CN117708028B - SATA RAID bridging chip - Google Patents
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Abstract
Description
技术领域Technical Field
本发明涉及一种SATA RAID桥接芯片,具体涉及一种支持用户选择FIFO接口或AMBA接口的SATA RAID桥接芯片。The invention relates to a SATA RAID bridge chip, in particular to a SATA RAID bridge chip which supports users to select a FIFO interface or an AMBA interface.
背景技术Background technique
硬盘接口作为主机和硬盘之间的连接部件,承担了所有数据传输的功能。它是硬盘缓存和主机内存之间数据传输的接口,同时也是硬盘和系统之间数据传输速度的瓶颈。也就是说硬盘接口的性能和速度对整个计算机系统运行的速度和效率起到很大的制约作用。As the connection component between the host and the hard disk, the hard disk interface undertakes all data transmission functions. It is the interface for data transmission between the hard disk cache and the host memory, and it is also the bottleneck of the data transmission speed between the hard disk and the system. In other words, the performance and speed of the hard disk interface play a great role in restricting the speed and efficiency of the entire computer system.
一种常见的硬盘接口是采用串行高级技术附件(Serial Advanced TechnologyAttachment, SATA)接口。SATA接口采用串行连接方式,具备了更强的纠错能力。串行接口还具有结构简单、支持热插拔、传输速度快等优点。SATA-2接口是从SATA的基础上发展起来的,其主要特征是外部传输率从SATA-1的1.5 Gbps速率进一步提高到了SATA-2的3 Gbps。A common hard disk interface is the Serial Advanced Technology Attachment (SATA) interface. The SATA interface uses a serial connection method and has stronger error correction capabilities. The serial interface also has the advantages of simple structure, hot plug support, and fast transmission speed. The SATA-2 interface is developed on the basis of SATA, and its main feature is that the external transmission rate is further increased from 1.5 Gbps of SATA-1 to 3 Gbps of SATA-2.
由于和传统的并口传输模式的集成驱动电子(Integrated Drive Electronics,IDE)硬盘相比,SATA接口硬盘具有传输速率高、数据更可靠、连线更简单等明显优势,所以目前市场上IDE硬盘已经被SATA硬盘所替代。采用SATA接口的设备,其数据传输方式一般为:硬盘→内存→中央处理器→内存→硬盘。参考图1,其展示了某常规的SATA接口的逻辑框图,其主要包括了物理层、链路层、传输层等。Compared with the traditional parallel port transmission mode of Integrated Drive Electronics (IDE) hard disk, SATA interface hard disk has obvious advantages such as high transmission rate, more reliable data, simpler connection, etc., so IDE hard disks have been replaced by SATA hard disks in the market. The data transmission mode of devices using SATA interface is generally: hard disk → memory → CPU → memory → hard disk. Refer to Figure 1, which shows the logic block diagram of a conventional SATA interface, which mainly includes the physical layer, link layer, transmission layer, etc.
磁盘存储器作为计算机系统的主要存储设备,其存取速度的增长滞后于中央处理单元(Central Processing Unit, CPU)的运算速度,因此出现输入/输出(Input/Output,I/O)瓶颈问题。为了增加计算机的数据存储容量,缩小CPU和I/O系统之间的速度差异,1988年美国加州大学伯克利分校的Patterson Gibson和Katz提出了廉价磁盘冗余阵列(Redundant Array of Inexpensive Disks,RAID)技术概念。As the main storage device of computer systems, the access speed of disk storage lags behind the computing speed of the central processing unit (CPU), resulting in an input/output (I/O) bottleneck problem. In order to increase the data storage capacity of computers and reduce the speed difference between the CPU and I/O systems, Patterson Gibson and Katz of the University of California, Berkeley proposed the concept of Redundant Array of Inexpensive Disks (RAID) technology in 1988.
RAID技术主要有三大功能:1、通过对数据进行条带化和对多块硬盘并行读写,提高数据存储速度;2、通过扩展阵列中的硬盘数量增加系统容量;3、通过镜像或者存储奇偶校验信息的方式,实现对数据的冗余保护。RAID technology has three main functions: 1. Improve data storage speed by striping data and reading and writing multiple hard disks in parallel; 2. Increase system capacity by expanding the number of hard disks in the array; 3. Realize redundant protection of data by mirroring or storing parity information.
为了解决CPU和I/O系统之间的速度差异,市场上通过SATA RAID桥接芯片实现与硬盘之间的数据传输。如果要实现RAID功能,在桥接芯片中需要集成RAID处理器。然而市面上的RAID处理器往往采用先入先出(First In First Out, FIFO)接口,无法直接与采用高级微控制器总线架构(Advanced Microcontroller Bus Architecture,AMBA)接口的主机设备及SATA核心搭配使用。In order to solve the speed difference between the CPU and I/O system, the market uses SATA RAID bridge chips to achieve data transmission between the hard disk. If the RAID function is to be implemented, a RAID processor needs to be integrated in the bridge chip. However, the RAID processors on the market often use a First In First Out (FIFO) interface and cannot be directly used with host devices and SATA cores that use the Advanced Microcontroller Bus Architecture (AMBA) interface.
鉴于市场现有的SATA RAID桥接芯片,内部常用的RAID处理器接口极为单一,不能根据用户实际应用需求来选择合适的接口。为了解决现有技术的不足,本发明提供了一种接口可选的SATA RAID桥接芯片,该芯片能够根据用户实际需求来选择相应的接口模式,可以灵活集成至不同厂家不同接口的设备中,缩短了SATA RAID桥接芯片的开发周期。In view of the existing SATA RAID bridge chips on the market, the commonly used internal RAID processor interface is extremely single, and it is impossible to select a suitable interface according to the actual application needs of users. In order to solve the shortcomings of the prior art, the present invention provides a SATA RAID bridge chip with optional interface, which can select the corresponding interface mode according to the actual needs of users, and can be flexibly integrated into devices with different interfaces from different manufacturers, shortening the development cycle of the SATA RAID bridge chip.
发明内容Summary of the invention
为了缓解或部分缓解上述技术问题,本发明的解决方案如下所述:In order to alleviate or partially alleviate the above technical problems, the solution of the present invention is as follows:
一种SATA RAID桥接芯片,包括RAID处理器、SATA核心和PHY层,所述SATA核心输出的数据经PHY层传输至SATA存储设备端,所述RAID处理器包括第一总线接口单元和RAID数据处理核心;所述SATA RAID桥接芯片支持从主机设备中接收AMBA协议数据,以及支持从主机设备中接收FIFO数据;所述第一总线接口单元用于将AMBA协议数据转换为FIFO数据,所述RAID数据处理核心用于处理所接收的FIFO数据并输出FIFO数据;并且,所述RAID数据处理核心所接收的FIFO数据,是所述SATA RAID桥接芯片从主机设备中接收的FIFO数据,或者是通过所述第一总线接口单元将AMBA协议数据转换所得的FIFO数据。A SATA RAID bridge chip comprises a RAID processor, a SATA core and a PHY layer, wherein data output by the SATA core is transmitted to a SATA storage device end via the PHY layer, and the RAID processor comprises a first bus interface unit and a RAID data processing core; the SATA RAID bridge chip supports receiving AMBA protocol data from a host device, and supports receiving FIFO data from the host device; the first bus interface unit is used for converting the AMBA protocol data into FIFO data, and the RAID data processing core is used for processing the received FIFO data and outputting the FIFO data; and the FIFO data received by the RAID data processing core is the FIFO data received by the SATA RAID bridge chip from the host device, or is the FIFO data obtained by converting the AMBA protocol data through the first bus interface unit.
在某实施例中,所述SATA RAID桥接芯片支持RAID模式和非RAID模式;在RAID模式下,所述RAID处理器从主机设备中接收AMBA协议数据或FIFO数据;在非RAID模式下,所述SATA核心从主机设备中接收AMBA协议数据或FIFO数据,所述RAID处理器被旁路。In a certain embodiment, the SATA RAID bridge chip supports RAID mode and non-RAID mode; in RAID mode, the RAID processor receives AMBA protocol data or FIFO data from the host device; in non-RAID mode, the SATA core receives AMBA protocol data or FIFO data from the host device, and the RAID processor is bypassed.
在某实施例中,若所述SATA核心包含FIFO接口,则所述RAID数据处理核心输出FIFO数据,经所述SATA核心的所述FIFO接口,传输至所述SATA核心。In one embodiment, if the SATA core includes a FIFO interface, the RAID data processing core outputs FIFO data and transmits the data to the SATA core via the FIFO interface of the SATA core.
在某实施例中,所述RAID处理器还包括第二总线接口单元,所述第二总线接口单元用于将FIFO数据转换为AMBA协议数据;若所述SATA核心包含AMBA接口和用于数据转换的第三总线接口单元,且所述用于数据转换的第三总线接口单元不支持旁路功能,则使能所述RAID处理器的所述第二总线接口单元。In a certain embodiment, the RAID processor also includes a second bus interface unit, which is used to convert FIFO data into AMBA protocol data; if the SATA core includes an AMBA interface and a third bus interface unit for data conversion, and the third bus interface unit for data conversion does not support a bypass function, the second bus interface unit of the RAID processor is enabled.
在某实施例中,若所述SATA核心包含AMBA接口和用于数据转换的第三总线接口单元,则旁路所述用于数据转换的第三总线接口单元。In one embodiment, if the SATA core includes an AMBA interface and a third bus interface unit for data conversion, the third bus interface unit for data conversion is bypassed.
在某实施例中,所述RAID处理器用于实现RAID-0、RAID-1、RAID-5和RAID-10功能。In one embodiment, the RAID processor is used to implement RAID-0, RAID-1, RAID-5 and RAID-10 functions.
在某实施例中,所述SATA RAID桥接芯片是专用集成电路。In one embodiment, the SATA RAID bridge chip is a dedicated integrated circuit.
在某实施例中,所述SATA核心和所述PHY层之间通过PIPE接口连接。In one embodiment, the SATA core and the PHY layer are connected via a PIPE interface.
在某实施例中,所述SATA存储设备端为磁盘。In one embodiment, the SATA storage device is a disk.
在某实施例中,所述SATA RAID桥接芯片用于主机设备对SATA存储设备端中的数据存取。In one embodiment, the SATA RAID bridge chip is used for a host device to access data in a SATA storage device.
本发明技术方案,具有如下有益的技术效果之一或多个:The technical solution of the present invention has one or more of the following beneficial technical effects:
1)本发明提供一种可灵活选择接口的SATA RAID桥接芯片,可以根据用户需求灵活选择FIFO接口或AMBA接口,拓宽了本发明桥接芯片的应用范围。1) The present invention provides a SATA RAID bridge chip with flexible interface selection, and can flexibly select a FIFO interface or an AMBA interface according to user needs, thereby broadening the application scope of the bridge chip of the present invention.
2)当不需要运行RAID功能时,可以绕过RAID处理器直接与SATA核心进行数据交互,提供了RAID模式和非RAID模式,芯片为用户提供了多种数据传输模式,拓宽了本发明桥接芯片的应用场景。2) When the RAID function does not need to be run, the RAID processor can be bypassed to directly interact with the SATA core for data, providing RAID mode and non-RAID mode. The chip provides users with a variety of data transmission modes, broadening the application scenarios of the bridge chip of the present invention.
此外,本发明还具有的其它有益效果将在具体实施例中提及。In addition, other beneficial effects of the present invention will be mentioned in the specific embodiments.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是现有技术中常规SATA接口逻辑框图;FIG1 is a conventional SATA interface logic block diagram in the prior art;
图2是本发明桥接芯片逻辑框图;FIG2 is a logic block diagram of a bridge chip according to the present invention;
图3是RAID处理器逻辑框图;FIG3 is a logic block diagram of a RAID processor;
图4是RAID模式下的桥接芯片数据传输和处理流程图;FIG4 is a flow chart of bridge chip data transmission and processing in RAID mode;
图5是非RAID模式下的桥接芯片数据传输和处理流程图。FIG5 is a flow chart of bridge chip data transmission and processing in non-RAID mode.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚,下面将结合本发明中的附图,对本发明中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
其中,在本发明的描述中,除非另有说明,“/”表示前后关联的对象是一种“或”的关系,例如,A/B可以表示A或B;本发明中的“和/或”仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况,其中A,B可以是单数或者复数。In the description of the present invention, unless otherwise specified, “/” indicates that the objects associated with each other are in an “or” relationship, for example, A/B can represent A or B; “and/or” in the present invention is only a description of the association relationship between associated objects, indicating that there can be three relationships, for example, A and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.
在本发明的描述中,除非另有说明,“多个”是指两个或多于两个。“以下至少一项(个)”或其类似表达,是指的这些项中的任意组合,包括单项(个)或复数项(个)的任意组合。例如,a,b,或c中的至少一项(个),可以表示:a,b,c,a-b,a-c,b-c,或a-b-c,其中a,b,c可以是单个,也可以是多个。In the description of the present invention, unless otherwise specified, "plurality" means two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can be represented by: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.
另外,为了便于清楚描述本发明实施例的技术方案,在本发明的实施例中,采用了“第一”、“第二”等字样对功能和作用基本相同的相同项或相似项进行区分。本领域技术人员可以理解“第一”、“第二”等字样并不对数量和执行次序进行限定,并且“第一”、“第二”等字样也并不限定一定不同。In addition, in order to clearly describe the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, the words "first", "second", etc. are used to distinguish the same items or similar items with substantially the same functions and effects. Those skilled in the art can understand that the words "first", "second", etc. do not limit the quantity and execution order, and the words "first", "second", etc. do not necessarily limit the difference.
在本发明实施例中,“示例地”、“例如”等词用于表示作例子、例证或说明。本发明实施例中被描述为“示例地”、“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言,使用“示例地”、“例如”等词旨在以具体方式呈现相关概念,便于理解。In the embodiments of the present invention, words such as "exemplarily" and "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" and "for example" is intended to present related concepts in a specific way for easy understanding.
参考图2,其展示了本发明桥接芯片的逻辑框图。本发明所述的桥接芯片,具体为SATA RAID桥接芯片,后文简称其为桥接芯片,其是一种专用集成电路。Referring to Fig. 2, a logic block diagram of the bridge chip of the present invention is shown. The bridge chip of the present invention is specifically a SATA RAID bridge chip, hereinafter referred to as a bridge chip, which is a special integrated circuit.
桥接芯片与主机设备之间可以通过AMBA接口或FIFO接口与上游的主机设备建立数据连接。The bridge chip and the host device can establish a data connection with the upstream host device through an AMBA interface or a FIFO interface.
该桥接芯片包括RAID处理器、SATA核心和物理(PHYsical, PHY)层。其中,RAID处理器用于RAID功能的实现,可以根据被配置的RAID模式进行相应模式的数据存取。可选地,所述RAID功能具体指的是RAID-0、RAID-1、RAID-5和RAID-10功能。The bridge chip includes a RAID processor, a SATA core and a physical (PHYsical, PHY) layer. The RAID processor is used to implement the RAID function, and can access data in a corresponding mode according to the configured RAID mode. Optionally, the RAID function specifically refers to RAID-0, RAID-1, RAID-5 and RAID-10 functions.
数据经过RAID处理器处理后,经过SATA核心和PHY层,发送到SATA存储设备端,比如若干磁盘,也可由从SATA存储设备端读取数据并传输至上游的主机设备。After being processed by the RAID processor, the data passes through the SATA core and PHY layer and is sent to the SATA storage device end, such as several disks. The data can also be read from the SATA storage device end and transmitted to an upstream host device.
SATA核心和RAID处理器之间设置有AMBA接口和FIFO接口,用于相应协议类型的数据传输。此外,SATA核心和PHY层通过标准的PCIe物理层接口(Physical Interface forPci Express, PIPE)连接,主要用于实现物理存储设备(比如磁盘1、磁盘2、……和磁盘n)的SATA存储接口,其中n为正整数。AMBA interface and FIFO interface are set between SATA core and RAID processor for data transmission of corresponding protocol types. In addition, SATA core and PHY layer are connected through standard PCIe physical layer interface (Physical Interface for PCI Express, PIPE), which is mainly used to implement SATA storage interface of physical storage devices (such as disk 1, disk 2, ... and disk n), where n is a positive integer.
若上游主机设备发送的数据为基于AMBA协议的数据,则集成时通过AMBA接口与桥接芯片相连进行数据交互。若上游主机设备发送的数据接口是通过FIFO接口,则需要与本发明桥接芯片的FIFO接口相连。If the data sent by the upstream host device is based on the AMBA protocol, the data exchange is carried out by connecting to the bridge chip through the AMBA interface during integration. If the data interface sent by the upstream host device is through the FIFO interface, it needs to be connected to the FIFO interface of the bridge chip of the present invention.
一方面,本发明的桥接芯片与主机设备之间可以通过AMBA或FIFO接口建立数据连接,从而可以实现RAID功能。这允许用户根据需求灵活地选择FIFO接口或AMBA接口,可以适用于不同厂家不同接口的设备的集成,拓宽了本发明桥接芯片的应用范围。On the one hand, the bridge chip of the present invention can establish a data connection with the host device through an AMBA or FIFO interface, thereby realizing the RAID function. This allows the user to flexibly select the FIFO interface or the AMBA interface according to the needs, and can be applicable to the integration of devices with different interfaces from different manufacturers, thus broadening the application scope of the bridge chip of the present invention.
另一方面,本发明的桥接芯片还具有两种不同的应用模式:RAID模式和非RAID模式。两种模式的主要区别特征在于是否旁路掉前述的RAID处理器,这拓展了桥接芯片的应用场景。On the other hand, the bridge chip of the present invention also has two different application modes: RAID mode and non-RAID mode. The main difference between the two modes is whether the aforementioned RAID processor is bypassed, which expands the application scenarios of the bridge chip.
具体地,参考图3,其展示了本发明中的RAID处理器所具有的主要功能模块。优选地,本发明桥接芯片中的RAID处理器被设计有第一总线接口单元和第二总线接口单元。RAID处理器可以接收和发送AMBA协议数据和FIFO数据。Specifically, referring to Fig. 3, it shows the main functional modules of the RAID processor in the present invention. Preferably, the RAID processor in the bridge chip of the present invention is designed with a first bus interface unit and a second bus interface unit. The RAID processor can receive and send AMBA protocol data and FIFO data.
第一总线接口单元,被配置为发送和接收AMBA协议数据。若上游的主机设备通过AMBA协议发送数据时,数据通过第一总线接口单元转换为FIFO数据,并送入RAID数据处理核心。The first bus interface unit is configured to send and receive AMBA protocol data. If the upstream host device sends data via the AMBA protocol, the data is converted into FIFO data via the first bus interface unit and sent to the RAID data processing core.
对于SATA核心,在不同的实施例中,其可能具有不同的接口类型或配置。For the SATA core, in different embodiments, it may have different interface types or configurations.
在某类实施例中,若下游的SATA核心包含的是FIFO接口,则RAID数据处理核心的输出的FIFO数据可以直接送入SATA核心。In certain embodiments, if the downstream SATA core includes a FIFO interface, the FIFO data output by the RAID data processing core can be directly sent to the SATA core.
在某类实施例中,若下游的SATA核心包含AMBA接口,且内部的第三总线接口单元与RAID处理器内部的第一/第二总线接口单元相同或相似,则旁路掉下游的SATA核心中的第三总线接口单元。该实施例有助于降低芯片功耗。In certain embodiments, if the downstream SATA core includes an AMBA interface and the internal third bus interface unit is the same as or similar to the first/second bus interface unit in the RAID processor, the third bus interface unit in the downstream SATA core is bypassed. This embodiment helps to reduce chip power consumption.
进一步地,如若无法/不允许旁路掉SATA核心中的第三总线接口单元,那么使能RAID处理器输出口的第二总线接口单元进行数据协议的转换,即第二总线接口单元将FIFO数据转换为AMBA协议数据。Furthermore, if it is impossible/not allowed to bypass the third bus interface unit in the SATA core, the second bus interface unit of the RAID processor output port is enabled to convert the data protocol, that is, the second bus interface unit converts the FIFO data into AMBA protocol data.
参考图4,其展示了RAID模式下桥接芯片的数据传输和处理流程图。在该模式下,位于上游的主机设备的数据通过AMBA/FIFO接口传输数据至RAID处理器,RAID处理器则通过AMBA/FIFO接口传输数据至SATA核心,并最终通过PHY层发送数据至SATA存储设备端。Refer to Figure 4, which shows the data transmission and processing flow chart of the bridge chip in RAID mode. In this mode, the data of the upstream host device is transmitted to the RAID processor through the AMBA/FIFO interface, and the RAID processor transmits the data to the SATA core through the AMBA/FIFO interface, and finally sends the data to the SATA storage device through the PHY layer.
参考图5,其展示了在非RAID模式下桥接芯片的数据传输和处理流程图。在该模式下,RAID处理器被旁路,主机设备输出的数据通过AMBA/FIFO接口直接和SATA核心连接,执行和完成对SATA存储设备端之间的数据传输。Refer to Figure 5, which shows the data transmission and processing flow chart of the bridge chip in non-RAID mode. In this mode, the RAID processor is bypassed, and the data output by the host device is directly connected to the SATA core through the AMBA/FIFO interface to execute and complete the data transmission between the SATA storage device ends.
为了更好的说明本发明,在上文的具体实施方式中给出了众多的具体细节。本领域技术人员应当理解,没有某些具体细节,本发明同样可以实施。在一些实例中,对于本领域技术人员熟知的方法、手段、元件和电路未作详细描述,以便于凸显本发明的主旨。In order to better illustrate the present invention, numerous specific details are provided in the above specific embodiments. It should be understood by those skilled in the art that the present invention can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present invention.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
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