine atom, a trifluoromethyl group, a cyano group, or an alkyl group having 1 to 6 carbon atoms. R14 is a single bond or a linear or branched alkanediyl group having 1 to 6 carbon atoms, and a portion of the carbon atoms thereof may be substituted by an ether bond or an ester bond. a is 1 or 2. b is an integer of 0 to 4.
重复单元b宜为如此的结构。The repeating unit b preferably has such a structure.
又,本发明中,前述抗蚀剂材料宜更含有具有选自羟基、羧基、内酯环、碳酸酯基、硫代碳酸酯基、羰基、环状缩醛基、醚键、酯键、磺酸酯键、氰基、酰胺基、-O-C(=O)-S-、及-O-C(=O)-NH-的密合性基团的重复单元c。Furthermore, in the present invention, the resist material preferably further contains a repeating unit c having an adhesive group selected from a hydroxyl group, a carboxyl group, a lactone ring, a carbonate group, a thiocarbonate group, a carbonyl group, a cyclic acetal group, an ether bond, an ester bond, a sulfonate bond, a cyano group, an amide group, -O-C(=O)-S-, and -O-C(=O)-NH-.
若为如此的抗蚀剂材料,则会成为和基板的密合性优良的抗蚀剂材料。Such a resist material can have excellent adhesion to the substrate.
又,本发明中,前述抗蚀剂材料宜更含有选自下述通式(d1)~(d3)表示的重复单元中的至少1种的重复单元d。In the present invention, the resist material preferably further contains at least one repeating unit d selected from the repeating units represented by the following general formulae (d1) to (d3).
[化3][Chemistry 3]
式中,RA分别独立地为氢原子或甲基。Z1为单键、亚苯基、-O-Z11-、-C(=O)-O-Z11-或-C(=O)-NH-Z11-,Z11为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、及羟基中的1种以上。Z2A为单键或酯键。Z2B为单键或碳数1~12的2价基团,且也可含有选自酯键、醚键、内酯环、溴原子、及碘原子中的1种以上。Z3为单键、亚甲基、亚乙基、亚苯基、氟化亚苯基、-O-Z31-、-C(=O)-O-Z31-或-C(=O)-NH-Z31-,Z31为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、卤素原子、及羟基中的1种以上。Rf1~Rf4分别独立地为氢原子、氟原子或三氟甲基,但至少1个为氟原子。R21~R28分别独立地为也可含有杂原子的碳数1~20的1价烃基。又,R23、R24及R25中的任2个或R26、R27及R28中的任2个也可互相键结并和它们所键结的硫原子一起形成环。M-为非亲核性相对离子。In the formula, RA is independently a hydrogen atom or a methyl group. Z1 is a single bond, a phenylene group, -OZ11- , -C(=O) -OZ11- or -C(=O)-NH- Z11- , Z11 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain one or more selected from a carbonyl group, an ester bond, an ether bond, and a hydroxyl group. Z2A is a single bond or an ester bond. Z2B is a single bond or a divalent group having 1 to 12 carbon atoms, and may contain one or more selected from an ester bond, an ether bond, a lactone ring, a bromine atom, and an iodine atom. Z3 is a single bond, methylene, ethylene, phenylene, fluorinated phenylene, -OZ31- , -C(=O) -OZ31- or -C(=O)-NH- Z31- , Z31 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain one or more selected from a carbonyl group, an ester bond, an ether bond, a halogen atom, and a hydroxyl group. Rf1 to Rf4 are each independently a hydrogen atom, a fluorine atom or a trifluoromethyl group, but at least one of them is a fluorine atom. R21 to R28 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. In addition, any two of R23 , R24 and R25 or any two of R26 , R27 and R28 may be bonded to each other and form a ring together with the sulfur atom to which they are bonded. M- is a non-nucleophilic counter ion.
若为如此的抗蚀剂材料,则会成为可减少酸扩散,且可防止酸扩散的模糊所致的分辨度的降低的抗蚀剂材料。Such a resist material can reduce acid diffusion and prevent a reduction in resolution due to blurring caused by acid diffusion.
此时,前述Z2B中宜含有至少1个以上的碘原子。In this case, the aforementioned Z 2B preferably contains at least one iodine atom.
重复单元d为如此的结构更佳。The repeating unit d is more preferably such a structure.
又,本发明中,前述抗蚀剂材料的分子量宜为1,000~100,000的范围。Furthermore, in the present invention, the molecular weight of the resist material is preferably in the range of 1,000 to 100,000.
若为如此的抗蚀剂材料,则会成为耐热性优良者,且会成为保持碱溶解性,且在图案形成后不会发生拖尾现象的抗蚀剂材料。Such a resist material has excellent heat resistance, maintains alkali solubility, and does not cause a tailing phenomenon after pattern formation.
又,本发明提供一种抗蚀剂组成物,其特征为:含有上述所记载的抗蚀剂材料。Furthermore, the present invention provides a resist composition, characterized in that it contains the resist material described above.
若为如此的抗蚀剂组成物,则会成为超过已知的正型抗蚀剂材料的高感度、高分辨度,且边缘粗糙度、尺寸变异小,曝光后的图案形状良好的抗蚀剂组成物。Such a resist composition has high sensitivity and high resolution exceeding those of known positive resist materials, has small edge roughness and dimensional variation, and has a good pattern shape after exposure.
此时,宜更含有选自酸产生剂、有机溶剂、淬灭剂、及表面活性剂中的1种以上。In this case, it is preferred to further contain one or more selected from the group consisting of an acid generator, an organic solvent, a quencher, and a surfactant.
本发明的抗蚀剂组成物中可添加如此的物质。Such substances may be added to the resist composition of the present invention.
又,本发明提供一种图案形成方法,包含下列步骤:Furthermore, the present invention provides a pattern forming method, comprising the following steps:
使用上述所记载的抗蚀剂组成物于基板上形成抗蚀剂膜,Using the resist composition described above to form a resist film on a substrate,
对前述抗蚀剂膜以高能射线进行曝光,及exposing the resist film to high energy radiation, and
将前述已曝光的抗蚀剂膜使用显影液进行显影。The exposed resist film is developed using a developer.
若为如此的图案形成方法,则可形成图案形状良好的图案。According to such a pattern forming method, a pattern having a good pattern shape can be formed.
此时,宜使用i射线、KrF准分子激光、ArF准分子激光、电子束、或波长3~15nm的极紫外线作为前述高能射线。In this case, i-rays, KrF excimer lasers, ArF excimer lasers, electron beams, or extreme ultraviolet rays having a wavelength of 3 to 15 nm are preferably used as the high-energy rays.
本发明的图案形成方法可使用如此的高能射线。The pattern forming method of the present invention can use such high-energy rays.
又,本发明提供一种单体,以下述通式(a)-1M或(a)-2M表示。The present invention also provides a monomer represented by the following general formula (a)-1M or (a)-2M.
[化4][Chemistry 4]
式中,RA为氢原子或甲基。X1为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有卤素原子。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also contain a halogen atom. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also contain one or more selected from an ether group and an ester group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R2 to R6 are independently a monovalent hydrocarbon group having 1 to 25 carbon atoms, which may also contain a heteroatom. Furthermore, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
又,本发明提供一种单体,以下述通式(a)-1’M或(a)-2’M表示。The present invention also provides a monomer represented by the following general formula (a)-1'M or (a)-2'M.
[化5][Chemistry 5]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
若为如此的单体,则会成为可使用作为超过已知的正型抗蚀剂材料的高感度、高分辨度,且边缘粗糙度、尺寸变异小,曝光后的图案形状良好的抗蚀剂材料的原料的单体。Such a monomer can be used as a raw material of a resist material having high sensitivity and high resolution exceeding known positive resist materials, small edge roughness and dimensional variation, and a good pattern shape after exposure.
[发明的效果][Effects of the Invention]
本发明的抗蚀剂材料可提高酸产生剂的分解效率,故抑制酸的扩散的效果高,且为高感度并具有高分辨度,曝光后的图案形状、边缘粗糙度及尺寸变异小,为良好的。因此,由于具有这些优良的特性,故实用性极高,尤其作为超大型集成电路制造用或EB描绘所为的光掩膜的微细图案形成材料、EB或EUV曝光用的图案形成材料非常有用。本发明的正型抗蚀剂材料不仅可应用于例如半导体电路形成时的光刻,还可应用于掩膜电路图案的形成、微机械、薄膜磁头电路形成。Resist material of the present invention can improve the decomposition efficiency of acid generator, so the effect of suppressing the diffusion of acid is high, and is highly sensitive and has high resolution, and the pattern shape, edge roughness and size variation after exposure are small, which is good. Therefore, owing to having these excellent characteristics, it is extremely practical, and is particularly useful as the fine pattern forming material of the photomask used for ultra-large integrated circuit manufacturing or EB description, and the pattern forming material used for EB or EUV exposure. Positive resist material of the present invention can not only be applied to photolithography when semiconductor circuit is formed, but also can be applied to the formation of mask circuit pattern, micromachine, and thin film magnetic head circuit formation.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
[图1]是表示合成例1-1合成的化合物2的1H-NMR(500MHz,DMSO-d6)图谱的图。Fig. 1 is a diagram showing the 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of Compound 2 synthesized in Synthesis Example 1-1.
[图2]是表示合成例1-1合成的化合物3的1H-NMR(500MHz,DMSO-d6)图谱的图。[ Fig. 2 ] is a diagram showing the 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of Compound 3 synthesized in Synthesis Example 1-1.
[图3]是表示合成例1-1合成的化合物4的1H-NMR(500MHz,DMSO-d6)图谱的图。[ Fig. 3 ] is a diagram showing the 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of Compound 4 synthesized in Synthesis Example 1-1.
[图4]是表示合成例1-1合成的单体1的1H-NMR(500MHz,DMSO-d6)图谱的图。Fig. 4 is a diagram showing the 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of Monomer 1 synthesized in Synthesis Example 1-1.
具体实施方式DETAILED DESCRIPTION
如上所述,要求开发超过已知的正型抗蚀剂材料的高感度、高分辨度,且边缘粗糙度、尺寸变异小,曝光后的图案形状良好的抗蚀剂材料,以及含有前述抗蚀剂材料的抗蚀剂组成物、图案形成方法、及为前述抗蚀剂材料的原料的单体。As described above, it is required to develop a resist material which has higher sensitivity and higher resolution than the known positive resist materials, has small edge roughness and dimensional variation, and has a good pattern shape after exposure, as well as a resist composition containing the aforementioned resist material, a pattern forming method, and a monomer which is a raw material of the aforementioned resist material.
本申请发明人为了获得近年要求的高分辨度且边缘粗糙度(LWR)、尺寸变异(CDU)小的正型抗蚀剂材料,而反复深入探讨后的结果,获得如下见解:其需要将酸扩散距离缩短至极限,且必须使酸扩散距离于分子等级下达到均匀,借由将含有特定重复单元的聚合物作为基础聚合物,且该重复单元具有自聚合物主链间隔酯键而键结的有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐,其酸扩散会变得非常小,且由于因曝光而产生的经碘化的1价芳香族羧酸的碱溶解特性为低膨润,而借由使酸扩散距离均匀化的效果及低膨润的效果这2种效果,制成LWR、CDU良好的化学增幅抗蚀剂材料的基础聚合物为有效的。The inventors of the present application have repeatedly conducted in-depth studies in order to obtain a positive resist material with high resolution and small edge roughness (LWR) and dimension variation (CDU) required in recent years, and have obtained the following findings: it is necessary to shorten the acid diffusion distance to the limit and make the acid diffusion distance uniform at the molecular level. By using a polymer containing a specific repeating unit as a base polymer, and the repeating unit having a substituted or unsubstituted iodinated monovalent aromatic carboxylic acid sulfonium salt or iodonium salt bonded to the polymer main chain via an ester bond, the acid diffusion becomes very small. In addition, since the alkali solubility property of the iodinated monovalent aromatic carboxylic acid generated by exposure is low swelling, it is effective to make a base polymer of a chemically amplified resist material with good LWR and CDU by virtue of the two effects of uniformizing the acid diffusion distance and the low swelling effect.
此外获得如下见解,乃至完成本发明:为了使溶解对比度改善而导入了羧基或酚性羟基的氢原子被酸不稳定基团取代的重复单元,借此可获得为高感度且曝光前后的碱溶解速度对比度会大幅提高,并且为高感度且抑制酸扩散的效果高,具有高分辨度,曝光后的图案形状及边缘粗糙度、尺寸变异小且良好,尤其适合作为超大型集成电路制造用或光掩膜的微细图案形成材料的抗蚀剂材料。In addition, the following insights were obtained, leading to the completion of the present invention: in order to improve the dissolution contrast, a repeating unit in which the hydrogen atoms of a carboxyl group or a phenolic hydroxyl group are replaced by an acid-labile group is introduced, thereby obtaining a resist material with high sensitivity and a greatly improved contrast of the alkali dissolution rate before and after exposure, and a high sensitivity and a high effect of inhibiting acid diffusion, high resolution, and small and good variation in pattern shape, edge roughness, and size after exposure, and is particularly suitable as a resist material for use in ultra-large integrated circuit manufacturing or as a fine pattern forming material for a photomask.
亦即,本发明为一种抗蚀剂材料,含有含自聚合物主链间隔酯键而键结的有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐的重复单元a。That is, the present invention is a resist material comprising a repeating unit a comprising a sulfonium salt or iodonium salt of a substituted or unsubstituted iodinated monovalent aromatic carboxylic acid bonded to a polymer main chain via an ester bond.
又,本发明为下述通式(a)-1M或(a)-2M表示的单体。Furthermore, the present invention is a monomer represented by the following general formula (a)-1M or (a)-2M.
[化6][Chemistry 6]
式中,RA为氢原子或甲基。X1为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有卤素原子。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also contain a halogen atom. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also contain one or more selected from an ether group and an ester group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R2 to R6 are independently a monovalent hydrocarbon group having 1 to 25 carbon atoms, which may also contain a heteroatom. Furthermore, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
又,本发明为下述通式(a)-1’M或(a)-2’M表示的单体。Furthermore, the present invention is a monomer represented by the following general formula (a)-1'M or (a)-2'M.
[化7][Chemistry 7]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
以下,针对本发明进行详细地说明,但本发明不限于此。Hereinafter, the present invention will be described in detail, but the present invention is not limited thereto.
[单体][monomer]
本发明为下述通式(a)-1M或(a)-2M表示的单体。The present invention is a monomer represented by the following general formula (a)-1M or (a)-2M.
[化8][Chemistry 8]
式中,RA为氢原子或甲基。X1为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有卤素原子。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also contain a halogen atom. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also contain one or more selected from an ether group and an ester group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R2 to R6 are independently a monovalent hydrocarbon group having 1 to 25 carbon atoms, which may also contain a heteroatom. Furthermore, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
式中,RA为氢原子或甲基,宜为甲基。X1为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有卤素原子,宜为单键或含有亚苯基者。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上,宜为含有醚基者。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上,宜为单键、亚甲基、亚乙基或亚丙基。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子,宜为氟原子。m为1~4的整数,n为0~3的整数,宜为m=1~2、n=0~1。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基,宜为芳香族烃基,为苯基、萘基、联苯基、苯基硫醚基、苯基醚基、或二苯甲酮基更佳。In the formula, RA is a hydrogen atom or a methyl group, preferably a methyl group. X1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms and containing an ester bond or an ether bond, and may also contain a halogen atom, preferably a single bond or one containing a phenylene group. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom, and preferably one containing an ether group. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms and not containing a fluorine atom, and may also contain one or more selected from an ether group and an ester group, and preferably a single bond, a methylene group, an ethylene group, or a propylene group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine, and preferably a fluorine atom. m is an integer of 1 to 4, n is an integer of 0 to 3, preferably m = 1 to 2, n = 0 to 1. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a heteroatom, preferably an aromatic hydrocarbon group, more preferably a phenyl group, a naphthyl group, a biphenyl group, a phenyl sulfide group, a phenyl ether group, or a benzophenone group.
又,本发明为下述通式(a)-1’M或(a)-2’M表示的单体。Furthermore, the present invention is a monomer represented by the following general formula (a)-1'M or (a)-2'M.
[化9][Chemistry 9]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
式中,RA为氢原子或甲基,宜为甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上,宜为单键或含有亚苯基者。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上,宜为含有醚基者。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上,宜为单键、亚甲基、亚乙基或亚丙基。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子,宜为氟原子。m为1~4的整数,n为0~3的整数,宜为m=1~2、n=0~1。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基,宜为芳香族烃基,为苯基、萘基、联苯基、苯基硫醚基、苯基醚基、或二苯甲酮基更佳。In the formula, RA is a hydrogen atom or a methyl group, preferably a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms and containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group, preferably a single bond or one containing a phenylene group. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom, and preferably one containing an ether group. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms and not containing a fluorine atom, and may also have one or more selected from an ether group and an ester group, and preferably a single bond, a methylene group, an ethylene group, or a propylene group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group, alkoxy group, acyloxy group, or halogen atom other than iodine, preferably a fluorine atom. m is an integer of 1 to 4, n is an integer of 0 to 3, preferably m=1 to 2, n=0 to 1. R2 to R6 are independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a heteroatom, preferably an aromatic hydrocarbon group, more preferably a phenyl group, a naphthyl group, a biphenyl group, a phenyl sulfide group, a phenyl ether group, or a benzophenone group.
[抗蚀剂材料][Resist material]
本发明的抗蚀剂材料含有含自聚合物主链间隔酯键而键结的有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐的重复单元a。1价芳香族羧酸宜为苯甲酸。前述重复单元a宜包含下述通式(a)-1或(a)-2表示的重复单元。The resist material of the present invention contains a repeating unit a containing a sulfonium salt or iodonium salt of a substituted or unsubstituted iodinated monovalent aromatic carboxylic acid bonded to the polymer main chain via an ester bond. The monovalent aromatic carboxylic acid is preferably benzoic acid. The repeating unit a preferably contains a repeating unit represented by the following general formula (a)-1 or (a)-2.
[化10][Chemistry 10]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为单键或碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a single bond or a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
前述通式(a)-1及(a)-2中,前述X2宜为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X2借由具有单键以外的结构,会增加锍盐、錪盐的可挠性而提高淬灭酸的能力。In the above-mentioned general formulas (a)-1 and (a)-2, the above-mentioned X2 is preferably a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may contain one or more selected from ester groups, ether groups, amide groups, lactone rings, sultone rings, and halogen atoms. By having a structure other than a single bond, X2 increases the flexibility of the sulfonium salt and the iodonium salt and improves the ability to quench the acid.
借由光分解,锍或錪会分解,并成为键结于聚合物的经碘化的1价芳香族羧酸。经碘化的1价芳香族羧酸具有在碱显影液中的膨润小的特征。若为低膨润的特性,则可降低于接触孔(contact hole)图案的显影时的膨润所导致的尺寸均匀性下降、或在线与间距图案(line and space pattern)于纯水淋洗后为了干燥的旋转干燥时可减少图案受到的应力,并使图案形成后的图案崩塌减少。By photolysis, the sulfonium or iodonium is decomposed to become an iodinated monovalent aromatic carboxylic acid bonded to the polymer. The iodinated monovalent aromatic carboxylic acid has the characteristic of small swelling in an alkaline developer. If it is a low swelling property, it can reduce the decrease in dimensional uniformity caused by swelling during the development of the contact hole pattern, or reduce the stress on the pattern during the spin drying for drying the line and space pattern after rinsing with pure water, and reduce the pattern collapse after the pattern is formed.
前述重复单元a是具有有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐结构的淬灭剂,为淬灭剂键结聚合物。淬灭剂键结聚合物具有抑制酸扩散的效果高,且如前所述分辨度优良的特征。借此,可达成高分辨、低LWR及低CDU。The repeating unit a is a quencher having a substituted or unsubstituted iodinated univalent aromatic carboxylic acid sulfonium salt or iodonium salt structure, and is a quencher-bonded polymer. The quencher-bonded polymer has a high effect of inhibiting acid diffusion and has excellent resolution as described above. Thereby, high resolution, low LWR and low CDU can be achieved.
上述通式(a)-1表示的重复单元a1及上述通式(a)-2表示的提供重复单元a2的单体可列举上述所记载的本发明的单体。又,其阴离子部可列举如下所示者,但不限于此。另外,下式中,RA和前述相同。The monomers providing the repeating unit a1 represented by the general formula (a)-1 and the repeating unit a2 represented by the general formula (a)-2 may include the monomers of the present invention described above. In addition, the anion portion thereof may include the following, but is not limited thereto. In the following formula, RA is the same as described above.
[化11][Chemistry 11]
[化12][Chemistry 12]
[化13][Chemistry 13]
[化14][Chemistry 14]
[化15][Chemistry 15]
[化16][Chemistry 16]
[化17][Chemistry 17]
[化18][Chemistry 18]
[化19][Chemistry 19]
[化20][Chemistry 20]
[化21][Chemistry 21]
[化22][Chemistry 22]
[化23][Chemistry 23]
[化24][Chemistry 24]
[化25][Chemistry 25]
[化26][Chemistry 26]
上述通式(a)-1表示的锍盐的阳离子可列举如下所示者,但不限于此。Examples of the cation of the sulfonium salt represented by the general formula (a)-1 include the following, but are not limited thereto.
[化27][Chemistry 27]
[化28][Chemistry 28]
[化29][Chemistry 29]
[化30][Chemistry 30]
[化31][Chemistry 31]
[化32][Chemistry 32]
[化33][Chemistry 33]
[化34][Chemistry 34]
[化35][Chemistry 35]
[化36][Chemistry 36]
[化37][Chemistry 37]
[化38][Chemistry 38]
[化39][Chemistry 39]
[化40][Chemistry 40]
[化41][Chemistry 41]
[化42][Chemistry 42]
[化43][Chemistry 43]
[化44][Chemistry 44]
[化45][Chemistry 45]
[化46][Chemistry 46]
[化47][Chemistry 47]
[化48][Chemistry 48]
[化49][Chemistry 49]
上述通式(a)-2表示的錪盐的阳离子可列举如下所示者,但不限于此。Examples of the cation of the iodonium salt represented by the general formula (a)-2 include the following, but are not limited thereto.
[化50][Chemistry 50]
前述抗蚀剂材料为了提高溶解对比度,宜更含有羧基及酚性羟基中的任一者或其两者的氢原子被酸不稳定基团取代的重复单元b。又,前述重复单元b宜为选自下述通式(b1)及(b2)表示的重复单元中的至少1种。以下,将羧基的氢原子被酸不稳定基团取代的重复单元称为重复单元b1,并将酚性羟基的氢原子被酸不稳定基团取代的重复单元称为重复单元b2。In order to improve the dissolution contrast, the resist material preferably further contains a repeating unit b in which the hydrogen atoms of either or both of a carboxyl group and a phenolic hydroxyl group are substituted with an acid-labile group. In addition, the repeating unit b is preferably at least one selected from the repeating units represented by the following general formulas (b1) and (b2). Hereinafter, the repeating unit in which the hydrogen atom of the carboxyl group is substituted with an acid-labile group is referred to as a repeating unit b1, and the repeating unit in which the hydrogen atom of the phenolic hydroxyl group is substituted with an acid-labile group is referred to as a repeating unit b2.
重复单元b1及b2分别可列举下述通式(b1)及(b2)表示者。Examples of the repeating units b1 and b2 include those represented by the following general formulae (b1) and (b2), respectively.
[化51][Chemistry 51]
式中,RA分别独立地为氢原子或甲基。Y1为单键、亚苯基、亚萘基、或具有酯键、醚键或内酯环的碳数1~12的连接基团。Y2为单键、酯键或酰胺键。R11及R12为酸不稳定基团。R13为氟原子、三氟甲基、氰基、或碳数1~6的烷基。R14为单键或直链状或分支状的碳数1~6的烷二基,且其碳原子的一部分也可被醚键或酯键取代。a为1或2。b为0~4的整数。In the formula, RA is independently a hydrogen atom or a methyl group. Y1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms and having an ester bond, an ether bond, or a lactone ring. Y2 is a single bond, an ester bond, or an amide bond. R11 and R12 are acid-labile groups. R13 is a fluorine atom, a trifluoromethyl group, a cyano group, or an alkyl group having 1 to 6 carbon atoms. R14 is a single bond or a linear or branched alkanediyl group having 1 to 6 carbon atoms, and a portion of the carbon atoms thereof may be substituted by an ether bond or an ester bond. a is 1 or 2. b is an integer of 0 to 4.
式中,RA分别独立地为氢原子或甲基,宜为甲基。Y1为单键、亚苯基、亚萘基、或具有酯键、醚键或内酯环的碳数1~12的连接基团,宜为单键或亚苯基。Y2为单键、酯键或酰胺键,宜为单键。R11及R12为酸不稳定基团。R13为氟原子、三氟甲基、氰基、或碳数1~6的烷基,宜为氟原子。R14为单键或直链状或分支状的碳数1~6的烷二基,且其碳原子的一部分也可被醚键或酯键取代,宜为酯键。a为1或2,a宜为1。b为0~4的整数,b宜为0或1。In the formula, RA is independently a hydrogen atom or a methyl group, preferably a methyl group. Y1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms and having an ester bond, an ether bond, or a lactone ring, preferably a single bond or a phenylene group. Y2 is a single bond, an ester bond, or an amide bond, preferably a single bond. R11 and R12 are acid-labile groups. R13 is a fluorine atom, a trifluoromethyl group, a cyano group, or an alkyl group having 1 to 6 carbon atoms, preferably a fluorine atom. R14 is a single bond or a linear or branched alkanediyl group having 1 to 6 carbon atoms, and a part of the carbon atoms thereof may be substituted by an ether bond or an ester bond, preferably an ester bond. a is 1 or 2, preferably 1. b is an integer of 0 to 4, preferably 0 or 1.
提供重复单元b1的单体可列举如下所示者,但不限于此。另外,下式中,RA及R11和前述相同。Examples of the monomers providing the repeating unit b1 include, but are not limited to, the following. In the following formula, RA and R11 are the same as those described above.
[化52][Chemistry 52]
[化53][Chemistry 53]
提供重复单元b2的单体可列举如下所示者,但不限于此。另外,下式中,RA及R12和前述相同。Examples of the monomers providing the repeating unit b2 include, but are not limited to, the following. In the following formula, RA and R12 are the same as those described above.
[化54][Chemistry 54]
R11或R12表示的酸不稳定基团有各种选择,可列举例如下述通式(AL-1)~(AL-3)表示者。The acid-labile group represented by R 11 or R 12 can be selected from various options, and examples thereof include those represented by the following general formulas (AL-1) to (AL-3).
[化55][Chemistry 55]
通式(AL-1)中,c为0~6的整数。RL1为碳数4~61且宜为4~15的叔烃基、各烃基分别为碳数1~6的饱和烃基的三烃基硅基、含有羰基、醚键或酯键的碳数4~20的饱和烃基、或通式(AL-3)表示的基团。In the general formula (AL-1), c is an integer of 0 to 6. RL1 is a tertiary hydrocarbon group having 4 to 61 carbon atoms, preferably 4 to 15 carbon atoms, a trihydrocarbylsilyl group in which each hydrocarbon group is a saturated hydrocarbon group having 1 to 6 carbon atoms, a saturated hydrocarbon group having 4 to 20 carbon atoms containing a carbonyl group, an ether bond or an ester bond, or a group represented by the general formula (AL-3).
RL1表示的叔烃基可为饱和也可为不饱和,且可为分支状也可为环状。其具体例可列举:叔丁基、叔戊基、1,1-二乙基丙基、1-乙基环戊基、1-丁基环戊基、1-乙基环己基、1-丁基环己基、1-乙基-2-环戊烯基、1-乙基-2-环己烯基、2-甲基-2-金刚烷基等。前述三烃基硅基可列举:三甲基硅基、三乙基硅基、二甲基叔丁基硅基等。前述含有羰基、醚键或酯键的饱和烃基为直链状、分支状、环状中的任一皆可,宜为环状者,其具体例可列举:3-氧代基环己基、4-甲基-2-氧代基氧杂环己烷-4-基、5-甲基-2-氧代基氧杂环戊烷-5-基、2-四氢吡喃基、2-四氢呋喃基等。The tertiary hydrocarbon group represented by R L1 may be saturated or unsaturated, and may be branched or cyclic. Specific examples thereof include: tert-butyl, tert-amyl, 1,1-diethylpropyl, 1-ethylcyclopentyl, 1-butylcyclopentyl, 1-ethylcyclohexyl, 1-butylcyclohexyl, 1-ethyl-2-cyclopentenyl, 1-ethyl-2-cyclohexenyl, 2-methyl-2-adamantyl, etc. The aforementioned trihydrocarbylsilyl group includes: trimethylsilyl, triethylsilyl, dimethyl-tert-butylsilyl, etc. The aforementioned saturated hydrocarbon group containing a carbonyl group, an ether bond or an ester bond may be any of straight chain, branched or cyclic, preferably cyclic, and specific examples thereof include 3-oxocyclohexyl, 4-methyl-2-oxooxan-4-yl, 5-methyl-2-oxooxan-5-yl, 2-tetrahydropyranyl, 2-tetrahydrofuranyl and the like.
通式(AL-1)表示的酸不稳定基团可列举:叔丁氧基羰基、叔丁氧基羰基甲基、叔戊基氧基羰基、叔戊基氧基羰基甲基、1,1-二乙基丙基氧基羰基、1,1-二乙基丙基氧基羰基甲基、1-乙基环戊基氧基羰基、1-乙基环戊基氧基羰基甲基、1-乙基-2-环戊烯基氧基羰基、1-乙基-2-环戊烯基氧基羰基甲基、1-乙氧基乙氧基羰基甲基、2-四氢吡喃基氧基羰基甲基、2-四氢呋喃基氧基羰基甲基等。Examples of the acid-labile group represented by the general formula (AL-1) include tert-butoxycarbonyl, tert-butoxycarbonylmethyl, tert-amyloxycarbonyl, tert-amyloxycarbonylmethyl, 1,1-diethylpropyloxycarbonyl, 1,1-diethylpropyloxycarbonylmethyl, 1-ethylcyclopentyloxycarbonyl, 1-ethylcyclopentyloxycarbonylmethyl, 1-ethyl-2-cyclopentenyloxycarbonyl, 1-ethyl-2-cyclopentenyloxycarbonylmethyl, 1-ethoxyethoxycarbonylmethyl, 2-tetrahydropyranyloxycarbonylmethyl, and 2-tetrahydrofuranyloxycarbonylmethyl.
此外,通式(AL-1)表示的酸不稳定基团也可列举下述通式(AL-1)-1~(AL-1)-10表示的基团。Examples of the acid-labile group represented by the general formula (AL-1) include groups represented by the following general formulae (AL-1)-1 to (AL-1)-10.
[化56][Chemistry 56]
式中,虚线为原子键。In the formula, the dotted lines are atomic bonds.
通式(AL-1)-1~(AL-1)-10中,c和前述相同。RL8分别独立地为碳数1~10的饱和烃基或碳数6~20的芳基。RL9为氢原子或碳数1~10的饱和烃基。RL10为碳数2~10的饱和烃基或碳数6~20的芳基。前述饱和烃基为直链状、分支状、环状中的任一皆可。In the general formulae (AL-1)-1 to (AL-1)-10, c is the same as described above. RL8 is independently a saturated hydrocarbon group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms. RL9 is a hydrogen atom or a saturated hydrocarbon group having 1 to 10 carbon atoms. RL10 is a saturated hydrocarbon group having 2 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms. The saturated hydrocarbon group may be linear, branched or cyclic.
通式(AL-2)中,RL2及RL3分别独立地为氢原子或碳数1~18且宜为1~10的饱和烃基。前述饱和烃基为直链状、分支状、环状中的任一皆可,其具体例可列举:甲基、乙基、丙基、异丙基、正丁基、仲丁基、叔丁基、环戊基、环己基、2-乙基己基、正辛基等。In the general formula (AL-2), RL2 and RL3 are each independently a hydrogen atom or a saturated hydrocarbon group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms. The saturated hydrocarbon group may be linear, branched or cyclic, and specific examples thereof include methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, cyclopentyl, cyclohexyl, 2-ethylhexyl, n-octyl and the like.
通式(AL-2)中,RL4为也可含有杂原子的碳数1~18且宜为1~10的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。前述烃基可列举碳数1~18的饱和烃基等,它们的氢原子的一部分也可被羟基、烷氧基、氧代基、氨基、烷基氨基等取代。如此的经取代的饱和烃基可列举如下所示者等。In the general formula (AL-2), RL4 is a hydrocarbon group having 1 to 18 carbon atoms and preferably 1 to 10 carbon atoms, which may contain heteroatoms. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched, or cyclic. Examples of the hydrocarbon group include saturated hydrocarbon groups having 1 to 18 carbon atoms, and some of the hydrogen atoms thereof may be substituted with hydroxyl, alkoxy, oxo, amino, alkylamino, or the like. Examples of such substituted saturated hydrocarbon groups include those shown below.
[化57][Chemistry 57]
式中,虚线为原子键。In the formula, the dotted lines are atomic bonds.
RL2与RL3、RL2与RL4、或RL3与RL4也可互相键结并和它们所键结的碳原子一起或和碳原子及氧原子一起形成环,此时,参与环的形成的RL2及RL3、RL2及RL4、或RL3及RL4分别独立地为碳数1~18且宜为1~10的烷二基。它们键结而得的环的碳数宜为3~10,为4~10更佳。 RL2 and RL3 , RL2 and RL4 , or RL3 and RL4 may also be bonded to each other and form a ring together with the carbon atom to which they are bonded or together with the carbon atom and the oxygen atom. In this case, RL2 and RL3 , RL2 and RL4 , or RL3 and RL4 participating in the formation of the ring are each independently an alkanediyl group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms. The carbon number of the ring formed by these bonding is preferably 3 to 10, more preferably 4 to 10.
通式(AL-2)表示的酸不稳定基团之中,直链状或分支状者可列举下式(AL-2)-1~(AL-2)-69表示者,但不限于此。另外,下式中,虚线为原子键。Among the acid-labile groups represented by the general formula (AL-2), linear or branched ones include those represented by the following formulae (AL-2)-1 to (AL-2)-69, but are not limited thereto. In the following formulae, the dotted lines represent atomic bonds.
[化58][Chemistry 58]
[化59][Chemistry 59]
[化60][Chemistry 60]
[化61][Chemistry 61]
通式(AL-2)表示的酸不稳定基团之中,环状者可列举四氢呋喃-2-基、2-甲基四氢呋喃-2-基、四氢哌喃-2-基、2-甲基四氢哌喃-2-基等。Among the acid-labile groups represented by the general formula (AL-2), cyclic ones include tetrahydrofuran-2-yl, 2-methyltetrahydrofuran-2-yl, tetrahydropyran-2-yl, and 2-methyltetrahydropyran-2-yl.
又,酸不稳定基团可列举下述通式(AL-2a)或(AL-2b)表示的基团。借由前述酸不稳定基团,抗蚀剂材料也可进行分子间或分子内交联。Examples of the acid-labile group include groups represented by the following general formula (AL-2a) or (AL-2b): The acid-labile group can also allow the resist material to undergo intermolecular or intramolecular crosslinking.
[化62][Chemistry 62]
式中,虚线为原子键。In the formula, the dotted lines are atomic bonds.
通式(AL-2a)或(AL-2b)中,RL11及RL12分别独立地为氢原子或碳数1~8的饱和烃基。前述饱和烃基为直链状、分支状、环状中的任一皆可。又,RL11与RL12也可互相键结并和它们所键结的碳原子一起形成环,此时,RL11及RL12分别独立地为碳数1~8的烷二基。RL13分别独立地为碳数1~10的饱和亚烃基。前述饱和亚烃基为直链状、分支状、环状中的任一皆可。d及e分别独立地为0~10的整数,宜为0~5的整数,f为1~7的整数,宜为1~3的整数。In the general formula (AL-2a) or (AL-2b), R L11 and R L12 are each independently a hydrogen atom or a saturated hydrocarbon group having 1 to 8 carbon atoms. The saturated hydrocarbon group may be any of linear, branched, or cyclic. Furthermore, R L11 and R L12 may be bonded to each other and form a ring together with the carbon atoms to which they are bonded. In this case, R L11 and R L12 are each independently an alkanediyl group having 1 to 8 carbon atoms. R L13 is each independently a saturated alkylene group having 1 to 10 carbon atoms. The saturated alkylene group may be any of linear, branched, or cyclic. d and e are each independently an integer of 0 to 10, preferably an integer of 0 to 5, and f is an integer of 1 to 7, preferably an integer of 1 to 3.
通式(AL-2a)或(AL-2b)中,LA为(f+1)价的碳数1~50的脂肪族饱和烃基、(f+1)价的碳数3~50的脂环族饱和烃基、(f+1)价的碳数6~50的芳香族烃基或(f+1)价的碳数3~50的杂环基。又,这些基团的碳原子的一部分也可被含杂原子的基团取代,且键结于这些基团的碳原子的氢原子的一部分也可被羟基、羧基、酰基或氟原子取代。LA宜为碳数1~20的饱和亚烃基、3价饱和烃基、4价饱和烃基等饱和烃基、碳数6~30的亚芳基等。前述饱和烃基为直链状、分支状、环状中的任一皆可。LB为-C(=O)-O-、-NH-C(=O)-O-或-NH-C(=O)-NH-。In the general formula (AL-2a) or (AL-2b), L A is an aliphatic saturated hydrocarbon group having 1 to 50 carbon atoms and having a valence of (f+1) , an alicyclic saturated hydrocarbon group having 3 to 50 carbon atoms and having a valence of (f+1) , an aromatic hydrocarbon group having 6 to 50 carbon atoms and having a valence of (f+1) , or a heterocyclic group having 3 to 50 carbon atoms and having a valence of (f+1) . In addition, part of the carbon atoms of these groups may be substituted by a heteroatom-containing group, and part of the hydrogen atoms bonded to the carbon atoms of these groups may be substituted by a hydroxyl group, a carboxyl group, an acyl group, or a fluorine atom. L A is preferably a saturated hydrocarbon group such as a saturated hydrocarbon group having 1 to 20 carbon atoms, a trivalent saturated hydrocarbon group, a tetravalent saturated hydrocarbon group, or an arylene group having 6 to 30 carbon atoms. The saturated hydrocarbon group may be straight chain, branched, or cyclic. L B is -C(=O)-O-, -NH-C(=O)-O-, or -NH-C(=O)-NH-.
通式(AL-2a)或(AL-2b)表示的交联型缩醛基可列举下式(AL-2)-70~(AL-2)-77表示的基团等。Examples of the cross-linked acetal group represented by the general formula (AL-2a) or (AL-2b) include groups represented by the following formulae (AL-2)-70 to (AL-2)-77.
[化63][Chemistry 63]
式中,虚线为原子键。In the formula, the dotted lines are atomic bonds.
通式(AL-3)中,RL5、RL6及RL7分别独立地为碳数1~20的烃基,且也可含有氧原子、硫原子、氮原子、氟原子等杂原子。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举:碳数1~20的烷基、碳数3~20的环状饱和烃基、碳数2~20的烯基、碳数3~20的环状不饱和烃基、碳数6~10的芳基等。又,RL5与RL6、RL5与RL7、或RL6与RL7也可互相键结并和它们所键结的碳原子一起形成碳数3~20的脂环。In the general formula (AL-3), R L5 , R L6 and R L7 are each independently a hydrocarbon group having 1 to 20 carbon atoms, and may contain heteroatoms such as oxygen atoms, sulfur atoms, nitrogen atoms, and fluorine atoms. The aforementioned hydrocarbon group may be saturated or unsaturated, and may be linear, branched, or cyclic. Specific examples thereof include: an alkyl group having 1 to 20 carbon atoms, a cyclic saturated hydrocarbon group having 3 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, a cyclic unsaturated hydrocarbon group having 3 to 20 carbon atoms, and an aryl group having 6 to 10 carbon atoms. In addition, R L5 and R L6 , R L5 and R L7 , or R L6 and R L7 may be bonded to each other and form an alicyclic ring having 3 to 20 carbon atoms together with the carbon atoms to which they are bonded.
通式(AL-3)表示的基团可列举:叔丁基、1,1-二乙基丙基、1-乙基降莰基、1-甲基环戊基、1-异丙基环戊基、1-乙基环戊基、1-甲基环己基、2-(2-甲基)金刚烷基、2-(2-乙基)金刚烷基、叔戊基等。Examples of the group represented by the general formula (AL-3) include tert-butyl, 1,1-diethylpropyl, 1-ethylnorbornyl, 1-methylcyclopentyl, 1-isopropylcyclopentyl, 1-ethylcyclopentyl, 1-methylcyclohexyl, 2-(2-methyl)adamantyl, 2-(2-ethyl)adamantyl, and tert-pentyl.
又,通式(AL-3)表示的基团也可列举下述通式(AL-3)-1~(AL-3)-19表示的基团。Examples of the group represented by the general formula (AL-3) include groups represented by the following general formulae (AL-3)-1 to (AL-3)-19.
[化64][Chemistry 64]
式中,虚线为原子键。In the formula, the dotted lines are atomic bonds.
通式(AL-3)-1~(AL-3)-19中,RL14分别独立地为碳数1~8的饱和烃基或碳数6~20的芳基。RL15及RL17分别独立地为氢原子或碳数1~20的饱和烃基。RL16为碳数6~20的芳基。前述饱和烃基为直链状、分支状、环状中的任一皆可。又,前述芳基宜为苯基等。RF为氟原子或三氟甲基。g为1~5的整数。In the general formulae (AL-3)-1 to (AL-3)-19, RL14 is independently a saturated hydrocarbon group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms. RL15 and RL17 are independently a hydrogen atom or a saturated hydrocarbon group having 1 to 20 carbon atoms. RL16 is an aryl group having 6 to 20 carbon atoms. The saturated hydrocarbon group may be linear, branched or cyclic. The aryl group is preferably a phenyl group or the like. RF is a fluorine atom or a trifluoromethyl group. g is an integer of 1 to 5.
此外,酸不稳定基团可列举下述通式(AL-3)-20或(AL-3)-21表示的基团。借由前述酸不稳定基团,抗蚀剂材料也可进行分子内或分子间交联。In addition, the acid-labile group includes a group represented by the following general formula (AL-3)-20 or (AL-3)-21. The acid-labile group can also crosslink the resist material intramolecularly or intermolecularly.
[化65][Chemistry 65]
式中,虚线为原子键。In the formula, the dotted lines are atomic bonds.
通式(AL-3)-20及(AL-3)-21中,RL14和前述相同。RL18为碳数1~20的(h+1)价的饱和亚烃基或碳数6~20的(h+1)价的亚芳基,且也可含有氧原子、硫原子、氮原子等杂原子。前述饱和亚烃基为直链状、分支状、环状中的任一皆可。h为1~3的整数。In the general formulae (AL-3)-20 and (AL-3)-21, R L14 is the same as described above. R L18 is a saturated alkylene group having a valence of (h+1) and having 1 to 20 carbon atoms or an arylene group having a valence of (h+1) and having 6 to 20 carbon atoms, and may contain heteroatoms such as oxygen atoms, sulfur atoms, and nitrogen atoms. The saturated alkylene group may be linear, branched, or cyclic. h is an integer of 1 to 3.
提供含有通式(AL-3)表示的酸不稳定基团的重复单元的单体可列举包含下述通式(AL-3)-22表示的外型立体异构体结构的(甲基)丙烯酸酯。Examples of the monomer providing a repeating unit containing an acid-labile group represented by the general formula (AL-3) include (meth)acrylates containing an exo-stereoisomer structure represented by the following general formula (AL-3)-22.
[化66][Chemistry 66]
通式(AL-3)-22中,RA和前述相同。RLc1为碳数1~8的饱和烃基或也可经取代的碳数6~20的芳基。前述饱和烃基为直链状、分支状、环状中的任一皆可。RLc2~RLc11分别独立地为氢原子或也可含有杂原子的碳数1~15的烃基。前述杂原子可列举氧原子等。前述烃基可列举:碳数1~15的烷基、碳数6~15的芳基等。RLc2与RLc3、RLc4与RLc6、RLc4与RLc7、RLc5与RLc7、RLc5与RLc11、RLc6与RLc10、RLc8与RLc9、或RLc9与RLc10也可互相键结并和它们所键结的碳原子一起形成环,此时,参与键结的基团为碳数1~15的也可含有杂原子的亚烃基。又,RLc2与RLc11、RLc8与RLc11、或RLc4与RLc6也可键结于相邻的碳者彼此不间隔任何基团而键结并形成双键。另外,亦以本式表示镜像体。In the general formula (AL-3)-22, RA is the same as described above. RLc1 is a saturated hydrocarbon group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms which may be substituted. The saturated hydrocarbon group may be linear, branched or cyclic. RLc2 to RLc11 are each independently a hydrogen atom or a hydrocarbon group having 1 to 15 carbon atoms which may contain a heteroatom. Examples of the heteroatom include an oxygen atom and the like. Examples of the hydrocarbon group include an alkyl group having 1 to 15 carbon atoms, an aryl group having 6 to 15 carbon atoms and the like. R Lc2 and R Lc3 , R Lc4 and R Lc6 , R Lc4 and R Lc7 , R Lc5 and R Lc7 , R Lc5 and R Lc11 , R Lc6 and R Lc10 , R Lc8 and R Lc9 , or R Lc9 and R Lc10 may also be bonded to each other and form a ring together with the carbon atoms to which they are bonded. In this case, the group involved in the bond is a alkylene group having 1 to 15 carbon atoms and may contain a heteroatom. Furthermore, R Lc2 and R Lc11 , R Lc8 and R Lc11 , or R Lc4 and R Lc6 may be bonded to adjacent carbon atoms without any group in between to form a double bond. In addition, the mirror image is also represented by this formula.
在此,提供通式(AL-3)-22表示的重复单元的单体可列举日本特开2000-327633号公报所记载者等。具体而言,可列举如下所示者,但不限于此。另外,下式中,RA和前述相同。Here, the monomers providing the repeating unit represented by the general formula (AL-3)-22 include those described in Japanese Patent Application Publication No. 2000-327633, etc. Specifically, the following may be mentioned, but it is not limited thereto. In the following formula, RA is the same as above.
[化67][Chemistry 67]
提供含有通式(AL-3)表示的酸不稳定基团的重复单元的单体也可列举下述通式(AL-3)-23表示的含有呋喃二基、四氢呋喃二基或氧杂降莰烷二基的(甲基)丙烯酸酯。Examples of the monomer providing a repeating unit containing an acid-labile group represented by the general formula (AL-3) include (meth)acrylates containing a furandiyl group, a tetrahydrofurandiyl group or an oxanorbornanediyl group represented by the following general formula (AL-3)-23.
[化68][Chemistry 68]
通式(AL-3)-23中,RA和前述相同。RLc12及RLc13分别独立地为碳数1~10的烃基。RLc12与RLc13也可互相键结并和它们所键结的碳原子一起形成脂环。RLc14为呋喃二基、四氢呋喃二基或氧杂降莰烷二基。RLc15为氢原子或也可含有杂原子的碳数1~10的烃基。前述烃基为直链状、分支状、环状中的任一皆可。其具体例可列举碳数1~10的饱和烃基等。In the general formula (AL-3)-23, RA is the same as described above. RLc12 and RLc13 are each independently a hydrocarbon group having 1 to 10 carbon atoms. RLc12 and RLc13 may also be bonded to each other and form an alicyclic ring together with the carbon atoms to which they are bonded. RLc14 is furandiyl, tetrahydrofurandiyl or oxa-norbornanediyl. RLc15 is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms which may contain a heteroatom. The aforementioned hydrocarbon group may be any of a straight chain, a branched shape, and a cyclic shape. Specific examples thereof include saturated hydrocarbon groups having 1 to 10 carbon atoms, and the like.
提供通式(AL-3)-23表示的重复单元的单体可列举如下所示者,但不限于此。另外,下式中,RA和前述相同,Ac为乙酰基,Me为甲基。Examples of monomers that provide repeating units represented by the general formula (AL-3)-23 include, but are not limited to, the following: In the following formula, RA is the same as above, Ac is an acetyl group, and Me is a methyl group.
[化69][Chemistry 69]
[化70][Chemistry 70]
前述抗蚀剂材料也可更含有具有选自羟基、羧基、内酯环、碳酸酯基、硫代碳酸酯基、羰基、环状缩醛基、醚键、酯键、磺酸酯键、氰基、酰胺基、-O-C(=O)-S-、及-O-C(=O)-NH-的密合性基团的重复单元c。The aforementioned resist material may further contain a repeating unit c having an adhesive group selected from a hydroxyl group, a carboxyl group, a lactone ring, a carbonate group, a thiocarbonate group, a carbonyl group, a cyclic acetal group, an ether bond, an ester bond, a sulfonate bond, a cyano group, an amide group, -O-C(=O)-S-, and -O-C(=O)-NH-.
提供重复单元c的单体可列举如下所示者,但不限于此。另外,下式中,RA和前述相同。Examples of the monomers providing the repeating unit c include, but are not limited to, the following. In the following formula, RA is the same as described above.
[化71][Chemistry 71]
[化72][Chemistry 72]
[化73][Chemistry 73]
[化74][Chemistry 74]
[化75][Chemistry 75]
[化76][Chemistry 76]
[化77][Chemistry 77]
[化78][Chemistry 78]
前述抗蚀剂材料也可更含有来自含有聚合性不饱和键的鎓盐的重复单元d。理想的重复单元d可列举:下述通式(d1)表示的重复单元(以下也称重复单元d1)、下述通式(d2)表示的重复单元(以下也称重复单元d2)、及下述通式(d3)表示的重复单元(以下也称重复单元d3)。另外,重复单元d1~d3可单独使用1种,或可组合使用2种以上。亦即,前述抗蚀剂材料宜更含有选自下述通式(d1)~(d3)表示的重复单元中的至少1种的重复单元d。The aforementioned resist material may also further contain a repeating unit d derived from an onium salt containing a polymerizable unsaturated bond. The ideal repeating unit d can be listed as: a repeating unit represented by the following general formula (d1) (hereinafter also referred to as repeating unit d1), a repeating unit represented by the following general formula (d2) (hereinafter also referred to as repeating unit d2), and a repeating unit represented by the following general formula (d3) (hereinafter also referred to as repeating unit d3). In addition, the repeating units d1 to d3 may be used alone or in combination of two or more. That is, the aforementioned resist material preferably further contains at least one repeating unit d selected from the repeating units represented by the following general formulas (d1) to (d3).
[化79][Chemistry 79]
式中,RA分别独立地为氢原子或甲基。Z1为单键、亚苯基、-O-Z11-、-C(=O)-O-Z11-或-C(=O)-NH-Z11-,Z11为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、及羟基中的1种以上。Z2A为单键或酯键。Z2B为单键或碳数1~12的2价基团,且也可含有选自酯键、醚键、内酯环、溴原子、及碘原子中的1种以上。Z3为单键、亚甲基、亚乙基、亚苯基、氟化亚苯基、-O-Z31-、-C(=O)-O-Z31-或-C(=O)-NH-Z31-,Z31为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、卤素原子、及羟基中的1种以上。Rf1~Rf4分别独立地为氢原子、氟原子或三氟甲基,但至少1个为氟原子。R21~R28分别独立地为也可含有杂原子的碳数1~20的1价烃基。又,R23、R24及R25中的任2个或R26、R27及R28中的任2个也可互相键结并和它们所键结的硫原子一起形成环。M-为非亲核性相对离子。In the formula, RA is independently a hydrogen atom or a methyl group. Z1 is a single bond, a phenylene group, -OZ11- , -C(=O) -OZ11- or -C(=O)-NH- Z11- , Z11 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain one or more selected from a carbonyl group, an ester bond, an ether bond, and a hydroxyl group. Z2A is a single bond or an ester bond. Z2B is a single bond or a divalent group having 1 to 12 carbon atoms, and may contain one or more selected from an ester bond, an ether bond, a lactone ring, a bromine atom, and an iodine atom. Z3 is a single bond, methylene, ethylene, phenylene, fluorinated phenylene, -OZ31- , -C(=O) -OZ31- or -C(=O)-NH- Z31- , Z31 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain one or more selected from a carbonyl group, an ester bond, an ether bond, a halogen atom, and a hydroxyl group. Rf1 to Rf4 are each independently a hydrogen atom, a fluorine atom or a trifluoromethyl group, but at least one of them is a fluorine atom. R21 to R28 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. In addition, any two of R23 , R24 and R25 or any two of R26 , R27 and R28 may be bonded to each other and form a ring together with the sulfur atom to which they are bonded. M- is a non-nucleophilic counter ion.
式中,RA分别独立地为氢原子或甲基,宜为甲基。Z1为单键、亚苯基、-O-Z11-、-C(=O)-O-Z11-或-C(=O)-NH-Z11-,Z11为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、及羟基中的1种以上,宜为乙醚。Z2A为单键或酯键,宜为酯键。Z2B为单键或碳数1~12的2价基团,且也可含有选自酯键、醚键、内酯环、溴原子、及碘原子中的1种以上。Z3为单键、亚甲基、亚乙基、亚苯基、氟化亚苯基、-O-Z31-、-C(=O)-O-Z31-或-C(=O)-NH-Z31-,Z31为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、卤素原子、及羟基中的1种以上。Rf1~Rf4分别独立地为氢原子、氟原子或三氟甲基,但至少1个为氟原子。In the formula, RA is independently a hydrogen atom or a methyl group, preferably a methyl group. Z1 is a single bond, a phenylene group, -OZ11- , -C(=O) -OZ11- or -C(=O)-NH- Z11- , Z11 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain at least one selected from a carbonyl group, an ester bond, an ether bond, and a hydroxyl group, and may be preferably ether. Z2A is a single bond or an ester bond, and may be preferably an ester bond. Z2B is a single bond or a divalent group having 1 to 12 carbon atoms, and may contain at least one selected from an ester bond, an ether bond, a lactone ring, a bromine atom, and an iodine atom. Z3 is a single bond, methylene, ethylene, phenylene, fluorinated phenylene, -OZ31- , -C(=O) -OZ31- or -C(=O)-NH- Z31- , Z31 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain at least one selected from a carbonyl group, an ester bond, an ether bond, a halogen atom and a hydroxyl group. Rf1 to Rf4 are each independently a hydrogen atom, a fluorine atom or a trifluoromethyl group, and at least one of them is a fluorine atom.
通式(d2)中,Rf1~Rf4分别独立地为氢原子、氟原子或三氟甲基,但至少1个为氟原子。尤其Rf3及Rf4中的至少1个宜为氟原子,Rf3及Rf4皆为氟原子更佳。In general formula (d2), Rf1 to Rf4 are independently hydrogen, fluorine or trifluoromethyl, and at least one of them is a fluorine atom. In particular, at least one of Rf3 and Rf4 is preferably a fluorine atom, and more preferably both Rf3 and Rf4 are fluorine atoms.
通式(d1)~(d3)中,R21~R28分别独立地为也可含有杂原子的碳数1~20的1价烃基。又,R23、R24及R25中的任2个或R26、R27及R28中的任2个也可互相键结并和它们所键结的硫原子一起形成环。前述1价烃基为直链状、分支状、环状中的任一皆可,其具体例可列举:碳数1~12的烷基、碳数6~12的芳基、碳数7~20的芳烷基等。又,这些基团的氢原子的一部分或全部也可被碳数1~10的烷基、卤素原子、三氟甲基、氰基、硝基、羟基、巯基、碳数1~10的烷氧基、碳数2~10的烷氧基羰基、或碳数2~10的酰氧基取代,这些基团的碳原子的一部分也可被羰基、醚键或酯键取代。In the general formulae (d1) to (d3), R 21 to R 28 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a hetero atom. In addition, any two of R 23 , R 24 and R 25 or any two of R 26 , R 27 and R 28 may be bonded to each other and form a ring together with the sulfur atom to which they are bonded. The monovalent hydrocarbon group may be linear, branched or cyclic, and specific examples thereof include an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms. Furthermore, part or all of the hydrogen atoms in these groups may be substituted by an alkyl group having 1 to 10 carbon atoms, a halogen atom, a trifluoromethyl group, a cyano group, a nitro group, a hydroxyl group, a mercapto group, an alkoxy group having 1 to 10 carbon atoms, an alkoxycarbonyl group having 2 to 10 carbon atoms, or an acyloxy group having 2 to 10 carbon atoms, and part of the carbon atoms in these groups may be substituted by a carbonyl group, an ether bond, or an ester bond.
通式(d2)及(d3)中,锍阳离子的具体例可列举和例示作为后述通式(1-1)表示的锍盐的阳离子者同样的例子。In the general formulae (d2) and (d3), specific examples of the sulfonium cation include the same examples as those exemplified as the cation of the sulfonium salt represented by the general formula (1-1) described later.
通式(d1)中,M-为非亲核性相对离子。前述非亲核性相对离子可列举:氯化物离子、溴化物离子等卤化物离子;三氟甲磺酸根离子、1,1,1-三氟乙烷磺酸根离子、九氟丁烷磺酸根离子等氟烷基磺酸根离子;甲苯磺酸根离子、苯磺酸根离子、4-氟苯磺酸根离子、1,2,3,4,5-五氟苯磺酸根离子等芳基磺酸根离子;甲磺酸根离子、丁烷磺酸根离子等烷基磺酸根离子;双(三氟甲基磺酰基)酰亚胺离子、双(全氟乙基磺酰基)酰亚胺离子、双(全氟丁基磺酰基)酰亚胺离子等酰亚胺酸离子;三(三氟甲基磺酰基)甲基化物离子、三(全氟乙基磺酰基)甲基化物离子等甲基化酸根离子。In the general formula (d1), M- is a non-nucleophilic counter ion. Examples of the non-nucleophilic counter ions include halide ions such as chloride ions and bromide ions; fluoroalkyl sulfonate ions such as trifluoromethanesulfonate ions, 1,1,1-trifluoroethanesulfonate ions, and nonafluorobutanesulfonate ions; aryl sulfonate ions such as toluenesulfonate ions, benzenesulfonate ions, 4-fluorobenzenesulfonate ions, and 1,2,3,4,5-pentafluorobenzenesulfonate ions; alkyl sulfonate ions such as methanesulfonate ions and butanesulfonate ions; imide acid ions such as bis(trifluoromethylsulfonyl)imide ions, bis(perfluoroethylsulfonyl)imide ions, and bis(perfluorobutylsulfonyl)imide ions; methylated acid ions such as tris(trifluoromethylsulfonyl)methide ions and tris(perfluoroethylsulfonyl)methide ions.
前述非亲核性相对离子更可列举:下述通式(d1-1)表示的α位被氟原子取代的磺酸根离子、下述通式(d1-2)表示的α位被氟原子取代且β位被三氟甲基取代的磺酸根离子等。The aforementioned non-nucleophilic relative ions can further be listed as follows: sulfonate ions represented by the following general formula (d1-1) in which the α-position is substituted with a fluorine atom, sulfonate ions represented by the following general formula (d1-2) in which the α-position is substituted with a fluorine atom and the β-position is substituted with a trifluoromethyl group, etc.
[化80][Chemistry 80]
R31-CF2-SO3 - (d1-1)R 31 -CF 2 -SO 3 - (d1-1)
通式(d1-1)中,R31为氢原子、碳数1~20的烷基、碳数2~20的烯基、或碳数6~20的芳基,且也可含有醚键、酯键、羰基、内酯环或氟原子。前述烷基及烯基为直链状、分支状、环状中的任一皆可。In the general formula (d1-1), R 31 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and may contain an ether bond, an ester bond, a carbonyl group, a lactone ring, or a fluorine atom. The alkyl group and the alkenyl group may be straight-chain, branched, or cyclic.
通式(d1-2)中,R32为氢原子、碳数1~30的烷基、碳数2~30的酰基、碳数2~20的烯基、碳数6~20的芳基、或碳数6~20的芳氧基,且也可含有醚键、酯键、羰基或内酯环。前述烷基、酰基、及烯基为直链状、分支状、环状中的任一皆可。In the general formula (d1-2), R 32 is a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an acyl group having 2 to 30 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aryloxy group having 6 to 20 carbon atoms, and may contain an ether bond, an ester bond, a carbonyl group, or a lactone ring. The alkyl group, acyl group, and alkenyl group may be straight-chain, branched, or cyclic.
又,前述Z2B中宜含有至少1个以上的碘原子。Furthermore, it is preferred that the aforementioned Z 2B contains at least one iodine atom.
提供重复单元d1的单体可列举如下所示者,但不限于此。另外,下式中,RA及M-和前述相同。Examples of the monomers providing the repeating unit d1 include, but are not limited to, the following: In the following formula, RA and M- are the same as those described above.
[化81][Chemistry 81]
提供重复单元d2的单体可列举如下所示者,但不限于此。另外,下式中,RA和前述相同。The monomers providing the repeating unit d2 include, but are not limited to, the following. In the following formula, RA is the same as described above.
[化82][Chemistry 82]
[化83][Chemistry 83]
[化84][Chemistry 84]
[化85][Chemistry 85]
[化86][Chemistry 86]
又,提供重复单元d2的单体宜为具有如下所示的阴离子者。另外,下式中,RA和前述相同。Furthermore, the monomer providing the repeating unit d2 is preferably one having an anion as shown below: In the following formula, RA is the same as above.
[化87][Chemistry 87]
[化88][Chemistry 88]
[化89][Chemistry 89]
[化90][Chemistry 90]
[化91][Chemistry 91]
[化92][Chemistry 92]
[化93][Chemistry 93]
[化94][Chemistry 94]
提供重复单元d3的单体可列举如下所示者,但不限于此。另外,下式中,RA和前述相同。Examples of the monomers providing the repeating unit d3 include, but are not limited to, the following. In the following formula, RA is the same as described above.
[化95][Chemistry 95]
[化96][Chemistry 96]
重复单元d1~d3具有酸产生剂的功能。借由使酸产生剂键结于聚合物主链,可使酸扩散缩小,且可防止酸扩散的模糊所导致的分辨度的降低。又,酸产生剂借由均匀地分散,LWR会改善。另外,使用含有重复单元d的抗蚀剂材料时,可省略后述添加型酸产生剂的掺合。Repeating units d1 to d3 function as an acid generator. By bonding the acid generator to the polymer main chain, the acid diffusion can be reduced and the reduction in resolution caused by the blurring of the acid diffusion can be prevented. In addition, the acid generator can be evenly dispersed to improve the LWR. In addition, when using a resist material containing repeating unit d, the addition of the additive acid generator described later can be omitted.
本发明的抗蚀剂材料中,借由使自聚合物主链间隔酯键而键结的有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐的具有淬灭剂功能的重复单元a、与d1~d3的具有酸产生剂功能的重复单元d进行共聚合,可在1个聚合物内具有全部的功能。此时,会有聚合物以外所添加的材料仅为有机溶剂、表面活性剂的情况,由于为单纯的材料构成,故有生产性高的益处。In the resist material of the present invention, by copolymerizing the repeating unit a having a quencher function of a substituted or unsubstituted iodinated monovalent aromatic carboxylic acid sulfonium salt or iodonium salt bonded to the polymer main chain via an ester bond, and the repeating unit d having an acid generator function of d1 to d3, all functions can be contained in one polymer. In this case, the only materials added other than the polymer may be an organic solvent or a surfactant, and since it is composed of simple materials, it has the advantage of high productivity.
具有双键的经碘化的1价芳香族羧酸的锍盐或錪盐的淬灭剂的聚合速度,和锍盐或錪盐的酸产生剂的聚合速度为相同程度,故淬灭剂与酸产生剂会均匀地存在聚合物中,借此会改善显影后的边缘粗糙度。在酸产生剂的阴离子部分含有碘时,利用吸收的光子数增加所致的酸产生时的对比度的改善,会更改善边缘粗糙度。本发明的抗蚀剂材料中的具有经碘化的1价芳香族羧酸的锍盐或錪盐的重复单元a,会发挥如下效果:碘的吸收所致的吸收的光子数增加,以致改善淬灭剂分解的对比度,并达成边缘粗糙度的改善。The polymerization rate of the quencher of the sulfonium salt or iodonium salt of the iodonium salt of the iodonium salt having a double bond is about the same as the polymerization rate of the acid generator of the sulfonium salt or iodonium salt, so the quencher and the acid generator are uniformly present in the polymer, thereby improving the edge roughness after development. When the anion part of the acid generator contains iodine, the edge roughness is further improved by utilizing the improvement of the contrast during acid generation due to the increase in the number of absorbed photons. The repeating unit a of the sulfonium salt or iodonium salt of the iodonium salt of the iodonium salt having an iodine in the resist material of the present invention has the following effect: the number of absorbed photons due to the absorption of iodine is increased, thereby improving the contrast of the decomposition of the quencher and achieving the improvement of the edge roughness.
前述抗蚀剂材料也可更含有不含氨基而含有碘原子的重复单元e。提供重复单元e的单体可列举如下所示者,但不限于此。另外,下式中,RA和前述相同。The resist material may further contain a repeating unit e which does not contain an amino group but contains an iodine atom. Examples of monomers providing the repeating unit e include, but are not limited to, the following. In the following formula, RA is the same as above.
[化97][Chemistry 97]
[化98][Chemistry 98]
前述抗蚀剂材料也可含有前述重复单元以外的重复单元f。重复单元f可列举来自苯乙烯、乙烯萘、茚、苊、香豆素、香豆酮等者。The resist material may contain a repeating unit f other than the repeating unit mentioned above. Examples of the repeating unit f include those derived from styrene, vinylnaphthalene, indene, acenaphthene, coumarin, coumarone, and the like.
前述抗蚀剂材料中,重复单元a1、a2、b1、b2、c、d1、d2、d3、e及f的含有比率宜为0≤a1≤1.0、0≤a2≤1.0、0<a1+a2≤1.0、0≤b1≤0.5、0≤b2≤0.5、0≤b1+b2≤0.9、0≤c≤0.9、0≤d1≤0.5、0≤d2≤0.5、0≤d3≤0.5、0≤d1+d2+d3≤0.5、0≤e≤0.5及0≤f≤0.5,为0.001≤a1≤0.8、0.001≤a2≤0.8、0.001≤a1+a2≤0.8、0≤b1≤0.8、0≤b2≤0.8、0.1≤b1+b2≤0.8、0≤c≤0.8、0≤d1≤0.4、0≤d2≤0.4、0≤d3≤0.4、0≤d1+d2+d3≤0.4、0≤e≤0.4及0≤f≤0.4更佳,为0.005≤a1≤0.7、0.005≤a2≤0.7、0.005≤a1+a2≤0.7、0≤b1≤0.7、0≤b2≤0.7、0≤b1+b2≤0.7、0≤c≤0.7、0≤d1≤0.3、0≤d2≤0.3、0≤d3≤0.3、0≤d1+d2+d3≤0.3、0≤e≤0.3及0≤f≤0.3再更佳。但,a1+a2+b1+b2+c+d1+d2+d3+e+f=1.0。In the resist material, the content ratio of the repeating units a1, a2, b1, b2, c, d1, d2, d3, e and f is preferably 0≤a1≤1.0, 0≤a2≤1.0, 0<a1+a2≤1.0, 0≤b1≤0.5, 0≤b2≤0.5, 0≤b1+b2≤0.9, 0≤c≤0.9, 0≤d1≤0.5, 0≤d2≤0.5, 0≤d3≤0.5, 0≤d1+d2+d3≤0.5, 0≤e≤0.5 and 0≤f≤0.5, and is 0.001≤a1≤0.8, 0.001≤a2≤0.8, 0.001≤a1+a2≤0.8, 0≤b1≤0.8, 0≤b2 ≤0.8, 0.1≤b1+b2≤0.8, 0≤c≤0.8, 0≤d1≤0.4, 0≤d2≤0.4, 0≤d3≤0.4, 0≤d1+d2+d3≤0.4, 0≤e≤0.4 and 0≤f≤0.4 are more preferred, and 0.005≤a1≤0.7, 0.005≤a2≤0.7, 0.005≤a1+a2≤0.7, 0≤b1≤0.7, 0≤b2≤0.7, 0≤b1+b2≤0.7, 0≤c≤0.7, 0≤d1≤0.3, 0≤d2≤0.3, 0≤d3≤0.3, 0≤d1+d2+d3≤0.3, 0≤e≤0.3 and 0≤f≤0.3 are even more preferred. But, a1+a2+b1+b2+c+d1+d2+d3+e+f=1.0.
合成前述抗蚀剂材料时,例如将提供前述重复单元的单体,在有机溶剂中,添加自由基聚合引发剂后进行加热,并实施聚合即可。When synthesizing the resist material, for example, a monomer providing the repeating unit is added with a radical polymerization initiator in an organic solvent, and then heated to perform polymerization.
聚合时使用的有机溶剂可列举:甲苯、苯、四氢呋喃(THF)、二乙醚、二噁烷、丙二醇单甲醚、γ丁内酯及它们的混合溶剂等。聚合引发剂可列举:2,2’-偶氮双异丁腈(AIBN)、2,2’-偶氮双(2,4-二甲基戊腈)、2,2-偶氮双(2-甲基丙酸)二甲酯、过氧化苯甲酰、过氧化月桂酰等。聚合时的温度宜为50~80℃。反应时间宜为2~100小时,为5~20小时更佳。Examples of organic solvents used in the polymerization include toluene, benzene, tetrahydrofuran (THF), diethyl ether, dioxane, propylene glycol monomethyl ether, γ-butyrolactone, and mixed solvents thereof. Examples of polymerization initiators include 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2-azobis(2-methylpropionic acid) dimethyl ester, benzoyl peroxide, lauroyl peroxide, and the like. The polymerization temperature is preferably 50 to 80°C. The reaction time is preferably 2 to 100 hours, more preferably 5 to 20 hours.
将含有羟基的单体予以共聚合时,能在聚合时事先将羟基以乙氧基乙氧基等容易因酸而脱保护的缩醛基进行取代,并在聚合后利用弱酸及水来实施脱保护,也能事先以乙酰基、甲酰基、三甲基乙酰基等进行取代,并在聚合后实施碱水解。When a monomer containing a hydroxyl group is copolymerized, the hydroxyl group can be replaced with an acetal group such as ethoxyethoxy that is easily deprotected by an acid during the polymerization, and then deprotected using a weak acid and water after the polymerization. Alternatively, the hydroxyl group can be replaced with an acetyl group, a formyl group, a pivaloyl group, etc., and then alkaline hydrolysis can be performed after the polymerization.
将羟基苯乙烯、羟基乙烯萘予以共聚合时,也可将羟基苯乙烯、羟基乙烯萘替换成使用乙酰氧基苯乙烯、乙酰氧基乙烯萘,并在聚合后,利用前述碱水解来将乙酰氧基予以脱保护而成为羟基苯乙烯、羟基乙烯萘。When hydroxystyrene and hydroxyvinylnaphthalene are copolymerized, acetoxystyrene and acetoxyvinylnaphthalene may be used instead of hydroxystyrene and hydroxyvinylnaphthalene, and after polymerization, the acetoxy group may be deprotected by the above-mentioned alkaline hydrolysis to obtain hydroxystyrene and hydroxyvinylnaphthalene.
碱水解时的碱可使用氨水、三乙胺等。又,反应温度宜为-20~100℃,为0~60℃更佳。反应时间宜为0.2~100小时,为0.5~20小时更佳。The base used in the alkaline hydrolysis may be aqueous ammonia, triethylamine, etc. The reaction temperature is preferably -20 to 100°C, more preferably 0 to 60°C. The reaction time is preferably 0.2 to 100 hours, more preferably 0.5 to 20 hours.
前述抗蚀剂材料,其使用THF作为溶剂的凝胶渗透层析(GPC)所为的聚苯乙烯换算重均分子量(Mw)宜为1,000~500,000,为1,000~100,000更佳,为2,000~30,000再更佳。Mw若为1,000以上,则抗蚀剂材料会成为耐热性优良者,若为500,000以下,则会保持碱溶解性,且在图案形成后不会发生拖尾现象。The polystyrene-equivalent weight average molecular weight (Mw) of the resist material measured by gel permeation chromatography (GPC) using THF as a solvent is preferably 1,000 to 500,000, more preferably 1,000 to 100,000, and even more preferably 2,000 to 30,000. If Mw is 1,000 or more, the resist material has excellent heat resistance, and if Mw is 500,000 or less, alkali solubility is maintained and tailing does not occur after pattern formation.
此外,前述抗蚀剂材料中分子量分布(Mw/Mn)广时,由于存在低分子量、高分子量的聚合物,故会有曝光后于图案上观察到异物、或图案的形状恶化的疑虑。随着图案规则微细化,Mw、Mw/Mn的影响也容易变大,故为了获得适合使用于微细的图案尺寸的抗蚀剂材料,前述抗蚀剂材料的Mw/Mn宜为1.0~2.0,为1.0~1.5特佳的窄分散。In addition, when the molecular weight distribution (Mw/Mn) of the aforementioned resist material is wide, there is a concern that foreign matter may be observed on the pattern after exposure or the shape of the pattern may deteriorate due to the presence of low molecular weight and high molecular weight polymers. As the pattern rules become finer, the influence of Mw and Mw/Mn is also likely to become greater. Therefore, in order to obtain a resist material suitable for use in a fine pattern size, the Mw/Mn of the aforementioned resist material is preferably 1.0 to 2.0, and a particularly preferred narrow distribution is 1.0 to 1.5.
为了获得窄分散聚合物,不仅可使用通常的自由基聚合,也可使用活性自由基聚合。活性自由基聚合可列举:使用了氮氧化物自由基的活性自由基聚合(Nitroxide-Mediated radical Polymerization:NMP)、原子转移自由基聚合(Atom Transfer RadicalPolymerization:ATRP),可逆的加成-裂解链转移(Reversible Addition-Fragmentationchain Transfer:RAFT)聚合。In order to obtain a narrowly dispersed polymer, not only conventional radical polymerization but also living radical polymerization can be used. Examples of living radical polymerization include living radical polymerization using nitroxide radicals (Nitroxide-Mediated Radical Polymerization: NMP), atom transfer radical polymerization (Atom Transfer Radical Polymerization: ATRP), and reversible addition-fragmentation chain transfer (Reversible Addition-Fragmentation Chain Transfer: RAFT) polymerization.
前述抗蚀剂材料也可包含组成比率、Mw、Mw/Mn不同的2种以上的聚合物。又,也可掺混含有重复单元a的聚合物与不含重复单元a的聚合物。The resist material may include two or more polymers having different composition ratios, Mw, and Mw/Mn. In addition, a polymer containing a repeating unit a and a polymer not containing a repeating unit a may be mixed.
[抗蚀剂组成物][Resist composition]
又,本发明提供一种抗蚀剂组成物,是含有上述所记载的抗蚀剂材料的抗蚀剂组成物。本发明的抗蚀剂组成物宜为更含有选自光酸产生剂、有机溶剂、淬灭剂、及表面活性剂中的1种以上者。以下,针对抗蚀剂组成物所含的各成分进行说明。In addition, the present invention provides a resist composition, which is a resist composition containing the resist material described above. The resist composition of the present invention preferably further contains one or more selected from a photoacid generator, an organic solvent, a quencher, and a surfactant. The following describes the components contained in the resist composition.
[酸产生剂][Acid generator]
本发明的抗蚀剂材料也可更含有会产生强酸的酸产生剂(以下也称添加型酸产生剂)。在此所谓强酸意指具有足以引起抗蚀剂材料的酸不稳定基团的脱保护反应的酸性度的化合物。前述酸产生剂可列举例如感应于活性光线或放射线并产生酸的化合物(光酸产生剂)。光酸产生剂若为因高能射线照射而产生酸的化合物,则为任意者皆无妨,宜为会产生磺酸、酰亚胺酸或甲基化酸者。理想的光酸产生剂有:锍盐、錪盐、磺酰基重氮甲烷、N-磺酰氧基酰亚胺、肟-O-磺酸酯型酸产生剂等。光酸产生剂的具体例可列举:日本特开2008-111103号公报的[0122]~[0142]段落所记载者。The resist material of the present invention may further contain an acid generator (hereinafter also referred to as an additive acid generator) that generates a strong acid. Here, the so-called strong acid means a compound having an acidity sufficient to cause a deprotection reaction of an acid-labile group of the resist material. Examples of the aforementioned acid generator include compounds (photoacid generators) that are responsive to active light or radiation and generate an acid. If the photoacid generator is a compound that generates an acid due to high-energy radiation irradiation, it can be any compound, and it is preferably one that generates sulfonic acid, imidic acid or methylated acid. Ideal photoacid generators include sulfonium salts, iodonium salts, sulfonyldiazomethane, N-sulfonyloxyimide, oxime-O-sulfonate acid generators, etc. Specific examples of photoacid generators include those described in paragraphs [0122] to [0142] of Japanese Patent Publication No. 2008-111103.
又,光酸产生剂也可理想地使用下述通式(1-1)表示的锍盐、下述通式(1-2)表示的錪盐。Furthermore, as the photoacid generator, a sulfonium salt represented by the following general formula (1-1) or an iodonium salt represented by the following general formula (1-2) can also be preferably used.
[化99][Chemistry 99]
通式(1-1)及(1-2)中,R101~R105分别独立地为也可含有杂原子的碳数1~20的1价烃基。又,R101、R102及R103中的任2个也可互相键结并和它们所键结的硫原子一起形成环。前述1价烃基为直链状、分支状、环状中的任一皆可,其具体例可列举和前述者同样的例子。In the general formulae (1-1) and (1-2), R101 to R105 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a hetero atom. In addition, any two of R101 , R102 and R103 may be bonded to each other and form a ring together with the sulfur atom to which they are bonded. The monovalent hydrocarbon group may be linear, branched or cyclic, and specific examples thereof include the same examples as those mentioned above.
通式(1-1)及(1-2)中,X-为选自下述通式(1A)~(1D)的阴离子。In the general formulae (1-1) and (1-2), X- is an anion selected from the group consisting of the following general formulae (1A) to (1D).
[化100][Chemical 100]
通式(1A)中,Rfa为氟原子或也可含有杂原子的碳数1~40的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和下述通式(1A’)中作为R107表示的烃基而后述者同样的例子。In the general formula (1A), R fa is a hydrocarbon group having 1 to 40 carbon atoms which may contain a fluorine atom or a heteroatom. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched, or cyclic. Specific examples thereof include the same examples as those described below for the hydrocarbon group represented by R 107 in the general formula (1A').
通式(1A)表示的阴离子宜为下述通式(1A’)表示者。The anion represented by the general formula (1A) is preferably represented by the following general formula (1A').
[化101][Chemistry 101]
通式(1A’)中,R106为氢原子或三氟甲基,宜为三氟甲基。R107为也可含有杂原子的碳数1~38的烃基。前述杂原子宜为氧原子、氮原子、硫原子、卤素原子等,为氧原子更佳。前述烃基考虑在微细图案形成时获得高分辨度的观点,为碳数6~30者特佳。In the general formula (1A'), R106 is a hydrogen atom or a trifluoromethyl group, preferably a trifluoromethyl group. R107 is a hydrocarbon group having 1 to 38 carbon atoms which may contain a hetero atom. The hetero atom is preferably an oxygen atom, a nitrogen atom, a sulfur atom, a halogen atom, etc., and is more preferably an oxygen atom. The hydrocarbon group is particularly preferably one having 6 to 30 carbon atoms from the viewpoint of obtaining a high resolution when forming a fine pattern.
R107表示的烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举:甲基、乙基、丙基、异丙基、丁基、异丁基、仲丁基、叔丁基、戊基、新戊基、己基、庚基、2-乙基己基、壬基、十一烷基、十三烷基、十五烷基、十七烷基、二十烷基等烷基;环戊基、环己基、1-金刚烷基、2-金刚烷基、1-金刚烷基甲基、降莰基、降莰基甲基、三环癸基、四环十二烷基、四环十二烷基甲基、二环己基甲基等环状饱和烃基;烯丙基、3-环己烯基等不饱和烃基;苯基、1-萘基、2-萘基等芳基;苄基、二苯基甲基等芳烷基等。The hydrocarbon group represented by R 107 may be saturated or unsaturated, and may be straight-chain, branched, or cyclic. Specific examples thereof include: alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, neopentyl, hexyl, heptyl, 2-ethylhexyl, nonyl, undecyl, tridecyl, pentadecyl, heptadecyl, and eicosyl; cyclic saturated hydrocarbon groups such as cyclopentyl, cyclohexyl, 1-adamantyl, 2-adamantyl, 1-adamantylmethyl, norbornyl, norbornylmethyl, tricyclodecanyl, tetracyclododecyl, tetracyclododecylmethyl, and dicyclohexylmethyl; unsaturated hydrocarbon groups such as allyl and 3-cyclohexenyl; aryl groups such as phenyl, 1-naphthyl, and 2-naphthyl; aralkyl groups such as benzyl and diphenylmethyl; and the like.
又,这些基团的氢原子的一部分或全部也可被含氧原子、硫原子、氮原子、卤素原子等杂原子的基团取代,这些基团的碳原子的一部分也可被含氧原子、硫原子、氮原子等杂原子的基团取代,其结果也可含有羟基、氰基、羰基、醚键、酯键、磺酸酯键、碳酸酯基、内酯环、磺内酯环、羧酸酐、卤烷基等。含杂原子的烃基可列举:四氢呋喃基、甲氧基甲基、乙氧基甲基、甲基硫代甲基、乙酰胺甲基、三氟乙基、(2-甲氧基乙氧基)甲基、乙酰氧基甲基、2-羧基-1-环己基、2-氧代基丙基、4-氧代基-1-金刚烷基、3-氧代基环己基等。Furthermore, part or all of the hydrogen atoms of these groups may be substituted by groups containing heteroatoms such as oxygen atoms, sulfur atoms, nitrogen atoms, and halogen atoms, and part of the carbon atoms of these groups may be substituted by groups containing heteroatoms such as oxygen atoms, sulfur atoms, and nitrogen atoms, and as a result, hydroxyl groups, cyano groups, carbonyl groups, ether bonds, ester bonds, sulfonate bonds, carbonate groups, lactone rings, sultone rings, carboxylic anhydrides, and haloalkyl groups may be contained. Examples of heteroatom-containing hydrocarbon groups include tetrahydrofuranyl, methoxymethyl, ethoxymethyl, methylthiomethyl, acetamidomethyl, trifluoroethyl, (2-methoxyethoxy)methyl, acetoxymethyl, 2-carboxy-1-cyclohexyl, 2-oxopropyl, 4-oxo-1-adamantyl, and 3-oxocyclohexyl.
关于含有通式(1A’)表示的阴离子的锍盐的合成,详如日本特开2007-145797号公报、日本特开2008-106045号公报、日本特开2009-007327号公报、日本特开2009-258695号公报等。又,也可理想地使用日本特开2010-215608号公报、日本特开2012-041320号公报、日本特开2012-106986号公报、日本特开2012-153644号公报等所记载的锍盐。The synthesis of the sulfonium salt containing the anion represented by the general formula (1A') is described in Japanese Patent Application Publication No. 2007-145797, Japanese Patent Application Publication No. 2008-106045, Japanese Patent Application Publication No. 2009-007327, Japanese Patent Application Publication No. 2009-258695, etc. Also, the sulfonium salts described in Japanese Patent Application Publication No. 2010-215608, Japanese Patent Application Publication No. 2012-041320, Japanese Patent Application Publication No. 2012-106986, Japanese Patent Application Publication No. 2012-153644, etc. can be preferably used.
通式(1A)表示的阴离子可列举和日本特开2018-197853号公报中例示作为式(1A)表示的阴离子者同样的例子。Examples of the anion represented by the general formula (1A) include the same examples as those exemplified as the anion represented by the formula (1A) in JP-A-2018-197853.
通式(1B)中,Rfb1及Rfb2分别独立地为氟原子或也可含有杂原子的碳数1~40的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和通式(1A’)中的R107的说明中所例示者同样的例子。Rfb1及Rfb2宜为氟原子或碳数1~4的直链状氟化烷基。又,Rfb1与Rfb2也可互相键结并和它们所键结的基团(-CF2-SO2-N--SO2-CF2-)一起形成环,此时,Rfb1与Rfb2互相键结而得的基团,宜为氟化亚乙基或氟化亚丙基。In the general formula (1B), Rfb1 and Rfb2 are each independently a fluorine atom or a hydrocarbon group having 1 to 40 carbon atoms which may contain a heteroatom. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched, or cyclic. Specific examples thereof include the same examples as those exemplified in the description of R107 in the general formula (1A'). Rfb1 and Rfb2 are preferably fluorine atoms or linear fluorinated alkyl groups having 1 to 4 carbon atoms. Furthermore, Rfb1 and Rfb2 may be bonded to each other and form a ring together with the group to which they are bonded (-CF2 - SO2 -N -- SO2 - CF2- ), in which case the group obtained by bonding Rfb1 and Rfb2 to each other is preferably a fluorinated ethylene group or a fluorinated propylene group.
通式(1C)中,Rfc1、Rfc2及Rfc3分别独立地为氟原子或也可含有杂原子的碳数1~40的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和通式(1A’)中的R107的说明中所例示者同样的例子。Rfc1、Rfc2及Rfc3宜为氟原子或碳数1~4的直链状氟化烷基。又,Rfc1与Rfc2也可互相键结并和它们所键结的基团(-CF2-SO2-C--SO2-CF2-)一起形成环,此时,Rfc1与Rfc2互相键结而得的基团,宜为氟化亚乙基或氟化亚丙基。In the general formula (1C), Rfc1 , Rfc2 and Rfc3 are each independently a fluorine atom or a hydrocarbon group having 1 to 40 carbon atoms which may contain a hetero atom. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched or cyclic. Specific examples thereof include the same examples as those exemplified in the description of R107 in the general formula (1A'). Rfc1 , Rfc2 and Rfc3 are preferably fluorine atoms or linear fluorinated alkyl groups having 1 to 4 carbon atoms. Furthermore, Rfc1 and Rfc2 may be bonded to each other and form a ring together with the group to which they are bonded (-CF2 - SO2 -C -- SO2 - CF2- ), in which case the group obtained by bonding Rfc1 and Rfc2 to each other is preferably a fluorinated ethylene group or a fluorinated propylene group.
通式(1D)中,Rfd为也可含有杂原子的碳数1~40的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和通式(1A’)中的R107的说明中所例示者同样的例子。In the general formula (1D), Rfd is a hydrocarbon group having 1 to 40 carbon atoms which may contain a heteroatom. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched, or cyclic. Specific examples thereof include the same examples as those exemplified in the description of R107 in the general formula (1A').
关于含有通式(1D)表示的阴离子的锍盐的合成,详如日本特开2010-215608号公报及日本特开2014-133723号公报。The synthesis of the sulfonium salt containing the anion represented by the general formula (1D) is described in detail in Japanese Unexamined Patent Publication Nos. 2010-215608 and 2014-133723.
通式(1D)表示的阴离子可列举和日本特开2018-197853号公报中例示作为式(1D)表示的阴离子者同样的例子。Examples of the anion represented by the general formula (1D) include the same examples as those exemplified as the anion represented by the formula (1D) in JP-A-2018-197853.
另外,含有通式(1D)表示的阴离子的光酸产生剂,虽然在磺基的α位不具有氟,但在β位具有2个三氟甲基,因此具有足以切断抗蚀剂材料中的酸不稳定基团的酸性度。因此,可使用作为光酸产生剂。In addition, the photoacid generator containing the anion represented by the general formula (1D) has no fluorine at the α-position of the sulfonic group but has two trifluoromethyl groups at the β-position, and thus has acidity sufficient to cut off the acid-labile groups in the resist material. Therefore, it can be used as a photoacid generator.
此外,光酸产生剂也可理想地使用下述通式(2)表示者。Furthermore, as the photoacid generator, a photoacid generator represented by the following general formula (2) can also be preferably used.
[化102][Chemistry 102]
通式(2)中,R201及R202分别独立地为也可含有杂原子的碳数1~30的烃基。R203也可含有杂原子的碳数1~30的亚烃基。又,R201及R202或R201及R203也可互相键结并和它们所键结的硫原子一起形成环。此时,前述环可列举和通式(1-1)的说明中例示作为R101与R102键结并和它们所键结的硫原子一起所能形成的环者同样的例子。In the general formula (2), R201 and R202 are each independently a hydrocarbon group having 1 to 30 carbon atoms which may contain a hetero atom. R203 may be a hydrocarbon ene group having 1 to 30 carbon atoms which may contain a hetero atom. Furthermore, R201 and R202 or R201 and R203 may be bonded to each other and form a ring together with the sulfur atom to which they are bonded. In this case, the aforementioned ring may be the same as those exemplified in the description of the general formula (1-1) as the ring that can be formed when R101 and R102 are bonded to each other and together with the sulfur atom to which they are bonded.
R201及R202表示的烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举:甲基、乙基、丙基、异丙基、正丁基、仲丁基、叔丁基、正戊基、叔戊基、正己基、正辛基、2-乙基己基、正壬基、正癸基等烷基;环戊基、环己基、环戊基甲基、环戊基乙基、环戊基丁基、环己基甲基、环己基乙基、环己基丁基、降莰基、三环[5.2.1.02,6]癸基、金刚烷基等环状饱和烃基;苯基、甲苯基、乙苯基、正丙苯基、异丙苯基、正丁苯基、异丁苯基、仲丁苯基、叔丁苯基、萘基、甲萘基、乙萘基、正丙萘基、异丙萘基、正丁萘基、异丁萘基、仲丁萘基、叔丁萘基、蒽基等芳基等。又,这些基团的氢原子的一部分或全部也可被含氧原子、硫原子、氮原子、卤素原子等杂原子的基团取代,这些基团的碳原子的一部分也可被含氧原子、硫原子、氮原子等杂原子的基团取代,其结果也可含有羟基、氰基、羰基、醚键、酯键、磺酸酯键、碳酸酯基、内酯环、磺内酯环、羧酸酐、卤烷基等。The hydrocarbon group represented by R 201 and R 202 may be saturated or unsaturated, and may be linear, branched, or cyclic. Specific examples thereof include: alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, n-pentyl, tert-pentyl, n-hexyl, n-octyl, 2-ethylhexyl, n-nonyl, and n-decyl; cyclic saturated hydrocarbon groups such as cyclopentyl, cyclohexyl, cyclopentylmethyl, cyclopentylethyl, cyclopentylbutyl, cyclohexylmethyl, cyclohexylethyl, cyclohexylbutyl, norbornyl, tricyclo[5.2.1.0 2,6 ]decyl, and adamantyl; and aryl groups such as phenyl, tolyl, ethylphenyl, n-propylphenyl, isopropylphenyl, n-butylphenyl, isobutylphenyl, sec-butylphenyl, tert-butylphenyl, naphthyl, methylnaphthyl, ethylnaphthyl, n-propylnaphthyl, isopropylnaphthyl, n-butylnaphthyl, isobutylnaphthyl, sec-butylnaphthyl, tert-butylnaphthyl, and anthracenyl. Furthermore, part or all of the hydrogen atoms of these groups may be substituted by groups containing hetero atoms such as oxygen atoms, sulfur atoms, nitrogen atoms, and halogen atoms, and part of the carbon atoms of these groups may be substituted by groups containing hetero atoms such as oxygen atoms, sulfur atoms, and nitrogen atoms, and as a result, they may contain hydroxyl groups, cyano groups, carbonyl groups, ether bonds, ester bonds, sulfonate bonds, carbonate groups, lactone rings, sultone rings, carboxylic anhydrides, haloalkyl groups, and the like.
R203表示的亚烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举:亚甲基、亚乙基、丙烷-1,3-二基、丁烷-1,4-二基、戊烷-1,5-二基、己烷-1,6-二基、庚烷-1,7-二基、辛烷-1,8-二基、壬烷-1,9-二基、癸烷-1,10-二基、十一烷-1,11-二基、十二烷-1,12-二基、十三烷-1,13-二基、十四烷-1,14-二基、十五烷-1,15-二基、十六烷-1,16-二基、十七烷-1,17-二基等烷二基;环戊烷二基、环己烷二基、降莰烷二基、金刚烷二基等环状饱和亚烃基;亚苯基、甲基亚苯基、乙基亚苯基、正丙基亚苯基、异丙基亚苯基、正丁基亚苯基、异丁基亚苯基、仲丁基亚苯基、叔丁基亚苯基、亚萘基、甲基亚萘基、乙基亚萘基、正丙基亚萘基、异丙基亚萘基、正丁基亚萘基、异丁基亚萘基、仲丁基亚萘基、叔丁基亚萘基等亚芳基等。又,这些基团的氢原子的一部分或全部也可被含氧原子、硫原子、氮原子、卤素原子等杂原子的基团取代,这些基团的碳原子的一部分也可被含氧原子、硫原子、氮原子等杂原子的基团取代,其结果也可含有羟基、氰基、羰基、醚键、酯键、磺酸酯键、碳酸酯基、内酯环、磺内酯环、羧酸酐、卤烷基等。前述杂原子宜为氧原子。The alkylene group represented by R 203 may be saturated or unsaturated, and may be straight-chain, branched, or cyclic. Specific examples thereof include: methylene, ethylene, propane-1,3-diyl, butane-1,4-diyl, pentane-1,5-diyl, hexane-1,6-diyl, heptane-1,7-diyl, octane-1,8-diyl, nonane-1,9-diyl, decane-1,10-diyl, undecane-1,11-diyl, dodecane-1,12-diyl, tridecane-1,13-diyl, tetradecane-1,14-diyl, pentadecane-1,15-diyl, hexadecane-1,16-diyl, Alkanediyl groups such as heptadecan-1,17-diyl; cyclic saturated alkylene groups such as cyclopentanediyl, cyclohexanediyl, norbornanediyl and adamantanediyl; arylene groups such as phenylene, methylphenylene, ethylphenylene, n-propylphenylene, isopropylphenylene, n-butylphenylene, isobutylphenylene, sec-butylphenylene, tert-butylphenylene, naphthylene, methylnaphthylene, ethylnaphthylene, n-propylnaphthylene, isopropylnaphthylene, n-butylnaphthylene, isobutylnaphthylene, sec-butylnaphthylene and tert-butylnaphthylene; and the like. Furthermore, part or all of the hydrogen atoms of these groups may be substituted by groups containing heteroatoms such as oxygen atoms, sulfur atoms, nitrogen atoms, and halogen atoms, and part of the carbon atoms of these groups may be substituted by groups containing heteroatoms such as oxygen atoms, sulfur atoms, and nitrogen atoms, and as a result, hydroxyl groups, cyano groups, carbonyl groups, ether bonds, ester bonds, sulfonate bonds, carbonate groups, lactone rings, sultone rings, carboxylic anhydrides, haloalkyl groups, etc. are contained. The aforementioned heteroatoms are preferably oxygen atoms.
通式(2)中,L1为单键、醚键、或也可含有杂原子的碳数1~20的亚烃基。前述亚烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和例示作为R203表示的亚烃基者同样的例子。In the general formula (2), L1 is a single bond, an ether bond, or a carbonylene group having 1 to 20 carbon atoms which may contain a hetero atom. The aforementioned carbonylene group may be saturated or unsaturated, and may be linear, branched, or cyclic. Specific examples thereof include the same examples as those exemplified as the carbonylene group represented by R203 .
通式(2)中,XA、XB、XC及XD分别独立地为氢原子、氟原子或三氟甲基。但,XA、XB、XC及XD中的至少1个为氟原子或三氟甲基。In the general formula (2), XA , XB , XC and XD are each independently a hydrogen atom, a fluorine atom or a trifluoromethyl group. However, at least one of XA , XB , XC and XD is a fluorine atom or a trifluoromethyl group.
通式(2)中,k为0~3的整数。In the general formula (2), k is an integer of 0-3.
通式(2)表示的光酸产生剂宜为下述通式(2’)表示者。The photoacid generator represented by the general formula (2) is preferably represented by the following general formula (2').
[化103][Chemistry 103]
通式(2’)中,L1和前述相同。RHF为氢原子或三氟甲基,宜为三氟甲基。R301、R302及R303分别独立地为氢原子或也可含有杂原子的碳数1~20的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和通式(1A’)中的R107的说明中所例示者同样的例子。x及y分别独立地为0~5的整数,z为0~4的整数。In the general formula (2'), L1 is the same as described above. RHF is a hydrogen atom or a trifluoromethyl group, preferably a trifluoromethyl group. R301 , R302 and R303 are each independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched or cyclic. Specific examples thereof include the same examples as those exemplified in the description of R107 in the general formula (1A'). x and y are each independently an integer of 0 to 5, and z is an integer of 0 to 4.
通式(2)表示的光酸产生剂可列举和日本特开2017-026980号公报中例示作为式(2)表示的光酸产生剂者同样的例子。Examples of the photo-acid generator represented by the general formula (2) include the same examples as those exemplified as the photo-acid generator represented by the formula (2) in JP-A-2017-026980.
前述光酸产生剂之中,含有通式(1A’)或(1D)表示的阴离子者,其酸扩散小且对抗蚀剂溶剂的溶解性亦优良,特别理想。又,通式(2’)表示者,其酸扩散极小,特别理想。Among the above-mentioned photoacid generators, those containing anions represented by general formula (1A') or (1D) are particularly preferred because they have low acid diffusion and excellent solubility in resist solvents. Also, those represented by general formula (2') are particularly preferred because they have extremely low acid diffusion.
此外,前述光酸产生剂也可使用具有含有被碘原子或溴原子取代的芳香环的阴离子的锍盐或錪盐。如此的盐可列举下述通式(3-1)或(3-2)表示者。Furthermore, the photoacid generator may be a sulfonium salt or iodonium salt having an anion containing an aromatic ring substituted with an iodine atom or a bromine atom. Examples of such salts include those represented by the following general formula (3-1) or (3-2).
[化104][Chemistry 104]
通式(3-1)及(3-2)中,p为符合1≤p≤3的整数。q及r为符合1≤q≤5、0≤r≤3及1≤q+r≤5的整数。q宜为符合1≤q≤3的整数,为2或3更佳。r宜为符合0≤r≤2的整数。In general formulae (3-1) and (3-2), p is an integer satisfying 1≤p≤3. q and r are integers satisfying 1≤q≤5, 0≤r≤3 and 1≤q+r≤5. q is preferably an integer satisfying 1≤q≤3, more preferably 2 or 3. r is preferably an integer satisfying 0≤r≤2.
通式(3-1)及(3-2)中,XBI为碘原子或溴原子,q为2以上时,可互为相同,也可相异。In the general formulae (3-1) and (3-2), XBI is an iodine atom or a bromine atom, and when q is 2 or more, they may be the same as or different from each other.
通式(3-1)及(3-2)中,L11为单键、醚键、酯键、或也可含有醚键或酯键的碳数1~6的饱和亚烃基。前述饱和亚烃基为直链状、分支状、环状中的任一皆可。In the general formulae (3-1) and (3-2), L 11 is a single bond, an ether bond, an ester bond, or a saturated alkylene group having 1 to 6 carbon atoms which may contain an ether bond or an ester bond. The saturated alkylene group may be linear, branched, or cyclic.
通式(3-1)及(3-2)中,L12在r为1时是单键或碳数1~20的2价连接基团,在r为2或3时是碳数1~20的3价或4价连接基团,该连接基团也可含有氧原子、硫原子或氮原子。In the general formulae (3-1) and (3-2), L12 is a single bond or a divalent linking group having 1 to 20 carbon atoms when r is 1, and is a trivalent or tetravalent linking group having 1 to 20 carbon atoms when r is 2 or 3. The linking group may contain an oxygen atom, a sulfur atom or a nitrogen atom.
通式(3-1)及(3-2)中,R401为羟基、羧基、氟原子、氯原子、溴原子或氨基、或也可含有氟原子、氯原子、溴原子、羟基、氨基或醚键的碳数1~20的饱和烃基、碳数1~20的饱和烃基氧基、碳数2~10的饱和烃基氧基羰基、碳数2~20的饱和烃基羰基氧基或碳数1~20的饱和烃基磺酰基氧基、或-NR401A-C(=O)-R401B或-NR401A-C(=O)-O-R401B。R401A为氢原子或碳数1~6的饱和烃基,且也可含有卤素原子、羟基、碳数1~6的烷氧基、碳数2~6的饱和烃基羰基或碳数2~6的饱和烃基羰基氧基。R401B为碳数1~16的脂肪族烃基或碳数6~12的芳基,且也可含有卤素原子、羟基、碳数1~6的饱和烃基氧基、碳数2~6的饱和烃基羰基或碳数2~6的饱和烃基羰基氧基。前述脂肪族烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。前述饱和烃基、饱和烃基氧基、饱和烃基氧基羰基、饱和烃基羰基及饱和烃基羰基氧基为直链状、分支状、环状中的任一皆可。p及/或r为2以上时,各R401可互为相同,也可相异。In the general formulae (3-1) and (3-2), R 401 is a hydroxyl group, a carboxyl group, a fluorine atom, a chlorine atom, a bromine atom or an amino group, or a saturated hydrocarbon group having 1 to 20 carbon atoms, a saturated hydrocarbon oxy group having 1 to 20 carbon atoms, a saturated hydrocarbon oxycarbonyl group having 2 to 10 carbon atoms, a saturated hydrocarbon carbonyloxy group having 2 to 20 carbon atoms or a saturated hydrocarbon sulfonyloxy group having 1 to 20 carbon atoms which may contain a fluorine atom, a chlorine atom, a bromine atom, a hydroxyl group, an amino group or an ether bond, or -NR 401A -C(=O)-R 401B or -NR 401A -C(=O)-OR 401B . R 401A is a hydrogen atom or a saturated hydrocarbon group having 1 to 6 carbon atoms, and may contain a halogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a saturated hydrocarbon carbonyl group having 2 to 6 carbon atoms or a saturated hydrocarbon carbonyloxy group having 2 to 6 carbon atoms. R 401B is an aliphatic hydrocarbon group having 1 to 16 carbon atoms or an aryl group having 6 to 12 carbon atoms, and may contain a halogen atom, a hydroxyl group, a saturated hydrocarbon oxy group having 1 to 6 carbon atoms, a saturated hydrocarbon carbonyl group having 2 to 6 carbon atoms, or a saturated hydrocarbon carbonyloxy group having 2 to 6 carbon atoms. The aforementioned aliphatic hydrocarbon group may be saturated or unsaturated, and may be any of linear, branched, and cyclic. The aforementioned saturated hydrocarbon group, saturated hydrocarbon oxy group, saturated hydrocarbon oxycarbonyl group, saturated hydrocarbon carbonyl group, and saturated hydrocarbon carbonyloxy group may be any of linear, branched, and cyclic. When p and/or r is 2 or more, each R 401 may be the same or different from each other.
它们之中,R401宜为羟基、-NR401A-C(=O)-R401B、-NR401A-C(=O)-O-R401B、氟原子、氯原子、溴原子、甲基、甲氧基等。Among them, R 401 is preferably a hydroxyl group, -NR 401A -C(=O)-R 401B , -NR 401A -C(=O)-OR 401B , a fluorine atom, a chlorine atom, a bromine atom, a methyl group, a methoxy group or the like.
通式(3-1)及(3-2)中,Rf11~Rf14分别独立地为氢原子、氟原子或三氟甲基,但它们中的至少1个为氟原子或三氟甲基。又,Rf11与Rf12也可合并形成羰基。Rf13及Rf14皆为氟原子特佳。In general formulae (3-1) and (3-2), Rf11 to Rf14 are independently hydrogen atoms, fluorine atoms or trifluoromethyl groups, but at least one of them is a fluorine atom or a trifluoromethyl group. Rf11 and Rf12 may also be combined to form a carbonyl group. It is particularly preferred that both Rf13 and Rf14 are fluorine atoms.
通式(3-1)及(3-2)中,R402、R403、R404、R405及R406分别独立地为氟原子、氯原子、溴原子、碘原子、或也可含有杂原子的碳数1~20的烃基。前述烃基可为饱和也可为不饱和,且为直链状、分支状、环状中的任一皆可。其具体例可列举和通式(1-1)及(1-2)的说明中例示作为R101~R105表示的烃基者同样的例子。又,这些基团的氢原子的一部分或全部也可被羟基、羧基、卤素原子、氰基、硝基、巯基、磺内酯基、砜基或含锍盐的基团取代,且这些基团的碳原子的一部分也可被醚键、酯键、羰基、酰胺键、碳酸酯基或磺酸酯键取代。又,R402及R403也可互相键结并和它们所键结的硫原子一起形成环。此时,前述环可列举和通式(1-1)的说明中例示作为R101与R102键结并和它们所键结的硫原子一起所能形成的环者同样的例子。In the general formulae (3-1) and (3-2), R402 , R403 , R404 , R405 and R406 are each independently a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a hydrocarbon group having 1 to 20 carbon atoms which may contain a hetero atom. The hydrocarbon group may be saturated or unsaturated, and may be linear, branched or cyclic. Specific examples thereof include the same examples as those exemplified as the hydrocarbon groups represented by R101 to R105 in the description of the general formulae (1-1) and (1-2). In addition, part or all of the hydrogen atoms of these groups may be substituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, a nitro group, a mercapto group, a sultone group, a sulfone group or a group containing a sulfonium salt, and part of the carbon atoms of these groups may be substituted with an ether bond, an ester bond, a carbonyl group, an amide bond, a carbonate group or a sulfonate bond. In this case , the ring may be the same as those exemplified as the ring that can be formed when R101 and R102 are bonded together with the sulfur atom to which they are bonded in the description of the general formula (1-1).
通式(3-1)表示的锍盐的阳离子可例举和例示作为通式(1-1)表示的锍盐的阳离子者同样的例子。又,通式(3-2)表示的錪盐的阳离子可列举和例示作为通式(1-2)表示的錪盐的阳离子者同样的例子。Examples of the cation of the sulfonium salt represented by the general formula (3-1) include the same examples as those exemplified as the cation of the sulfonium salt represented by the general formula (1-1). Examples of the cation of the iodonium salt represented by the general formula (3-2) include the same examples as those exemplified as the cation of the iodonium salt represented by the general formula (1-2).
通式(3-1)或(3-2)表示的鎓盐的阴离子可列举如下所示者,但不限于此。另外,下式中,XBI和前述相同。Examples of the anion of the onium salt represented by the general formula (3-1) or (3-2) include, but are not limited to, the following. In the following formula, XBI is the same as described above.
[化105][Chemistry 105]
[化106][Chemistry 106]
[化107][Chemistry 107]
[化108][Chemistry 108]
[化109][Chemistry 109]
[化110][Chemistry 110]
[化111][Chemistry 111]
[化112][Chemistry 112]
[化113][Chemistry 113]
[化114][Chemistry 114]
[化115][Chemistry 115]
[化116][Chemistry 116]
[化117][Chemistry 117]
[化118][Chemistry 118]
[化119][Chemistry 119]
[化120][Chemistry 120]
[化121][Chemistry 121]
[化122][Chemistry 122]
[化123][Chemistry 123]
[化124][Chemistry 124]
[化125][Chemistry 125]
[化126][Chemistry 126]
[化127][Chemistry 127]
本发明的抗蚀剂组成物中,添加型酸产生剂的含量相对于抗蚀剂材料100质量份,宜为0.1~50质量份,为1~40质量份更佳。前述抗蚀剂材料含有重复单元d1~d3及/或含有添加型酸产生剂,借此本发明的抗蚀剂组成物可作为化学增幅抗蚀剂组成物而发挥功能。In the resist composition of the present invention, the content of the additive acid generator is preferably 0.1 to 50 parts by mass, more preferably 1 to 40 parts by mass, relative to 100 parts by mass of the resist material. The resist material contains repeating units d1 to d3 and/or contains an additive acid generator, whereby the resist composition of the present invention can function as a chemically amplified resist composition.
[有机溶剂][Organic solvents]
本发明的抗蚀剂组成物中也可掺合有机溶剂。前述有机溶剂若为可溶解前述各成分及后述各成分者,则无特别限制。如此的有机溶剂可列举:日本特开2008-111103号公报的[0144]~[0145]段落所记载的环己酮、环戊酮、甲基-2-正戊基酮、2-庚酮等酮类;3-甲氧基丁醇、3-甲基-3-甲氧基丁醇、1-甲氧基-2-丙醇、1-乙氧基-2-丙醇、二丙酮醇等醇类;丙二醇单甲醚、乙二醇单甲醚、丙二醇单乙醚、乙二醇单乙醚、丙二醇二甲醚、二乙二醇二甲醚等醚类;丙二醇单甲醚乙酸酯、丙二醇单乙醚乙酸酯、乳酸乙酯、丙酮酸乙酯、乙酸丁酯、3-甲氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙酸叔丁酯、丙酸叔丁酯、丙二醇单叔丁醚乙酸酯等酯类;γ-丁内酯等内酯类;及它们的混合溶剂。An organic solvent may also be blended into the resist composition of the present invention. The aforementioned organic solvent is not particularly limited as long as it can dissolve the aforementioned components and the components described below. Such organic solvents include: ketones such as cyclohexanone, cyclopentanone, methyl-2-n-pentyl ketone, and 2-heptanone described in paragraphs [0144] to [0145] of Japanese Patent Publication No. 2008-111103; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, and diacetone alcohol; propylene glycol monomethyl ether, ethylene glycol Ethers such as monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, and diethylene glycol dimethyl ether; esters such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, and propylene glycol monotert-butyl ether acetate; lactones such as γ-butyrolactone; and mixed solvents thereof.
本发明的抗蚀剂组成物中,前述有机溶剂的含量相对于抗蚀剂材料100质量份,宜为100~10,000质量份,为200~8,000质量份更佳。In the resist composition of the present invention, the content of the organic solvent is preferably 100 to 10,000 parts by mass, more preferably 200 to 8,000 parts by mass, based on 100 parts by mass of the resist material.
[其它成分][Other ingredients]
除了含有前述成分之外,更因应目的适当组合并掺合表面活性剂、溶解抑制剂等来构成抗蚀剂组成物,借此在曝光部中,前述抗蚀剂材料会因催化剂反应而使其对显影液的溶解速度加快,故可制成极高感度的抗蚀剂组成物。此时,抗蚀剂膜的溶解对比度及分辨度高,具有曝光宽容度,制程适应性优良,曝光后的图案形状良好,同时尤其可抑制酸扩散,故疏密尺寸差小,考量这些特性,可制成实用性高,且作为超大型集成电路用抗蚀剂材料非常有效者。In addition to the aforementioned components, a surfactant, a dissolution inhibitor, etc. are appropriately combined and blended according to the purpose to form a resist composition, whereby the aforementioned resist material will accelerate its dissolution rate in the developer due to the catalyst reaction in the exposure portion, so that a highly sensitive resist composition can be made. At this time, the resist film has high dissolution contrast and resolution, has exposure latitude, excellent process adaptability, and a good pattern shape after exposure. In particular, acid diffusion can be suppressed, so the density difference is small. Considering these characteristics, it can be made into a highly practical resist material that is very effective as a very large integrated circuit.
前述表面活性剂可列举日本特开2008-111103号公报的[0165]~[0166]段落所记载者。借由添加表面活性剂,可进一步改善或控制抗蚀剂组成物的涂布性。表面活性剂可单独使用1种,或可组合使用2种以上。本发明的抗蚀剂组成物中,前述表面活性剂的含量相对于抗蚀剂材料100质量份,宜为0.0001~10质量份。The surfactants described in paragraphs [0165] to [0166] of Japanese Patent Application Publication No. 2008-111103 can be cited. By adding a surfactant, the coating properties of the resist composition can be further improved or controlled. The surfactants can be used alone or in combination of two or more. In the resist composition of the present invention, the content of the surfactant is preferably 0.0001 to 10 parts by mass relative to 100 parts by mass of the resist material.
借由掺合溶解抑制剂,可进一步扩大曝光部与未曝光部的溶解速度差,且可使分辨度进一步改善。By adding a dissolution inhibitor, the difference in dissolution rate between the exposed area and the unexposed area can be further increased, and the resolution can be further improved.
就前述溶解抑制剂而言,其分子量宜为100~1,000,为150~800更佳,且可列举分子内含有2个以上的酚性羟基的化合物中的前述酚性羟基的氢原子被酸不稳定基团以整体而言0~100摩尔%的比例取代而成的化合物、或分子内含有羧基的化合物中的前述羧基的氢原子被酸不稳定基团以整体而言平均50~100摩尔%的比例取代而成的化合物。具体可列举:双酚A、三苯酚、酚酞、甲酚酚醛清漆树脂、萘羧酸、金刚烷羧酸、胆酸的羟基、羧基的氢原子被酸不稳定基团取代而成的化合物等,例如日本特开2008-122932号公报的[0155]~[0178]段落所记载。The dissolution inhibitor preferably has a molecular weight of 100 to 1,000, more preferably 150 to 800, and includes compounds containing two or more phenolic hydroxyl groups in the molecule, wherein the hydrogen atoms of the phenolic hydroxyl groups are replaced by acid-labile groups at a ratio of 0 to 100 mol % as a whole, or compounds containing carboxyl groups in the molecule, wherein the hydrogen atoms of the carboxyl groups are replaced by acid-labile groups at an average ratio of 50 to 100 mol % as a whole. Specifically, compounds in which the hydrogen atoms of the hydroxyl groups and carboxyl groups of bisphenol A, trisphenol, phenolphthalein, cresol novolac resin, naphthalenecarboxylic acid, adamantanecarboxylic acid, and bile acid are replaced by acid-labile groups, etc., such as those described in paragraphs [0155] to [0178] of Japanese Patent Application Laid-Open No. 2008-122932.
前述溶解抑制剂的含量相对于抗蚀剂材料100质量份,宜为0~50质量份,为5~40质量份更佳。前述溶解抑制剂可单独使用1种,或可组合使用2种以上。The content of the dissolution inhibitor is preferably 0 to 50 parts by mass, more preferably 5 to 40 parts by mass, based on 100 parts by mass of the resist material. The dissolution inhibitor may be used alone or in combination of two or more.
本发明的抗蚀剂组成物中也可掺合淬灭剂(以下称其它淬灭剂)。前述其它淬灭剂可列举已知型的碱性化合物。已知型的碱性化合物可列举:一级、二级、三级的脂肪族胺类、混成胺类、芳香族胺类、杂环胺类、具有羧基的含氮化合物、具有磺酰基的含氮化合物、具有羟基的含氮化合物、具有羟基苯基的含氮化合物、醇性含氮化合物、酰胺类、酰亚胺类、氨基甲酸酯类等。尤其宜为日本特开2008-111103号公报的[0146]~[0164]段落所记载的一级、二级、三级的胺化合物,为具有羟基、醚键、酯键、内酯环、氰基、磺酸酯键的胺化合物或日本专利第3790649号公报所记载的具有氨基甲酸酯基的化合物等特佳。借由添加如此的碱性化合物,例如可更为抑制在抗蚀剂膜中的酸的扩散速度或可修正形状。The resist composition of the present invention may also be blended with a quencher (hereinafter referred to as other quenchers). Examples of the aforementioned other quenchers include known basic compounds. Examples of known basic compounds include primary, secondary, and tertiary aliphatic amines, mixed amines, aromatic amines, heterocyclic amines, nitrogen-containing compounds having carboxyl groups, nitrogen-containing compounds having sulfonyl groups, nitrogen-containing compounds having hydroxyl groups, nitrogen-containing compounds having hydroxyphenyl groups, alcoholic nitrogen-containing compounds, amides, imides, and carbamates. In particular, the primary, secondary, and tertiary amine compounds described in paragraphs [0146] to [0164] of Japanese Patent Publication No. 2008-111103 are preferred, and amine compounds having hydroxyl groups, ether bonds, ester bonds, lactone rings, cyano groups, and sulfonate bonds, or compounds having carbamate groups described in Japanese Patent Publication No. 3790649 are particularly preferred. By adding such a basic compound, for example, the diffusion rate of the acid in the resist film can be further suppressed or the shape can be corrected.
又,其它淬灭剂可列举:日本特开2008-158339号公报所记载的α位未经氟化的磺酸及羧酸的锍盐、錪盐、铵盐等鎓盐。α位经氟化的磺酸、酰亚胺酸或甲基化物酸在用以使羧酸酯的酸不稳定基团脱保护时为必要的,而借由和α位未经氟化的鎓盐的盐交换,会释放出α位未经氟化的磺酸或羧酸。α位未经氟化的磺酸及羧酸不会引起脱保护反应,故作为淬灭剂而发挥功能。In addition, other quenchers include onium salts such as sulfonium salts, iodonium salts, and ammonium salts of sulfonic acids and carboxylic acids that are not fluorinated at the α-position as described in Japanese Patent Application Laid-Open No. 2008-158339. Sulfonic acids, imidic acids, or methide acids that are fluorinated at the α-position are necessary for deprotecting the acid-labile group of carboxylic acid esters, and the sulfonic acids or carboxylic acids that are not fluorinated at the α-position are released by salt exchange with the onium salts that are not fluorinated at the α-position. Sulfonic acids and carboxylic acids that are not fluorinated at the α-position do not cause deprotection reactions, and thus function as quenchers.
其它淬灭剂更可列举日本特开2008-239918号公报所记载的聚合物型的淬灭剂。其借由配向于涂层后的抗蚀剂表面来提高图案化后的抗蚀剂的矩形性。聚合物型淬灭剂也具有防止使用浸润式曝光用的保护膜时的图案的膜损失、图案圆顶化的效果。Other quenchers include polymer quenchers described in Japanese Patent Application Publication No. 2008-239918. The polymer quenchers are aligned on the resist surface after coating to improve the rectangularity of the resist after patterning. The polymer quenchers also have the effect of preventing film loss and doming of the pattern when using a protective film for immersion exposure.
本发明的抗蚀剂组成物中,其它淬灭剂的含量相对于抗蚀剂材料100质量份,宜为0~5质量份,为0~4质量份更佳。其它淬灭剂可单独使用1种,或可组合使用2种以上。In the resist composition of the present invention, the content of other quenchers is preferably 0 to 5 parts by mass, more preferably 0 to 4 parts by mass, based on 100 parts by mass of the resist material. Other quenchers may be used alone or in combination of two or more.
本发明的抗蚀剂组成物中也可掺合用以使旋涂后的抗蚀剂表面的拒水性改善的拒水性改善剂。前述拒水性改善剂可使用于未使用面涂(top coat)的浸润式光刻。前述拒水性改善剂宜为含氟化烷基的高分子化合物、特定结构的含有1,1,1,3,3,3-六氟-2-丙醇残基的高分子化合物等,为日本特开2007-297590号公报、日本特开2008-111103号公报等所例示者更佳。前述拒水性改善剂需要溶解于有机溶剂显影液。前述特定的具有1,1,1,3,3,3-六氟-2-丙醇残基的拒水性改善剂对显影液的溶解性良好。就拒水性改善剂而言,含有含氨基、胺盐的重复单元的高分子化合物,其防止曝光后烘烤(PEB)时的酸的蒸发而防止显影后的孔洞图案的开口不良的效果高。拒水性改善剂可单独使用1种,或可组合使用2种以上。本发明的抗蚀剂组成物中,拒水性改善剂的含量相对于抗蚀剂材料100质量份,宜为0~20质量份,为0.5~10质量份更佳。The resist composition of the present invention may also be mixed with a water repellency improver for improving the water repellency of the resist surface after spin coating. The aforementioned water repellency improver can be used in immersion lithography without using a top coat. The aforementioned water repellency improver is preferably a polymer compound containing a fluorinated alkyl group, a polymer compound containing a 1,1,1,3,3,3-hexafluoro-2-propanol residue of a specific structure, and the like, and is preferably exemplified by Japanese Patent Publication No. 2007-297590 and Japanese Patent Publication No. 2008-111103. The aforementioned water repellency improver needs to be dissolved in an organic solvent developer. The aforementioned specific water repellency improver having a 1,1,1,3,3,3-hexafluoro-2-propanol residue has good solubility in a developer. As for the water repellency improver, a polymer compound containing a repeating unit containing an amino group or an amine salt has a high effect of preventing the evaporation of the acid during post-exposure baking (PEB) and preventing poor opening of the hole pattern after development. The water repellency improver may be used alone or in combination of two or more. In the resist composition of the present invention, the content of the water repellency improver is preferably 0 to 20 parts by mass, more preferably 0.5 to 10 parts by mass, based on 100 parts by mass of the resist material.
本发明的抗蚀剂组成物中也可掺合乙炔醇类。前述乙炔醇类可列举日本特开2008-122932号公报的[0179]~[0182]段落所记载者。本发明的抗蚀剂组成物中,乙炔醇类的含量相对于抗蚀剂材料100质量份,宜为0~5质量份。The resist composition of the present invention may also contain acetylene alcohols. Examples of the acetylene alcohols include those described in paragraphs [0179] to [0182] of Japanese Patent Application Laid-Open No. 2008-122932. In the resist composition of the present invention, the content of the acetylene alcohols is preferably 0 to 5 parts by mass relative to 100 parts by mass of the resist material.
[图案形成方法][Pattern Formation Method]
将本发明的抗蚀剂组成物使用于各种集成电路制造时,可适用公知的光刻技术。亦即,本发明提供一种图案形成方法,包含下列步骤:When the resist composition of the present invention is used in the manufacture of various integrated circuits, known photolithography techniques can be applied. That is, the present invention provides a pattern forming method comprising the following steps:
使用上述所记载的抗蚀剂组成物于基板上形成抗蚀剂膜,Using the resist composition described above to form a resist film on a substrate,
对前述抗蚀剂膜以高能射线进行曝光,及exposing the resist film to high energy radiation, and
将前述已曝光的抗蚀剂膜使用显影液进行显影。The exposed resist film is developed using a developer.
例如,将本发明的抗蚀剂组成物利用旋涂、辊涂、流涂、浸涂、喷涂、刮涂等适当的涂布方法以涂布膜厚成为0.01~2μm的方式涂布于集成电路制造用的基板(Si、SiO2、SiN、SiON、TiN、WSi、BPSG、SOG、有机抗反射膜等)或掩膜电路制造用的基板(Cr、CrO、CrON、MoSi2、SiO2等)上。将其于加热板上进行宜为60~150℃、10秒~30分钟,为80~120℃、30秒~20分钟更佳的预烘,并形成抗蚀剂膜。For example, the resist composition of the present invention is applied to a substrate for integrated circuit manufacturing (Si, SiO2, SiN, SiON, TiN , WSi, BPSG, SOG, organic antireflection film, etc.) or a substrate for mask circuit manufacturing (Cr, CrO, CrON, MoSi2 , SiO2 , etc.) by an appropriate coating method such as spin coating, roll coating, flow coating, dip coating, spray coating, or blade coating so that the coating thickness becomes 0.01 to 2 μm. This is pre-baked on a hot plate preferably at 60 to 150°C for 10 seconds to 30 minutes, more preferably at 80 to 120°C for 30 seconds to 20 minutes, to form a resist film.
然后,使用高能射线对前述抗蚀剂膜进行曝光。前述高能射线可列举:紫外线、远紫外线、EB(电子束)、EUV(极紫外线)、X射线、软X射线、准分子激光、i射线、γ射线、同步辐射等。其中,宜使用i射线、KrF准分子激光、ArF准分子激光、电子束、或波长3~15nm的极紫外线。使用紫外线、远紫外线、EUV、X射线、软X射线、准分子激光、γ射线、同步辐射等作为前述高能射线时,使用用以形成目的的图案的掩膜,以曝光量宜成为约1~200mJ/cm2且成为约10~100mJ/cm2更佳的方式进行照射。使用EB作为高能射线时,以曝光量宜为约0.1~100μC/cm2且更佳为约0.5~50μC/cm2的条件直接或使用用以形成目的的图案的掩膜进行描绘。另外,本发明的抗蚀剂组成物尤其适于利用高能射线之中KrF准分子激光、ArF准分子激光、EB、EUV、X射线、软X射线、γ射线、同步辐射所为的微细图案化,特别适于利用EB或EUV所为的微细图案化。Then, the resist film is exposed using high-energy rays. Examples of the high-energy rays include ultraviolet rays, far ultraviolet rays, EB (electron beam), EUV (extreme ultraviolet rays), X-rays, soft X-rays, excimer lasers, i-rays, gamma rays, synchrotron radiation, and the like. Among them, i-rays, KrF excimer lasers, ArF excimer lasers, electron beams, or extreme ultraviolet rays with a wavelength of 3 to 15 nm are preferably used. When ultraviolet rays, far ultraviolet rays, EUV, X-rays, soft X-rays, excimer lasers, gamma rays, synchrotron radiation, and the like are used as the high-energy rays, a mask for forming the intended pattern is used, and irradiation is performed in a manner where the exposure amount is preferably about 1 to 200 mJ/cm 2 and more preferably about 10 to 100 mJ/cm 2. When EB is used as the high-energy ray, the exposure amount is preferably about 0.1 to 100 μC/cm 2 and more preferably about 0.5 to 50 μC/cm 2, and the pattern is depicted directly or using a mask for forming the intended pattern. In addition, the resist composition of the present invention is particularly suitable for fine patterning using KrF excimer laser, ArF excimer laser, EB, EUV, X-ray, soft X-ray, γ-ray, and synchrotron radiation among high-energy rays, and is particularly suitable for fine patterning using EB or EUV.
曝光后,也可在加热板上实施宜为50~150℃、10秒~30分钟且更佳为60~120℃、30秒~20分钟的PEB。After the exposure, PEB may be performed on a hot plate preferably at 50 to 150° C. for 10 seconds to 30 minutes, more preferably at 60 to 120° C. for 30 seconds to 20 minutes.
于曝光后或PEB后,使用0.1~10质量%且宜为2~5质量%的氢氧化四甲铵(TMAH)、氢氧化四乙铵(TEAH)、氢氧化四丙铵(TPAH)、氢氧化四丁铵(TBAH)等碱水溶液的显影液,并利用浸渍(dip)法、浸置(puddle)法、喷雾(spray)法等常用方法显影3秒~3分钟且宜为5秒~2分钟,借此照射光的部分会溶解于显影液,未曝光的部分则不溶解,并于基板上形成目的的正型图案。After exposure or PEB, a developer of an alkaline aqueous solution of 0.1 to 10 mass % and preferably 2 to 5 mass % tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), tetrabutylammonium hydroxide (TBAH) or the like is used, and development is performed for 3 seconds to 3 minutes and preferably 5 seconds to 2 minutes using a common method such as a dip method, a puddle method, or a spray method, whereby the portion irradiated with light is dissolved in the developer, while the portion not exposed is not dissolved, and a desired positive pattern is formed on the substrate.
也可实施使用含有包含酸不稳定基团的抗蚀剂材料的抗蚀剂组成物,并利用有机溶剂显影来获得负图案的负显影。此时使用的显影液可列举:2-辛酮、2-壬酮、2-庚酮、3-庚酮、4-庚酮、2-己酮、3-己酮、二异丁基酮、甲基环己酮、苯乙酮、甲基苯乙酮、乙酸丙酯、乙酸丁酯、乙酸异丁酯、乙酸戊酯、乙酸丁烯酯、乙酸异戊酯、甲酸丙酯、甲酸丁酯、甲酸异丁酯、甲酸戊酯、甲酸异戊酯、戊酸甲酯、戊烯酸甲酯、巴豆酸甲酯、巴豆酸乙酯、丙酸甲酯、丙酸乙酯、3-乙氧基丙酸乙酯、乳酸甲酯、乳酸乙酯、乳酸丙酯、乳酸丁酯、乳酸异丁酯、乳酸戊酯、乳酸异戊酯、2-羟基异丁酸甲酯、2-羟基异丁酸乙酯、苯甲酸甲酯、苯甲酸乙酯、乙酸苯酯、乙酸苄酯、苯乙酸甲酯、甲酸苄酯、甲酸苯乙酯、3-苯丙酸甲酯、丙酸苄酯、苯乙酸乙酯、乙酸2-苯乙酯等。这些有机溶剂可单独使用1种或可混合使用2种以上。It is also possible to implement negative development of a negative pattern using a resist composition containing a resist material containing an acid-labile group and developing with an organic solvent. The developer used in this case may include 2-octanone, 2-nonanone, 2-heptanone, 3-heptanone, 4-heptanone, 2-hexanone, 3-hexanone, diisobutyl ketone, methylcyclohexanone, acetophenone, methylacetophenone, propyl acetate, butyl acetate, isobutyl acetate, amyl acetate, butyl acetate, isoamyl acetate, propyl formate, butyl formate, isobutyl formate, amyl formate, isoamyl formate, methyl valerate, methyl pentenoate, methyl crotonate, crotonyl acetate, propyl formate, butyl formate, isobutyl formate, amyl formate, isoamyl formate, methyl valerate, methyl pentenoate, methyl croton ... ethyl acetate, methyl propionate, ethyl propionate, ethyl 3-ethoxypropionate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, isobutyl lactate, amyl lactate, isoamyl lactate, methyl 2-hydroxyisobutyrate, ethyl 2-hydroxyisobutyrate, methyl benzoate, ethyl benzoate, phenyl acetate, benzyl acetate, methyl phenylacetate, benzyl formate, phenylethyl formate, methyl 3-phenylpropionate, benzyl propionate, ethyl phenylacetate, 2-phenylethyl acetate, etc. These organic solvents may be used alone or in combination of two or more.
显影结束时,可实施淋洗。淋洗液宜为和显影液混溶且不使抗蚀剂膜溶解的溶剂。如此的溶剂可理想地使用碳数3~10的醇、碳数8~12的醚化合物、碳数6~12的烷、烯、炔、芳香族系的溶剂。When the development is finished, rinsing may be performed. The rinsing solution is preferably a solvent that is miscible with the developer and does not dissolve the resist film. Such a solvent may preferably be an alcohol having 3 to 10 carbon atoms, an ether compound having 8 to 12 carbon atoms, an alkane, alkene, or alkyne having 6 to 12 carbon atoms, or an aromatic solvent.
具体而言,碳数3~10的醇可列举:正丙醇、异丙醇、1-丁醇、2-丁醇、异丁醇、叔丁醇、1-戊醇、2-戊醇、3-戊醇、叔戊醇、新戊醇、2-甲基-1-丁醇、3-甲基-1-丁醇、3-甲基-3-戊醇、环戊醇、1-己醇、2-己醇、3-己醇、2,3-二甲基-2-丁醇、3,3-二甲基-1-丁醇、3,3-二甲基-2-丁醇、2-乙基-1-丁醇、2-甲基-1-戊醇、2-甲基-2-戊醇、2-甲基-3-戊醇、3-甲基-1-戊醇、3-甲基-2-戊醇、3-甲基-3-戊醇、4-甲基-1-戊醇、4-甲基-2-戊醇、4-甲基-3-戊醇、环己醇、1-辛醇等。Specifically, examples of the alcohol having 3 to 10 carbon atoms include n-propanol, isopropanol, 1-butanol, 2-butanol, isobutanol, tert-butanol, 1-pentanol, 2-pentanol, 3-pentanol, tert-pentanol, neopentyl alcohol, 2-methyl-1-butanol, 3-methyl-1-butanol, 3-methyl-3-pentanol, cyclopentanol, 1-hexanol, 2-hexanol, 3-hexanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-1-butanol, 3,3-dimethyl-2-butanol, 2-ethyl-1-butanol, 2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, 4-methyl-3-pentanol, cyclohexanol, and 1-octanol.
碳数8~12的醚化合物可列举:二正丁醚、二异丁醚、二(仲丁基)醚、二正戊醚、二异戊醚、二(仲戊基)醚、二(叔戊基)醚、二正己醚等。Examples of the ether compound having 8 to 12 carbon atoms include di-n-butyl ether, diisobutyl ether, di(sec-butyl) ether, di-n-pentyl ether, diisopentyl ether, di(sec-pentyl) ether, di(tert-pentyl) ether, and di-n-hexyl ether.
碳数6~12的烷可列举:己烷、庚烷、辛烷、壬烷、癸烷、十一烷、十二烷、甲基环戊烷、二甲基环戊烷、环己烷、甲基环己烷、二甲基环己烷、环庚烷、环辛烷、环壬烷等。碳数6~12的烯可列举:己烯、庚烯、辛烯、环己烯、甲基环己烯、二甲基环己烯、环庚烯、环辛烯等。碳数6~12的炔可列举:己炔、庚炔、辛炔等。Examples of the alkanes having 6 to 12 carbon atoms include hexane, heptane, octane, nonane, decane, undecane, dodecane, methylcyclopentane, dimethylcyclopentane, cyclohexane, methylcyclohexane, dimethylcyclohexane, cycloheptane, cyclooctane, and cyclononane. Examples of the alkenes having 6 to 12 carbon atoms include hexene, heptene, octene, cyclohexene, methylcyclohexene, dimethylcyclohexene, cycloheptene, and cyclooctene. Examples of the alkynes having 6 to 12 carbon atoms include hexyne, heptyne, and octyne.
芳香族系的溶剂可列举:甲苯、二甲苯、乙苯、异丙苯、叔丁苯、均三甲苯等。Examples of the aromatic solvent include toluene, xylene, ethylbenzene, cumene, tert-butylbenzene, and mesitylene.
借由实施淋洗可使抗蚀剂图案的崩塌、缺陷的发生减少。又,淋洗并非必要,借由不实施淋洗可减少溶剂的使用量。By performing rinsing, the occurrence of resist pattern collapse and defects can be reduced. In addition, rinsing is not essential, and the amount of solvent used can be reduced by not performing rinsing.
显影后的孔洞图案、沟图案也可利用热流、RELACS技术或DSA技术进行收缩。于孔洞图案上涂布收缩剂,利用烘烤时来自抗蚀剂层的酸催化剂的扩散,会在抗蚀剂的表面引起收缩剂的交联,收缩剂会附着于孔洞图案的侧壁。烘烤温度宜为70~180℃,为80~170℃更佳,时间宜为10~300秒,将多余的收缩剂去除并使孔洞图案缩小。The hole pattern and groove pattern after development can also be shrunk by heat flow, RELACS technology or DSA technology. A shrinking agent is coated on the hole pattern, and the diffusion of the acid catalyst from the resist layer during baking will cause the shrinking agent to crosslink on the surface of the resist, and the shrinking agent will adhere to the side wall of the hole pattern. The baking temperature is preferably 70-180°C, preferably 80-170°C, and the time is preferably 10-300 seconds to remove the excess shrinking agent and shrink the hole pattern.
实施例Example
以下,例示合成例、实施例及比较例具体地说明本发明,但本发明不限于下述实施例。Hereinafter, the present invention will be specifically described with reference to synthesis examples, examples and comparative examples, but the present invention is not limited to the following examples.
[1]单体的合成[1]Synthesis of monomers
[合成例][Synthesis Example]
[合成例1-1]单体1的合成[Synthesis Example 1-1] Synthesis of Monomer 1
依循下述流程来合成单体1。Monomer 1 was synthesized according to the following scheme.
(1)化合物2的合成(1) Synthesis of Compound 2
将化合物1(580g)、2-氯乙醇(520g)、碳酸钾(726g)、溴化钠(31.5g)、DMF(3,970g)进行混合,于90℃搅拌20小时。反应结束后予以冰冷,添加纯水(3,600g)并搅拌30分钟。其后添加甲基异丁基酮(4,500g)并搅拌1小时。将有机层分离提取后,实施通常的水系处理(aqueous work-up),将溶剂馏去,添加己烷(3,500g)并搅拌2小时晶析后进行过滤,借此以固体形式获得化合物2(604g)。Compound 1 (580 g), 2-chloroethanol (520 g), potassium carbonate (726 g), sodium bromide (31.5 g), and DMF (3,970 g) were mixed and stirred at 90°C for 20 hours. After the reaction was completed, it was ice-cooled, pure water (3,600 g) was added, and it was stirred for 30 minutes. Methyl isobutyl ketone (4,500 g) was then added and stirred for 1 hour. After the organic layer was separated and extracted, a usual aqueous work-up was performed, the solvent was distilled off, hexane (3,500 g) was added, and it was stirred for 2 hours and crystallized, and then filtered to obtain compound 2 (604 g) in the form of a solid.
化合物2的1H-NMR(500MHz,DMSO-d6)图谱如图1所示。The 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of Compound 2 is shown in FIG1 .
[化128][Chemistry 128]
(2)化合物3的合成(2) Synthesis of Compound 3
将化合物2(600g)、四氢呋喃(2,800g)于冰冷下进行搅拌,并滴加25%氢氧化钠水溶液(330g)、纯水(900g)。于40℃搅拌16小时。反应结束后将有机溶剂馏去,以TBME清洗水溶液。添加20%盐酸(430g)与己烷(1L)并搅拌晶析后进行过滤,借此以固体形式获得化合物3(560g)。Compound 2 (600 g) and tetrahydrofuran (2,800 g) were stirred under ice cooling, and 25% sodium hydroxide aqueous solution (330 g) and pure water (900 g) were added dropwise. The mixture was stirred at 40°C for 16 hours. After the reaction was completed, the organic solvent was distilled off and the aqueous solution was washed with TBME. 20% hydrochloric acid (430 g) and hexane (1 L) were added and stirred for crystallization and then filtered to obtain compound 3 (560 g) as a solid.
化合物3的1H-NMR(500MHz,DMSO-d6)图谱如图2所示。The 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of compound 3 is shown in FIG2 .
[化129][Chemistry 129]
(3)化合物4的合成(3) Synthesis of Compound 4
将化合物3(560g)、甲基丙烯酸酐(340g)、乙腈(3,000g)、聚合抑制剂(1,000ppm/理论产量)溶解,于冰冷下滴加三乙胺(442g)、DMAP(22g)、乙腈(600g)的混合物后,于冰冷下搅拌3小时。反应结束后,于冰冷下添加5%碳酸氢钠水(1,900g),搅拌20分钟后,添加20%盐酸水溶液(1,070g)、纯水(5,300g)并搅拌晶析。利用分滤将得到的固体以乙酸乙酯(4,500g)溶解,将有机层分离提取后,以饱和食盐水、纯水清洗,并将有机层进行活性碳处理。将溶剂馏去,添加己烷(5.7L)并搅拌晶析后进行过滤,借此以固体形式获得化合物4(460g)。Compound 3 (560 g), methacrylic anhydride (340 g), acetonitrile (3,000 g), and a polymerization inhibitor (1,000 ppm/theoretical yield) were dissolved, and a mixture of triethylamine (442 g), DMAP (22 g), and acetonitrile (600 g) was added dropwise under ice-cooling, and then stirred for 3 hours under ice-cooling. After the reaction was completed, 5% sodium bicarbonate water (1,900 g) was added under ice-cooling, and after stirring for 20 minutes, 20% hydrochloric acid aqueous solution (1,070 g) and pure water (5,300 g) were added and stirred for crystallization. The obtained solid was dissolved in ethyl acetate (4,500 g) by fractionation, and the organic layer was separated and extracted, and then washed with saturated brine and pure water, and the organic layer was treated with activated carbon. The solvent was distilled off, hexane (5.7 L) was added, and the mixture was stirred for crystallization and filtered to obtain compound 4 (460 g) as a solid.
化合物4的1H-NMR(500MHz,DMSO-d6)图谱如图3所示。The 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of compound 4 is shown in FIG3 .
[化130][Chemistry 130]
(4)单体1的合成(4) Synthesis of Monomer 1
于化合物4(38g)中添加碳酸钾(17g)、1-戊醇(40g)、纯水(90g)并于室温搅拌1小时后,添加化合物5(44g)、二氯甲烷(300g)并搅拌2小时。将有机层分离提取后,实施通常的水系处理(aqueous work-up),添加聚合抑制剂(100ppm/理论产量)并将溶剂馏去,以油状形式获得单体1(60g)。将得到的单体1溶解于γ-丁内酯(56g),制成γ-丁内酯溶液。Potassium carbonate (17 g), 1-pentanol (40 g), and pure water (90 g) were added to compound 4 (38 g) and stirred at room temperature for 1 hour, and then compound 5 (44 g) and dichloromethane (300 g) were added and stirred for 2 hours. After the organic layer was separated and extracted, a conventional aqueous work-up was performed, a polymerization inhibitor (100 ppm/theoretical yield) was added, and the solvent was distilled off to obtain monomer 1 (60 g) in an oily form. The obtained monomer 1 was dissolved in γ-butyrolactone (56 g) to prepare a γ-butyrolactone solution.
单体1的1H-NMR(500MHz,DMSO-d6)图谱如图4所示。除了检测到标的物峰部之外,还会检测到使用的溶剂峰部(1-戊醇、甲基异丁基酮、γ-丁内酯)。The 1 H-NMR (500 MHz, DMSO-d 6 ) spectrum of monomer 1 is shown in Figure 4. In addition to the peak of the target substance, peaks of the solvent used (1-pentanol, methyl isobutyl ketone, γ-butyrolactone) were also detected.
[化131][Chemistry 131]
利用和锍盐溴化物与具有聚合性双键的碘化苯甲酸化合物、或苯甲酸化合物的离子交换,获得下述单体2~15、比较单体1~3。单体1亦合并表示。By ion exchange with a sulfonium salt bromide and an iodinated benzoic acid compound or a benzoic acid compound having a polymerizable double bond, the following monomers 2 to 15 and comparative monomers 1 to 3 were obtained. Monomer 1 is also shown together.
[化132][Chemistry 132]
[化133][Chemistry 133]
[化134][Chemistry 134]
[化135][Chemistry 135]
[2]聚合物的合成[2] Synthesis of polymers
聚合物的合成使用的酸不稳定基单体(ALG单体1)、PAG单体1~8如下所述。又,聚合物的Mw使用了THF作为溶剂的GPC所为的聚苯乙烯换算测定值。The acid-labile group monomer (ALG monomer 1) and PAG monomers 1 to 8 used in the synthesis of the polymer are as follows. The Mw of the polymer was a polystyrene-equivalent measurement value obtained by GPC using THF as a solvent.
[化136][Chemistry 136]
[化137][Chemistry 137]
[化138][Chemistry 138]
[合成例2-1]聚合物1的合成[Synthesis Example 2-1] Synthesis of Polymer 1
于2L的烧瓶中添加单体1(3.5g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(5.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物1。聚合物1的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 1 (3.5 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (5.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing and nitrogen blowing under reduced pressure were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 1. The composition of polymer 1 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化139][Chemistry 139]
[合成例2-2]聚合物2的合成[Synthesis Example 2-2] Synthesis of Polymer 2
于2L的烧瓶中添加单体2(3.4g)、甲基丙烯酸-1-甲基-1-环己酯(7.3g)、4-羟基苯乙烯(4.8g)、PAG单体2(11.0g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物2。聚合物2的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 2 (3.4 g), 1-methyl-1-cyclohexyl methacrylate (7.3 g), 4-hydroxystyrene (4.8 g), PAG monomer 2 (11.0 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing and nitrogen blowing under reduced pressure were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 2. The composition of polymer 2 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化140][Chemistry 140]
[合成例2-3]聚合物3的合成[Synthesis Example 2-3] Synthesis of Polymer 3
于2L的烧瓶中添加单体3(3.0g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(3.6g)、PAG单体1(11.9g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物3。聚合物3的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 3 (3.0 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (3.6 g), PAG monomer 1 (11.9 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and the reaction was allowed to proceed for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 3. The composition of polymer 3 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化141][Chemistry 141]
[合成例2-4]聚合物4的合成[Synthesis Example 2-4] Synthesis of Polymer 4
于2L的烧瓶中添加单体4(3.2g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、3-羟基苯乙烯(3.6g)、PAG单体2(11.0g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物4。聚合物4的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 4 (3.2 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 3-hydroxystyrene (3.6 g), PAG monomer 2 (11.0 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 4. The composition of polymer 4 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化142][Chemistry 142]
[合成例2-5]聚合物5的合成[Synthesis Example 2-5] Synthesis of Polymer 5
于2L的烧瓶中添加单体5(4.1g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(4.2g)、PAG单体3(8.5g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物5。聚合物5的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 5 (4.1 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (4.2 g), PAG monomer 3 (8.5 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and the reaction was allowed to proceed for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 5. The composition of polymer 5 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化143][Chemistry 143]
[合成例2-6]聚合物6的合成[Synthesis Example 2-6] Synthesis of Polymer 6
于2L的烧瓶中添加单体6(4.9g)、ALG单体1(8.9g)、4-羟基苯乙烯(5.4g)、PAG单体4(10.2g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物6。聚合物6的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 6 (4.9 g), ALG monomer 1 (8.9 g), 4-hydroxystyrene (5.4 g), PAG monomer 4 (10.2 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) as a polymerization initiator was added, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 6. The composition of polymer 6 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化144][Chemistry 144]
[合成例2-7]聚合物7的合成[Synthesis Example 2-7] Synthesis of Polymer 7
于2L的烧瓶中添加单体7(3.8g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(4.8g)、PAG单体5(5.5g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物7。聚合物7的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 7 (3.8 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (4.8 g), PAG monomer 5 (5.5 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 7. The composition of polymer 7 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化145][Chemistry 145]
[合成例2-8]聚合物8的合成[Synthesis Example 2-8] Synthesis of Polymer 8
于2L的烧瓶中添加单体8(3.4g)、ALG单体1(8.9g)、4-羟基苯乙烯(5.4g)、PAG单体4(9.7g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物8。聚合物8的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 8 (3.4 g), ALG monomer 1 (8.9 g), 4-hydroxystyrene (5.4 g), PAG monomer 4 (9.7 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 8. The composition of polymer 8 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化146][Chemistry 146]
[合成例2-9]聚合物9的合成[Synthesis Example 2-9] Synthesis of Polymer 9
于2L的烧瓶中添加单体1(3.5g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(4.2g)、PAG单体6(9.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物9。聚合物9的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 1 (3.5 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (4.2 g), PAG monomer 6 (9.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 9. The composition of polymer 9 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化147][Chemistry 147]
[合成例2-10]聚合物10的合成[Synthesis Example 2-10] Synthesis of Polymer 10
于2L的烧瓶中添加单体9(3.8g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(4.2g)、PAG单体6(9.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物10。聚合物10的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 9 (3.8 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (4.2 g), PAG monomer 6 (9.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and the reaction was allowed to proceed for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 10. The composition of polymer 10 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化148][Chemistry 148]
[合成例2-11]聚合物11的合成[Synthesis Example 2-11] Synthesis of Polymer 11
于2L的烧瓶中添加单体1(3.5g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(4.2g)、PAG单体7(9.6g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物11。聚合物11的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 1 (3.5 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (4.2 g), PAG monomer 7 (9.6 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 11. The composition of polymer 11 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化149][Chemistry 149]
[合成例2-12]聚合物12的合成[Synthesis Example 2-12] Synthesis of Polymer 12
于2L的烧瓶中添加单体9(3.8g)、甲基丙烯酸-1-甲基-1-环戊酯(8.4g)、4-羟基苯乙烯(4.2g)、PAG单体7(9.6g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物12。聚合物12的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 9 (3.8 g), 1-methyl-1-cyclopentyl methacrylate (8.4 g), 4-hydroxystyrene (4.2 g), PAG monomer 7 (9.6 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 12. The composition of polymer 12 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化150][Chemistry 150]
[合成例2-13]聚合物13的合成[Synthesis Example 2-13] Synthesis of Polymer 13
于2L的烧瓶中添加单体10(3.8g)、甲基丙烯酸-1-乙烯基-1-环戊酯(9.0g)、3-羟基苯乙烯(4.2g)、PAG单体6(9.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物13。聚合物13的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 10 (3.8 g), 1-vinyl-1-cyclopentyl methacrylate (9.0 g), 3-hydroxystyrene (4.2 g), PAG monomer 6 (9.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing and nitrogen blowing under reduced pressure were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and the reaction was allowed to proceed for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 13. The composition of polymer 13 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化151][Chemistry 151]
[合成例2-14]聚合物14的合成[Synthesis Example 2-14] Synthesis of Polymer 14
于2L的烧瓶中添加单体11(4.5g)、甲基丙烯酸-1-乙炔基-1-环戊酯(8.9g)、3-羟基苯乙烯(4.2g)、PAG单体8(9.8g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物14。聚合物14的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 11 (4.5 g), 1-ethynyl-1-cyclopentyl methacrylate (8.9 g), 3-hydroxystyrene (4.2 g), PAG monomer 8 (9.8 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 14. The composition of polymer 14 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化152][Chemistry 152]
[合成例2-15]聚合物15的合成[Synthesis Example 2-15] Synthesis of Polymer 15
于2L的烧瓶中添加单体12(4.6g)、甲基丙烯酸-1-乙炔基-1-环戊酯(8.9g)、3-羟基苯乙烯(4.2g)、PAG单体8(9.8g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物15。聚合物15的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 12 (4.6 g), 1-ethynyl-1-cyclopentyl methacrylate (8.9 g), 3-hydroxystyrene (4.2 g), PAG monomer 8 (9.8 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 15. The composition of polymer 15 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化153][Chemistry 153]
[合成例2-16]聚合物16的合成[Synthesis Example 2-16] Synthesis of Polymer 16
于2L的烧瓶中添加单体13(4.2g)、ALG单体1(8.9g)、3-羟基苯乙烯(4.2g)、PAG单体6(9.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物16。聚合物16的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 13 (4.2 g), ALG monomer 1 (8.9 g), 3-hydroxystyrene (4.2 g), PAG monomer 6 (9.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 16. The composition of polymer 16 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化154][Chemistry 154]
[合成例2-17]聚合物17的合成[Synthesis Example 2-17] Synthesis of Polymer 17
于2L的烧瓶中添加单体14(4.2g)、ALG单体1(8.9g)、3-羟基苯乙烯(4.2g)、PAG单体6(9.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物17。聚合物17的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 14 (4.2 g), ALG monomer 1 (8.9 g), 3-hydroxystyrene (4.2 g), PAG monomer 6 (9.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) as a polymerization initiator was added, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 17. The composition of polymer 17 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化155][Chemistry 155]
[合成例2-18]聚合物18的合成[Synthesis Example 2-18] Synthesis of Polymer 18
于2L的烧瓶中添加单体15(4.7g)、ALG单体1(8.9g)、3-羟基苯乙烯(4.2g)、PAG单体6(9.4g)、及作为溶剂的THF(40g)。将该反应容器于氮气环境下冷却至-70℃,重复3次减压脱气及吹氮。升温至室温后,添加作为聚合引发剂的AIBN(1.2g),升温至60℃,并使其反应15小时。将该反应溶液添加于异丙醇1L中,并将析出的白色固体进行分滤。将得到的白色固体以60℃进行减压干燥,获得聚合物18。聚合物18的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Monomer 15 (4.7 g), ALG monomer 1 (8.9 g), 3-hydroxystyrene (4.2 g), PAG monomer 6 (9.4 g), and THF (40 g) as a solvent were added to a 2 L flask. The reaction vessel was cooled to -70 ° C under a nitrogen environment, and degassing under reduced pressure and nitrogen blowing were repeated 3 times. After warming to room temperature, AIBN (1.2 g) was added as a polymerization initiator, the temperature was raised to 60 ° C, and it was reacted for 15 hours. The reaction solution was added to 1 L of isopropanol, and the precipitated white solid was filtered. The obtained white solid was dried under reduced pressure at 60 ° C to obtain polymer 18. The composition of polymer 18 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化156][Chemistry 156]
[比较合成例1]比较聚合物1的合成[Comparative Synthesis Example 1] Synthesis of Comparative Polymer 1
将单体1替换成使用比较单体1,除此之外,以和合成例2-1同样的方法获得比较聚合物1。比较聚合物1的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。A comparative polymer 1 was obtained in the same manner as in Synthesis Example 2-1 except that the monomer 1 was replaced with the comparative monomer 1. The composition of the comparative polymer 1 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化157][Chemistry 157]
[比较合成例2]比较聚合物2的合成[Comparative Synthesis Example 2] Synthesis of Comparative Polymer 2
将单体1替换成使用比较单体2,除此之外,以和合成例2-1同样的方法获得比较聚合物2。比较聚合物2的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Comparative polymer 2 was obtained in the same manner as in Synthesis Example 2-1 except that monomer 1 was replaced with comparative monomer 2. The composition of comparative polymer 2 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化158][Chemistry 158]
[比较合成例3]比较聚合物3的合成[Comparative Synthesis Example 3] Synthesis of Comparative Polymer 3
不使用单体1,除此之外,以和合成例2-1同样的方法获得比较聚合物3。比较聚合物3的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Comparative polymer 3 was obtained in the same manner as in Synthesis Example 2-1 except that monomer 1 was not used. The composition of comparative polymer 3 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化159][Chemistry 159]
[比较合成例4]比较聚合物4的合成[Comparative Synthesis Example 4] Synthesis of Comparative Polymer 4
不使用单体4,除此之外,以和合成例2-4同样的方法获得比较聚合物4。比较聚合物4的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Comparative polymer 4 was obtained in the same manner as in Synthesis Example 2-4 except that monomer 4 was not used. The composition of comparative polymer 4 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化160][Chemistry 160]
[比较合成例5]比较聚合物5的合成[Comparative Synthesis Example 5] Synthesis of Comparative Polymer 5
将单体1替换成使用比较单体3,除此之外,以和合成例2-1同样的方法获得比较聚合物5。比较聚合物5的组成利用13C-NMR及1H-NMR进行确认,Mw及Mw/Mn利用GPC进行确认。Comparative polymer 5 was obtained in the same manner as in Synthesis Example 2-1 except that monomer 1 was replaced with comparative monomer 3. The composition of comparative polymer 5 was confirmed by 13 C-NMR and 1 H-NMR, and Mw and Mw/Mn were confirmed by GPC.
[化161][Chemistry 161]
[实施例1~22、比较例1~5][Examples 1 to 22, Comparative Examples 1 to 5]
将于已使作为表面活性剂的OMNOVA公司制表面活性剂Polyfox636溶解50ppm而成的有机溶剂中以表1、2所示的组成使各成分溶解而成的溶液,以0.2μm尺寸的过滤器进行过滤,制得抗蚀剂组成物。A solution prepared by dissolving the components shown in Tables 1 and 2 in an organic solvent in which 50 ppm of OMNOVA surfactant Polyfox 636 was dissolved was filtered through a 0.2 μm filter to obtain a resist composition.
表1、2中,各成分如下所述。In Tables 1 and 2, the components are as follows.
·有机溶剂:PGMEA(丙二醇单甲醚乙酸酯)Organic solvent: PGMEA (propylene glycol monomethyl ether acetate)
DAA(二丙酮醇)DAA (Diacetone Alcohol)
EL(乳酸乙酯)EL(ethyl lactate)
·酸产生剂:PAG-1(参照下述结构式)Acid generator: PAG-1 (see the following structural formula)
·淬灭剂:Q-1、Q-2、比较淬灭剂RQ-1(参照下述结构式)Quencher: Q-1, Q-2, comparative quencher RQ-1 (see the following structural formula)
[化162][Chemistry 162]
[EUV曝光评价][EUV exposure evaluation]
将表1、2所示的各抗蚀剂组成物旋涂于以膜厚20nm形成有含硅的旋涂式硬掩膜SHB-A940(硅的含量为43质量%)的Si基板上,使用加热板以105℃预烘60秒,制得膜厚50nm的抗蚀剂膜。对其使用ASML公司制EUV扫描式曝光机NXE3400(NA0.33,σ0.9/0.6,四极照明,晶圆上尺寸为节距46nm,+20%偏压的孔洞图案的掩膜)进行曝光,于加热板上以表1、2所记载的温度实施60秒的PEB,并以2.38质量%的TMAH水溶液实施30秒的显影,获得尺寸23nm的孔洞图案。Each resist composition shown in Tables 1 and 2 was spin-coated on a Si substrate with a silicon-containing spin-coated hard mask SHB-A940 (silicon content of 43 mass%) formed with a film thickness of 20 nm, and pre-baked at 105° C. for 60 seconds using a hot plate to obtain a resist film with a film thickness of 50 nm. It was exposed using an EUV scanning exposure machine NXE3400 manufactured by ASML (NA0.33, σ0.9/0.6, quadrupole illumination, a mask with a hole pattern with a size of 46 nm pitch on the wafer and a bias voltage of +20%), and PEB was performed for 60 seconds on a hot plate at the temperature described in Tables 1 and 2, and developed for 30 seconds with a 2.38 mass % TMAH aqueous solution to obtain a hole pattern with a size of 23 nm.
测定孔洞尺寸分别以23nm形成时的曝光量,并令其为感度。又,使用日立制作所(股)制测长SEM(CG6300)测定50个孔洞的尺寸,求出CDU(尺寸变异3σ)。The exposure amount when the hole size was formed at 23 nm was measured and the result was defined as sensitivity. The size of 50 holes was measured using a length measurement SEM (CG6300) manufactured by Hitachi, Ltd. to determine CDU (dimensional variation 3σ).
结果如表1、2所示。The results are shown in Tables 1 and 2.
[表1][Table 1]
[表2][Table 2]
由表1、2的结果可知,含有使用了特定的聚合物的本发明的抗蚀剂材料的抗蚀剂组成物,且该特定的聚合物含有具有被碘取代的1价芳香族羧酸的锍盐、錪盐结构的重复单元a,其满足充分的感度及尺寸均匀性(实施例1~22)。相对于此,使用了不含本发明的抗蚀剂材料的抗蚀剂组成物的比较例1~5,成为感度及尺寸均匀性差的结果。As can be seen from the results in Tables 1 and 2, the resist composition containing the resist material of the present invention using a specific polymer, wherein the specific polymer contains a repeating unit a having a sulfonium salt or iodonium salt structure of a monovalent aromatic carboxylic acid substituted with iodine, satisfies sufficient sensitivity and dimensional uniformity (Examples 1 to 22). In contrast, Comparative Examples 1 to 5 using the resist composition not containing the resist material of the present invention result in poor sensitivity and dimensional uniformity.
本说明书包含如下方面。This specification includes the following aspects.
[1]:一种抗蚀剂材料,其特征为:含有重复单元a,该重复单元a含有自聚合物主链间隔酯键而键结的有取代或无取代的经碘化的1价芳香族羧酸的锍盐或錪盐。[1]: A resist material characterized by comprising a repeating unit a comprising a substituted or unsubstituted iodinated sulfonium salt or iodonium salt of a monovalent aromatic carboxylic acid bonded to a polymer main chain via an ester bond.
[2]:如上述[1]的抗蚀剂材料,其特征为:前述重复单元a包含下述通式(a)-1或(a)-2表示的重复单元。[2]: The resist material according to [1] above, wherein the repeating unit a comprises a repeating unit represented by the following general formula (a)-1 or (a)-2.
[化163][Chemistry 163]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为单键或碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a single bond or a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
[3]:如上述[2]的抗蚀剂材料,其特征为:前述通式(a)-1及(a)-2中,前述X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。[3]: The resist material of [2] above is characterized in that: in the general formulas (a)-1 and (a)-2, the X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom.
[4]:如上述[1]至上述[3]中任一项的抗蚀剂材料,其特征为:更含有羧基及酚性羟基中的任一者或其两者的氢原子被酸不稳定基团取代的重复单元b。[4]: The resist material according to any one of [1] to [3], further comprising a repeating unit b in which the hydrogen atoms of one or both of a carboxyl group and a phenolic hydroxyl group are substituted with an acid-labile group.
[5]:如上述[4]的抗蚀剂材料,其特征为:前述重复单元b为选自下述通式(b1)及(b2)表示的重复单元中的至少1种。[5]: The resist material according to [4] above, wherein the repeating unit b is at least one selected from the repeating units represented by the following general formulae (b1) and (b2).
[化164][Chemistry 164]
式中,RA分别独立地为氢原子或甲基。Y1为单键、亚苯基、亚萘基、或具有酯键、醚键或内酯环的碳数1~12的连接基团。Y2为单键、酯键或酰胺键。R11及R12为酸不稳定基团。R13为氟原子、三氟甲基、氰基、或碳数1~6的烷基。R14为单键或直链状或分支状的碳数1~6的烷二基,且其碳原子的一部分也可被醚键或酯键取代。a为1或2。b为0~4的整数。In the formula, RA is independently a hydrogen atom or a methyl group. Y1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms and having an ester bond, an ether bond, or a lactone ring. Y2 is a single bond, an ester bond, or an amide bond. R11 and R12 are acid-labile groups. R13 is a fluorine atom, a trifluoromethyl group, a cyano group, or an alkyl group having 1 to 6 carbon atoms. R14 is a single bond or a linear or branched alkanediyl group having 1 to 6 carbon atoms, and a portion of the carbon atoms thereof may be substituted by an ether bond or an ester bond. a is 1 or 2. b is an integer of 0 to 4.
[6]:如上述[1]至上述[5]中任一项的抗蚀剂材料,其特征为:前述抗蚀剂材料更含有具有选自羟基、羧基、内酯环、碳酸酯基、硫代碳酸酯基、羰基、环状缩醛基、醚键、酯键、磺酸酯键、氰基、酰胺基、-O-C(=O)-S-、及-O-C(=O)-NH-的密合性基团的重复单元c。[6]: The resist material according to any one of [1] to [5] above, characterized in that the resist material further contains a repeating unit c having an adhesive group selected from a hydroxyl group, a carboxyl group, a lactone ring, a carbonate group, a thiocarbonate group, a carbonyl group, a cyclic acetal group, an ether bond, an ester bond, a sulfonate bond, a cyano group, an amide group, -O-C(=O)-S-, and -O-C(=O)-NH-.
[7]:如上述[1]至上述[6]中任一项的抗蚀剂材料,其特征为:前述抗蚀剂材料更含有选自下述通式(d1)~(d3)表示的重复单元中的至少1种的重复单元d。[7]: The resist material as described in any one of [1] to [6] above, characterized in that: the resist material further contains at least one repeating unit d selected from the repeating units represented by the following general formulas (d1) to (d3).
[化165][Chemistry 165]
式中,RA分别独立地为氢原子或甲基。Z1为单键、亚苯基、-O-Z11-、-C(=O)-O-Z11-或-C(=O)-NH-Z11-,Z11为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、及羟基中的1种以上。Z2A为单键或酯键。Z2B为单键或碳数1~12的2价基团,且也可含有选自酯键、醚键、内酯环、溴原子、及碘原子中的1种以上。Z3为单键、亚甲基、亚乙基、亚苯基、氟化亚苯基、-O-Z31-、-C(=O)-O-Z31-或-C(=O)-NH-Z31-,Z31为碳数1~6的烷二基、碳数2~6的烯二基或亚苯基,且也可含有选自羰基、酯键、醚键、卤素原子、及羟基中的1种以上。Rf1~Rf4分别独立地为氢原子、氟原子或三氟甲基,但至少1个为氟原子。R21~R28分别独立地为也可含有杂原子的碳数1~20的1价烃基。又,R23、R24及R25中的任2个或R26、R27及R28中的任2个也可互相键结并和它们所键结的硫原子一起形成环。M-为非亲核性相对离子。In the formula, RA is independently a hydrogen atom or a methyl group. Z1 is a single bond, a phenylene group, -OZ11- , -C(=O) -OZ11- or -C(=O)-NH- Z11- , Z11 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain one or more selected from a carbonyl group, an ester bond, an ether bond, and a hydroxyl group. Z2A is a single bond or an ester bond. Z2B is a single bond or a divalent group having 1 to 12 carbon atoms, and may contain one or more selected from an ester bond, an ether bond, a lactone ring, a bromine atom, and an iodine atom. Z3 is a single bond, methylene, ethylene, phenylene, fluorinated phenylene, -OZ31- , -C(=O) -OZ31- or -C(=O)-NH- Z31- , Z31 is an alkanediyl group having 1 to 6 carbon atoms, an alkenediyl group having 2 to 6 carbon atoms or a phenylene group, and may contain one or more selected from a carbonyl group, an ester bond, an ether bond, a halogen atom, and a hydroxyl group. Rf1 to Rf4 are each independently a hydrogen atom, a fluorine atom or a trifluoromethyl group, but at least one of them is a fluorine atom. R21 to R28 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. In addition, any two of R23 , R24 and R25 or any two of R26 , R27 and R28 may be bonded to each other and form a ring together with the sulfur atom to which they are bonded. M- is a non-nucleophilic counter ion.
[8]:如上述[7]的抗蚀剂材料,其特征为:前述Z2B中含有至少1个以上的碘原子。[8]: The resist material according to [7] above, wherein the Z 2B contains at least one iodine atom.
[9]:如上述[1]至上述[8]中任一项的抗蚀剂材料,其特征为:前述抗蚀剂材料的分子量为1,000~100,000的范围。[9]: The resist material according to any one of [1] to [8] above, wherein the molecular weight of the resist material is in the range of 1,000 to 100,000.
[10]:一种抗蚀剂组成物,其特征为:含有如上述[1]至上述[9]中任一项的抗蚀剂材料。[10]: A resist composition characterized by comprising a resist material as described in any one of [1] to [9] above.
[11]:如上述[10]的抗蚀剂组成物,其特征为:更含有选自酸产生剂、有机溶剂、淬灭剂、及表面活性剂中的1种以上。[11]: The resist composition as described in [10] above is characterized in that it further contains one or more selected from the group consisting of an acid generator, an organic solvent, a quencher, and a surfactant.
[12]:一种图案形成方法,包含下列步骤:[12]: A pattern forming method comprising the following steps:
使用如上述[10]或上述[11]的抗蚀剂组成物于基板上形成抗蚀剂膜,Using the resist composition of [10] or [11] above, forming a resist film on a substrate,
对前述抗蚀剂膜以高能射线进行曝光,及exposing the resist film to high energy radiation, and
将前述已曝光的抗蚀剂膜使用显影液进行显影。The exposed resist film is developed using a developer.
[13]:如上述[12]的图案形成方法,其特征为:使用i射线、KrF准分子激光、ArF准分子激光、电子束、或波长3~15nm的极紫外线作为前述高能射线。[13]: The pattern forming method as described in [12] above is characterized in that i-rays, KrF excimer lasers, ArF excimer lasers, electron beams, or extreme ultraviolet rays with a wavelength of 3 to 15 nm are used as the aforementioned high-energy rays.
[14]:一种单体,其特征为:以下述通式(a)-1M或(a)-2M表示。[14]: A monomer characterized by being represented by the following general formula (a)-1M or (a)-2M.
[化166][Chemistry 166]
式中,RA为氢原子或甲基。X1为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有卤素原子。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1 is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also contain a halogen atom. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also contain one or more selected from an ether group and an ester group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R2 to R6 are independently a monovalent hydrocarbon group having 1 to 25 carbon atoms, which may also contain a heteroatom. Furthermore, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
[15]:一种单体,其特征为:以下述通式(a)-1’M或(a)-2’M表示。[15]: A monomer characterized by being represented by the following general formula (a)-1’M or (a)-2’M.
[化167][Chemistry 167]
式中,RA为氢原子或甲基。X1’为单键、亚苯基、亚萘基、或含有酯键或醚键的碳数1~12的连接基团,且也可具有选自卤素原子、羟基、烷氧基、酰氧基、硝基、及氰基中的1种以上。X2为碳数1~12的直链状、分支状、或环状的亚烷基,且也可含有选自酯基、醚基、酰胺基、内酯环、磺内酯环、及卤素原子中的1种以上。X3为单键或不含氟原子的碳数1~6的直链状或分支状的亚烷基,且也可具有选自醚基及酯基中的1种以上。Y为选自酯基及磺酸酯基的基团。R1分别独立地为碳数1~4的直链状或分支状的烷基、烷氧基、酰氧基、或碘以外的卤素原子。m为1~4的整数,n为0~3的整数。R2~R6分别独立地为也可含有杂原子的碳数1~25的1价烃基。又,R2、R3及R4中的任2个也可互相键结并和它们所键结的硫原子一起形成环。In the formula, RA is a hydrogen atom or a methyl group. X1' is a single bond, a phenylene group, a naphthylene group, or a linking group having 1 to 12 carbon atoms containing an ester bond or an ether bond, and may also have one or more selected from a halogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a nitro group, and a cyano group. X2 is a linear, branched, or cyclic alkylene group having 1 to 12 carbon atoms, and may also contain one or more selected from an ester group, an ether group, an amide group, a lactone ring, a sultone ring, and a halogen atom. X3 is a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms without a fluorine atom, and may also have one or more selected from an ether group and an ester group. Y is a group selected from an ester group and a sulfonate group. R1 is independently a linear or branched alkyl group having 1 to 4 carbon atoms, an alkoxy group, an acyloxy group, or a halogen atom other than iodine. m is an integer of 1 to 4, and n is an integer of 0 to 3. R 2 to R 6 are each independently a monovalent hydrocarbon group having 1 to 25 carbon atoms which may contain a hetero atom. In addition, any two of R 2 , R 3 and R 4 may be bonded to each other to form a ring together with the sulfur atom to which they are bonded.
另外,本发明不限于上述实施形态。上述实施形态为例示的,具有和本发明的权利要求所记载的技术思想实质上相同的构成,发挥同样的作用效果者,皆包含于本发明的技术范围内。The present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments are merely examples, and those having substantially the same configuration as the technical concept described in the claims of the present invention and having the same functions and effects are all included in the technical scope of the present invention.
Claims (15)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-068859 | 2023-04-19 | ||
| JP2023-184363 | 2023-10-27 | ||
| JP2023184363 | 2023-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118812766A true CN118812766A (en) | 2024-10-22 |
Family
ID=93064115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410467831.3A Pending CN118812766A (en) | 2023-04-19 | 2024-04-18 | Resist material, resist composition, pattern forming method, and monomer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118812766A (en) |
-
2024
- 2024-04-18 CN CN202410467831.3A patent/CN118812766A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7639675B2 (en) | Positive resist material and pattern forming method | |
| JP7283373B2 (en) | Chemically amplified resist material and pattern forming method | |
| JP7351262B2 (en) | Positive resist material and pattern forming method | |
| JP7666321B2 (en) | Positive resist material and pattern forming method | |
| JP7264019B2 (en) | Positive resist material and pattern forming method | |
| TWI837959B (en) | Positive resist composition and pattern forming process | |
| JP7622544B2 (en) | Chemically amplified positive resist material and pattern formation method | |
| TWI837530B (en) | Positive resist composition and patterning process | |
| JP7626044B2 (en) | Positive resist material and pattern forming method | |
| KR20220106706A (en) | Positive resist composition and pattern forming process | |
| JP7673652B2 (en) | Positive resist material and pattern forming method | |
| CN116136647A (en) | Positive type resist material and pattern forming method | |
| TWI888104B (en) | Resist material, resist composition, patterning process, and monomer | |
| JP7647673B2 (en) | Positive resist material and pattern forming method | |
| KR102925415B1 (en) | Resist material, resist composition, patterning process, and monomer | |
| TWI888099B (en) | Monomer, resist material, resist composition, and patterning process | |
| JP7757911B2 (en) | Positive resist material and pattern forming method | |
| CN118812766A (en) | Resist material, resist composition, pattern forming method, and monomer | |
| CN118818895A (en) | Resist material, resist composition, and pattern forming method | |
| KR20240155121A (en) | Positive resist composition and pattern forming process | |
| CN120335236A (en) | Positive resist material and pattern forming method | |
| TW202513617A (en) | Resist composition and pattern forming process | |
| JP2025087601A (en) | Positive resist material and pattern forming method | |
| JP2025182799A (en) | Resist composition and pattern forming method | |
| JP2023152629A (en) | Positive resist material and pattern forming method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |