CN1167125C

CN1167125C - Fixing device of radiator

Info

Publication number: CN1167125C
Application number: CNB011229284A
Authority: CN
Inventors: 吴汉顺
Original assignee: Wistron Corp; Acer Inc
Current assignee: Wistron Corp; Acer Inc
Priority date: 2001-07-18
Filing date: 2001-07-18
Publication date: 2004-09-15
Anticipated expiration: 2021-07-18
Also published as: CN1397998A

Abstract

A fixing device of radiator is used to fix the radiator on the electronic element of host board to transfer the heat generated by the electronic element to outside, which includes multiple convex columns set around the electronic element of host board, each convex column has a slot and a spring plate with an elastic part and multiple joint parts, the joint parts on the spring plate will correspond to the slots of convex columns after the elastic part is deformed properly, the elastic part will generate pressure to the radiator after the joint parts and slots are jointed, forcing the radiator to be tightly jointed on the electronic element.

Description

The fixture of radiator

Technical field

The present invention relates to a kind of fixture of radiator, particularly relate to a kind of fixture that can make radiator closely be fitted in electronic component.

Background technology

In order to make the computer can be faster and deal with data data in large quantities, computer manufacturing person must manage the processing speed of speed-up computation machine central interior processor (CPU), yet along with the raising of CPU (central processing unit) processing speed, its heat that is produced in the running is also just increasing.Owing to the electronic component of computer-internal is easy to lose efficacy because be heated; there is not suitable heat abstractor through continuing for a long time to use as computer; to be easy to make computer (particularly notebook computer) that phenomenon takes place to shut down; therefore computer in the market nearly all has heat abstractor; purpose is exactly will be with the electronic component of computer-internal; the heat that produces of CPU (central processing unit) particularly; be discharged into the external world, cause shutdown because be heated with the electronic component of avoiding computer-internal.

With reference to shown in Figure 1, Fig. 1 is the radiator schematic diagram of notebook computer, for a notebook computer, its inner electronic component major part all is combined on the motherboard 10 with welding manner, CPU (central processing unit) 12 in these electronic components is easy to generate high heat especially, must utilize radiator 14 that the heat that it produced is sent to the external world, radiator 14 shown in the figure is metal materials, utilize the direct way of contact to receive the heat that CPU (central processing unit) 12 produces, and heat being sent to the fan 16 of computer in heat conducting mode, the running by fan 16 is sent to the external world with heat again.

With reference to Fig. 2 A-2B, it is the schematic diagram of the fixture 20 of radiator 14 in the known technology, in the known technology for radiator 14 is attached on the CPU (central processing unit) 12, CPU (central processing unit) 12 at motherboard 10 all around is provided with four circular hole posts 22, fixture 20 is sheet metals, its surface is provided with four four circular hole posts, 22 corresponding screws 24 with motherboard 10, radiator 14 is fixed on the mode of CPU (central processing unit) 12, it is the upper surface that earlier radiator 14 is placed on CPU (central processing unit) 12, again fixture 20 is placed on the radiator 14, make four screws 24 of fixture 20 corresponding with four circular hole posts 22 of motherboard 10 respectively, utilize four bolts 26 to pass four screws 24 respectively again, and then radiator 14 is fixed on the top of the CPU (central processing unit) 12 of motherboard 10, because the assembling process of the fixture 20 in the known technology is difficulty and loaded down with trivial details comparatively, so tend to cause the reduction of productivity ratio and the raising of cost.

Given this, computer manufacturing person all the design of the fixture of being devoted to radiator with reelect, in the hope of designing the fixture that has in conjunction with firm and easy to operate, radiator can be fixed on the CPU (central processing unit) apace, so that finish the assembling of computer.

Summary of the invention

Main purpose of the present invention is to provide a kind of fixture of radiator, and radiator can be fixed on the electronic component apace.

Disclosed fixture is to be applied on the cooling system of notebook computer, owing to be easy to produce heat during the running of the electronic component (for example CPU (central processing unit)) of computer main frame panel, therefore must utilize radiator that the heat that it produced is diffused to the external world, technical scheme of the present invention mainly is to utilize fixture that radiator is fixed on the CPU (central processing unit), and its brief description is described below.

Radiator with CPU (central processing unit) is that example describes, fixture of the present invention comprises a plurality of projections, they are located at respectively around the CPU (central processing unit) of motherboard, its number with four preferably and four corners that are located at CPU (central processing unit) be the best, each projection is equipped with a draw-in groove and a shell fragment in addition, form by an elastic portion and a plurality of junction surface, elastic portion is the protrusion curved surface that is shaped in advance, its material is a plate-shape metal, the quantity at junction surface is identical with projection quantity, after the elastic portion process distortion of shell fragment, junction surface on it will be corresponding with the draw-in groove of projection respectively, in case therefore the junction surface engages one another with draw-in groove, elastic portion will produce downward pressure to radiator owing to distortion, force radiator closely to be fitted on the CPU (central processing unit).

Be given a shock or the influence of external force for fear of shell fragment, it produced with the projection of motherboard separate, cause radiator not to be combined in reliably on the CPU (central processing unit) of motherboard, and then have influence on the heat radiation effect of notebook computer.The present invention is in above-mentioned a plurality of projections, have at least the upper surface of a projection to be provided with a combined hole (for example screw), on shell fragment, be provided with simultaneously at least one location hole, when the junction surface of shell fragment engages one another with the draw-in groove of projection, combined hole just can with location hole in correspondence with each other, fixture was passed location hole with a coupling apparatus (for example bolt) and was bonded on the combined hole this moment, make shell fragment can positively be fixed on the projection of motherboard, with the junction surface of avoiding shell fragment because with the exact separation of projection, and have influence on the radiating effect of radiator to CPU (central processing unit).

Understand for purpose of the present invention, feature and effect being had further, be described with reference to the accompanying drawings as follows.

Description of drawings

Fig. 1 is the radiator schematic diagram of notebook computer;

Fig. 2 A～2B is a fixture of utilizing known technology, radiator is fixed on the schematic diagram of CPU (central processing unit);

Fig. 3 A～3C utilizes fixture of the present invention, radiator is fixed on the schematic diagram of CPU (central processing unit);

Fig. 4 is the view of another embodiment of fixture of the present invention;

Fig. 5 is the method flow diagram that fixture of the present invention is fixed to radiator in the electronic component of motherboard.

Embodiment

The present invention discloses a kind of fixture of radiator, utilize fixture radiator to be fixed on the electronic component of motherboard, the heat that electronic component is produced in the running can be sent to the external world by radiator, have influence on the usefulness of electronic component to avoid heat not shed, the present invention will describe as embodiment with the heat radiation of the CPU (central processing unit) of notebook computer, yet practical range of the present invention has more than and is limited to this.

With reference to Fig. 3 A～3C, fixture 30 of the present invention is applied in the cooling system of notebook computer, it comprises a plurality of projections 32 and a shell fragment 34, projection 32 is the best with four, and be located at four corners of the CPU (central processing unit) 12 of motherboard 10 respectively, each projection 32 is equipped with a draw-in groove 35 in addition; Shell fragment 34 is made up of an elastic portion 36 and a plurality of junction surface 38, and elastic portion 36 is the plate-shape metal of a protrusion curved surface that is shaped in advance, 38 at junction surface be located at elastic portion 36 around, its quantity is identical with the quantity of projection 32.After the elastic portion 36 process distortion (being pressed into the plane) of shell fragment 34, junction surface 38 around it will be corresponding with the draw-in groove 35 of projection 32 respectively, this moment is as after (directions X) moves in the same direction with shell fragment 34, junction surface 38 on it will engage one another with the draw-in groove 35 of projection 32, because the elastic portion 34 after the distortion will produce elastic force, and radiator 14 produced a downward pressure, and then force radiator 14 closely to be fitted on the CPU (central processing unit) 12.

Be given a shock or the influence of external force for fear of shell fragment 34, make between the projection 32 of the junction surface 38 of shell fragment 34 and motherboard 10, separate because get loose, cause radiator 14 not to be combined in reliably on the CPU (central processing unit) 12, and then have influence on the radiating effect of notebook computer.Fixture 30 of the present invention has at least the upper surface of a projection 32 to be provided with a combined hole 31 (for example screw) in above-mentioned projection 32, on shell fragment 34, be provided with simultaneously at least one location hole 33, combined hole 31 is the best with the quantity of location hole 33 with two, when the junction surface 38 of shell fragment 34 engages one another with the draw-in groove 35 of projection 32, the combined hole 31 of projection 32 just can with the location hole 33 of shell fragment 34 in correspondence with each other, fixture 30 was also passed location hole 33 respectively with two coupling apparatus 37 (for example bolt) and was locked on the combined hole 31 this moment, shell fragment 34 can be fixed on the projection 32 of motherboard 10 reliably, with the junction surface 38 of avoiding shell fragment 34 be subjected to external force or vibrations influence and by separating in the draw-in groove 35 of projection 32.

With reference to Fig. 4, Fig. 4 is the view of another embodiment of the present invention, because present embodiment and aforesaid embodiment are roughly the same, therefore will repeat no more for the components identical function, and give identical numbering, only is described at different elements at this.Main different of present embodiment and previous embodiment be in, the fixture 30 of present embodiment ' have two projections 32 ', they are located at two sides of CPU (central processing unit) (not shown) respectively, wherein a projection 32 ' upper surface combined hole 31 ' (screw) is set, simultaneously shell fragment 34 ' have two junction surfaces 38 ' and location hole 33 '.When shell fragment 34 ' junction surface 38 ' with projection 32 ' draw-in groove 35 ' when engaging, shell fragment 34 ' location hole 33 ' just and projection 32 ' combined hole 31 ' corresponding, and can engage one another, this moment again with coupling apparatus 37 ' (bolt) pass location hole 33 ' be combined in projection 32 ' combined hole 31 ' on, reaching with radiator 14 ' be fixed on the effect of CPU (central processing unit), and avoid causing shell fragment 34 ' with projection 32 ' separate.Certain coupling apparatus of the present invention also can be formed by three projections and by the shell fragment with three junction surfaces, but this is a simple transformation applications of the present invention, still belongs to scope of the present invention, is not therefore narrated.

With reference to Fig. 5, Fig. 5 is the disclosed method that radiator is fixed to the electronic component on the motherboard, its step comprises: at first form a plurality of projections on motherboard, above-mentioned projection be arranged on electronic component around, and above-mentioned projection respectively has a draw-in groove 51, then radiator is placed on the upper surface 52 of this electronic component, the shell fragment that will have an elastic portion and a plurality of junction surfaces again is placed in the upper surface 53 of radiator, utilize the distortion of the elastic portion of shell fragment again, make junction surface on it corresponding to the draw-in groove 54 of above-mentioned projection, again above-mentioned junction surface is engaged in the draw-in groove at last, make the elastic portion of shell fragment produce pressure to this radiator, and then cause radiator closely to be fitted on this electronic component 55 because of distortion.

In sum, the coupling apparatus of radiator of the present invention has following advantage:

1. the present invention is combined in coupling apparatus on the projection of motherboard with juncture, and its operation is comparatively simple.

2. the present invention only needs one or two bolts just coupling apparatus can be locked on the projection of motherboard, avoids shell fragment because external force or vibrations separate with projection, and that known technology must lock four bolts is therefore more time-consuming.

Certainly; the above only is the preferred embodiment of the coupling apparatus of radiator of the present invention; be not in order to limit practical range of the present invention; any those of ordinary skill in the art is in the modification of being made under spiritual condition of the present invention; all should belong to scope of the present invention, so protection scope of the present invention ought be a foundation with following claims.

Claims

1. A fixing device for a heat sink, the heat sink is fixed on an electronic component of a main board so as to dissipate heat, and it comprises: a plurality of bosses, which are respectively arranged around the electronic components of the main board, so that Each of the protrusions has a slot; and an elastic piece, which has an elastic portion and a plurality of joints, wherein after the elastic portion of the elastic plate is properly deformed, the joints on it will be respectively connected with the protrusions of the protrusions. The slots correspond to each other, and after being engaged with each other, the deformation of the elastic part is used to generate pressure on the heat sink, so that the heat sink can be closely attached to the electronic component.

2. The radiator fixing device according to claim 1, wherein at least one of the protrusions is provided with a joint hole on the upper surface of the protrusion, and at least one positioning hole is provided on the elastic piece, when the engagement of the elastic piece When the part is engaged with the slot of the boss, the combination hole just corresponds to the positioning hole, and the fixing device is combined in the combination hole through the positioning hole by a combination device, so as to achieve Preventing the engaging portion of the elastic piece from disengaging from the slot of the protruding post.

3. The radiator fixing device according to claim 2, wherein the coupling hole is a screw hole, and the coupling device is a bolt.

4. The heat sink fixing device according to claim 1, wherein the electronic component of the motherboard is a central processing unit (CPU).

5. The heat sink fixing device according to claim 1, wherein the main board is disposed on a notebook computer.

6. The heat sink fixing device according to claim 1, wherein the elastic portion of the elastic piece is a pre-shaped convex curved surface, and the convex curved surface faces the electronic component, when the joint portion of the elastic piece and After the engaging grooves of the protrusions are engaged with each other, the convex curved surface will be deformed and exert pressure on the heat sink, so that it can be closely attached to the electronic component.

7. The heat sink fixing device according to claim 1, wherein the material of the shrapnel is metal.

8 . The fixing device of the heat sink according to claim 1 , wherein the engaging portions of the elastic pieces all engage with the slots of the protruding posts in the same direction.

9. The fixing device of the heat sink according to claim 1, wherein the fixing device comprises four protrusions, which are respectively arranged at four corners of the electronic component.

10. The heat sink fixing device as claimed in claim 1, wherein the fixing device comprises two protrusions, which are respectively arranged on two sides of the electronic component.

11. A method of fixing a radiator to an electronic component of a motherboard, the steps comprising:

a. forming a plurality of protrusions on the main board, the protrusions are arranged around the electronic components, and each of the protrusions has a slot;

b. placing the heat sink on the upper surface of the electronic component;

c. arranging an elastic piece having an elastic portion and a plurality of joint portions on the upper surface of the heat sink;

d. Deform the elastic part of the elastic piece so that the joint part on it corresponds to the slot of the protrusion;

e. Then engage the engaging portion in the slot, so that the elastic portion of the elastic plate is deformed to exert pressure on the heat sink, thereby causing the heat sink to be closely attached to the electronic component.

12. The method for fixing the heat sink to the electronic components of the motherboard according to claim 11, wherein at least one of the protrusions has a joint hole on the upper surface of the protrusion, and at least one joint portion of the elastic sheet is provided with The positioning hole, when the engaging portion of the elastic piece is engaged with the slot of the boss, the combining hole is just corresponding to the positioning hole, and the fixing device is combined with a combining device through the positioning hole The combination hole is used to prevent the joint part of the elastic piece from being disengaged from the slot of the boss.

13. The method for fixing a heat sink to an electronic component on a motherboard as claimed in claim 12, wherein the coupling hole is a screw hole, and the coupling device is a bolt.

14. The method of securing a heat sink to an electronic component of a motherboard as claimed in claim 11, wherein the electronic component of the motherboard is a central processing unit (CPU).

15. The method of fixing a heat sink to an electronic component of a motherboard as claimed in claim 11, wherein the motherboard is provided on a notebook computer.

16. The method for fixing a heat sink to an electronic component on a motherboard as claimed in claim 11, wherein the elastic part of the elastic sheet in step c is a pre-shaped convex curved surface, and the convex curved surface faces the electronic component, When the engaging portion of the elastic sheet engages with the slot of the protruding post, the convex curved surface will be deformed and exert pressure on the heat sink, so that it can be closely attached to the electronic component.

17. The method for fixing the heat sink to the electronic components of the motherboard as claimed in claim 11, wherein the material of the shrapnel in step c is metal.

18 . The method for fixing the heat sink to the electronic component of the mainboard as claimed in claim 11 , wherein in step e, the engaging portions of the elastic pieces all engage with the slots of the protrusions in the same direction. 19 .

19. The method for fixing a heat sink to an electronic component on a mainboard as claimed in claim 11, wherein step a comprises four protrusions respectively disposed at four corners of the electronic component.

20. The method for fixing a heat sink to an electronic component on a motherboard as claimed in claim 11, wherein step a comprises two protrusions, which are respectively disposed on two sides of the electronic component.