CN200966203Y

CN200966203Y - heat sink

Info

Publication number: CN200966203Y
Application number: CN 200620149935
Authority: CN
Inventors: 裴林
Original assignee: Molex LLC
Current assignee: Molex LLC
Priority date: 2006-11-07
Filing date: 2006-11-07
Publication date: 2007-10-24
Anticipated expiration: 2016-11-07

Abstract

The utility model relates to a heat dissipation device for dissipating heat for electronic components, including a heat sink, a fixing frame and a fastener; the heat sink includes a base and a plurality of heat dissipation fins; the fixing frame includes a metal frame and two plastic fasteners, the frame includes a body and two side plates, a through hole is provided in the center of the body, the two fasteners are respectively installed on the two side plates of the frame, each fastener includes a main body, a mounting portion, a plurality of hooks and a fixing portion; the two fixing portions are hooked on both sides of the lower surface of the electronic component, the base of the heat sink passes through the through hole of the fixing frame and is attached to the top surface of the electronic component to dissipate heat. The heat dissipation device does not need to open an assembly hole on the circuit board when in use, and its metal frame can withstand large bending force and is not easy to break in a high temperature environment for a long time, and the two plastic fasteners are hooked on both sides of the bottom of the electronic component, which will not cause a short circuit of the electronic component.

Description

Heat abstractor

Technical field

The utility model relates to a kind of heat abstractor, relates in particular to a kind of heat abstractor with fixed mount.

Background technology

General electronic installation now is the central processing unit in the computer and electronic component on every side thereof for example, in working order down all can the evolution of heat.Along with the processing speed of central processing unit speeds, the heat that it distributed also increases thereupon.Therefore, need install a heat abstractor additional on central processing unit dispels the heat.

General heat abstractor comprises that mainly one is used to plug the connector body of central processing unit, one radiator and a fastener, these connector body two ends respectively are provided with a grab, and this fastener can match with this grab, provide heat radiation thereby radiator is abutted to the central processing unit end face for it.This heat abstractor need adopt structure comparatively fragility, the higher connector body of cost, is unfavorable for reducing cost.

And the heat abstractor that does not generally adopt connector body makes up as No. 92202848 described radiator steady rest of TaiWan, China patent application, it is to offer some pilot holes on circuit board, thereby the fixed part that re-uses a steady rest matches with these pilot holes and is fixed to circuit board, and this radiator adopts bolt to lock on this steady rest again.Need on circuit board, offer pilot hole when this heat abstractor is used in combination, influence the wiring on the circuit board.

In order to address the above problem, the combination of a kind of heat abstractor is disclosed in No. 200420096018.8 Chinese patent, comprise that fixed mount and that a radiator, is positioned at this radiator below is used for this radiator is fixed to fastener on this fixed mount.Be provided with a draw-in groove between the cross rib of this fixed mount and two fixed parts, thereby this draw-in groove matches with the both sides of this electronic component and is fixed on the electronic component, therefore need not influence wiring on the circuit board offering pilot hole on the circuit board; Each outwards is equipped with a grab outside of these fixed mount two longerons, thereby this fastener can match with this grab this radiator is fixed on this fixed mount, thereby the base bottom of this radiator can the through hole by this fixed mount be amplexiformed mutually with this electronic component end face and is its heat radiation.But because this fixed mount is that plastic material is made, because temperature of electronic component is higher, it is subjected to two bigger cross ribs of bending power long-term work is softening easily under near 100 degrees centigrade hot environment to fracture, thereby influences its useful life when using.

Summary of the invention

The utility model is in order to solve above-mentioned two kinds of existing different technologies problems of heat abstractor that do not adopt connector body, special need on circuit board, not offer pilot hole when proposing a kind of uses, have one under hot environment long-term work be not easy to soften the heat abstractor of the fixed mount that fractures.

A kind of heat abstractor that is used for electronic element radiating comprises that fixed mount and that a radiator, is positioned at this radiator below is used for this radiator is fixed to fastener on this fixed mount; This radiator comprises a pedestal and some radiating fins, this fixed mount comprises the fastener that a metal framework and two plastic cement are made, this framework comprises a body and the biside plate that extends to form from the relative both sides bending downwards of this body, this body center offers a through hole, respectively offers an opening and some hole clippings on this biside plate;

This two fastener is installed in respectively on the biside plate of this framework, and each fastener comprises a main body, an installation portion, some grabs and a fixed part; Described installation portion correspondence is fastened in the opening of this side plate, thereby described grab correspondence is buckled in the hole clipping of this side plate this fastener is fixed on this framework; This fixed part is that the lower edge from this main body bends inwards to extend and forms, and this two fixed parts hook is located at the both sides of this electronic component lower surface, and the projection of this radiator amplexiforms with this electronic component end face mutually by the through hole of this fixed mount.

The utility model heat abstractor need not influence wiring on the circuit board offering pilot hole on the circuit board, it is combined into a fixed mount by the combining structure of using a kind of uniqueness with a metal framework and two plastic cement fasteners, metal framework wherein can bear bigger bending power in long-term work under the hot environment and also be not easy to fracture, other two plastic cement fasteners then can hook be located at the both sides of electronic component lower surface, its plastic cement material is not worried causing the electronic component short circuit yet, has preferable result of use.

Description of drawings

Fig. 1 is the three-dimensional combination figure of the utility model heat abstractor and circuit board;

Fig. 2 is the three-dimensional exploded view of the utility model heat abstractor and circuit board;

Fig. 3 is the three-dimensional exploded view of the utility model heat abstractor and another angle of circuit board;

Fig. 4 is the utility model heat abstractor and the end view of circuit board under assembled state;

Fig. 5 is the A-A direction cutaway view of Fig. 4;

Fig. 6 is the stereogram of the utility model heat abstractor fixed mount;

Fig. 7 is the three-dimensional exploded view of the utility model heat abstractor fixed mount.

Embodiment

To shown in Figure 5, heat abstractor of the present utility model mainly comprises a radiator 1, one fixed mount 2 and a fastener 3 as Fig. 1.

The electronic component 4 that this heat abstractor is used to help to be welded on the circuit board 5 dispels the heat.The bottom of this electronic component 4 is provided with some spherical pins 42, its directly correspondence be welded on this circuit board 5.

This radiator 1 comprises a pedestal 11 and some radiating fins 12.The bottom surface of this pedestal 11 protrudes out downwards and is provided with a projection 110.These radiating fins 12 extend upward from the upper surface of this pedestal 11 and form, and position offers a storage tank 120 in the middle of it.

As Fig. 6, shown in Figure 7, this fixed mount 2 comprises the fastener 22 that a metal square framework 21 and two plastic cement are made.This framework 21 comprises a body 212, bends downwards from these body 212 relative both sides and extend biside plate 214 and two limiting plates 216 that form.The middle position of this body 212 offers the through hole 2122 that a projection 110 that can hold this radiator 1 passes through.The middle part of these side plate 214 lower edges offers an opening 2142.Bending transition position between this biside plate 214 and this body 212 respectively is provided with two hole clippings 2144 respectively.This two limiting plate 216 extends to form from the relative two edges bending downwards of these body 212 through holes 2122, and each the outside bending of the two ends of this body 212 is provided with a grab 2124.

This two fastener 22 is installed in the inboard of the biside plate 214 of this fixed mount 2 respectively.This fastener 22 comprises that a main body 222, an installation portion 224, two correspondences are buckled in the grab 226 in two hole clippings 2144 of this framework 21 and bend inwards from the lower edge of this main body 222 and extends a fixed part 228 that forms.

This installation portion 224 goes out opening 2142 outside projections that should framework 21 from the lower edge of this main body 222, offers one between this installation portion 224 and this main body 222 and can be fastened on wherein draw-in groove 2242 along the side plates 214 at place for these 2142 weeks of opening.This two grab 226 goes out from the top of this main body 222 to two hole clippings, 2144 outside projections that should framework 21.

Only need this fastener 22 is inserted into from bottom to top side plate 214 inboards of this framework 21 when assembling this fixed mount 2, make being fastened on along correspondence in week in the draw-in groove 2242 of this installation portion 224 of these side plate 214 adjacent openings 2142, two grabs 226 of this fastener 22 are corresponding respectively to be fastened on and in two hole clippings 2144 of this fixed mount 2 this fastener 22 can't to be deviate from downwards can to reach assembling.

This fastener 3 is that integrated punching forms, and it mainly comprises a pressure section 31 and from extended two

holding parts

32,33 of this pressure section 31 two ends difference, respectively is provided with a button hole 320,330 on this two holding

part

32,33.

When this heat abstractor is installed to electronic component 4, earlier the top of this fixed mount 2 from this electronic component 4 pressed downward on this electronic component 4, this moment this framework 21 the earlier stressed inwardly elastic return of outwards opening again of biside plate 214, make the fixed part 228 of this two fastener 22 snap onto the both sides of these electronic component 4 lower surfaces, two limiting plates 216 of this framework 21 are resisted against the two ends of this electronic component 4, prevent that this fixed mount 2 from moving up in front and back, and then this radiator 1 is attached to the top of this fixed mount 2, the bottom of its pedestal 11 projections 110 is amplexiformed by the through hole 2122 of framework 21 and the end face of this electronic component 4, and then fastener 3 is installed in the storage tank 120 of this radiator 1, and make its two button hole 320, the corresponding fastener of 330 difference is to two grabs 2124 of this fixed mount 2; This moment, the pressure section 31 of this fastener 3 closely was crimped onto the end face of this electronic component 4 with this radiator 1, and the lower surface that two fixed parts, 228 hooks of this fixed mount 2 are located at these electronic component 4 both sides makes fixed mount 2 make progress, and so far finishes the whole erection process.

The utility model is combined into a fixed mount 2 by the combining structure of using a kind of uniqueness with a metal framework 21 and two plastic cement fasteners 22, metal framework 21 wherein can be born fastener 3 hooks and is located at the bigger bending power that these framework 21 two ends are produced, and long-term work also is not easy softening fractureing under near 100 degrees centigrade hot environment; Two other plastic cement fasteners 22 then hook are located at the below of electronic component 4 both sides, and its plastic cement material is not worried causing the electronic component short circuit with spherical pin 42 short circuits of electronic component 4 belows yet.The utility model need not influence wiring on the circuit board offering pilot hole on the circuit board, it is higher owing to temperature of electronic component when using also to have overcome the plastic cement fixed mount that is made into integration in the prior art, causes the softening easily problem that fractures of its two cross rib long-term work under hot environment.

Claims

1. A heat dissipation device, comprising a radiator, a fixing frame located below the radiator, and a buckle for fixing the radiator to the fixing frame; the radiator includes a base and a plurality of cooling fins It is characterized in that: the fixed frame includes a frame made of metal and two fasteners made of plastic,

The frame body includes a main body and two side plates bent and extended downwards from opposite sides of the main body, a through hole is opened in the center of the main body, and an opening and a plurality of clamping holes are opened on each of the two side plates;

The two fasteners are installed on the two side panels of the frame respectively, and each fastener includes a main body, a mounting part, a plurality of hooks and a fixing part bent and extended inwardly from the lower edge of the main body The mounting part is correspondingly locked in the opening of the side plate, and the hook is correspondingly locked in the hole of the side plate so as to fix the fastener to the frame.

2. The heat dissipation device according to claim 1, wherein the opening is opened at the lower edge of the side plate.

3. The heat dissipation device according to claim 1 or 2, characterized in that: the two fasteners are installed on the inner sides of the two side panels of the frame respectively, and the installation part protrudes outward from the lower edge of the main body Furthermore, a card slot is provided between the installation part and the main body, and the peripheral edge of the side plate adjacent to the opening is locked in the card slot.

4. The heat dissipation device according to claim 1, wherein the clamping hole is opened at a bending transition between the side plate and the main body.

5. The heat dissipation device according to claim 1 or 4, characterized in that: the two fasteners are installed on the inner sides of the two side panels of the frame respectively, and the hook is from the top of the main body of the fastener to the inner side of the frame. protruding outward.

6. The heat dissipation device according to claim 1, characterized in that: the two ends of the main body of the frame body are respectively bent outwards and provided with a hook, and the buckle includes a pressing part and two ends extending from the pressing part to the two ends. Two buckling parts extending out respectively; each of the two buckling parts is provided with a button hole, and the two button holes are respectively combined with the two hooks to fix the radiator to the fixing frame.

7. The heat dissipation device according to claim 1, characterized in that: the heat dissipation device is used to dissipate heat for an electronic component, the two fixing parts of the fixing frame are respectively hooked on both sides of the lower surface of the electronic component, and the heat dissipation The base of the device passes through the through hole of the fixing frame and sticks to the top surface of the electronic component.

8. The heat dissipation device according to claim 7, characterized in that: the frame body further includes two limiting plates bent and extended downwards from two opposite edges of the through hole of the body, the two limiting plates Abutting against the two ends of the electronic component prevents the fixing frame from moving.

9. The heat dissipation device according to claim 7, wherein the electronic component is directly soldered to a circuit board, and a plurality of ball pins are provided on the lower surface thereof.

10. The heat dissipation device according to claim 1, wherein a protrusion protrudes downward from the bottom of the base.