Disclosure of Invention
The application provides a display substrate and a display device.
According to a first aspect of an embodiment of the present application, there is provided a display substrate. The display substrate comprises a display area and a frame area surrounding the display area, wherein the frame area comprises a first sub-frame area and a second sub-frame area positioned between the first sub-frame area and the display area; the display substrate includes:
an array substrate;
the color film substrate is arranged opposite to the array substrate; the color film substrate comprises a substrate, a heightening layer positioned at one side of the substrate and a liquid crystal orientation layer; the pad layer is positioned in the first sub-frame area, and the liquid crystal orientation layer is positioned in the second sub-frame area and the display area;
the frame sealing glue is positioned in the first sub-frame area and positioned between the array substrate and the color film substrate; the orthographic projection of the frame sealing glue on the substrate falls into the orthographic projection of the pad layer on the substrate; the distance from the surface of the part of the color film substrate, which is positioned in the first sub-frame area and is in contact with the frame sealing glue, to the substrate is greater than the distance from the surface of the liquid crystal orientation layer, which is away from the substrate, to the substrate;
and the liquid crystal molecules are positioned at the inner side of the frame sealing glue.
In one embodiment, the elevated layer is located between the frame seal and the substrate, the elevated layer being in contact with the frame seal; the material of the pad layer is an organic material.
In one embodiment, the display substrate further includes a spacer located in the display area, and the raised layer and the spacer are disposed on the same layer.
In one embodiment, a groove is formed in the surface, facing the frame sealing glue, of the pad layer, and the frame sealing glue partially enters the groove; or, the surface of the pad layer facing the frame sealing glue is provided with a bulge, and the frame sealing glue coats the bulge.
In one embodiment, the color film substrate further includes a light shielding layer, where the light shielding layer is located in the display area, the first sub-frame area, and the second sub-frame area; the light shielding layer comprises a light shielding part positioned in the first sub-frame area, and the thickness of the light shielding part is larger than that of other areas of the light shielding layer; the pad layer is the shading part.
In an embodiment, the color film substrate further includes a color film layer at least located in the display area, and the pad layer and the color film layer are arranged in the same layer.
In one embodiment, the edge of the orthographic projection of the sealant on the substrate is located inside the edge of the orthographic projection of the lift-off layer on the substrate.
In one embodiment, the ratio of the distance from the edge of the orthographic projection of the frame sealing glue on the substrate to the edge of the same side of the orthographic projection of the pad layer on the substrate to the width of the frame sealing glue ranges from 1/5 to 1/3.
In one embodiment, the color film substrate further includes a light shielding layer, where the light shielding layer is located in the display area, the first sub-frame area, and the second sub-frame area; the light shielding layer is made of metal; the color film substrate further comprises an auxiliary film layer positioned on one side, away from the substrate, of the light shielding layer, the auxiliary film layer is positioned in the first sub-frame area, and the orthographic projection of the frame sealing adhesive on the substrate falls into the orthographic projection of the auxiliary film layer on the substrate; the reflectivity of the auxiliary film layer is smaller than that of the shading layer.
In one embodiment, the color film substrate further includes a color film layer at least located in the display area, where the color film layer includes a blue filter structure; the auxiliary film layer and the blue light filtering structure are arranged on the same layer.
According to a second aspect of an embodiment of the present application, there is provided a display device including the display substrate described above.
According to the display substrate and the display device provided by the embodiment of the application, the raised layer positioned in the first sub-frame area is arranged, and the orthographic projection of the frame sealing glue on the substrate falls in the orthographic projection of the raised layer on the substrate, so that the distance from the surface of the region of the color film substrate where the raised layer is positioned in the lamination direction of the film layer to the substrate is increased, namely the distance from the surface of the portion of the color film substrate positioned in the first sub-frame area, which is contacted with the frame sealing glue, to the substrate is increased, and is larger than the distance from the surface of the liquid crystal orientation layer, which is contacted with the frame sealing glue, so that the material of the liquid crystal orientation layer flows to the surface of the color film substrate, which is contacted with the frame sealing glue, in the process of preparing the liquid crystal orientation layer, and the frame sealing glue are caused to be in direct contact with the liquid crystal orientation layer, so that the adhesiveness between the frame sealing glue and the color film substrate is poor, the situation that the array substrate and the color film substrate are separated when the array substrate falls is improved, and the reliability of the display substrate is promoted. Compared with the scheme that annular isolation columns are arranged in the first sub-frame area to prevent materials of the liquid crystal orientation layer from flowing to the surface of the color film substrate opposite to the frame sealing glue, the method can avoid the phenomenon that the width of the first sub-frame area of the display substrate is reduced to cause that silicon balls in the frame sealing glue move to one side of the isolation columns, which is away from the substrate, so that one end of the array is tilted basically to cause yellowing of the edge area of the display area.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.
The embodiment of the application provides a display substrate and a display device. The display substrate and the display device according to the embodiments of the present application will be described in detail with reference to the accompanying drawings. The features of the embodiments described below can be supplemented or combined with one another without conflict.
The embodiment of the application provides a display substrate. As shown in fig. 1, the display substrate includes a display area 101 and a frame area 102 surrounding the display area 101, wherein the frame area 102 includes a first sub-frame area 103 and a second sub-frame area 104 located between the first sub-frame area 103 and the display area 101. The first sub-frame region 103 and the second sub-frame region 104 may each have a ring shape. The second sub-frame region 104 is adjacent to the first sub-frame region 103 and the display region 101, respectively.
As shown in fig. 2 to 5, the display substrate includes an array substrate 10, a color film substrate 20, liquid crystal molecules 30, and a frame sealing adhesive 40. The color film substrate 20 is disposed opposite to the array substrate 10. The color film substrate 20 comprises a substrate 21, a pad layer 22 positioned at one side of the substrate 21 and a liquid crystal orientation layer 23; the pad layer 22 is located in the first sub-frame area 103, and the liquid crystal alignment layer 23 is located in at least the second sub-frame area 104 and the display area 101. The frame sealing glue 40 is located in the first sub-frame area 103 and between the array substrate 10 and the color film substrate 20, so as to adhere the array substrate 10 and the color film substrate 20 together. The orthographic projection of the frame sealing glue 40 on the substrate 21 falls within the orthographic projection of the raised layer 22 on the substrate 21. The distance from the surface of the color film substrate 20, which is in contact with the frame sealing glue 40, to the substrate 21 is greater than the distance from the surface of the liquid crystal alignment layer 23, which is away from the substrate 21, to the substrate 21. The liquid crystal molecules 30 are located inside the frame sealing glue 40. The liquid crystal molecules 30 may be located in the display region 101, the first sub-frame region 103, and the second sub-frame region 104.
According to the display substrate provided by the embodiment of the application, the raised layer positioned in the first sub-frame area is arranged, and the orthographic projection of the frame sealing glue on the substrate falls in the orthographic projection of the raised layer on the substrate, so that the distance from the surface of the region of the color film substrate where the raised layer is positioned in the lamination direction of the film layer to the substrate can be increased, namely the distance from the surface of the portion of the color film substrate positioned in the first sub-frame area, which is contacted with the frame sealing glue, to the substrate is increased, so that the distance is greater than the distance from the surface of the liquid crystal orientation layer, which is contacted with the substrate, to the substrate, so that the material of the liquid crystal orientation layer flows to the surface of the color film substrate, which is contacted with the frame sealing glue, in the process of preparing the liquid crystal orientation layer can be effectively prevented, and the liquid crystal orientation layer is in direct contact with the frame sealing glue, so that the adhesiveness of the frame sealing glue and the color film substrate is poor, the situation that the array substrate and the color film substrate are separated when the array substrate falls can be improved, and the reliability of the display substrate can be improved. Compared with the scheme that annular isolation columns are arranged in the first sub-frame area to prevent materials of the liquid crystal orientation layer from flowing to the surface of the color film substrate opposite to the frame sealing glue, the method can avoid the phenomenon that the width of the first sub-frame area of the display substrate is reduced to cause that silicon balls in the frame sealing glue move to one side of the isolation columns, which is away from the substrate, so that one end of the array is tilted basically to cause yellowing of the edge area of the display area.
In one embodiment, as shown in fig. 2 to 5, the array substrate 10 includes a substrate 12, a thin film transistor 11 located on one side of the substrate 12, a gate insulating layer 13, an interlayer dielectric layer 14, a planarization layer 15, a first electrode 16, an insulating layer 17, a second electrode 18, and a liquid crystal alignment film layer 19.
The thin transistor 11 includes an active layer 111, a gate electrode 112, a first pole 113, and a second pole 114. The gate electrode 112 is located on a side of the active layer 111 facing away from the substrate 12. The first pole 113 and the second pole 114 are located on a side of the active layer 111 facing away from the substrate base plate 12. One of the first pole 113 and the second pole 114 is a source, and the other is a drain. The gate insulating layer 13 is located between the active layer 111 and the gate electrode 112, the interlayer dielectric layer 14 covers the active layer 111, and the first electrode 113 and the second electrode 114 are electrically connected to the active layer 111 through vias penetrating the interlayer dielectric layer 14, respectively. The planarization layer 15 is located on a side of the interlayer dielectric layer 14 facing away from the substrate 12, covering the first pole 113 and the second pole 114. The first electrode 16, the insulating layer 17, the second electrode 18, and the liquid crystal alignment film layer 19 are sequentially disposed on the side of the planarization layer 15 facing away from the substrate 12. One of the first electrode 16 and the second electrode 18 may be a pixel electrode, and the other may be a common electrode, for example, the first electrode 16 is a pixel electrode, and the second electrode 18 is a common electrode. The first electrode 16 may be connected to the first electrode 113 through a via hole penetrating the planarization layer 15. The liquid crystal alignment film layer 19 may be located in the display area 101, the first sub-frame area 103 and the second sub-frame area 104, and the front projection of the liquid crystal alignment film layer 19 on the substrate 12 and the front projection of the frame sealing glue 40 on the substrate 12 do not overlap, and the liquid crystal alignment film layer 19 may be located inside the frame sealing glue 40.
In one embodiment, the materials of the liquid crystal alignment layer 19 and the liquid crystal alignment layer 23 may be PI (Polyimide). In other embodiments, the materials of the liquid crystal alignment layer 19 and the liquid crystal alignment layer 23 may be other organic materials.
In one embodiment, as shown in fig. 2 to 5, the color film substrate 20 further includes an organic resin layer 24 between the substrate 21 and the liquid crystal alignment layer 23, and the liquid crystal alignment layer 23 is in direct contact with the organic resin layer 24. The organic resin layer 24 covers the display area 101, the first sub-frame area 103, and the second sub-frame area 104. The thickness of the portion of the organic resin layer 24 located in the display region 101, the thickness of the portion of the organic resin layer 24 located in the first sub-frame region 103, and the thickness of the portion of the organic resin layer 24 located in the second sub-frame region 104 may not be all the same.
In one embodiment, as shown in fig. 2 to 5, the color film substrate further includes a light shielding layer 25 and a color film layer 26 on a side of the liquid crystal alignment layer 23 facing the substrate 21. The light shielding layer 25 is located in the display area 101, the first sub-frame area 103, and the second sub-frame area 104. The light shielding layer 25 is provided with a plurality of through holes at a portion thereof located in the display area 101. The color film layer 26 may be located in the display area 101 and the second sub-frame area 104. The color film layer 26 includes a plurality of filtering structures 261, and each through hole of the light shielding layer 25 is respectively provided with a filtering structure 261. The color film layer 26 is located in the plurality of filtering structures 261 in the second sub-frame region 104, and the sides of two adjacent filtering structures 261 are contacted, that is, no gap exists between the two adjacent filtering structures 261. The organic resin layer 24 is located on the side of the color film layer 26 facing away from the substrate 21. In some embodiments, the plurality of filtering structures 261 of the color film layer 26 may include a blue filtering structure, a red filtering structure, and a green filtering structure.
In one embodiment, the liquid crystal alignment layer 23 may be located in the display area 101, the first sub-frame area 103 and the second sub-frame area 104, and the front projection of the liquid crystal alignment layer 23 on the substrate 12 does not overlap with the front projection of the frame sealant 40 on the substrate 12, and the liquid crystal alignment layer 23 may be located inside the frame sealant 40.
In one embodiment, as shown in fig. 2 to 5, the frame sealing glue 40 includes a plurality of silicon balls 41, and the silicon balls 41 can play a supporting role to maintain a certain thickness of the frame sealing glue 40.
In one embodiment, as shown in fig. 2 to 5, the display substrate further includes spacers 50 located in the display area 101. The material of the spacer 50 is an organic resin.
In one embodiment, as shown in fig. 2 and 3, the raised layer 22 is located between the frame sealing glue 40 and the substrate 21, and the raised layer 22 is in direct contact with the frame sealing glue 40; the material of the pad layer 22 is an organic material. By providing the material of the spacer layer 22 as an organic material, the adhesion between the spacer layer 22 and the frame sealing adhesive 40 can be improved.
In one embodiment, the lift-off layer 22 is located on a side of the organic resin layer 24 facing away from the substrate 21 and is in direct contact with the organic resin layer 24. The material of the lift-off layer 22 is an organic material, so that the adhesion between the lift-off layer 22 and the organic resin layer 24 is good.
Further, as shown in fig. 2 and 3, the spacer layer 22 is disposed on the same layer as the spacer 50. Wherein the arrangement of the spacer layer 22 and the spacer 50 is that the materials of the spacer layer and the spacer layer are the same, and the spacer layer are formed simultaneously in the same process step. The arrangement is beneficial to simplifying the preparation process of the display substrate; and the material of the spacer 50 and the pad layer 22 is organic resin, the elasticity of the organic resin is better, the organic resin can be compressed to a certain extent, after the array substrate and the color film substrate of the display substrate are aligned, the compressed amount of the pad layer 22 can be controlled, so that the distances between the array substrate and the color film substrate at each position of the display substrate are approximately the same, the distance between the array substrate and the color film substrate at the edge of the display region is prevented from being larger than the distance between the array substrate and the color film substrate at the center region of the display region, the problem that the edge of the display region presents dark state display is avoided, and the display quality of the display substrate is improved.
In one embodiment, as shown in fig. 3, a groove 221 is formed on a surface of the raised layer 22 facing the frame sealing glue 40, and the frame sealing glue 40 partially enters the groove 221. By providing the grooves 221 on the surface of the raised layer 22 facing the frame sealing glue 40, the contact area between the raised layer 22 and the frame sealing glue 40 can be increased, and the reliability of the display substrate can be further improved.
In another embodiment, a protrusion is disposed on a surface of the pad layer facing the frame sealing glue, and the frame sealing glue wraps the protrusion. Through setting up the arch at the surface towards sealing the frame glue of bed hedgehopping layer, can increase the area of contact between bed hedgehopping layer and the frame glue, and then promote the reliability of display substrate.
In one embodiment, as shown in fig. 2 and 3, in order to prevent the edge area of the array substrate from tilting after the array substrate and the color film substrate are aligned, the thickness of each film layer satisfies the following relationship:
H 22 +H 40 =H 1 +H 16 +H 18 +H 19 +H 23 +H 26 -H 25 +△H 24
wherein H is 22 Is the thickness of the lift-off layer 22; h 40 The thickness of the frame sealing glue 40; h 1 The distance between the array substrate and the color film substrate in the display area is the same as the distance between the array substrate and the color film substrate in the display area; h 16 Is the thickness of the first electrode 16; h 18 Is the thickness of the second electrode 18; h 19 Is the thickness of the liquid crystal alignment film layer 19; h 23 Is the thickness of the liquid crystal alignment layer 23; h 26 Is the thickness of the color film layer 26; h 25 Is the thickness of the light shielding layer 25; deltaH 24 Is a thickness difference between a portion of the organic resin layer 24 located in the display region and a portion located in the first sub-frame region.
In one embodiment, as shown in fig. 4, the light shielding layer 25 includes a light shielding portion 251 located in the first sub-frame region 103, and the thickness of the light shielding portion 251 is greater than that of other regions of the light shielding layer 25; the raised layer 22 is the light shielding portion 251. In this way, the raised layer 22 and the light shielding layer 25 are formed simultaneously, and the formation of the raised layer 22 does not require additional preparation steps, which is helpful for simplifying the complexity of the preparation process of the display substrate. The light shielding layer 25 may be prepared using a gray-scale mask, and the light transmittance of the region corresponding to the light shielding part 251 of the gray-scale mask is different from that of the other regions of the gray-scale mask.
In one embodiment, as shown in fig. 5, the backing layer 22 is disposed on the same layer as the color film layer 26. Thus, the raised layer 22 and the color film layer 26 are formed simultaneously, and the formation of the raised layer 22 does not require additional process steps, which is helpful for simplifying the manufacturing process complexity of the display substrate. In this embodiment, the lift-off layer 22 is located on the side of the light-shielding layer 25 facing away from the substrate 21.
In one embodiment, the edge of the orthographic projection of the sealant 40 on the substrate 21 is located inside the edge of the orthographic projection of the lift-off layer 22 on the substrate 21. By the arrangement, the situation that the frame sealing glue 40 is contacted with the liquid crystal alignment layer due to the fact that the width of the pad high layer 22 is smaller in the process of preparing the pad high layer 22 caused by process errors can be effectively avoided.
Further, the ratio of the distance from the edge of the front projection of the frame sealing glue 40 on the substrate 21 to the edge of the same side of the front projection of the pad layer 22 on the substrate 21 to the width of the frame sealing glue 40 is in the range of 1/5-1/3. By the arrangement, the frame sealing glue 40 is effectively prevented from contacting the liquid crystal alignment layer, and the width of the first sub-frame area 103 is not increased too much. In some embodiments, the ratio may be 1/5, 1/4, 1/3, etc.
In one embodiment, the coating error in the process of coating the frame sealing glue 40 is 100 μm, the etching error in preparing the raised layer 22 is 2 μm, and the distance from two edges of the front projection of the frame sealing glue 40 on the substrate 21 to the edge on the same side of the front projection of the raised layer 22 on the substrate 21 is greater than or equal to 102 μm. For example, when the width of the seal 40 is 800 μm, the width of the spacer layer 22 is 1004 μm or more. By this arrangement, even if the coating error and the etching error reach the maximum, the orthographic projection of the frame sealing glue 40 on the substrate 21 can be completely within the orthographic projection of the pad layer 22 on the substrate 21.
In one embodiment, the material of the light shielding layer 25 is metal, and the spacer layer 22 is in direct contact with the frame sealing glue 40. By arranging the light shielding layer 25 of metal, the material of the light shielding layer 25 is prevented from remaining in the through hole when the through hole is formed on the light shielding layer 25, so that the formation of a pixel dark spot is avoided; the higher reflectivity of the spacer layer 22 can improve the problem that the width of the frame sealing glue cannot be detected due to the reflection of the light shielding layer when the width of the frame sealing glue is detected by an optical instrument after the frame sealing glue 40 is formed.
Further, the color film substrate further includes an auxiliary film layer located at a side of the light shielding layer 25 away from the substrate 21, the auxiliary film layer is located in the first sub-frame area 103, and the orthographic projection of the frame sealing glue 40 on the substrate 21 falls within the orthographic projection of the auxiliary film layer on the substrate 21; the reflectivity of the auxiliary film layer is smaller than that of the light shielding layer 25. By forming the auxiliary film layer on the side of the light shielding layer 25 away from the substrate, and the reflectivity of the auxiliary film layer is lower than that of the light shielding layer, the problem that the width of the frame sealing adhesive cannot be detected due to reflection of the light shielding layer can be further improved. In this embodiment, the display substrate may be used for a virtual reality display device, which may meet the high requirements of the virtual reality display device for visual effects.
Further, the color film layer comprises a blue light filtering structure; the auxiliary film layer and the blue light filtering structure are arranged on the same layer. The auxiliary film layer and the blue light filtering structure in the color film layer can be formed simultaneously, so that the complexity of the preparation process of the display substrate is simplified; and the reflectivity of the blue filtering structure is smaller than that of the filtering structures with other colors, which is more beneficial to improving the problem that the width of the frame sealing glue cannot be detected due to the reflection of the shading layer.
For the embodiment shown in fig. 2, it was found by experiments that when the thickness of the lift-off layer 22 is greater than or equal to 0.8 μm, the thickness uniformity of the lift-off layer 22 is good; the minimum wet area of the frame sealing adhesive is more than or equal to 1000 mu m 2 The method comprises the steps of carrying out a first treatment on the surface of the The smallest dimension of the silicon balls 41 in the current frame sealing glue 40 is 1.7 μm. The sum of the thicknesses of the lift-up layer 22 and the frame sealing adhesive 40 is generally 4.5 μm when the display device is a vehicle-mounted display device; the sum of the thicknesses of the lift-off layer 22 and the frame sealing glue 40 is typically 3.3 μm when the display device is used in a virtual reality device.
As can be determined from the above values, the size of the silicon ball 41 is 3.7 μm when the thickness of the lift-up layer 22 is 0.8 μm and the display device is a vehicle-mounted display device; the size of the silicon sphere 41 when the display device is used in a virtual reality device is 2.5 μm. Both values are greater than 1.7 μm. When the wet area of the frame sealing glue is minimum, the width of the frame sealing glue is 1000 mu m when the display device is a vehicle-mounted display device 2 3.7 μm=270 μm, i.e. the width of the frame sealing glue of the vehicle-mounted display device is larger than 270 μm; the width of the frame sealing adhesive of the vehicle-mounted display device is generally larger than or equal to 1000 μm. When the wet area of the frame sealing glue is minimum, the width of the frame sealing glue is 1000 mu m when the display equipment is virtual reality equipment 2 2.5 μm=400 μm, i.e. the width of the frame sealing glue of the virtual reality device is larger than 400 μm; the width of the frame sealing glue of the virtual reality device is generally about 600 μm.
The embodiment of the application also provides a display device, which comprises the display substrate in any embodiment.
In some embodiments, the display device further comprises a housing, the display substrate being embedded within the housing.
The display device provided by the embodiment of the application can be any suitable display device, including but not limited to a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, an electronic book, and any other product or component with a display function.
It is noted that in the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Moreover, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or intervening layers may be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may be present. In addition, it will be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intervening layer or element may also be present. Like reference numerals refer to like elements throughout.
Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.